This is information on a product in full production.
November 2014 DocID027072 Rev 1 1/8
8
EMIF06-HSD04F3
6-line low capacitance IPAD™ for mic ro-SD card
with EMI filtering and ESD protection
Datasheet production data
Fig ure 1. Pi n config urat io n (bum p sid e)
Features
Very low line capacitance to compens ate long
PCB tracks (4.5 pF typ.)
208 MHz clock frequency compliant with SD3.0
UHS-1 SDR 104 standard
High ESD robustn ess: up to ±12 kV contact
Lead-free package in 400 µm pit ch
Package t hicknes s: 500 µm typ.
Very low PCB space consumption
High reliability offer by the monolithic
integration
Complies wit h the following standards:
IEC 61000-4-2 level 4
±15 kV (air discharge)
±8 kV (contact discharge)
Application
Where ESD protection for sensitive equipment is
required:
Sm artphones and Tablets
Camera, Printers, Laptop s and desktops
Description
The EMIF06-HSD04F3 chip is a highly integrated
device designed to protect the application against
ESD eve nt during the insertion of the m icro-SD
card.
The EMIF06-HSD04F3 must be placed close to
the micro-SD card conn ector for efficient ESD
protection.
TM: IPAD is a trade mark of STMicroelectronics
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Characteristics EMIF06-HSD04F3
2/8 DocID027072 Rev 1
1 Characteristics
Figure 2. EMIF06-HSD04F3 Schematic
Table 1. Absolute maximum rati ngs (Tamb = 25 °C)
Symbol Parameter Value Unit
VPP
ESD dischar ge IEC 61000-4-2, level 4
(on pins Vcc, SDclk, SDcmd, SDdat0, SDdat1, SDdat2, SDdat3
Air discharge
Contact discharge, external pins
ESD dischar ge IEC 61000-4-2, level 1
(on pins clk, dat0, dat1,dat2, dat3, cmd)
Air discharge
Contact discharge, internal pins
15
12
15
10
kV
TjMaximum junction temperature 125 °C
Top Operating tem perature range - 40 to + 85 °C
Tstg Storage tem perature range - 55 to + 150 °C
Ta bl e 2. Pin c o nf i gurat io n
Pin Signal Pin Signal
A1 dat0 C1 Cmd
A2 dat1
A3 SDdat1 C3 GND
A4 SDdat0 C4 SDcmd
B1 clk D1 dat3
B2 Vcc D2 dat2
B3 GND D3 SDdat2
B4 SDclk D4 SDdat3
DocID027072 Rev 1 3/8
EMIF06-HSD04F3 Characteristics
Figure 3. Electrical characteristics (definitions)
Ta ble 3. Electrical chara cteri stics (values , Tamb = 25 °C)
Symbol Param eter Test condi ti ons Min. Typ. Max. Unit
VBR Breakdown voltage IR = 1 mA 5 9 V
IRM Lea kage current at VRM VRM = 3 V per line 100 nA
Cline Data line capacitance VBIAS = 0 V, F = 10 MHz, VOSC = 30 mV 4.5 pF
R1, R2, R3,
R4, R5, R6 Serial re sistanc e Tolerance ±23% 1 Ω
R9, R10, R11,
R12 Pull -up resistance Tolerance ±20% 40 50 60 kΩ
R13 Pull-up resist ance on cmd Tolerance ±20% 12 15 18 kΩ
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Table 4. Line capaci tan ce versus voltage (typical values)
Figure 6. ESD response to IEC 61000-4-2
(+8 kV cont act discharge) Figure 7. ESD response to IEC 61000-4-2
(-8 kV contact disc harge)
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Figure 8. Digital crosstalk dat0 versus clk line
(VCC = 3.9 V, Rload = 1 M
Figure 9. Line cap acit an ce versus frequency
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DocID027072 Rev 1 5/8
EM IF06-HSD04F3 Packag e informati on
2 Package information
Epoxy meets UL94, V0
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPA CK ®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an S T trademark .
Figu re 10 . Fli p- Chi p pac k age dime n s io ns
Figu re 11. Fo ot prin t rec om m endati ons Figu re 12. Ma rki ng
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Pack age informa tion EM IF06-HS D04F3
6/8 DocID027072 Rev 1
Figure 13. Tape and reel specification
Note: More information is available in the application notes:
AN2348, “IPAD™ 400 µm Flip Chip: package description and recommendations for use”
AN1751, “EMI filters: recommendat ions and m easurem ents”
AN4541, “EMI filters for S D3.0 card: High speed SD card and fil tering devices”
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DocID027072 Rev 1 7/8
EM IF06-HSD04F3 Order ing inform ation
3 Ordering information
Figure 14. Ordering information scheme
4 Revision history
Table 5. Ordering information
Order code Marking Package Wei ght Base qty Delivery mo de
EMIF06-HSD04F3 LF Flip Chip 2.77 mg 5000 Tape and reel (7”)
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Table 6. Document revision history
Date Revision Changes
04-Nov-2014 1 Ini ti al release
EMIF06-HSD04F3
8/8 DocID027072 Rev 1
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