SN54LVC74A, SN74LVC74A www.ti.com SCAS287T - JANUARY 1993 - REVISED JULY 2013 DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH CLEAR AND PRESET Check for Samples: SN54LVC74A, SN74LVC74A FEATURES DESCRIPTION * * * * The SN54LVC74A dual positive-edge-triggered Dtype flip-flop is designed for 2.7-V to 3.6-V VCC operation, and the SN74LVC74A dual positive-edgetriggered D-type flip-flop is designed for 1.65-V to 3.6V VCC operation. 1 3 12 4 11 5 10 6 9 7 8 1D 1CLK 1PRE 1Q 1Q 1 14 2 13 2CLR 3 4 12 2D 5 6 10 2PRE 9 2Q 11 2CLK 7 8 1CLK NC 1PRE NC 1Q 3 2CLR VCC 2CLR 2D 2CLK 2PRE 2Q 2Q 4 2 1 20 19 18 5 6 17 16 7 8 15 14 9 10 11 12 13 2D NC 2CLK NC 2PRE 2Q 2Q 13 1CLR NC VCC 14 2 1D 1 SN54LVC74A . . . FK PACKAGE (TOP VIEW) 1Q GND NC 1CLR 1D 1CLK 1PRE 1Q 1Q GND SN74LVC74A . . . RGY PACKAGE (TOP VIEW) VCC SN54LVC74A . . . J OR W PACKAGE SN74LVC74A . . . D, DB, NS, OR PW PACKAGE (TOP VIEW) The data I/Os and control inputs are overvoltage tolerant. This feature allows the use of these devices for down-translation in a mixed-voltage environment. 2Q * 1CLR * A low level at the preset (PRE) or clear (CLR) inputs sets or resets the outputs, regardless of the levels of the other inputs. When PRE and CLR are inactive (high), data at the data (D) input meeting the setup time requirements is transferred to the outputs on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the levels at the outputs. GND * Operate From 1.65 V to 3.6 V Inputs Accept Voltages to 5.5 V Max tpd of 5.2 ns at 3.3 V Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25C Typical VOHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25C Latch-Up Performance Exceeds 250 mA Per JESD 17 ESD Protection Exceeds JESD 22 - 2000-V Human-Body Model (A114-A) - 200-V Machine Model (A115-A) - 1000-V Charged-Device Model (C101) NC - No internal connection 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 1993-2013, Texas Instruments Incorporated On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. SN54LVC74A, SN74LVC74A SCAS287T - JANUARY 1993 - REVISED JULY 2013 www.ti.com FUNCTION TABLE INPUTS (1) OUTPUTS PRE CLR CLK D Q L H X X H Q L H L X X L H L L X X H (1) H (1) H H H H L H H L L H H H L X Q0 Q0 This configuration is nonstable; that is, it does not persist when PRE or CLR returns to its inactive (high) level. LOGIC DIAGRAM, EACH FLIP-FLOP (POSITIVE LOGIC) PRE CLK C C C Q TG C C C C D TG TG TG C C C Q CLR 2 Submit Documentation Feedback Copyright (c) 1993-2013, Texas Instruments Incorporated Product Folder Links: SN54LVC74A SN74LVC74A SN54LVC74A, SN74LVC74A www.ti.com SCAS287T - JANUARY 1993 - REVISED JULY 2013 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC Supply voltage range -0.5 6.5 V VI Input voltage range (2) -0.5 6.5 V VO Output voltage range (2) -0.5 VCC + 0.5 IIK Input clamp current VI < 0 -50 mA IOK Output clamp current VO < 0 -50 mA IO Continuous output current 50 mA 100 mA (3) Continuous current through VCC or GND D package JA Package thermal impedance (4) 86 DB package (4) 96 NS package (4) 76 PW package (4) (1) (2) (3) (4) (5) C/W 113 RGY package (5) Tstg V 47 Storage temperature range -65 150 C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed. The value of VCC is provided in the recommended operating conditions table. The package thermal impedance is calculated in accordance with JESD 51-7. The package thermal impedance is calculated in accordance with JESD 51-5. Recommended Operating Conditions (1) SN54LVC74A VCC Supply voltage VIH High-level input voltage Operating Data retention only MAX MIN MAX 2 3.6 1.65 3.6 1.5 1.5 VCC = 1.65 V to 1.95 V UNIT V 0.65 x VCC VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V SN74LVC74A MIN 1.7 2 V 2 VCC = 1.65 V to 1.95 V 0.35 x