1.95 GHz to 3.4 GHz,
Tunable Band-Pass Filter
Data Sheet
HMC891ALP5E
Rev. 0 Document Feedback
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rights of third parties that may result from its use. Specifications subject to change without notice. No
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Trademarks and registered trademarks are the property of their respective owners.
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Tel: 781.329.4700 ©2018 Analog Devices, Inc. All rights reserved.
Technical Support www.analog.com
FEATURES
Amplitude settling time: 200 ns
Re-entry rejection (wideband rejection): ≥30 dB
Single-chip replacement for mechanically tuned designs
RoHs compliant, 32-lead, 5 mm x 5 mm LFCSP package
APPLICATIONS
Testing and measurement equipment
Military radar and electronic warfare/electronic counter
measure (ECM)
Satellite communication and space
Industrial and medical equipment
FUNCTIONAL BLOCK DIAGRAM
RFOUTRFIN
VFCTL VBWCTL
GNDGND
16962-001
HMC891ALP5E
Figure 1.
GENERAL DESCRIPTION
The HMC891ALP5E is a monolithic microwave integrated
circuit (MMIC) band-pass filter that features a user-selectable
pass band frequency. The 3 dB filter bandwidth is approximately
9% and the 20 dB filter bandwidth is approximately 23%. The
center frequency (fCENTER) can be varied between 1.95 GHz and
3.4 GHz by applying an analog tune voltage between 0 V and 14 V.
This tunable filter can be used as a smaller alternative to
physically large switched filter banks and cavity tuned filters.
The HMC891ALP5E has excellent microphonics due to the
monolithic design, and provides a dynamically adjustable
solution in advanced communications applications.
HMC891ALP5E Data Sheet
Rev. 0 | Page 2 of 11
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Absolute Maximum Ratings ............................................................ 4
Pin Configuration and Function Descriptions ............................. 5
Typical Performance Characteristics ..............................................6
Theory of Operation .........................................................................9
Applications Information .............................................................. 10
Typical Application Circuit ....................................................... 10
Evaluation Printed Circuit Board (PCB) ................................ 10
Outline Dimensions ....................................................................... 11
Ordering Guide .......................................................................... 11
REVISION HISTORY
9/2018—Revision 0: Initial Version
Data Sheet HMC891ALP5E
Rev. 0 | Page 3 of 11
SPECIFICATIONS
TA = 25°C, center frequency control voltage (VFCTL) = bandwidth control voltage (VBWCTL), unless otherwise noted.
Table 1.
Parameter Min Typ Max Unit Test Conditions/Comments
FREQUENCY RANGE
Center Frequency (fCENTER) 1.95 3.4 GHz
BANDWIDTH
3 dB 9 %
3 dB Bandwidth Control (VBWCTL) ±3 % Percent change of bandwidth over fCENTER as voltage changes
REJECTION
Low-Side 0.89 × fCENTER ≥20 dB
High-Side 1.13 × fCENTER ≥20 dB
Re-entry 6.40 × fCENTER ≤30 dB
LOSS
Insertion Loss 8 dB
Return Loss 10 dB
DYNAMIC PERFORMANCE
Max Input Power for Linear
Operation
10 dBm
Input Third-Order Intercept
(Input IP3)
32 dBm Input power (PIN) = 20 dBm, two tone
Group Delay 3 ns
Phase Sensitivity 3.6 Rad/V
Amplitude Settling 200 ns Time to settle to minimum insertion loss, within ≤0.5 dB of
static insertion loss
Drift Rate 0.6 MHz/°C
RESIDUAL PHASE NOISE
1 MHz Offset −165 dBc/Hz
TUNING
Voltages (VFCTL, VBWCTL) 0 14 V Each pin can be driven independently
Current
Center Frequency Control
Current (IFCTL)
±1 µA Rated current for each pin
Bandwidth Control Current
(IBWCTL)
±1 µA Rated current for each pin
HMC891ALP5E Data Sheet
Rev. 0 | Page 4 of 11
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
Tuning
Voltage (VFCTL, VBWCTL) −0.5 V to +15 V
Current (IFCTL, IBWCTL) ±1 mA
RF Input Power 27 dBm
Temperature
Operating Temperature Range −40°C to +85°C
Storage Temperature Range
−65°C to +150°C
Junction Temperature for 1 Million Mean
Time to Failure (MTTF)
175°C
Nominal Junction Temperature
(Electronic Pad Temperature, TEPAD =
+85°C, PIN = 10 dBm)
90°C
Electrostatic Discharge (ESD) Rating
Human Body Model (HBM) 1500 V
Field Induced Charge Device Model
(FICDM)
1250 V
Moisture Sensitivity Level (MSL) Rating MSL3
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
ESD CAUTION
Data Sheet HMC891ALP5E
Rev. 0 | Page 5 of 11
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
NOTES
1. NI C = NOT INT E RNALLY CONNECTED. ALL DATA SHOWN
HEREI N WAS MEASURE D WI TH T HE SE P INS CONNECTED
TO RF/ DC GRO UND E X TERNALLY.
