SCES200J − APRIL 1999 − REVISED SEPTEMBER 2003
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DAvailable in the Texas Instruments
NanoStarand NanoFreePackages
DSupports 5-V VCC Operation
DInputs Accept Voltages to 5.5 V
DMax tpd of 5.4 ns at 3.3 V
DLow Power Consumption, 10-µA Max ICC
D±24-mA Output Drive at 3.3 V
DTypical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
DTypical VOHV (Output VOH Undershoot)
>2 V at VCC = 3.3 V, TA = 25°C
DIoff Feature Supports Partial-Power-Down
Mode Operation
DLatch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
DESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 1000-V Charged-Device Model (C101)
description/ordering information
This dual Schmitt-trigger inverter is designed for 1.65-V to 5.5-V VCC operation.
NanoStarand NanoFreepackage technology is a major breakthrough in IC packaging concepts, using the
die as the package.
ORDERING INFORMATION
TAPACKAGE†ORDERABLE
PART NUMBER TOP-SIDE
MARKING‡
NanoStar − WCSP (DSBGA)
0.17-mm Small Bump − YEA SN74LVC2G14YEAR
NanoFree − WCSP (DSBGA)
0.17-mm Small Bump − YZA (Pb-free)
SN74LVC2G14YZAR
NanoStar − WCSP (DSBGA)
0.23-mm Large Bump − YEP
Reel of 3000 SN74LVC2G14YEPR _ _ _CF_
−40°C to 85°CNanoFree − WCSP (DSBGA)
0.23-mm Large Bump − YZP (Pb-free) SN74LVC2G14YZPR
Reel of 3000 SN74LVC2G14DBVR
SOT (SOT-23) − DBV Reel of 250 SN74LVC2G14DBVT C14_
Reel of 3000 SN74LVC2G14DCKR
Reel of 250 SN74LVC2G14DCKT
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
‡DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,
and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb, • = Pb-free).
Copyright 2003, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
DBV OR DCK PACKAGE
(TOP VIEW)
1
2
3
6
5
4
1A
GND
2A
1Y
VCC
2Y
3
2
1
4
5
6
2A
GND
1A
2Y
VCC
1Y
YEA, YEP, YZA, OR YZP PACKAGE
(BOTTOM VIEW)
NanoStar and NanoFree are trademarks of Texas Instruments.
!"# $"%&! '#(
'"! ! $#!! $# )# # #* "#
'' +,( '"! $!#- '# #!#&, !&"'#
#- && $##(