1/27
www.rohm.com 2009.05 - Rev.B
© 2009 ROHM Co., Ltd. All rights reserved.
CMOS LDO Regulator Series for Portable Equipments
High-speed
Load Response
FULL CMOS LDO Regulators
BUTA2WNVX Series, BUTA2WHFV Series
●Description
BU□□TA2WNVX /HFV series is high-performance FULL CMOS regulator with 200-mA output, which is mounted on
microminiature package SSON004X1216 (1.2 mm 1.6 mm 0.6 mm) &HVSOF5(1.6mm X 1.6mm X0.6mm). It has
excellent noise characteristics and load responsiveness characteristics de spite its low circuit current consumption of 40 A.
It is most appropriate for various applications such as power supplies for logic IC, RF, and camera modules.
Microminiature package SSON004X1216 & HVSOF5 with built-in heatsink is adopted for the package, which contributes to
the space-saving design of the set.
●Features
1) High-accuracy output voltage of 1% (25 mV on 1.5-V & 1.8-V products）
2) High ripple rejection: 70 dB (Typ., 1 kHz, VOUT1.8 V))
3) Compatible with small ceramic capacitor (CIN=Co=1.0 F)
4) Low current consumption: 40 A
5) ON/OFF control of output voltage
6) With built-in overcurrent protection circuit and over heat protection circuit
7) With built-in output discharge circuit
8) Adopting microminiature power package SSON004X1216
●Applications
Battery-powered portable equipment, etc.
Absolute maximum rating
Parameter Symbol Limits Unit
Maximum applied power voltage VMAX -0.3 ~ +6.5 V
Power dissipation Pd1 220*
1
(SSON004X1216) mW
Pd2 410*
2
(HVSOF5) mW
Maximum junction temperature TjMAX +125 °C
Operational temperature range Topr -40 ~ +85 °C
Storage temperature range Tstg -55 ~ +125 °C
*1 When 1 PCB (70 m m 70 mm, thickness 1.6-mm glass epoxy) a standard ROHM board is implemented.
Reduced to 2.2 mW/C when used at Ta=25C or higher.
*2 Wh en 1 PCB (70 mm 70 mm, thickness 1.6-mm glass epoxy) a standard ROHM board is implemented.
Reduced to 4.1 mW/C when used at Ta=25C or higher.
Recommended operating range (Do not exceed Pd.）
Parameter Symbol Limits Unit
Input power supply voltage VIN 2.5 ~ 5.5 V
Maximum output current IMAX 200 mA
Recommended operating conditi ons
Parameter Symbol Min. Typ. Max. Unit Conditions
Input capacitor CIN 0.5*31.0 － μF A ceramic capacitor is recommended.
Output capacitor CO 0.5*31.0 － μF A ceramic capacitor is recommended.
*3 Set the capacity value of the capacitor so that it does not fall below the minimum value, taking temperature characteristics,
DC device characteristics, and change with time into consideration.
No.09020EAT01
Technical Note
2/27
BUTA2WNVX Series, BUTA2WHFV Series
www.rohm.com 2009.05 - Rev.B
© 2009 ROHM Co., Ltd. All rights reserved.
Block diagram, recommended circuit diagram, and pin configuration diagram
PIN No. Symbol Function
1 VOUT Voltage output
2 GND Grounding
3 STBY
ON/OFF control of
output voltage
(High: ON, Low: OFF)
4 VIN Power input
BH□□TA2WNVX
12
43
Fig.1 Recommended circuit diagram Recommended ceramic capacitor for Cin & Co
Murata Manufacturing Co., Ltd.
GRM188B11A105KA61D
123
4
5
1
Cin
VIN VIN
GND
STBY
VOUT VOUT
Co
VREF
OCP
STBY Discharge
VSTBY
4/3
2
1/4
3/1
PIN No. Sym bol Function
1 STBY
ON/OFF control of
output voltag e
(High:ON, Low:OFF )
2 GND Grounding
3 VIN Power input
4 VOUT Voltage output
5 N.C. No Connect
BU□□TA2WHFV(HVSOF5)
BU□□TA2WNVX(SSON004X1216)
Technical Note
3/27
BUTA2WNVX Series, BUTA2WHFV Series
www.rohm.com 2009.05 - Rev.B
© 2009 ROHM Co., Ltd. All rights reserved.
●Electrical characteristics(Ta=25C, VIN=VOUT+1.0 V (VIN=3.5 V on VOUT=1.8-V and1.5-V products), STBY=1.5 V, CIN=1.0 F, CO=1.0 F,
unless otherwise specified)
* This product does not have radiation-proof design.
Parameter Symbol Min. Typ. Max. Unit Conditions
Output voltage VOUT VOUT×0.99 VOUT VOUT×1.01 V IOUT=10 μA，VOUT≥2.5 V
VOUT-25 mV VOUT+25 mV IOUT=10 μA，VOUT<2.5 V
Circuit current IIN - 40 95 μAIOUT=0mA
Circuit current (at STBY) ISTBY - - 1 μASTBY=0 V
Ripple rejection RR 55
70
- dB
VRR=-20 dBv, fRR=1 kHz,
IOUT=10 mA
1.5 V≤VOUT≤1.8 V
65 VRR=-20 dBv,fRR=1 kHz,
IOUT=10 mA
2.5 V≤VOUT
Input/Output voltage difference VSAT
- 400 800 mV 2.5 V≤VOUT≤2.6 V
(VIN=0.98*VOUT, IOUT=200 mA)
- 360 720 mV 2.7 V≤VOUT≤2.85 V
(VIN=0.98*VOUT, IOUT=200 mA)
- 330 660 mV 2.9 V≤VOUT≤3.1 V
(VIN=0.98*VOUT,IOUT=200 mA)
- 300 600 mV 3.2 V≤VOUT≤3.4 V
(VIN=0.98*VOUT, IOUT=200 mA)
Line regulation VDL - 2 20 mV VIN=VOUT+1.0 V to 5.5 V,
IOUT=10 μA
Load regulation VDLO - 10 80 mV IOUT=0.01 mA to 100 mA
Overcurrent protection
detection current ILMAX 250 400 700 mA Vo=VOUT*0.8
Output short-circuit current ISHORT 20 70 150 mA Vo=0 V
Output discharge resistance RDSC 20 40 80 Ω VIN=4.0 V, STBY=0 V
Standby pull-down resistance RSTB 500 1000 2000 kΩ
Standby control ON VSTBH 1.5 - 5.5 V
OFF VSTBL -0.3 - 0.3 V
Technical Note
4/27
BUTA2WNVX Series, BUTA2WHFV Series
www.rohm.com 2009.05 - Rev.B
© 2009 ROHM Co., Ltd. All rights reserved.