2. EXPOSED PAD. T HE PACKAG E BOT TOM HAS AN EXPOSED
PAD THAT M US T BE CONNECTED TO RF/ DC GRO UND.
24 NIC
23 NIC
22 NIC
21 NIC
20 GND
19 RFOUT
18 NIC
17 NIC
1
2
3
4
5
6
7
8
NIC
NIC
NIC
NIC
GND
RFIN
NIC
NIC
9
10
11
12
13
14
15
16
NIC
NIC
NIC
V
FCTL
NIC
V
BWCTL
NIC
NIC
32
31
30
29
28
27
26
25
NIC
NIC
NIC
NIC
NIC
NIC
NIC
NIC
HMC891ALP5E
TOP VIEW
(No t t o Scale)
16962-002
Figure 2. Pin Configuration
Table 3. Pin Function Descriptions
Pin No. Mnemonic Description
1 to 4, 7 to 11, 13, 15 to
18, 21 to 32
NIC Not Internally Connected. These pins are not connected internally. All data shown herein was measured
with these pins externally connected to RF/dc ground.
5, 20 GND Ground. Connect these pins to RF/dc ground.
6 RFIN Radio Frequency Input. This pin is dc-coupled and matched to 50 Ω. Do not apply an external voltage to
this pin.
12 VFCTL Center Frequency Control Voltage. This pin controls the fCENTER of the device.
14 VBWCTL Bandwidth Control Voltage. This pin controls the bandwidth of the device.
19
RFOUT
Radio Frequency Output. This pin is dc-coupled and matched at 50 Ω. Do not apply an external
voltage to this pin.
EPAD Exposed Pad. The package bottom has an exposed metal pad that must be connected to RF/dc
ground.
INTERFACE SCHEMATICS
GND
16962-003
Figure 3. GND Interface Schematic
RFIN
46nH
250Ω
16962-004
Figure 4. RFIN Interface Schematic
V
FCTL
31.8pF 20pF
46nH 250Ω
16962-005
Figure 5. VFCTL Interface Schematic
V
BWCTL
42.4pF 15pF
46nH 250Ω
16962-006
Figure 6. VBWCTL Interface Schematic
RFOUT
46nH
250Ω
16962-007
Figure 7. RFOUT Interface Schematic
HMC891ALP5E Data Sheet
Rev. 0 | Page 6 of 11
TYPICAL PERFORMANCE CHARACTERISTICS
0
–70
–60
–50
–40
–30
–20
–10
INSERTION LOSS (dB)
RF FREQ UE NCY ( GHz)
14V
7V
0V
0 5 10 15 20 25 30
16962-008
Figure 8. Insertion Loss vs. Broadband RF Frequency at Various VFCTL = VBWCTL
Voltages
0
–16
–14
–12
–10
–8
–6
–4
–2
0 1 2 3 4 5 6
INSERTION LOSS (dB)
RF FREQ UE NCY ( GHz)
14V
7V
0V
16962-009
Figure 9. Insertion Loss vs. RF Frequency at Various VFCTL = VBWCTL Voltages
0
–16
–14
–12
–10
–8
–6
–4
–2
0 1 2 3 4 5 6
INSERTION LOSS (dB)
RF FREQ UE NCY ( GHz)
+85°C
+25°C
–40°C
16962-010
Figure 10. Insertion Loss vs. RF Frequency at Various Temperatures,
VFCTL = VBWCTL = 7 V
0
–30
–20
–10
0 5 10 15 20 25 30
RET URN LOS S ( dB)
RF FREQ UE NCY ( GHz)
S22, 14V
S11, 14V
S22, 7V
S11, 7V
S22, 0V
S11, 0V
16962-011
Figure 11. Return Loss vs. Broadband RF Frequency at Various VFCTL = VBWCTL
Voltages
0
–25
–15
–5
–20
–10
RETURN LO S S ( dB)
RF FREQ UE NCY ( GHz)
S22, 14V
S11, 14V
S22,7V
S11, 7V
S22, 0V
S11, 0V
012345 6
16962-012
Figure 12. Return Loss vs. RF Frequency at Various VFCTL = VBWCTL Voltages
0
–25
–15
–5
–20
–10
RETURN LO S S ( dB)
RF FREQ UE NCY ( GHz)
0 1 2 3 4 5 6
+85°C
+25°C
–40°C
16962-013
Figure 13. Return Loss vs. RF Frequency at Various Temperatures,
VFCTL = VBWCTL = 7 V
Data Sheet HMC891ALP5E
Rev. 0 | Page 7 of 11
4.0
0
1.5
3.5
0.5
2.5
1.0
3.0
2.0
CENT ER FREQUENCY ( GHz)
V
FCTL
= V
BWCTL
(V)
0 2 46810 1412
+85°C
+25°C
–40°C
16962-014
Figure 14. Center Frequency (fCENTER) vs. VFCTL = VBWCTL at Various Temperatures
20
0
15
5
10
BANDWIDT H ( %)
V
FCTL
= V
BWCTL
(V)
0 2 4 6 810 1412
+85°C
+25°C
–40°C
16962-015
Figure 15. 3 dB Bandwidth vs. VFCTL = VBWCTL at Various Temperatures
1.0
0.5
0.9
0.7
0.6
0.8
LOW-SIDE REJECTION RATIO
VFCTL = VBWCTL (V)
0246810 1412
+85°C
+25°C
–40°C
16962-016
REJECT IO N RATI O I S DE FI NE D AS THE RATI O
OF T HE FREQUENCY AT W HICH T HE RE LAT IVE
INSERTION LOSS IS 20dB TO
f
CENTER.
