CM1206 ESD Protection Arrays, Chip Scale Package Features Product Description * The CM1206 family of transient voltage suppressor arrays provides a very high level of protection for sensitive electronic components that may be subjected to ESD. The back-to-back Zener connections provide ESD protection in cases where nodes with AC signals are present. * * * * * * Functionally and pin compatible with CMD's PACDN2404C/08C/16C family of devices OptiGuardTM coated for improved reliability at assembly 4, 8, or 16 transient voltage suppressors in a single package In-system Electrostatic Discharge (ESD) protection to +18kV contact discharge per IEC 61000-4-2 international standard Supports AC signal applications Compact Chip Scale Package (0.65mm pitch) format saves board space and eases layout in space critical applications compared to discrete solutions and traditional wire bonded packages Lead-free versions available These devices are designed and characterized to safely dissipate ESD strikes at levels well beyond the maximum requirements set forth in the IEC 61000-4-2 international standard. All I/Os are rated at +18kV using the IEC 61000-4-2 contact discharge method. Using the MIL-STD-883D (Method 3015) specification for Human Body Model (HBM) ESD, all pins are protected for contact discharges to greater than +30kV. The Chip Scale Package format of these devices enable extremely small footprints that are necessary in portable electronics such as cellular phones, PDAs, internet appliances and PCs. The large solder bumps allow for standard attachment to laminate boards without the use of underfill. Applications * * * * * * * * ESD protection for sensitive electronic equipment I/O port, keypad and button circuitry protection for portable devices Wireless Handsets Handheld PCs / PDAs MP3 Players Digital Cameras and Camcorders Notebooks Desktop PCs The CM1206 incorporates OptiGuardTM coating which results in improved reliability at assembly. The CM1206 is also available with optional lead-free finishing. Electrical Schematic B1 B2 B3 B1 B2 B3 B4 B5 D1 D2 D3 D4 D5 A1 A2 A3 A1 A2 A3 A4 A5 C1 C2 C3 C4 C5 B1 B2 B3 B4 B5 A1 A2 A3 A4 A5 CM1206-04CS/CP CM1206-08CS/CP CM1206-16CS/CP (c) 2004 California Micro Devices Corp. All rights reserved. 06/28/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 1 CM1206 PACKAGE / PINOUT DIAGRAMS Orientation Marking (see note 2) TOP VIEW BOTTOM VIEW (Bumps Down View) (Bumps Up View) 1 A 2 3 L06 B B1 B2 B3 A1 A2 A3 CM1206-04 CSP Package Orientation Marking (see note 2) 1 A TOP VIEW BOTTOM VIEW (Bumps Down View) (Bumps Up View) 2 3 4 5 120608 B B1 B2 B3 B4 B5 A1 A2 A3 A4 A5 CM1206-08 CSP Package TOP VIEW BOTTOM VIEW (Bumps Up View) (Bumps Down View) Orientation Marking (see note 2) 1 2 3 4 5 A B C CM1206 16 D D1 D2 D3 D4 D5 C1 C2 C3 C4 C5 B1 B2 B3 B4 B5 A1 A2 A3 A4 A5 CM1206-16 CSP Package Notes: 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. Ordering Information PART NUMBERING INFORMATION Lead-free Finish2 Standard Finish Bumps Package Ordering Part Number1 Part Marking Ordering Part Number1 6 CSP CM1206-04CS L06 CM1206-04CP L06 10 CSP CM1206-08CS 120608 CM1206-08CP 120608 20 CSP CM1206-16CS CM120616 CM1206-16CP CM120616 Part Marking Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark (c) 2004 California Micro Devices Corp. All rights reserved. 