Fig.4 Stability area characteris tics (Example)
Lineup
■ 200 mA BU□□TA2WNVX / HFV series
Product Name 1.5 1.8 2.5 2.6 2.7 2.8 2.85 Package
BU□□TA2WNVX
BU□□TA2WHFV
○ ○ ○ ○ ○ ○ ○ SSON004X1216
HVSOF5
2.9 3.0 3.1 3.2 3.3 3.4 -
○ ○ ○ ○ ○ ○ -
Model name: BU□□TA2WNVX / HFV
a
Symbol Contents
Specification of output voltage
a
□□ Output
voltage (V) □□ Output
voltage (V) □□ Output
voltage (V)
15 1.5 V(Typ.) 28 2.8 V(Typ.) 32 3.2 V(Typ.)
18 1.8 V(Typ.) 2J 2.85 V(Typ.) 33 3.3 V(Typ.)
25 2.5 V(Typ.) 29 2.9 V(Typ.) 34 3.4 V(Typ.)
26 2.5 V(Typ.) 30 3.0 V(Typ.) - -
27 2.7 V(Typ.) 31 3.1 V(Typ.) - -
Input/Output terminal equivalent circuit schematic
1pin (VOUT) 2pin (GND) 3pin (STBY) 4pin (VIN)
VIN
STBY
Fig.２ Input/Output equivalent circuit
About input/output capacitor
It is recommended to place a capacitor as close as possible to the pins
between the input terminal and GND or between the output terminal and
GND.
The capacitor between the input terminal and GND becomes valid when
source impedance increases or when wiring is long. The larger the
capacity of the output capacitor between the output terminal and GND is,
the better the stability and characteristics in output load fluctuation become.
However, please check the status of actual implementation. Ceramic
capacitors generally have variation, temperature charact eristics, and direc t
current bias characteristics and the capacity value also decreases with
time depending on the usage conditions. It is recommended to select a
ceramic capacitor upon inquiring about detailed data of the related
manufacturer.
About the equivalent series resistance (ESR) of a ceramic capacitor
Capacitors generally have ESR (equivalent series resistance) and it
operates stably in the ESR-IOUT area shown on the right. Since ceramic
capacitors, tantalum capacitors, electrolytic capacitors, etc. generally have
different ESR, please check the ESR of the capacitor to be used and use it
within the stability area range shown in the right graph for evaluation of the
actual application.
VOUT
VIN
Fig.3 Capacity – bias characteristics
Capacity value of ceramic capacitor - DC bias characteristics
(Example)
-100
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
10
00.511.522.533.54
DC Bias Voltage [V]
Capacitance Change [%]
10-V withstand v oltage
B1characteristics
GRM188B11A105KA61D
10-V withstand voltage
B ch aracteristics
6.3-V withstand voltage
B characteristics
4-V withstand v oltage
X6S characteristics
10-V withstand vo ltage
F characteristics
10-V withstand voltage
F characteristics
0.01
0.1
1
10
100
0 50 100 150 200
IOUT [m A]
ESR [Ω]
Stability area
Unstable area
Technical Note
5/27
BUTA2WNVX Series, BUTA2WHFV Series
www.rohm.com 2009.05 - Rev.B
© 2009 ROHM Co., Ltd. All rights reserved.
Fig. 5 Output Voltage Fig. 6 Line Regulation
Fig. 14 VOUT vs. Temp
Reference data BU15TA2WNVX / HFV (Ta=25ºC unless otherwise specified.)
Fig. 7 Circuit Current IGND
Fig. 8 Circuit Current IGND Fig. 9 STBY Input Current Fig. 10 IOUT - IGND
Fig. 16 IGND vs. Temp (STBY) Fig. 15 IGND vs. Temp
Fig. 11 Load Regulation Fig. 13 STBY Threshold
Fig. 12 OCP Threshold
0.0
0.3
0.6
0.9
1.2
1.5
1.8
00.511.522.533.544.555.5
Vin Voltage (V)
Output Voltage (V)
IO=0uA
IO=100uA
IO=50mA
IO=200mA Temp=25°C
VIN = STBY
1.45
1.46
1.47
1.48
1.49
1.50
1.51
1.52
1.53
1.54
1.55
1.25 1.35 1.45 1.55 1.65 1.75 1.85 1.95 2.05 2.15 2.25
Vin Voltage (V)
Output Voltage (V)
IO=0uA
IO=100uA
IO=50mA
IO=200mA
Temp=25°C
VIN = STBY
0
20
40
60
80
100
00.511.522.533.544.555.5
Vin Voltage (V)
Gnd Current (uA)
Temp=-40°C
Temp=25°C
Temp=85°C IO=0uA
VIN = STBY
0
20
40
60
80
100
120
140
00.511.522.533.544.555.5
Vin Voltage (V)
Gnd Current (uA)
IO=200mA
VIN = STBY
Temp=-40°C
Temp=25°C
Temp=85°C
0
2
4
6
8
10
00.511.522.533.544.555.5
ST BY Voltage (V)
STBY Current (uA)
VIN = STBY
Temp=85°C
Temp=25°C
Temp=-40°C
40
50
60
70
80
90
100
110
120
0 0.05 0.1 0.15 0.2
O u tp ut Current (A)
Gnd Curr ent (uA)
VIN = 3.5V
STBY = 1.5V
Temp=85°C
Temp=25°C
Temp=-40°C
1.45
1.46
1.47
1.48
1.49
1.50
1.51
1.52
1.53
1.54
1.55
0 0.05 0.1 0.15 0.2
Output Current (A)
Output Voltage (V)
VIN = 3.5V
STBY = 1.5V
Temp=-40°C
Temp=25°C
Temp=85°C
0.00
0.25
0.50
0.75
1.00
1.25
1.50
1.75
2.00
0.00 0.10 0.20 0.30 0.40 0.50 0.60
Output Current (A)
Output Voltage (V)
VIN=5.5V
Temp=25°C
STBY = 1.5V
VIN=3.5V
VIN=2.5V
0.00
0.25
0.50
0.75
1.00
1.25
1.50
1.75
2.00
0 0.5 1 1.5
STBY Voltage (V)
Output Voltage (V)
Temp=85°C
Temp=25°C
Temp=-40°C
1.45
1.46
1.47
1.48
1.49
1.50
1.51
1.52
1.53
1.54
1.55
-40 -15 10 35 60 85
Temp (°C)
Output Voltage (V)
VIN=3.5V
STBY=1.5V
Io=0.1mA
0.00
10.00
20.00
30.00
40.00
50.00
-40 -15 10 35 60 85
Temp (°C)
Input Current (uA)
VIN=3.5V
STBY=1.5V
Io=0mA
-0.100
0.000
0.100
0.200
0.300
0.400
0.500
0.600
0.700
0.800
0.900
1.000
-40 -15 10 35 60 85
Temp (°C)
Gnd Curr ent ( uA)
VIN=3.5V
STBY=0V
Technical Note
6/27
BUTA2WNVX Series, BUTA2WHFV Series
www.rohm.com 2009.05 - Rev.B
© 2009 ROHM Co., Ltd. All rights reserved.
