1.95 GHz to 3.4 GHz, Tunable Band-Pass Filter HMC891ALP5E Data Sheet FUNCTIONAL BLOCK DIAGRAM Amplitude settling time: 200 ns Re-entry rejection (wideband rejection): 30 dB Single-chip replacement for mechanically tuned designs RoHs compliant, 32-lead, 5 mm x 5 mm LFCSP package APPLICATIONS HMC891ALP5E GND GND RFIN RFOUT VFCTL VBWCTL Testing and measurement equipment Military radar and electronic warfare/electronic counter measure (ECM) Satellite communication and space Industrial and medical equipment 16962-001 FEATURES Figure 1. GENERAL DESCRIPTION The HMC891ALP5E is a monolithic microwave integrated circuit (MMIC) band-pass filter that features a user-selectable pass band frequency. The 3 dB filter bandwidth is approximately 9% and the 20 dB filter bandwidth is approximately 23%. The center frequency (fCENTER) can be varied between 1.95 GHz and 3.4 GHz by applying an analog tune voltage between 0 V and 14 V. Rev. 0 This tunable filter can be used as a smaller alternative to physically large switched filter banks and cavity tuned filters. The HMC891ALP5E has excellent microphonics due to the monolithic design, and provides a dynamically adjustable solution in advanced communications applications. Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 (c)2018 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com HMC891ALP5E Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Typical Performance Characteristics ..............................................6 Applications ....................................................................................... 1 Theory of Operation .........................................................................9 Functional Block Diagram .............................................................. 1 Applications Information .............................................................. 10 General Description ......................................................................... 1 Typical Application Circuit ....................................................... 10 Revision History ............................................................................... 2 Evaluation Printed Circuit Board (PCB) ................................ 10 Specifications..................................................................................... 3 Outline Dimensions ....................................................................... 11 Absolute Maximum Ratings............................................................ 4 Ordering Guide .......................................................................... 11 Pin Configuration and Function Descriptions ............................. 5 REVISION HISTORY 9/2018--Revision 0: Initial Version Rev. 0 | Page 2 of 11 Data Sheet HMC891ALP5E SPECIFICATIONS TA = 25C, center frequency control voltage (VFCTL) = bandwidth control voltage (VBWCTL), unless otherwise noted. Table 1. Parameter FREQUENCY RANGE Center Frequency (fCENTER) BANDWIDTH 3 dB 3 dB Bandwidth Control (VBWCTL) REJECTION Low-Side High-Side Re-entry LOSS Insertion Loss Return Loss DYNAMIC PERFORMANCE Max Input Power for Linear Operation Input Third-Order Intercept (Input IP3) Group Delay Phase Sensitivity Amplitude Settling Drift Rate RESIDUAL PHASE NOISE 1 MHz Offset TUNING Voltages (VFCTL, VBWCTL) Current Center Frequency Control Current (IFCTL) Bandwidth Control Current (IBWCTL) Min Typ 1.95 Max Unit 3.4 GHz 9 3 % % 0.89 x fCENTER 1.13 x fCENTER 6.40 x fCENTER Percent change of bandwidth