VCC VIL Low-level input voltage VCC = 2.3 V to 2.7 V 0.7 VI Input voltage 0 5.5 0 5.5 V VO Output voltage 0 VCC 0 VCC V VCC = 2.7 V to 3.6 V 0.8 0.8 VCC = 1.65 V IOH -4 VCC = 2.3 V High-level output current -8 VCC = 2.7 V -12 -12 VCC = 3 V -24 -24 VCC = 1.65 V IOL Low-level output current t/v Input transition rise or fall rate TA Operating free-air temperature (1) V mA 4 VCC = 2.3 V 8 VCC = 2.7 V 12 12 VCC = 3 V 24 24 10 -55 125 -40 mA 10 ns/V 125 C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Copyright (c) 1993-2013, Texas Instruments Incorporated Product Folder Links: SN54LVC74A SN74LVC74A Submit Documentation Feedback 3 SN54LVC74A, SN74LVC74A SCAS287T - JANUARY 1993 - REVISED JULY 2013 www.ti.com Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC -55C TO 125C (1) -40C TO 85C (1) SN54LVC74A SN74LVC74A MIN IOH = -100 A 2.7 V to 3.6 V VOH TYP (1) MAX MIN TYP VCC - 0.2 VCC - 0.2 1.65 V 1.2 1.2 IOH = -8 mA 2.3 V 1.7 1.7 2.7 V 2.2 2.2 2.2 3V 2.4 2.4 2.4 IOH = -24 mA 3V 2.2 2.2 2.2 IOL = 100 A 1.65 V to 3.6 V MAX V 0.2 0.2 0.2 IOL = 4 mA 1.65 V 0.45 0.45 IOL = 8 mA 2.3 V 0.7 0.7 IOL = 12 mA 2.7 V 0.4 0.4 0.4 IOL = 24 mA 3V 0.55 0.55 0.55 II VI = 5.5 V or GND ICC VI = VCC or GND, Ci TYP UNIT VCC - 0.2 2.7 V to 3.6 V ICC MIN SN74LVC74A Recommended IOH = -4 mA IOH = -12 mA VOL MAX 1.65 V to 3.6 V -40C TO 125C IO = 0 One input at VCC - 0.6 V, Other inputs at VCC or GND VI = VCC or GND V 3.6 V 5 5 5 A 3.6 V 10 10 10 A 2.7 V to 3.6 V 500 500 500 A 3.3 V 5 5 5 pF All typical values are at VCC = 3.3 V, TA = 25C. Timing Requirements over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) SN54LVC74A fclock VCC = 3.3 V 0.3 V MIN MAX MIN MAX Clock frequency tw Pulse duration tsu Setup time before CLK th Hold time, data after CLK 4 VCC = 2.7 V Submit Documentation Feedback 83 100 PRE or CLR low 3.3 3.3 CLK high or low 3.3 3.3 Data 3.4 3 PRE or CLR inactive 2.2 2 1 1 UNIT MHz ns ns ns Copyright (c) 1993-2013, Texas Instruments Incorporated Product Folder Links: SN54LVC74A SN74LVC74A SN54LVC74A, SN74LVC74A www.ti.com SCAS287T - JANUARY 1993 - REVISED JULY 2013 Timing Requirements over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) SN74LVC74A -40C to 85C VCC = 1.8 V 0.15 V MIN fclock Recommended VCC = 1.8 V 0.15 V MAX Clock frequency -40C to 125C MIN tw Pulse duration tsu Setup time before CLK th Hold time, data after CLK VCC = 2.5 V 0.2 V MAX 83 -40C to 85C MIN UNIT VCC = 2.5 V 0.2 V MAX 83 -40C to 125C Recommended MIN MAX 83 83 PRE or CLR low 4.1 4.1 3.3 3.3 CLK high or low 4.1 4.1 3.3 3.3 Data 3.6 3.6 2.3 2.3 PRE or CLR inactive 2.7 2.7 1.9 1.9 1 1 1 1 MHz ns ns ns Timing Requirements over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) SN74LVC74A -40C to 85C VCC = 2.7 V MIN fclock Recommended MIN MAX 83 tw Pulse duration tsu Setup time before CLK th Hold time, data after CLK -40C to 85C VCC = 3.3 V 0.3 V VCC = 2.7 V MAX Clock frequency -40C to 125C MIN UNIT VCC = 3.3 V 0.3 V MAX 83 -40C to 125C Recommended MIN 150 MAX 100 PRE or CLR low 3.3 3.3 3.3 3.3 CLK high or low 3.3 3.3 3.3 3.3 Data 3.4 3.4 3 3 PRE or CLR inactive 2.2 2.2 2 2 1 1 0 1 MHz ns ns ns Switching Characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) SN54LVC74A FROM (INPUT) PARAMETER TO (OUTPUT) VCC = 3.3 V 0.3 V VCC = 2.7 V MIN fmax MAX 83 CLK tpd Q or Q PRE or CLR MIN UNIT MAX 100 MHz 6 1 5.2 6.4 1 5.4 ns Switching Characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) SN74LVC74A PARAMETER FROM (INPUT) TO (OUTPUT) -40C to 85C VCC = 1.8 V 0.15 V MIN fmax tpd MAX 83 CLK PRE or CLR Q or Q -40C to 125C Recommended VCC = 1.8 V 0.15 V MIN MAX 83 -40C to 85C VCC = 2.5 V 0.2 V MIN MAX 83 -40C to 125C Recommended UNIT VCC = 2.5 V 0.2 V MIN MAX 83 MHz 1 7.1 1 7.1 1 4.4 1 4.4 1 