Fig. 19 Output Noise Spectral
Den s i ty vs . Fr eq .
Reference data BU15TA2WNVX /HFV ( Ta=25ºC unless otherwise specified.)
Fig. 18 Ripple Rejection vs. VIN
(Iout=10 mA)
Fig. 17 Ripple Rejection vs. Freq.
Fig. 24 Load Response
Current Pulse=10 kHz Fig. 25 Load Response
Current Pulse=10 kHz
Fig. 20 Load Response Fig. 21 Load Response
Fig. 22 Load Response Fig. 23 Load Response
0
10
20
30
40
50
60
70
80
0.1 1 10 100 1000
Frequency (kHz)
Ripple Rejection (dB)
Vin= 3.5V
Io=10mA
Ta = 25℃
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.1 1 10 100
Frequency f [kHz]
Output Noise Density [μ V/√ Hz]
Co=1.0μF
Cin=1.0μF
Iout=10mA
temp=25℃
0
10
20
30
40
50
60
70
80
2.5 3.5 4.5 5.5
Input Voltage VIN[V]
Ripple Rejection [dB]
Co=1.0μF
Cin=none
Iout=10mA
temp=25℃
f=100kHz
f=10kHz
f=1kHz
f
=0.1kHz
Technical Note
7/27
BUTA2WNVX Series, BUTA2WHFV Series
www.rohm.com 2009.05 - Rev.B
© 2009 ROHM Co., Ltd. All rights reserved.
Reference data BU15TA2WNVX / HFV (Ta=25ºC unless otherwise specified.)
Fig. 29 Startup Time
Iout = 200 mA Fig. 30 Startup Time (STBY=VIN)
Iout = 0 mA
Fig. 28 Startup Time
Iout = 0 mA
Fig. 32 Discharge Time
Iout = 0 mA Fig. 33 VIN Response
Iout = 10 mA
Fig. 31 Startup Time (STBY=VIN)
Iout = 200mA
Fig. 26 Load Response
Current Pulse=100 kHz Fig. 27 Load Response
Current Pulse=100 kHz
Technical Note
8/27
BUTA2WNVX Series, BUTA2WHFV Series
www.rohm.com 2009.05 - Rev.B
© 2009 ROHM Co., Ltd. All rights reserved.
Fig. 34 Output Voltage Fig. 35 Line Regulation
Fig. 43 VOUT vs Temp
●Reference data BU18TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)
Fig. 36 Circuit Current IGND
Fig. 38 STBY Input Current Fig. 39 IOUT - IGND
Fig. 45 IGND vs Tem p (STBY) Fig. 44 IGND vs Tem p
Fig. 40 Load Regulation Fig. 42 STBY Threshold Fig. 41 OCP Threshold
Fig. 37 Circuit Current IGND
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
00.511.522.533.544.555.5
Vi n Voltage (V)
Output Voltage (V)
IO=0uA
IO=100uA
IO=50mA
IO=200mA Temp=25°C
VIN = STBY
0
20
40
60
80
100
00.511.522.533.544.555.5
Vin Voltage (V)
Gnd Current (uA)
Temp=-40°C
Temp=25°C
Temp=85°C IO=0uA
VIN = STBY
0
20
40
60
80
100
120
140
00.511.522.533.544.555.5
Vin Voltage (V)
Gnd Current (uA)
IO=200mA
VIN = STBY
Temp=-40°C
Temp=25°C
Temp=85°C
0
2
4
6
8
10
00.511.522.533.544.555.5
STBY Voltage (V)
STBY Current (uA)
VIN = STBY
Temp=85°C
Temp=25°C
Temp=-40°C
1.75
1.76
1.77
1.78
1.79
1.80
1.81
1.82
1.83
1.84
1.85
0 0.05 0.1 0.15 0.2
Output Current (A)
Output Voltage (V)
VIN = 3.5V
STBY = 1.5V
Temp=-40°C
Temp=25°C
Temp=85°C
0.00
0.50
1.00
1.50
2.00
2.50
3.00
3.50
0.00 0.10 0.20 0.30 0.40 0.50 0.60
Output Current (A)
Output Voltage (V)
VIN=5.5V
Temp=25°C
STBY = 1.5V
VIN=3.5V
VIN=2.5V
0.00
0.50
1.00
1.50
2.00
2.50
3.00
3.50
00.511.5
STBY Voltage (V)
Output Voltage (V)
Temp=85°C
Temp=25°C
Temp=-40°C
1.75
1.76
1.77
1.78
1.79
1.80
1.81
1.82
1.83
1.84
1.85
-40 -15 10 35 60 85
Temp (°C)
Output Voltage (V)
VIN=3.5V
STBY=1.5V
Io=0.1mA
0.00
10.00
20.00
30.00
40.00
50.00
-40 -15 10 35 60 85
Temp (°C)
Input Current (uA)
VIN=3.5V
STBY=1.5V
Io=0mA
-0.100
0.000
0.100
0.200
0.300
0.400
0.500
0.600
0.700
0.800
0.900
1.000
-40 -15 10 35 60 85
Temp (°C)
G nd Current (uA)
VIN=3.5V
STBY=0V
1.75
1.76
1.77
1.78
1.79
1.80
1.81
1.82
1.83
1.84
1.85
1.75 1.85 1.95 2.05 2.15 2.25 2.35
Vin Voltage (V)
Output Voltage (V)
IO=0uA
IO=100uA
IO=50mA
IO=200mA
Temp=25°C
VIN = STBY
40
50
60
70
80
90
100
110
120
0 0.05 0.1 0.15 0.2
Output Current (A)
Gnd Current (uA)
VIN = 3.5V
STBY = 1.5V
Temp=85°C
Temp=25°C
Temp=-40°C
Technical Note
9/27
BUTA2WNVX Series, BUTA2WHFV Series
www.rohm.com 2009.05 - Rev.B
© 2009 ROHM Co., Ltd. All rights reserved.
Fig. 46 Ripple Rejection VS Freq. Fig. 47 Ripple Rejection VS VIN Fig. 48 Output Noise Spectrl
Density VS Freq.