over fCENTER as voltage changes 20 dB 20 dB 30 dB 8 10 dB dB 10 0 Test Conditions/Comments dBm 32 dBm 3 3.6 200 ns Rad/V ns 0.6 MHz/C -165 dBc/Hz Input power (PIN) = 20 dBm, two tone Time to settle to minimum insertion loss, within 0.5 dB of static insertion loss 14 V Each pin can be driven independently 1 A Rated current for each pin 1 A Rated current for each pin Rev. 0 | Page 3 of 11 HMC891ALP5E Data Sheet ABSOLUTE MAXIMUM RATINGS ESD CAUTION Table 2. Parameter Tuning Voltage (VFCTL, VBWCTL) Current (IFCTL, IBWCTL) RF Input Power Temperature Operating Temperature Range Storage Temperature Range Junction Temperature for 1 Million Mean Time to Failure (MTTF) Nominal Junction Temperature (Electronic Pad Temperature, TEPAD = +85C, PIN = 10 dBm) Electrostatic Discharge (ESD) Rating Human Body Model (HBM) Field Induced Charge Device Model (FICDM) Moisture Sensitivity Level (MSL) Rating Rating -0.5 V to +15 V 1 mA 27 dBm -40C to +85C -65C to +150C 175C 90C 1500 V 1250 V MSL3 Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. 0 | Page 4 of 11 Data Sheet HMC891ALP5E 32 31 30 29 28 27 26 25 NIC NIC NIC NIC NIC NIC NIC NIC PIN CONFIGURATION AND FUNCTION DESCRIPTIONS 1 2 3 4 5 6 7 8 HMC891ALP5E TOP VIEW (Not to Scale) 24 23 22 21 20 19 18 17 NIC NIC NIC NIC GND RFOUT NIC NIC NOTES 1. NIC = NOT INTERNALLY CONNECTED. ALL DATA SHOWN HEREIN WAS MEASURED WITH THESE PINS CONNECTED TO RF/DC GROUND EXTERNALLY. 2. EXPOSED PAD. THE PACKAGE BOTTOM HAS AN EXPOSED PAD THAT MUST BE CONNECTED TO RF/DC GROUND. 16962-002 NIC 9 NIC 10 NIC 11 VFCTL 12 NIC 13 VBWCTL 14 NIC 15 NIC 16 NIC NIC NIC NIC GND RFIN NIC NIC Figure 2. Pin Configuration Table 3. Pin Function Descriptions Pin No. 1 to 4, 7 to 11, 13, 15 to 18, 21 to 32 5, 20 6 Mnemonic NIC 12 14 19 VFCTL VBWCTL RFOUT GND RFIN EPAD Description Not Internally Connected. These pins are not connected internally. All data shown herein was measured with these pins externally connected to RF/dc ground. Ground. Connect these pins to RF/dc ground. Radio Frequency Input. This pin is dc-coupled and matched to 50 . Do not apply an external voltage to this pin. Center Frequency Control Voltage. This pin controls the fCENTER of the device. Bandwidth Control Voltage. This pin controls the bandwidth of the device. Radio Frequency Output. This pin is dc-coupled and matched at 50 . Do not apply an external voltage to this pin. Exposed Pad. The package bottom has an exposed metal pad that must be connected to RF/dc ground. INTERFACE SCHEMATICS VBWCTL 46nH 250 42.4pF 15pF 16962-006 16962-003 GND Figure 3. GND Interface Schematic Figure 6. VBWCTL Interface Schematic RFIN RFOUT 250 46nH Figure 4. RFIN Interface Schematic 16962-007 250 16962-004 46nH Figure 7. RFOUT Interface Schematic 31.8pF 250 20pF 16962-005 VFCTL 46nH Figure 5. VFCTL Interface Schematic Rev. 0 | Page 5 of 11 HMC891ALP5E Data Sheet TYPICAL PERFORMANCE CHARACTERISTICS 0 0 -30 -40 14V 7V 0V -50 -10 S22, 14V S11, 14V S22, 7V S11, 7V S22, 0V S11, 0V -20 -60 0 5 10 15 20 25 -30 16962-008 -70 30 RF FREQUENCY (GHz) Figure 8. Insertion Loss vs. Broadband RF Frequency at Various VFCTL = VBWCTL Voltages 0 5 10 15 20 25 30 RF FREQUENCY (GHz) 16962-011 -20 RETURN LOSS (dB) INSERTION LOSS (dB) -10 Figure 11. Return Loss vs. Broadband RF Frequency at Various VFCTL = VBWCTL Voltages 0 0 -2 RETURN LOSS (dB) INSERTION LOSS (dB) -5 -4 -6 -8 -10 14V 7V 0V -12 -10 S22, 14V S11, 14V S22, 7V S11, 7V S22, 0V S11, 0V -15 -20 0 1 2 3 4 5 6 RF FREQUENCY (GHz) -25 16962-009 -16 0 