6.9 1 6.9 1 4.6 1 4.6 tsk(o) ns ns Copyright (c) 1993-2013, Texas Instruments Incorporated Product Folder Links: SN54LVC74A SN74LVC74A Submit Documentation Feedback 5 SN54LVC74A, SN74LVC74A SCAS287T - JANUARY 1993 - REVISED JULY 2013 www.ti.com Switching Characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) SN74LVC74A PARAMETER FROM (INPUT) TO (OUTPUT) -40C to 125C -40C to 85C Recommended VCC = 2.7 V MIN fmax tpd MAX CLK PRE or CLR Q or Q MIN Recommended VCC = 3.3 V 0.3 V VCC = 2.7 V 83 -40C to 125C -40C to 85C MAX 83 MIN MAX 150 MIN MAX 100 MHz 1 6 6 1 5.2 5.2 1 6.4 6.4 1 5.4 5.4 tsk(o) UNIT VCC = 3.3 V 0.3 V 1 ns ns Operating Characteristics TA = 25C Cpd 6 PARAMETER TEST CONDITIONS VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V TYP TYP TYP Power dissipation capacitance per flip-flop f = 10 MHz 24 24 26 Submit Documentation Feedback UNIT pF Copyright (c) 1993-2013, Texas Instruments Incorporated Product Folder Links: SN54LVC74A SN74LVC74A SN54LVC74A, SN74LVC74A www.ti.com SCAS287T - JANUARY 1993 - REVISED JULY 2013 PARAMETER MEASUREMENT INFORMATION VLOAD S1 RL From Output Under Test CL (see Note A) Open GND RL TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open VLOAD GND LOAD CIRCUIT INPUTS VCC 1.8 V 0.15 V 2.5 V 0.2 V 2.7 V 3.3 V 0.3 V VI tr/tf VCC VCC 2.7 V 2.7 V 2 ns 2 ns 2.5 ns 2.5 ns VM VLOAD CL RL V VCC/2 VCC/2 1.5 V 1.5 V 2 x VCC 2 x VCC 6V 6V 30 pF 30 pF 50 pF 50 pF 1 k 500 500 500 0.15 V 0.15 V 0.3 V 0.3 V VI Timing Input VM 0V tw tsu VI Input VM VM th VI Data Input VM VM 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VI VM Input VM 0V VOH VM Output VM VOL VM 0V VLOAD/2 VM tPZH VOH Output VM tPLZ Output Waveform 1 S1 at VLOAD (see Note B) tPLH tPHL VM tPZL tPHL tPLH VI Output Control VM VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS VOL + V VOL tPHZ Output Waveform 2 S1 at GND (see Note B) VM VOH - V VOH 0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 . D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms Copyright (c) 1993-2013, Texas Instruments Incorporated Product Folder Links: SN54LVC74A SN74LVC74A Submit Documentation Feedback 7 SN54LVC74A, SN74LVC74A SCAS287T - JANUARY 1993 - REVISED JULY 2013 www.ti.com REVISION HISTORY Changes from Revision S (May 2005) to Revision T * 8 Page Extended maximum temperature operating range from 85C to 125C. .............................................................................. 3 Submit Documentation Feedback Copyright (c) 1993-2013, Texas Instruments Incorporated Product Folder Links: SN54LVC74A SN74LVC74A PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) 5962-9761601Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 59629761601Q2A SNJ54LVC 74AFK 5962-9761601QCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9761601QC A SNJ54LVC74AJ 5962-9761601QDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9761601QD A SNJ54LVC74AW 5962-9761601V2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 59629761601V2A SNV54LVC 74AFK 5962-9761601VCA ACTIVE CDIP J 14 25 TBD A42 N / A for Pkg Type -55 to 125 5962-9761601VC A SNV54LVC74AJ 5962-9761601VDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9761601VD A SNV54LVC74AW SN74LVC74AD ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LVC74A SN74LVC74ADBLE OBSOLETE SSOP DB 14 TBD Call TI Call TI -40 to 125 SN74LVC74ADBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LC74A SN74LVC74ADBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LC74A SN74LVC74ADE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LVC74A SN74LVC74ADG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LVC74A SN74LVC74ADR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LVC74A