●Reference data BU18TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)
Fig. 49 Load Response
Fig. 51 Load Response Fig. 52 Load Response
Fig. 50 Load Response
Fig. 53 Load Response
Current Pulse=10kHz
Fig. 54 Load Response
Current Pulse=10kHz
⇔
0
10
20
30
40
50
60
70
80
0.1 1 10 100 1000
Frequency (kHz)
Ripple Rejection (dB)
Vin= 3.5V
Io=10mA
Ta = 25℃
0
10
20
30
40
50
60
70
80
2.5 3.5 4.5 5.5
Input Voltage VIN[V]
Ripple Rejection [dB]
Co=1.0μF
Cin=none
Iout=10mA
temp=25℃
f=100kHz
f=10kHz
f=1kHz
f=0.1kHz
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.1 1 10 100
Frequency f [kHz]
Output Noise Density [μV/√Hz]
Co=1.0μF
Cin=1.0μF
Iout=10mA
temp=25℃
Technical Note
10/27
BUTA2WNVX Series, BUTA2WHFV Series
www.rohm.com 2009.05 - Rev.B
© 2009 ROHM Co., Ltd. All rights reserved.
●Reference data BU18TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)
Fig. 55 Load Response
Current Pulse=100kHz
Fig. 56 Load Response
Current Pulse=100kHz
Fig. 57 Start Up Time
Iout = 0mA Fig. 58 Start Up Time
Iout = 200mA Fig. 59 Start Up Time (STBY=VIN)
Iout = 0mA
Fig. 61 Discharge Time
Iout = 0mA Fig. 62 VIN Response
Iout = 10mA
Fig. 60 Start Up Time(STBY=VIN)
Iout = 200mA
⇔
Technical Note
11/27
BUTA2WNVX Series, BUTA2WHFV Series
www.rohm.com 2009.05 - Rev.B
© 2009 ROHM Co., Ltd. All rights reserved.
Fig. 63 Output Voltage Fig. 64 Line Regulation
Fig. 72 VOUT vs Temp
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0.50
0 0.05 0.1 0.15 0.2
O u tp ut Current (A)
Dropout Voltage (V)
VIN=0.98*VOUT
STBY=1.5V
Temp.=-40°C
Temp.=25°C
Temp.=85°C
●Reference data BU25TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)
Fig. 65 Circuit Current IGND
Fig. 67 STBY Input Current Fig. 68 IOUT - IGND
Fig. 74 IGND vs Tem p (STBY) Fig. 73 IGND vs Tem p
Fig. 69 Load Regulation Fig. 71 STBY Threshold Fig. 70 OCP Threshold
Fig. 66 Dropout Voltage
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
00.511.522.533.544.555.5
Vin Voltage (V)
Output Voltage (V)
IO=0uA
IO=100uA
IO=50mA
IO=200mA
Temp.=25°C
VIN=STBY
2.45
2.46
2.47
2.48
2.49
2.50
2.51
2.52
2.53
2.54
2.55
2.4 2.5 2.6 2.7 2.8 2.9 3
Vin Voltage (V)
Output Voltage (V)
IO=0uA
IO=100uA
IO=50mA
IO=200mA
Temp.=25°C
VIN=STBY
0
20
40
60
80
100
00.511.522.533.544.555.5
Vin Voltage (V)
Gnd Current (uA)
Temp.=-40°C
Temp.=25°C
Temp.=85°C IO=0uA
VIN=STBY
0
2
4
6
8
10
00.511.522.533.544.555.5
ST BY Voltage (V)
STBY Current (uA)
Temp.=85°C
Temp.=25°C
Temp.=-40°C
40
50
60
70
80
90
100
110
120
0 0.05 0.1 0.15 0.2
Output Current (A)
Gnd Current (uA)
Temp.=85°C
Temp.=25°C
Temp.=-40°C
0.00
0.50
1.00
1.50
2.00
2.50
3.00
0 0.1 0.2 0.3 0.4 0.5 0.6
Output Current (A)
Output Voltage (V)
VIN=5.5V VIN=3.5V
VIN=3.0V
Temp.=25°C
STBY=1.5V
0.00
0.50
1.00
1.50
2.00
2.50
3.00
3.50
00.511.5
STBY Voltage (V)
Output Voltage (V)
Temp.=85°C
Temp.=25°C
Temp.=-40°C
2.45
2.46
2.47
2.48
2.49
2.50
2.51
2.52
2.53
2.54
2.55
-40 -15 10 35 60 85
Tem p. (°C)
Output Voltage (V)
VIN=3.5V
STBY=1.5V
Io=0.1mA
0.00
10.00
20.00
30.00
40.00
50.00
-40 -15 10 35 60 85
Temp. (°C)
Gnd Current (uA)
VIN=3.5V
STBY=1.5V
Io=0mA
-0.100
0.000
0.100
0.200
0.300
0.400
0.500
0.600
0.700
0.800
0.900
1.000
-40 -15 10 35 60 85
Temp. (°C)
Gnd Current (uA)
VIN=3.5V
STBY=0V
2.45
2.46
2.47
2.48
2.49
2.50
2.51
2.52
2.53
2.54
2.55
0 0.05 0.1 0.15 0.2
Output Current (A)
Output Voltage (V)
VIN=3.5V
STBY=1.5V
Temp.=-40°C
Temp.=25°C
Temp.=85°C
Technical Note
12/27
BUTA2WNVX Series, BUTA2WHFV Series
www.rohm.com 2009.05 - Rev.B
© 2009 ROHM Co., Ltd. All rights reserved.
Fig. 75 Ripple Rejection VS Freq. Fig. 76 Ripple Rejection VS VIN Fig. 77 Output Noise Spectrl
Density VS Freq.
●Reference data BU25TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)
Fig. 78 Load Response
Fig. 80 Load Response Fig. 81 Load Response
Fig. 79 Load Response
Fig. 82 Load Response
Current Pulse=10kHz
Fig. 83 Load Response
Current Pulse=10kHz
IOUT=0mA→100m A
IOUT=100m A→0m A
⇔
⇔
0
10
20
30
40
50
60
70
80
0.1 1 10 100 1000
Frequency (kHz)
Ripple Rejection (dB)
Vin= 3.5V
Io=10mA
Ta = 25℃
0
10
20
30
40
50
60
70
80
2.5 3.5 4.5 5.5
Input Voltage VIN[V]
Ripple Rejection [dB]
Co=1.0μF
Cin=none
Iout=10mA
temp=25℃
f=100kHz
f=10kHz
f
=1kHz
f=0.1kHz
0
0.2
0.4
0.6
0.8
1
1.2
0.1 1 10 100
Frequency f [kHz]
Output Noise Density [μV/√Hz]
Co=1.0μF
Cin=1.0μF
Iout=10mA
temp=25℃
Technical Note
13/27
BUTA2WNVX Series, BUTA2WHFV Series
www.rohm.com 2009.05 - Rev.B
© 2009 ROHM Co., Ltd. All rights reserved.