1 2 3 4 5 6 RF FREQUENCY (GHz) Figure 9. Insertion Loss vs. RF Frequency at Various VFCTL = VBWCTL Voltages 16962-012 -14 Figure 12. Return Loss vs. RF Frequency at Various VFCTL = VBWCTL Voltages 0 0 -2 RETURN LOSS (dB) INSERTION LOSS (dB) -5 -4 -6 -8 -10 +85C +25C -40C -12 -10 -15 +85C +25C -40C -20 0 1 2 3 4 RF FREQUENCY (GHz) 5 6 -25 16962-010 -16 0 1 2 3 4 5 6 RF FREQUENCY (GHz) Figure 10. Insertion Loss vs. RF Frequency at Various Temperatures, VFCTL = VBWCTL = 7 V Figure 13. Return Loss vs. RF Frequency at Various Temperatures, VFCTL = VBWCTL = 7 V Rev. 0 | Page 6 of 11 16962-013 -14 Data Sheet HMC891ALP5E 4.0 0 3.5 +85C +25C -40C 3.0 INSERTION LOSS (dB) CENTER FREQUENCY (GHz) -2 2.5 2.0 1.5 +85C +25C -40C 1.0 -4 -6 -8 -10 0 2 4 6 8 10 12 14 VFCTL = VBWCTL (V) -12 16962-014 0 0 4 6 8 10 14 Figure 17. Insertion Loss vs. VFCTL = VBWCTL at Various Temperatures 20 10 0 0 2 4 6 8 10 12 14 VFCTL = VBWCTL (V) Figure 15. 3 dB Bandwidth vs. VFCTL = VBWCTL at Various Temperatures -10 +85C +25C -40C -15 -20 16962-015 +85C +25C -40C 5 -5 0 2 4 6 8 10 12 14 VFCTL = VBWCTL (V) 16962-018 MAXIMUM RETURN LOSS (dB) 0 15 Figure 18. Maximum Return Loss in a 2 dB Bandwidth vs. VFCTL = VBWCTL at Various Temperatures 1.0 1.5 +85C +25C -40C +85C +25C -40C HIGH-SIDE REJECTION RATIO 0.9 0.8 0.7 0.6 1.4 1.3 1.2 1.1 REJECTION RATIO IS DEFINED AS THE RATIO OF THE FREQUENCY AT WHICH THE RELATIVE INSERTION LOSS IS 20dB TO fCENTER . 0.5 0 2 4 6 8 10 12 VFCTL = VBWCTL (V) 14 Figure 16. Low-Side Rejection Ratio vs. VFCTL = VBWCTL at Various Temperatures 1.0 0 2 4 6 8 10 12 14 VFCTL = VBWCTL (V) Figure 19. High-Side Rejection Ratio vs. VFCTL = VBWCTL at Various Temperatures Rev. 0 | Page 7 of 11 16962-019 REJECTION RATIO IS DEFINED AS THE RATIO OF THE FREQUENCY AT WHICH THE RELATIVE INSERTION LOSS IS 20dB TO fCENTER . 16962-016 LOW-SIDE REJECTION RATIO 12 VFCTL = VBWCTL (V) Figure 14. Center Frequency (fCENTER) vs. VFCTL = VBWCTL at Various Temperatures BANDWIDTH (%) 2 16962-017 0.5 HMC891ALP5E Data Sheet 200 4.0 14V 7V 0V 3.5 150 3.0 GROUP DELAY (ns) TUNING SENSITIVITY (MHz/V) +85C +25C -40C 100 50 2.5 2.0 1.5 1.0 0 2 4 6 8 10 12 14 VFCTL = VBWCTL (V) 0 1.0 16962-020 0 Figure 20. Tuning Sensitivity vs. VFCTL = VBWCTL at Various Temperatures 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 RF FREQUENCY (GHz) 16962-023 0.5 Figure 23. Group Delay vs. RF Frequency at Various VFCTL = VBWCTL Voltages 40 5.0 +85C +25C -40C 4.5 +85C +25C -40C 35 4.0 INPUT IP3 (dBm) GROUP DELAY (ns) 30 3.5 3.0 2.5 2.0 1.5 25 20 15 10 1.0 5 0 0 2 4 6 8 10 12 14 VFCTL = VBWCTL (V) 0 16962-021 0 Figure 21. Group Delay vs. VFCTL = VBWCTL at Various Temperature 4 6 8 10 12 14 VFCTL = VBWCTL (V) Figure 24. Input IP3 vs. VFCTL = VBWCTL at Various Temperatures, Input Power (PIN) = 20 dBm -100 15 14V 7V 1V 10 -120 -130 -140 -150 -160 5 0 -5 -10 -15 -20 100 1k 10k 100k 1M OFFSET FREQUENCY (Hz) Figure 22. Residual Phase Noise vs. Offset Frequency at Various VFCTL = VBWCTL Voltages 10M -25 -1 16962-022 -170 10 14V 10V 7V 3V 1V 0V 4 9 14 INPUT POWER (dBm) 19 24 16962-025 PHASE SHIFT (Degrees) -110 PHASE NOISE (dBc/Hz) 2 16962-024 0.5 Figure 25. Phase Shift vs. Input Power (PIN), at Various VFCTL = VBWCTL Voltages Rev. 0 | Page 8 of 11 Data Sheet HMC891ALP5E THEORY OF OPERATION The HMC891ALP5E is a MMIC band-pass filter that features a user-selectable pass band frequency. Varying the applied analog tuning voltage between 0 V and 14 V at VFCTL varies the fCENTER frequency between 1.95 GHz and 