2 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 06/28/04 CM1206 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range RATING UNITS -65 to +150 C STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range RATING UNITS -40 to +85 C ELECTRICAL OPERATING CHARACTERISTICS (NOTE 1) SYMBOL PARAMETER CONDITIONS MIN VREV Reverse Standoff Voltage IDIODE=10A 5.9 ILEAK Leakage Current VIN=3.3V DC VSIG Signal Clamp Voltage Positive Clamp Negative Clamp ILOAD = 10mA In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Notes 2 & 3 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Notes 2 & 3 Channel Capacitance At 2.5V DC, f = 1MHz VESD VCL C 6.0 -9.2 TYP MAX UNITS V 7.6 -7.6 100 nA 9.2 -6.0 V V +30 kV +18 kV +14 -14 39 V V 47 pF Note 1: TA=25C unless otherwise specified. GND in this document refers to the lower supply voltage. Note 2: ESD applied to channel pins with respect to GND, one at a time. All other channels are open. All GND pins tied to ground. Note 3: These parameters are guaranteed by design and characterization. (c) 2004 California Micro Devices Corp. All rights reserved. 06/28/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 3 CM1206 Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER VALUE Pad Size on PCB 0.300mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.350mm Round Solder Stencil Thickness 0.125 - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.360mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance -- Edge To Corner Ball +50m Solder Ball Side Coplanarity +20m Maximum Dwell Time Above Liquidous 60 seconds Soldering Maximum Temperature 260C Non-Solder Mask Defined Pad 0.300mm DIA. Solder Stencil Opening 0.360mm DIA. Solder Mask Opening 0.350mm DIA. Figure 1. Recommended Non-Solder Mask Defined Pad Illustration Temperature (C) 250 200 150 100 50 0 Figure 2. Eutectic (SnPb) Solder Ball Reflow Profile 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 3. Lead-free (SnAgCu) Solder Ball Reflow Profile (c) 2004 California Micro Devices Corp. All rights reserved. 4 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 06/28/04 CM1206 Mechanical Details The CM1206 devices are packaged in custom Chip Scale Packages (CSP). CM1206-04 6-bump CSP Mechanical Specifications The CM1206-04 devices are packaged in a 6-bump custom Chip Scale Package (CSP). Dimensions are presented below. Mechanical Package Diagrams PACKAGE DIMENSIONS Package OptiGuardTM Coating A1 Custom CSP C1 B1 6 Millimeters Min Nom Inches Max Min Nom 3 Max A2 1.759 1.804 1.849 0.0693 0.0710 0.0728 B1 0.645 0.650 0.655 0.0254 0.0256 0.0258 B2 0.645 0.650 0.655 0.0254 0.0256 0.0258 B3 0.645 0.650 0.655 0.0254 0.0256 0.0258 C1 0.202 0.252 0.302 0.0080 0.0099 0.0119 C2 0.202 0.252 0.302 0.0080 0.0099 0.0119 D1 0.638 0.707 0.776 0.0251 0.0278 0.0306 D2 0.394 0.445 0.495 0.0155 0.0175 0.0195 A2 1.109 1.154 1.199 0.0437 0.0454 0.0472 2 1 SIDE VIEW A B C2 A1 # per tape and reel B3 B2 Bumps Dim BOTTOM VIEW 0.35 DIA. 63/37 Sn/Pb (Eutectic) or 95.5/3.8/0.7 Sn/Ag/Cu (Lead-free) SOLDER BUMPS D1 D2 DIMENSIONS IN MILLIMETERS Package Dimensions for CM1206-04 6-bump Chip Scale Package 3500 pieces Controlling dimension: millimeters CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 CM1206-04 1.804 X 1.154 X 0.707 1.98 X 1.32 X 0.91 TAPE WIDTH W REEL DIA. QTY PER REEL P0 P1 8mm 178mm (7") 3500 4mm 4mm 10 Pitches Cumulative Tolerance On Tape 0.2 mm Po Top Cover Tape Ao W Bo Ko For tape feeder reference only including draft. Concentric around B. Embossment Center Lines of Cavity P1 User Direction of Feed Figure 4. Tape and Reel Mechanical Data (c) 2004 California Micro Devices Corp. All rights reserved. 