●Reference data BU25TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)
Fig. 84 Load Response
Current Pulse=100kHz
Fig. 85 Load Response
Current Pulse=100kHz
Fig. 86 Start Up Time
Iout = 0mA Fig. 87 Start Up Time
Iout = 200mA Fig. 88 Start Up Time (STBY=VIN)
Iout = 0mA
Fig. 90 Discharge Time
Iout = 0mA Fig. 91 VIN Response
Iout = 10mA
Fig. 89 Start Up Time(STBY=VIN)
Iout = 200mA
⇔
⇔
Technical Note
14/27
BUTA2WNVX Series, BUTA2WHFV Series
www.rohm.com 2009.05 - Rev.B
© 2009 ROHM Co., Ltd. All rights reserved.
Fig. 92 Output Voltage Fig. 93 Line Regulation
Fig. 101 VOUT vs Temp
●Reference data BU28TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)
Fig. 94 Circuit Current IGND
Fig. 96 STBY Input Current Fig. 97 IOUT - IGND
Fig. 103 IGND vs Temp (STBY) Fig. 102 IGND vs Temp
Fig. 98 Load Regulation Fig. 100 STBY Threshold Fig. 99 OCP Threshold
Fig. 95 Dropout Voltage
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
00.511.522.533.544.555.5
Vin Voltage (V)
Output Voltage (V)
Temp.=25°C
IO=0uA
IO=100uA
IO=50mA
IO=200mA
VIN = STBY
2.75
2.76
2.77
2.78
2.79
2.80
2.81
2.82
2.83
2.84
2.85
2.7 2.8 2.9 3 3.1 3.2
Vin Voltage (V)
Output Voltage (V)
Temp.=25°C
IO=0uA
IO=100uA
IO=50mA
IO=200mA
VIN = STBY
0
20
40
60
80
100
00.511.522.533.544.555.5
Vin Voltage (V)
Gnd Current (uA)
Temp.=-40°C
Temp.=25°C
Temp.=85°C
IO=0uA
VIN = STBY
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0 0.05 0.1 0.15 0.2
Output Current (A)
Dropout Voltage (V)
VI N=0. 98 x V O UT
STB Y = 1.5V
Temp.= -40°C
Temp.=25°C
Temp.=85°C
0
2
4
6
8
10
00.511.522.533.544.555.5
STBY Voltage (V)
STBY Current (uA)
Temp.=85°C
Temp.=25°C
Temp.=-40°C
VIN = ST BY
40
50
60
70
80
90
100
110
120
0 0.05 0.1 0.15 0.2
O u tp ut Currnt (A)
Gnd Current (uA)
VIN = 3.8V
STBY = 1.5V
Temp.=85°C
Temp.=25°C
Temp.=-40°C
2.75
2.76
2.77
2.78
2.79
2.80
2.81
2.82
2.83
2.84
2.85
0 0.05 0.1 0.15 0.2
Output Currnt (A)
Output Vol tage (V)
Temp.=-40°C
Temp.=25°C
Temp.=85°C
VIN = 3.8V
STBY = 1.5V
0.00
0.50
1.00
1.50
2.00
2.50
3.00
3.50
0 0.1 0.2 0.3 0.4 0.5 0.6
Output Current (A)
Output Voltage (V)
VIN=5.5V
STBY = 1.5V
VIN=3.8V
VIN=3.3V
Temp=25°C
0.00
0.50
1.00
1.50
2.00
2.50
3.00
3.50
00.511.5
STBY Voltage (V)
Output Voltage (V)
VIN=3.8V
Temp.=85°C
Temp.=25°C
Temp.=-40°C
2.75
2.76
2.77
2.78
2.79
2.80
2.81
2.82
2.83
2.84
2.85
-40 -15 10 35 60 85
Temp. (°C)
Output Voltage (V)
VIN=3.8V
STBY=1.5V
Io=0.1mA
0.00
10.00
20.00
30.00
40.00
50.00
-40 -15 10 35 60 85
Temp. (°C)
Gnd Current (uA)
VIN=3.8V
STBY=1.5V
Io=0mA
-0.100
0.000
0.100
0.200
0.300
0.400
0.500
0.600
0.700
0.800
0.900
1.000
-40 -15 10 35 60 85
Temp. (°C)
Gnd Curr en t (uA)
VIN=3.8V
STBY=0V
Technical Note
15/27
BUTA2WNVX Series, BUTA2WHFV Series
www.rohm.com 2009.05 - Rev.B
© 2009 ROHM Co., Ltd. All rights reserved.
Fig. 104 Ripple Rejection VS Freq. Fig. 105 Ripple Rejection VS VIN Fig. 106 Output Noise Spectrl
Density VS Freq.
●Reference data BU28TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)
Fig. 107 Load Response
Fig.109 Load Response Fig. 110 Load Response
Fig. 108 Load Response
Fig. 111 Load Response
Current Pulse=10kHz
Fig. 112 Load Response
Current Pulse=10kHz
⇔
⇔
0
10
20
30
40
50
60
70
80
0.1 1 10 100 1000
Frequency (kHz)
Ripple Rejection (dB)
Vin= 3.8V
Io=10mA
Ta = 25℃
0
10
20
30
40
50
60
70
80
2.8 3.8 4.8
Input Voltage VIN[V]
Ripple Rejection [dB]
f=100kHz
f=10kHz
f=1kHz
f=0.1kHz
Co=1.0μF
Cin=none
Iout=10mA
temp=25℃
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
0.1 1 10 100
Frequency f [kHz]
Output Noise Density [μV/√Hz]
Co=1.0μF
Cin=1.0μF
Iout=10mA
temp=25℃
Technical Note
16/27
BUTA2WNVX Series, BUTA2WHFV Series
www.rohm.com 2009.05 - Rev.B
© 2009 ROHM Co., Ltd. All rights reserved.
●Reference data BU28TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)
Fig. 113 Load Response
Current Pulse=100kHz
Fig. 114 Load Response
Current Pulse=100kHz
Fig. 115 Start Up Time
Iout = 0mA Fig. 116 Start Up Time
Iout = 200mA Fig. 117 Start Up Time (STBY=VIN)
Iout = 0mA
Fig. 119 Discharge Time
Iout = 0mA Fig.120 VIN Response
Iout = 10mA
Fig. 118 Start Up Time(STBY=VIN)
Iout = 200mA
⇔
⇔
Technical Note
17/27
BUTA2WNVX Series, BUTA2WHFV Series
www.rohm.com 2009.05 - Rev.B
© 2009 ROHM Co., Ltd. All rights reserved.