3.4 GHz. The bandwidth of the filter is adjustable by using the VBWCTL control voltage, which can vary from 0 V to 14 V. Typical operation is to tie the VFCTL and VBWCTL control voltages together. Rev. 0 | Page 9 of 11 HMC891ALP5E Data Sheet APPLICATIONS INFORMATION PRIMARY SILKSCREEN TYPICAL APPLICATION CIRCUIT PRIMARY SOLDER MASK 0.5oz Cu L2_GND PLANE PREPREG AS REQUIRED 0.5oz Cu L3_GND PLANE 370HR 0.5oz Cu C2 100pF (LAYER 2) (LAYER 3) SECONDARY SIDE (LAYER 4) Figure 27. Cross Sectional View of the EV1HMC891ALP5 PCB Layers OUT J2 GND 16962-026 PACKAGE BASE VFCTL VBWCTL J4 J3 0.5oz Cu PRIMARY SIDE (LAYER 1) ARLON OR ROGERS CORE 10MILS 1MIL (CRITICAL) 16962-028 NOMINAL FINISHED BOARD THICKNESS 0.062" 10% 27 26 25 24 23 22 21 20 19 18 17 14 15 16 C1 100pF 9 10 IN J1 3 4 5 6 7 8 HMC891ALP5E 11 12 13 1 2 30 29 28 32 31 Figure 26 shows the typical application circuit for the HMC891ALP5E. The RFIN and RFOUT pins are dc-coupled and require external, 100 pF series capacitors (C1 and C2). Figure 26. Typical Application Circuit EVALUATION PRINTED CIRCUIT BOARD (PCB) Table 4. Bill of Materials for the EV1HMC891ALP5 Item J1, J2 J3, J4 C1, C2 U1 PCB 1 2 Description PCB mount, Subminiature Version A (SMA) connector, SRI PCB mount SMA connector, Johnson Capacitor, 100 pF, 0402 HMC891ALP5E 08-0495982 evaluation PCB Circuit board material is Arlon 25FR or Rogers 25FR. 08-049598 is the raw, bare PCB identifier. Reference the EV1HMC891ALP5 when ordering the complete evaluation PCB. 16962-027 All RF traces are routed on Layer 1 (primary side) and the remaining three layers are ground planes that provide a solid ground for RF transmission lines, as shown in Figure 27. The top dielectric material is Rogers 4350, which offers low loss performance. The prepreg material in Layer 2 attaches the Isola 370HR core layer with copper traces layers above and below the core layer. The prepreg material and the Isola 370HR core layer are used to achieve the required board finish thickness. The circuit board in this application uses RF circuit design techniques. Signal lines must have an impedance of 50 , and the package ground leads and exposed pad must be connected directly to the ground plane (see Figure 27). Use a sufficient number of via holes to connect the top and bottom ground planes. The evaluation circuit board shown in Figure 28 is available from Analog Devices, Inc. upon request. Figure 28. Evaluation PCB, Top Layer Outline Dimensions Rev. 0 | Page 10 of 11 Data Sheet HMC891ALP5E OUTLINE DIMENSIONS DETAIL A (JEDEC 95) 5.10 5.00 SQ 4.90 25 1 0.50 BSC 3.75 3.60 SQ 3.55 EXPOSED PAD 8 17 TOP VIEW 0.80 0.75 0.70 TOP VIEW PKG-004570 SEATING PLANE PIN 1 INDIC ATOR AREA OPTIONS (SEE DETAIL A) 32 24 0.50 0.40 0.30 16 9 BOTTOM VIEW 0.05 MAX 0.02 NOM COPLANARITY 0.08 0.20 REF 0.20 MIN FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. COMPLIANT TO JEDEC STANDARDS MO-220-WHHD-5 10-20-2017-C PIN 1 INDICATOR 0.30 0.25 0.18 Figure 29. 32-Lead Lead Frame Chip Scale Package [LFCSP] 5 mm x 5 mm Body and 0.75 mm Package Height (CP-32-12) Dimensions shown in millimeters ORDERING GUIDE Model1 HMC891ALP5E HMC891ALP5ETR EV1HMC891ALP5 1 Temperature Range -40C to +85C -40C to +85C Package Description 32-Lead Lead Frame Chip Scale Package [LFCSP] 32-Lead Lead Frame Chip Scale Package [LFCSP] Evaluation PCB All models are RoHS-Compliant Parts. (c)2018 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D16962-0-9/18(0) Rev. 0 | Page 11 of 11 Package Option CP-32-12 CP-32-12