SN74LVC74ADRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LVC74A Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 18-Oct-2013 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) SN74LVC74ADRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LVC74A SN74LVC74ADT ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LVC74A SN74LVC74ADTE4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LVC74A SN74LVC74ADTG4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LVC74A SN74LVC74ANSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LVC74A SN74LVC74ANSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LVC74A SN74LVC74APW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LC74A SN74LVC74APWE4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LC74A SN74LVC74APWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LC74A SN74LVC74APWLE OBSOLETE TSSOP PW 14 TBD Call TI Call TI -40 to 125 SN74LVC74APWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 LC74A SN74LVC74APWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LC74A SN74LVC74APWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LC74A SN74LVC74APWT ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LC74A SN74LVC74APWTE4 ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LC74A SN74LVC74APWTG4 ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LC74A SN74LVC74ARGYR ACTIVE VQFN RGY 14 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 LC74A SN74LVC74ARGYRG4 ACTIVE VQFN RGY 14 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 LC74A Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 18-Oct-2013 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) SNJ54LVC74AFK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 59629761601Q2A SNJ54LVC 74AFK SNJ54LVC74AJ ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9761601QC A SNJ54LVC74AJ SNJ54LVC74AW ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9761601QD A SNJ54LVC74AW (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Addendum-Page 3 Samples PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54LVC74A, SN54LVC74A-SP, SN74LVC74A : * Catalog: SN74LVC74A, SN54LVC74A * Automotive: SN74LVC74A-Q1, SN74LVC74A-Q1 * Enhanced Product: SN74LVC74A-EP, SN74LVC74A-EP * Military: SN54LVC74A * Space: SN54LVC74A-SP NOTE: Qualified Version Definitions: * Catalog - TI's standard catalog product * Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects * Enhanced Product - Supports Defense, Aerospace and Medical Applications * Military - QML certified for Military and Defense Applications * Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74LVC74ADBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 SN74LVC74ADR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74LVC74ADT SOIC D 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74LVC74ANSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 SN74LVC74APWR TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1 SN74LVC74APWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74LVC74APWRG4 TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74LVC74APWT TSSOP PW 14 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74LVC74ARGYR VQFN RGY 14 3000 330.0 12.4 3.75 3.75 1.15 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LVC74ADBR SSOP DB 14 2000 367.0 367.0 38.0 SN74LVC74ADR SOIC D 14 2500 367.0 367.0 38.0 SN74LVC74ADT SOIC D 14 250 367.0 367.0 38.0 SN74LVC74ANSR SO NS 14 2000 367.0 367.0 38.0 SN74LVC74APWR TSSOP PW 14 2000 364.0 364.0 27.0 SN74LVC74APWR TSSOP PW 14 2000 367.0 367.0 35.0 SN74LVC74APWRG4 TSSOP PW 14 2000 367.0 367.0 35.0 SN74LVC74APWT TSSOP PW 14 250 367.0 367.0 35.0 SN74LVC74ARGYR VQFN RGY 14 3000 367.0 367.0 35.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2013, Texas Instruments Incorporated