Fig. 121 Output Voltage Fig. 122 Line Regulation
Fig. 130 VOUT vs Temp
●Reference data BU30TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)
Fig. 123 Circuit Current IGND
Fig. 125 STBY Input Current Fig. 126 IOUT - IGND
Fig. 132 IGND vs Temp (STBY) Fig. 131 IGND vs Temp
Fig. 127 Load Regulation Fig. 129 STBY Threshold Fig.128 OCP Threshold
Fig. 124 Dropout Voltage
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
00.511.522.533.544.555.5
Vin Voltage (V)
Output Vol tage (V)
Temp.=25°C
IO=0uA
IO=100uA
IO=50mA
IO=200mA
VIN=STBY
2.95
2.96
2.97
2.98
2.99
3.00
3.01
3.02
3.03
3.04
3.05
2.9 3 3.1 3.2 3.3 3.4 3.5
Vin Voltage (V)
Output Voltage (V)
Temp.=25°C
IO=0uA
IO=100uA
IO=50mA
IO=200mA
VIN=STB
Y
0
20
40
60
80
100
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
Vin Voltage (V)
Gnd Current (uA)
IO=0uA
Temp.=-40°C
Temp.=25°C
Temp.=85°C VIN=STBY
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0 0.05 0.1 0.15 0.2
Output Current (A)
Dropout Voltage (V)
VIN=0.98*VOUT
STBY=1.5V
Temp.=-40°C
Temp.=25°C
Temp.=85°C
0
2
4
6
8
10
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
ST BY Voltage (V)
STBY Current (uA)
Temp.=85°C
Temp.=25°C
Temp.=-40°C
VIN=STBY
40
50
60
70
80
90
100
110
120
0 0.05 0.1 0.15 0.2
Output Current (A)
Gnd Current (uA)
Temp.=85°C
Temp.=25°C
Temp=-40°C
2.95
2.96
2.97
2.98
2.99
3.00
3.01
3.02
3.03
3.04
3.05
0 0.05 0.1 0.15 0.2
Output Current (A)
Output Voltage (V)
VIN=4.0V
STBY=1.5V
Temp.=-40°C
Temp.=25°C
Temp.=85°C
0.00
0.50
1.00
1.50
2.00
2.50
3.00
3.50
0 0.1 0.2 0.3 0.4 0.5 0.6
Output Current (A)
Output Voltage (V)
VIN=5.5V VIN=4.0V
VIN=3.5V
Temp.=25°C
STBY=1.5V
0.00
0.50
1.00
1.50
2.00
2.50
3.00
3.50
00.511.5
STBY Voltage (V)
Output Voltage (V)
VIN=4.0V
Temp.=85°C
Temp.=25°C
Temp.=-40°C
2.95
2.96
2.97
2.98
2.99
3.00
3.01
3.02
3.03
3.04
3.05
-40 -15 10 35 60 85
Tem p. (°C)
Output Voltage (V)
VIN=4.0V
STBY=1.5V
Io=0.1mA
0.00
10.00
20.00
30.00
40.00
50.00
-40 -15 10 35 60 85
Temp. (°C)
Input Current (µA)
VIN=4.0V
STBY=1.5V
Io=0mA
-0.100
0.000
0.100
0.200
0.300
0.400
0.500
0.600
0.700
0.800
0.900
1.000
-40 -15 10 35 60 85
Temp. (°C)
Input Current (µA)
VIN=4.0V
STBY=0V
Io=0mA
Technical Note
18/27
BUTA2WNVX Series, BUTA2WHFV Series
www.rohm.com 2009.05 - Rev.B
© 2009 ROHM Co., Ltd. All rights reserved.
Fig. 133 Ripple Rejection VS Freq. Fig. 134 Ripple Rejection VS VIN Fig. 135 Output Noise Spectrl
Density VS Freq.
●Reference data BU30TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)
Fig. 136 Load Response
Fig. 138 Load Response Fig. 139 Load Response
Fig. 137 Load Response
Fig. 140 Load Response
Current Pulse=10kHz Fig. 141 Load Response
Current Pulse=10kHz
0
10
20
30
40
50
60
70
80
0.1 1 10 100 1000
Frequency (kHz)
Ripple Rejection (dB)
Vin= 4.0V
Io=10mA
Ta = 2 5 ℃
0
10
20
30
40
50
60
70
80
345
Input Voltage VIN[V]
Ripple Rejection [dB]
f=100kHz
f=10kHz
f=1 kHz
f=0.1kHz
Co=1.0μF
Cin=none
Iout=10mA
temp=25℃
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
0.1 1 10 100
Frequency f [kHz]
Output Noise Density [μV/√Hz]
Co=1.0μF
Cin=1.0μF
Iout=10mA
temp=25℃
Technical Note
19/27
BUTA2WNVX Series, BUTA2WHFV Series
www.rohm.com 2009.05 - Rev.B
© 2009 ROHM Co., Ltd. All rights reserved.
●Reference data BU30TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)
Fig. 142 Load Response
Current Pulse=100kHz
Fig. 143 Load Response
Current Pulse=100kHz
Fig. 144 Start Up Time
Iout = 0mA Fig. 145 Start Up Time
Iout = 200mA Fig. 146 Start Up Time (STBY=VIN)
Iout = 0mA
Fig. 148 Discharge Time
Iout = 0mA Fig. 149 VIN Response
Iout = 10mA
Fig. 147 Start Up Time(STBY=VIN)
Iout = 200mA
Technical Note
20/27
BUTA2WNVX Series, BUTA2WHFV Series
www.rohm.com 2009.05 - Rev.B
© 2009 ROHM Co., Ltd. All rights reserved.
