EMIF06-HSD04F3 6-line low capacitance IPADTM for micro-SD card with EMI filtering and ESD protection Datasheet - production data Features * Very low line capacitance to compensate long PCB tracks (4.5 pF typ.) * 208 MHz clock frequency compliant with SD3.0 UHS-1 SDR 104 standard * High ESD robustness: up to 12 kV contact )OLS&KLS EXPSV * Lead-free package in 400 m pitch Figure 1. Pin configuration (bump side) * Package thickness: 500 m typ. * Very low PCB space consumption $ * High reliability offer by the monolithic integration % Complies with the following standards: & ' * IEC 61000-4-2 level 4 - 15 kV (air discharge) - 8 kV (contact discharge) Application Where ESD protection for sensitive equipment is required: * Smartphones and Tablets * Camera, Printers, Laptops and desktops Description The EMIF06-HSD04F3 chip is a highly integrated device designed to protect the application against ESD event during the insertion of the micro-SD card. The EMIF06-HSD04F3 must be placed close to the micro-SD card connector for efficient ESD protection. TM: IPAD is a trademark of STMicroelectronics November 2014 This is information on a product in full production. DocID027072 Rev 1 1/8 www.st.com 8 Characteristics 1 EMIF06-HSD04F3 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 C) Symbol VPP Parameter Value ESD discharge IEC 61000-4-2, level 4 (on pins Vcc, SDclk, SDcmd, SDdat0, SDdat1, SDdat2, SDdat3 Air discharge Contact discharge, external pins ESD discharge IEC 61000-4-2, level 1 (on pins clk, dat0, dat1,dat2, dat3, cmd) Air discharge Contact discharge, internal pins Tj Maximum junction temperature Top Tstg 15 12 kV 15 10 125 C Operating temperature range - 40 to + 85 C Storage temperature range - 55 to + 150 C Figure 2. EMIF06-HSD04F3 Schematic Table 2. Pin configuration 2/8 Unit Pin Signal Pin Signal A1 dat0 C1 Cmd A2 dat1 A3 SDdat1 C3 GND A4 SDdat0 C4 SDcmd B1 clk D1 dat3 B2 Vcc D2 dat2 B3 GND D3 SDdat2 B4 SDclk D4 SDdat3 DocID027072 Rev 1 EMIF06-HSD04F3 Characteristics Table 3. Electrical characteristics (values, Tamb = 25 C) Symbol Parameter Test conditions Min. Typ. Max. Unit 9 V VBR Breakdown voltage IR = 1 mA IRM Leakage current at VRM VRM = 3 V per line 100 nA Cline Data line capacitance VBIAS = 0 V, F = 10 MHz, VOSC = 30 mV 4.5 pF Serial resistance Tolerance 23% R1, R2, R3, R4, R5, R6 R9, R10, R11, Pull-up resistance R12 R13 5 1 Tolerance 20% 40 50 60 k Pull-up resistance on cmd Tolerance 20% 12 15 18 k Figure 3. Electrical characteristics (definitions) , 6\PERO 9%5 950 ,50 3DUDPHWHU %UHDNGRZQYROWDJH 6WDQGRIIYROWDJH /HDNDJHFXUUHQWDW 950 &OLQH /LQHFDSDFLWDQFH 9&/ 9%5 950 9 ,50 ,33 Figure 4. Attenuation versus frequency Figure 5. Analog crosstalk versus frequency 6 G% ;7DON G% ) +] 0 0 &ON 'DW 'DW 0 0 * 'DW 'DW &PG * * 0 0 &ON'DW DocID027072 Rev 1 0 0 ) +] * * * 'DW6''DW 3/8 Characteristics EMIF06-HSD04F3 Figure 6. ESD response to IEC 61000-4-2 (+8 kV contact discharge) 9GLY Figure 7. ESD response to IEC 61000-4-2 (-8 kV contact discharge) 9GLY 9 33 (6'SHDNYROWDJH 9 &/&ODPSLQJYROWDJH#QV 9 &/&ODPSLQJYROWDJH#QV 9 &/&ODPSLQJYROWDJH#QV 9 9 9 9 9 9 9 9 33 (6'SHDNYROWDJH 9 &/&ODPSLQJYROWDJH#QV 9 &/&ODPSLQJYROWDJH#QV 9 &/&ODPSLQJYROWDJH#QV QVGLY Figure 8. Digital crosstalk dat0 versus clk line (VCC = 3.9 V, Rload = 1 M QVGLY 9 Figure 9. Line capacitance versus frequency &/,1( S) 3 G%P 9%,$6 9 ) +] 0 &ON 'DW 'DW 0 Table 4. Line capacitance versus voltage (typical values) &/,1( ) ) 0+] 926& P9 7DPE & 9%,$6 9 4/8 DocID027072 Rev 1 'DW 'DW &PG * EMIF06-HSD04F3 Package information * Epoxy meets UL94, V0 * Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. P Figure 10. Flip-Chip package dimensions P P P PPP P 2 Package information P PPP Figure 11. Footprint recommendations &RSSHUSDG'LDPHWHU PUHFRPPHQGHG PPD[L PXP 6ROGHUPDVNRSHQLQJ PPLQL PXP 6ROGHUVWHQFLORSHQLQJ PUHFRPPHQGHG Figure 12. Marking 'RW67ORJR (&23$&.VWDWXV [[ PDUNLQJ ] PDQXIDFWXULQJ ORFDWLRQ \ZZ GDWHFRGH \ \HDU ZZ ZHHN DocID027072 Rev 1 [ [ ] \ Z Z 5/8 Package information EMIF06-HSD04F3 'RWLGHQWLI\LQJ3LQ$ORFDWLRQ [[] \ZZ 67( [[] \ZZ 67( [[ \ZZ 67( Figure 13. Tape and reel specification $OOGLPHQVLRQVDUHLQPP 8VHUGLUHFWLRQRIXQUHHOLQJ Note: More information is available in the application notes: AN2348, "IPADTM 400 m Flip Chip: package description and recommendations for use" AN1751, "EMI filters: recommendations and measurements" AN4541, "EMI filters for SD3.0 card: High speed SD card and filtering devices" 6/8 DocID027072 Rev 1 EMIF06-HSD04F3 3 Ordering information Ordering information Figure 14. Ordering information scheme (0,) +6') (0,ILOWHU 1XPEHURIOLQHV $SSOLFDWLRQ +6' +LJKVSHHG6'FDUG 9HUVLRQ 'HVLJQYHUVLRQ 3DFNDJH ) )OLS FKLS /HDGIUHHSLWFK PEXPS P Table 5. Ordering information 4 Order code Marking Package Weight Base qty Delivery mode EMIF06-HSD04F3 LF Flip Chip 2.77 mg 5000 Tape and reel (7") Revision history Table 6. Document revision history Date Revision 04-Nov-2014 1 Changes Initial release DocID027072 Rev 1 7/8 EMIF06-HSD04F3 IMPORTANT NOTICE - PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST's terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers' products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. (c) 2014 STMicroelectronics - All rights reserved 8/8 DocID027072 Rev 1