Figure 16. Low-Side Rejection Ratio vs. VFCTL = VBWCTL
at Various Temperatures
0
–2
–12
–4
–8
–10
–6
INSERTION LOSS (dB)
V
FCTL
= V
BWCTL
(V)
0 2 46 8 10 1412
+85°C
+25°C
–40°C
16962-017
Figure 17. Insertion Loss vs. VFCTL = VBWCTL at Various Temperatures
V
FCTL
= V
BWCTL
(V)
0 2 4 6 810 14
12
+85°C
+25°C
–40°C
0
–20
–15
–5
–10
MAXIMUM RETURN LO SS (d B)
16962-018
Figure 18. Maximum Return Loss in a 2 dB Bandwidth vs. VFCTL = VBWCTL at
Various Temperatures
1.5
1.0
1.4
1.2
1.1
1.3
HIG H-SI DE RE JE CTI ON RAT IO
VFCTL = VBWCTL (V)
0246810 1412
+85°C
+25°C
–40°C
16962-019
REJECT IO N RATI O I S DE FI NE D AS THE RATI O
OF T HE FREQUENCY AT W HICH T HE RE LAT IVE
INSERTION LOSS IS 20dB TO
f
CENTER.
Figure 19. High-Side Rejection Ratio vs. VFCTL = VBWCTL at Various
Temperatures
HMC891ALP5E Data Sheet
Rev. 0 | Page 8 of 11
200
0
150
50
100
TUNING SENSITIVI T Y (MHz/V)
V
FCTL
= V
BWCTL
(V)
02 4 6810 1412
+85°C
+25°C
–40°C
16962-020
Figure 20. Tuning Sensitivity vs. VFCTL = VBWCTL at Various Temperatures
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
GROUP DELAY ( ns)
V
FCTL
= V
BWCTL
(V)
0246810 1412
+85°C
+25°C
–40°C
16962-021
Figure 21. Group Delay vs. VFCTL = VBWCTL at Various Temperature
–100
–170
–160
–150
–140
–130
–120
–110
PHASE NOISE (dBc/Hz)
OFFSET F REQUENCY (Hz)
10 100 1k 10k 100k 1M 10M
14V
7V
1V
16962-022
Figure 22. Residual Phase Noise vs. Offset Frequency at
Various VFCTL = VBWCTL Voltages
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
GROUP DELAY ( ns)
RF F RE QUENCY ( GHz)
1.0 5.04.54.03.53.02.52.01.5
14V
7V
0V
16962-023
Figure 23. Group Delay vs. RF Frequency at Various VFCTL = VBWCTL Voltages
40
0
30
10
20
35
25
5
15
INP UT IP 3 (d Bm)
V
FCTL
= V
BWCTL
(V)
0 2 4 6 8 10 1412
+85°C
+25°C
–40°C
16962-024
Figure 24. Input IP3 vs. VFCTL = VBWCTL at Various Temperatures, Input Power
(PIN) = 20 dBm
15
10
5
0
–5
–10
–15
–20
–25
PHASE S HIF T (Degrees)
INPUT POW E R ( dBm)
–1 24191494
0V
1V
3V
7V
10V
14V
16962-025
Figure 25. Phase Shift vs. Input Power (PIN), at Various VFCTL = VBWCTL Voltages
Data Sheet HMC891ALP5E
Rev. 0 | Page 9 of 11
THEORY OF OPERATION
The HMC891ALP5E is a MMIC band-pass filter that features a
user-selectable pass band frequency. Varying the applied analog
tuning voltage between 0 V and 14 V at VFCTL varies the fCENTER
frequency between 1.95 GHz and 3.4 GHz. The bandwidth of
the filter is adjustable by using the VBWCTL control voltage, which
can vary from 0 V to 14 V. Typical operation is to tie the VFCTL
and VBWCTL control voltages together.