Fig. 150 Output Voltage Fig. 151 Line Regulation
Fig. 159 VOUT vs Temp
●Reference data BU33TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)
Fig. 152 Circuit Current IGND
Fig. 154 STBY Input Current Fig. 155 IOUT - IGND
Fig. 161 IGND vs Temp (STBY) Fig. 160 IGND vs Temp
Fig. 156 Load Regulation Fig. 158 STBY Threshold
Fig. 157 OCP Threshold
Fig. 153 Dropout Voltage
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
00.511.522.533.544.555.5
Vin Voltage (V)
Output Vol tage (V)
IO=0uA
IO=100uA
IO=50mA
IO=200mA
Temp.=25°C
VIN = STBY
3.25
3.26
3.27
3.28
3.29
3.30
3.31
3.32
3.33
3.34
3.35
3.2 3.3 3.4 3.5 3.6 3.7
Vin Voltage (V)
Output Voltage (V)
IO=0uA
IO=100uA
IO=50mA
IO=200mA
Temp=25°C
VIN = STBY
0
20
40
60
80
100
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
Vin Voltage (V)
Gnd Current (uA)
Temp.=-40°C
Temp.=25°C
Temp.=85°C IO=0uA
VIN = STBY
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0 0.05 0.1 0.15 0.2
Output Current (A)
Dropout Voltage (V)
VIN=0.98 x VOUT
STBY = 1.5V
Temp.=-40°C
Temp.=25°C
Temp.=85°C
0
2
4
6
8
10
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
V
STBY
Voltage (V)
STBY Current (uA)
VIN = STBY
Temp.=85°C
Temp.=25°C
Temp.=-40°C
40
50
60
70
80
90
100
110
120
0 0.05 0.1 0.15 0.2
Output Current (A)
Gnd Current (uA)
VIN = 4.3V
STBY = 1.5V
Temp.=85°C
Temp.=25°C
Temp.=-40°C
3.25
3.26
3.27
3.28
3.29
3.30
3.31
3.32
3.33
3.34
3.35
0 0.05 0.1 0.15 0.2
Output Current (A)
Output Voltage (V)
VIN = 4.3V
STBY = 1.5V
Temp.=-40°C
Temp.=25°C
Temp.=85°C
0.00
0.50
1.00
1.50
2.00
2.50
3.00
3.50
0 0.1 0.2 0.3 0.4 0.5 0.6
Output Current (A)
Output Voltage (V)
VIN=5.5V
STBY = 1.5V
Temp=25
℃
VIN=4.3V
VIN=3.8V
0.00
0.50
1.00
1.50
2.00
2.50
3.00
3.50
00.511.5
STBY Voltage (V)
Output Voltage (V)
VIN=4.3V
Temp.=85°C
Temp.=25°C
Temp.=-40°C
3.25
3.26
3.27
3.28
3.29
3.30
3.31
3.32
3.33
3.34
3.35
-40 -15 10 35 60 85
Tem p. (°C)
Output Voltage (V)
VIN=4.3V
STBY=1.5V
Io=0.1mA
0.00
10.00
20.00
30.00
40.00
50.00
-40 -15 10 35 60 85
Temp. (°C)
Gnd Current (uA)
VIN=4.3V
STBY=1.5V
Io=0mA
-0.100
0.000
0.100
0.200
0.300
0.400
0.500
0.600
0.700
0.800
0.900
1.000
-40 -15 10 35 60 85
Temp. (°C)
Gnd Current (uA)
VIN=4.3V
STBY=0V
Technical Note
21/27
BUTA2WNVX Series, BUTA2WHFV Series
www.rohm.com 2009.05 - Rev.B
© 2009 ROHM Co., Ltd. All rights reserved.
Fig. 162 Ripple Rejection VS Freq. Fig. 163 Ripple Rejection VS VIN Fig. 164 Output Noise Spectrl
Density VS Freq.
●Reference data BU33TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)
Fig. 165 Load Response
Fig. 167 Load Response Fig. 168 Load Response
Fig. 166 Load Response
Fig. 169 Load Response
Current Pulse=10kHz
Fig. 170 Load Response
Current Pulse=10kHz
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
0.1 1 10 100
Frequency f [kHz]
Output Noise Density [μV/√ Hz]
Co=1.0μF
Cin=1.0μF
Iout=10mA
temp=25℃
0
10
20
30
40
50
60
70
80
3.3 4.3 5.3
Input Voltage VIN[V]
Ripple Rejection [dB]
f=100kHz
f=10kHz
f=1kHz
f=0.1kHz
Co=1.0μF
Cin=none
Iout=10mA
temp=25℃
0
10
20
30
40
50
60
70
80
0.1 1 10 100 1000
Frequency (kHz)
Ripple Rejection (dB)
Vin= 4.3V
Io=10mA
Ta = 25℃
Technical Note
22/27
BUTA2WNVX Series, BUTA2WHFV Series
www.rohm.com 2009.05 - Rev.B
© 2009 ROHM Co., Ltd. All rights reserved.
●Reference data BU33TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)
Fig. 171 Load Response
Current Pulse=100kHz
Fig. 172 Load Response
Current Pulse=100kHz
Fig. 173 Start Up Time
Iout = 0mA Fig. 174 Start Up Time
Iout = 200mA Fig. 175 Start Up Time (STBY=VIN)
Iout = 0mA
Fig. 177 Discharge Time
Iout = 0mA Fig. 178 VIN Response
Iout = 10mA
Fig. 176 Start Up Time(STBY=VIN)
Iout = 200mA
Technical Note
23/27
BUTA2WNVX Series, BUTA2WHFV Series
www.rohm.com 2009.05 - Rev.B
© 2009 ROHM Co., Ltd. All rights reserved.
●About power dissipation (Pd)
As for power dissipation, an approximate estimate of the heat reduction characteristics and internal power consumption of
IC are shown, so please use these for reference. Since power dissipation changes substantially depending on the
implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is
recommended to measure Pd on a set board. Exceeding the power dissipation of IC may lead to deterioration of the original
IC performance, such as causing operation of the thermal shutdown circuit or reduction i n current capability. Therefore, be
sure to prepare sufficient margin within power dissipation for usage.
Calculation of the maximum internal power consumption of IC (PMAX)
PMAX=(VIN-VOUT)×IOUT(MAX.) (VIN: Input voltage VOUT: Output voltage IOUT(MAX): Maximum output current)
Measurement conditions
Evaluation Board 1
(Single-side Board) Evaluation Board 2
(Double-side Board)
Layout of Board for
Measurement
(Unit: mm)
IC Implementation
Position
Top Layer (Top View) Top Layer (Top View)
Bottom Layer (Top View) Bottom Layer (Top View)
Measurement State With board implemented (Wind speed 0 m/s) With board implemented (Wind speed 0 m/s)
Board Material Glass epoxy resin (Sing le-side board) Glass epoxy resin (Double-side board)
Board Size 40 mm x 40 mm x 0.8 mm 40 mm x 40 mm x 0.8 mm
Wiring
Rate Top layer Metal (GND) wiring rate: Approx. 25% Metal (GND) wiring rate: Approx. 25%
Bottom layer Metal (GND) wiring rate: Approx 0% Metal (GND) wiring rate: Approx 25%
Through Hole 0 holes Diameter 0.5 mm 12 holes
Power Dissipation 1100 mW 1250 mW
Thermal Resistance θja=91°C/W θja=80°C/W
* Please design the margin so that PMAX
becomes is than Pd (PMAXPd) within
the usage temperature range.
- Standard ROHM board -
Size: 70 mm 70 mm 1.6 mm
Material: Glass epoxy board
40
20
40
20
40 40
20
40 20 40 20
40 20
40
0
500
1000
1500
0 25 50 75 100 125
Ta (℃)
Pd (mW)
Evaluation board 2
(Double-side board)
Evaluation board 1
(Singl e-side board)
Standard ROHM board
1250 mW
1100 mW
220 mW
Fig.179 SSON004X1216 Power dissipation heat reduction characteristics (Reference)
○ SSON004X1216
Technical Note
24/27
BUTA2WNVX Series, BUTA2WHFV Series
www.rohm.com 2009.05 - Rev.B
© 2009 ROHM Co., Ltd. All rights reserved.
