VOLTAGE RANGE 50 to 1000 Volts CURRENT 8.0 Amperes
RECTRON
SEMICONDUCTOR
TECHNICAL SPECIFICA TION
FEATURES
* Low leakage
* Low forward voltage
* Mounting position: Any
* Surge overload rating: 250 amperes peak
* Ideal for printed circuit boards
* High forward surge current capability
* UL listed the recognized component directory, file #E94233
* Epoxy: Device has UL flammability classification 94V-O
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 oC ambient temperature unless otherwise specified.
Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
RS801
THRU
RS807
MAXIMUM RATINGS
(At TA = 25oC unless otherwise noted)
RS-8
Dimensions in inches and (millimeters)
RATINGS
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Bridge Input Voltage
Peak Forward Surge Current 8.3 ms single half sine-wave
superimposed on rated load
SYMBOL
V
RRM
V
DC
I
O
I
FSM
V
RMS
Volts
Volts
Amps
8.0
250
UNITS
Maximum Average Forward Rectified Output Current at Tc = 75
o
C
50 200 400100 600 800 1000
35 140 28070 420 560 700
50 200 400100 600 800 1000 Volts
Amps
RS801 RS803 RS804RS802 RS805 RS806 RS807
Maximum DC Blocking Voltage
with heat sink
.268 (6.8)
.280 (7.1)
.180 (4.6)
.220 (5.6)
.048 (1.2)
.052 (1.3)
.740 (18.
.780 (19.
.895 (22.7)
.935 (23.7)(3.8 x 5.7L)
.15 x .23L
.600 (16.8)
.700 (17.8)
1.00
(25.4)
.300
(7.5)
.140
(3.5)
DIA.
MIN.
AC
HOLE THRU
MECHANICAL DA T A
SINGLE-PHASE GLASS PASSIVATED
SILICON BRIDGE RECTIFIER
ELECTRICAL CHARACTERISTICS
(At TA = 25oC unless otherwise noted)
2005-3
REV: A
Operating and Storage Temperature Range T
J,
T
STG
-55 to + 150
0
C
DC Blocking Voltage per element
CHARACTERISTICS
V
F
SYMBOL
I
R
UNITS
1.2
1.0 mAmps
uAmps
Maximum Reverse Current at Rated
Maximum Forward Voltage Drop per element at 8.0A DC Volts
@T
A
= 25
o
C
@T
A
= 125
o
C
5.0
RS801 RS803 RS804RS802 RS805 RS806 RS807
0
C/W
Rθ
JA
18
Rθ
JC
7
Typical Thermal Resistance (Note 1)
(Note 2)
NOTES:1.Units mounted in free air, no heatsink, P.C.B. at 0.375” (9.5mm) lead length with 0.5x0.5” (12x12mm) copper pads.
2.Units mounted on a 3.0x3.0x0.11” thick (7.5x7.5x0.3cm) Al. Plate heatsink.
3. “Fully ROHS compliant”, “100% Sn plating (Pb-free)”.