06/28/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 5 CM1206 Mechanical Details (cont'd) CM1206-08 10-bump CSP Mechanical Specifications The CM1206-08 devices are packaged in a 6-bump custom Chip Scale Package (CSP). Dimensions are presented below. Mechanical Package Diagrams PACKAGE DIMENSIONS Package Custom CSP Bumps 10 Millimeters Min Nom C1 B1 Inches Max Min Nom 5 Max 4 A2 3.059 3.104 3.149 0.1204 0.1222 0.1240 3 B1 0.645 0.650 0.655 0.0254 0.0256 0.0258 2 B2 0.645 0.650 0.655 0.0254 0.0256 0.0258 1 C1 0.202 0.252 0.302 0.0080 0.0099 0.0119 C2 0.202 0.252 0.302 0.0080 0.0099 0.0119 D1 0.638 0.707 0.776 0.0251 0.0278 0.0306 D2 0.394 0.445 0.495 0.0155 0.0175 0.0195 A2 1.109 1.154 1.199 0.0437 0.0454 0.0472 B A B A C2 A1 # per tape and reel OptiGuardTM Coating A1 B2 Dim BOTTOM VIEW 0.35 DIA. 63/37 Sn/Pb (Eutectic) or 95.5/3.8/0.7 Sn/Ag/Cu (Lead-free) SOLDER BUMPS D1 D2 SIDE VIEW 3500 pieces DIMENSIONS IN MILLIMETERS Controlling dimension: millimeters Package Dimensions for CM1206-08 10-bump Chip Scale Package CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 CM1206-08 3.104 X 1.154 X 0.707 3.28 X 1.32 X 0.81 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 8mm 178mm (7") 3500 4mm 4mm 10 Pitches Cumulative Tolerance On Tape 0.2 mm Po Top Cover Tape Ao W Bo Ko For tape feeder reference only including draft. Concentric around B. Embossment Center Lines of Cavity P1 User Direction of Feed Figure 5. Tape and Reel Mechanical Data (c) 2004 California Micro Devices Corp. All rights reserved. 6 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 06/28/04 CM1206 Mechanical Details (cont'd) CM1206-16 20-bump CSP Mechanical Specifications The CM1206-16 devices are packaged in a 20-bump custom Chip Scale Package (CSP). Dimensions are presented below. Mechanical Package Diagrams PACKAGE DIMENSIONS Custom CSP Bumps 20 Dim Millimeters Min Nom C1 B1 Inches Max Min Nom 5 Max 4 A2 3.059 3.104 3.149 0.1204 0.1222 0.1240 3 B1 0.645 0.650 0.655 0.0254 0.0256 0.0258 2 B2 0.645 0.650 0.655 0.0254 0.0256 0.0258 1 C1 0.202 0.252 0.302 0.0080 0.0099 0.0119 C2 0.202 0.252 0.302 0.0080 0.0099 0.0119 D1 0.638 0.707 0.776 0.0251 0.0278 0.0306 D2 0.394 0.445 0.495 0.0155 0.0175 0.0195 A2 2.409 2.454 2.499 0.0948 0.0966 0.0984 D C B A B A C2 A1 # per tape and reel OptiGuardTM Coating A1 B2 Package BOTTOM VIEW SIDE VIEW D1 D2 0.35 DIA. 63/37 Sn/Pb (Eutectic) or 95.5/3.8/0.7 Sn/Ag/Cu (Lead-free) SOLDER BUMPS 3500 pieces DIMENSIONS IN MILLIMETERS Controlling dimension: millimeters Package Dimensions for CM1206-16 20-bump Chip Scale Package CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 CM1206-16 3.104 X 2.454 X 0.707 3.28 X 2.64 X 0.86 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 8mm 178mm (7") 3500 4mm 4mm 10 Pitches Cumulative Tolerance On Tape 0.2 mm Po Top Cover Tape Ao W Bo Ko For tape feeder reference only including draft. Concentric around B. Embossment Center Lines of Cavity P1 User Direction of Feed Figure 6. Tape and Reel Mechanical Data (c) 2004 California Micro Devices Corp. All rights reserved. 06/28/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 7