●DEVICE TYPE & Mark
a
XX
output
voltage
package
SSON004
X1216 HVSOF5
15 1.5V typ. AA BA
18 1.8V typ. AB BB
23 2.3V typ. AG BC
25 2.5V typ. AC BD
26 2.6V typ. AD BE
27 2.7V typ. AE BF
28 2.8V typ. AF BG
2J 2.85V typ. AG BH
29 2.9V typ. AH BJ
30 3.0V typ. AJ BK
31 3.1V typ. AK BL
32 3.2V typ. AL BM
33 3.3V typ. AM BN
34 3.4V typ. AN BP
○ HVSOF5
Fig.180 HVSOF5 Power dissipation heat reduction characteristics (Reference)
* Please design the margin so that PMAX
becomes is than Pd (PMAXPd) within
the usage temperature range.
Device type: BUXXTA2WNVX
a
Device typce: BUXXTA2WHFV
a
○SSON004X1216 ○HVSOF5
　Pd（W)
Technical Note
25/27
BUTA2WNVX Series, BUTA2WHFV Series
www.rohm.com 2009.05 - Rev.B
© 2009 ROHM Co., Ltd. All rights reserved.
Mark
Lot No.
○ SSON004X1216
○ HVSOF5
標印
Lot No.
Makrk
Technical Note
26/27
BUTA2WNVX Series, BUTA2WHFV Series
www.rohm.com 2009.05 - Rev.B
© 2009 ROHM Co., Ltd. All rights reserved.
Other notes
- About absolute maximum rating
Breakage may occur when absolute maximum ratings such as applied voltage and operating temperature range are
exceeded. Short mode or open mode cannot be specified at occurrence of a break, so please prepare physical safety
measures (e.g., fuse) if such special mode in which the absolute maximum rating is exceeded can be assumed.
- About GND potential
Please be sure that the potential of the GND terminal is the lowest in any operating condition.
- About thermal design
Please provide thermal design with sufficient margin, taking power dissipation (Pd) in actual usage conditions into
consideration.
- About short between pins and misattachment
Please be careful regarding the IC direction and misal ignment at attachment onto a printed circuit board. Misattachment
may cause a break of IC. Short caused by foreign matter between outputs, output and power suppl y, or GNDs may also
lead to a break.
- About operation in a strong electromag netic field
Please note that usage in a strong electromagnetic fie ld may cause malfunction.
- About common imped ance
Please give due consideration to wiring of the power source and GND by reducing common-mode ripple or
making ripple as small as po ssible (e.g., making the wiring as thick and short as possible, or reducing ripple by
LC), etc.
- About STBY terminal voltage
Set STBY terminal voltage to 0.3 V or less to put each channel into a standby state and to 1.5 V or more to put each
channel into an op erating state. Do not fix STBY terminal voltage to 0.3 V or more and 1.5 V or less or do not len gthen
the transition time. This may cause malfunction or failure.
When shorting the VIN terminal and STBY terminal for usage, the status will be “STBY=VIN＝LOW ” at turning the powe r
OFF, and discharge of the VOUT terminal cannot operate, which means voltage may remain for a certain time in the
VOUT terminal. Since turning the power ON again in this state may cause overshoot, turn the power ON for use after the
VOUT terminal is completely discharged.
- About overcurr ent protectio n circuit
Output has a built-in overcurrent protection circuit, which prevents IC break at load short. Note that this protectio n circuit
is effective for prevention of breaks due to unexpected accidents. Please avoid usage by which the protection circuit
operates continuously.
- About thermal shutdown
Output is OFF when the thermal circuit operates since a temperature protection circuit is built in to prevent thermal
breakdown. However, it recovers when the temperature returns to a certain temper ature. The thermal circuit operates at
emergency such as overheating of IC. Since it is prepared to prevent IC breakdown, please do not use it in a state in
which protection works.
About reverse current
For applications on which reverse current is assumed to flow into IC,
it is recommended to prepare a path to let the current out
by putting a bypass diode between the VIN-VOUT terminals.
About testing on a set board
When connecting a capacitor to a terminal with low impedance for testing on a set board, please be sure to discharge for
each process since IC may be stressed. As a countermeasure agai nst static electricit y, prepare grounding in the assem bly
process and take sufficient care in transportation and storage. In additi on, when connecting a capacitor to a jig in a testing
process, please do so after turning the power OFF and remove it after turning the power OFF.
Fig.181 Example of bypass diode connection
Reverse current
VIN
GND
STBY
OUT
Technical Note
27/27
BUTA2WNVX Series, BUTA2WHFV Series
www.rohm.com 2009.05 - Rev.B
© 2009 ROHM Co., Ltd. All rights reserved.
●Selection of order type
B U 1 5 N V X
ROHM type Output voltage
15 : 1.5V
18 : 1.8V
25 : 2.5V
26 : 2.6V
27 : 2.7V
28 : 2.8V
2J : 2.85V
29 : 2.9V
30 : 3.0V
31 : 3.1V
32 : 3.2V
33 : 3.3V
34 : 3.4V
Lineup
High-speed Load Response
Full CMOS LDO Regulators
T R
Package
NVX : SSON004X1216
HFV : HVSOF5
Package specification
TR : reel shape emboss taping
T A 2 W
(Unit : mm)
SSON004X1216
S
0.08 S
3
4
21
1PIN MARK
1.2±0.1
0.65±0.1
0.75±0.1
1.6±0.1
0.2±0.1
0.8±0.1
0.6MAX
(0.12)
0.02+0.03
-
0.02
0.2 +0.05
-
0.04
∗
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper right when you hold
reel on the left hand and you pull out the tape on the right hand
5000pcs
TR
()
Direction of feed
Reel 1pin
(Unit : mm)
HVSOF5
S
0.08
M
0.1 S
4
321
5
(0.05)
1.6±0.05
1.0±0.05
1.6±0.05
1.2±0.05
(MAX 1.28 include BURR)
45
321
(0.8)
(0.91)
(0.3)
(0.41)
0.2MAX
0.13±0.05
0.22±0.05
0.6MAX
0.5
0.02 +0.03
–0.02
Direction of feed
Reel
∗
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper right when you hold
reel on the left hand and you pull out the tape on the right hand
3000pcs
TR
()
1pin
R0039
A
www.rohm.com
© 2009 ROHM Co., Ltd. All rights reserved.
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Notes
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consent of ROHM Co.,Ltd.
The content specied herein is subject to change for improvement without notice.
The content specied herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specied in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specied herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specied in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, ofce-automation equipment, commu-
nication devices, electronic appliances and amusement devices).
The Products specied in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, re or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, re control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
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any of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
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