HMC891ALP5E Data Sheet
Rev. 0 | Page 10 of 11
APPLICATIONS INFORMATION
TYPICAL APPLICATION CIRCUIT
Figure 26 shows the typical application circuit for the
HMC891ALP5E. The RFIN and RFOUT pins are dc-coupled
and require external, 100 pF series capacitors (C1 and C2).
24
23
22
21
20
19
18
17
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
PACKAGE
BASE
GND
C2
100pF
C1
100pF OUT
J2
IN
J1
V
BWCTL
J3
V
FCTL
J4
HMC891ALP5E
16962-026
Figure 26. Typical Application Circuit
EVALUATION PRINTED CIRCUIT BOARD (PCB)
All RF traces are routed on Layer 1 (primary side) and the
remaining three layers are ground planes that provide a solid
ground for RF transmission lines, as shown in Figure 27. The
top dielectric material is Rogers 4350, which offers low loss
performance. The prepreg material in Layer 2 attaches the Isola
370HR core layer with copper traces layers above and below the
core layer. The prepreg material and the Isola 370HR core layer
are used to achieve the required board finish thickness.
NOMINAL
FINISHED
BOARD
T
HICKNESS 0.062"
±10%
PRIMARY SILKSCREEN
PRIMARY SOLDER MASK
PRIMARY SIDE (LAYER 1)
L2_GND PLANE (LAYER 2)
L3_GND PLANE (LAYER 3)
SECONDARY SIDE (LAYER 4)
0.5oz Cu
ARLON OR ROGERS CORE 10MILS ±1MIL (CRITICAL)
0.5oz Cu
PREPREG AS REQUIRED
0.5oz Cu
370HR
0.5oz Cu
16962-028
Figure 27. Cross Sectional View of the EV1HMC891ALP5
PCB Layers
The circuit board in this application uses RF circuit design
techniques. Signal lines must have an impedance of 50 Ω, and
the package ground leads and exposed pad must be connected
directly to the ground plane (see Figure 27). Use a sufficient
number of via holes to connect the top and bottom ground
planes. The evaluation circuit board shown in Figure 28 is
available from Analog Devices, Inc. upon request.
Table 4. Bill of Materials for the EV1HMC891ALP5
Item Description
J1, J2 PCB mount, Subminiature Version A (SMA) connector, SRI
J3, J4 PCB mount SMA connector, Johnson
C1, C2 Capacitor, 100 pF, 0402
U1 HMC891ALP5E
PCB 08-0495982 evaluation PCB
1 Circuit board material is Arlon 25FR or Rogers 25FR.
2 08-049598 is the raw, bare PCB identifier. Reference the EV1HMC891ALP5
when ordering the complete evaluation PCB.
16962-027
Figure 28. Evaluation PCB, Top Layer Outline Dimensions
Data Sheet HMC891ALP5E
Rev. 0 | Page 11 of 11
OUTLINE DIMENSIONS
0.50
0.40
0.30
10-20-2017-C
1
0.50
BSC
BOTTOM VIEWTOP VIEW
TOP VIEW
PIN 1
INDICATOR
32
916
17
24
25
8
EXPOSED
PAD
SEATING
PLANE
0.05 MAX
0.02 NOM
0.20 REF
COPLANARITY
0.08
0.30
0.25
0.18
5.10
5.00 SQ
4.90
0.80
0.75
0.70
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.20 MIN
3.75
3.60 SQ
3.55
COMPLIANT TO JEDEC STANDARDS MO-220-WHHD-5
PKG-004570
PIN 1
INDICATOR AREA OPTIONS
(SEE DETAIL A)
DETAIL A
(JEDEC 95)
Figure 29. 32-Lead Lead Frame Chip Scale Package [LFCSP]
5 mm × 5 mm Body and 0.75 mm Package Height
(CP-32-12)
Dimensions shown in millimeters
ORDERING GUIDE
Model1 Temperature Range Package Description Package Option
HMC891ALP5E −40°C to +85°C 32-Lead Lead Frame Chip Scale Package [LFCSP] CP-32-12
HMC891ALP5ETR −40°C to +85°C 32-Lead Lead Frame Chip Scale Package [LFCSP] CP-32-12
EV1HMC891ALP5 Evaluation PCB
1 All models are RoHS-Compliant Parts.
©2018 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D16962-0-9/18(0)
