Everlight Electronics Co., Ltd. http://www.everlight.com Rev.2 Page: 1 of 10
Device No. : DSE-000 Prepared date:30-Jun.-2011 Prepared by:ZhouChen
Technical Data Sheet
0805 Package Chip LED(1.0mm Height)
17-21/GHC-XS1T2M/3T
Features
․Package in 8mm tape on 7〞diameter reel.
․Compatible with automatic placement equipment.
․Compatible with infrared and vapor phase reflow
solder process.
․Mono-color type.
․Pb-free.
․The product itself will remain with in RoHS compliant version.
Descriptions
․The 17-21 SMD LED is much smaller than lead
frame type components, thus enable smaller board
size, higher packing density, reduced storage space
and finally smaller equipment to be obtained.
․Besides, lightweight makes them ideal for
miniature applications. etc.
Applications
․Backlighting in dashboard and switch.
․Telecommunication: indicator and backlighting in
telephone and fax.
․Flat backlight for LCD, switch and symbol.
․General use.
Device Selection Guide
Part No. Chip Emitted Color Resin Color
Material
17-21/GHC-XS1T2M/3T InGaN Brilliant Green Water Clear
Everlight Electronics Co., Ltd. http://www.everlight.com Rev.2 Page: 2 of 10
Device No. : DSE-000 Prepared date:30-Jun.-2011 Prepared by:ZhouChen
17-21/GHC-XS1T2M/3T
Package Outline Dimensions
+
-
1.05
Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm
Everlight Electronics Co., Ltd. http://www.everlight.com Rev.2 Page: 3 of 10
Device No. : DSE-000 Prepared date:30-Jun.-2011 Prepared by:ZhouChen
17-21/GHC-XS1T2M/3T
Absolute Maximum Ratings (Ta=25℃
℃℃
℃)
Parameter Symbol
Rating Unit
Reverse Voltage V
R
5 V
Forward Current I
F
25 mA
Peak Forward Current
(Duty 1/10 @1KHz) I
FP
100 mA
Power Dissipation P
d
95 mW
ElectrostaticDischarge
(HBM) ESD 150 V
Operating Temperature Topr -40 ~ +85 ℃
Storage Temperature Tstg -40 ~ +90 ℃
Soldering Temperature Tsol Reflow Soldering: 260 ℃ for 10 sec
Hand Soldering: 350℃ for 3 sec
Electro-Optical Characteristics (Ta=25℃
℃℃
℃)
Parameter Symbol
Min. Typ. Max. Unit Condition
Luminous Intensity
I
v
180 ----- 450 mcd
I
F
=20mA
Viewing Angle
2θ
1/2
---- 140 ---- deg
Peak Wavelength
λ
p
---- 518 ---- nm
Dominant Wavelength
λ
d
515 ---- 530 nm
Spectrum Radiation
Bandwidth
△λ
---- 35 ---- nm
Forward Voltage
V
F
2.75 ---- 3.95 V
Reverse Current I
R
---- ---- 50 μA
V
R
=5V
Notes:
1.Tolerance of Luminous Intensity ±
±±
±11%
2.Tolerance of Dominant Wavelength ±
±±
±1nm
3.Tolerance of Forward Voltage ±
±±
±0.1V
Everlight Electronics Co., Ltd. http://www.everlight.com Rev.2 Page: 4 of 10
Device No. : DSE-000 Prepared date:30-Jun.-2011 Prepared by:ZhouChen
17-21/GHC-XS1T2M/3T
Bin Range Of Dom. Wavelength
Groups Bin Min Max Unit Condition
X
W 515 520
nm I
F
=20mA X 520 525
Y 525 530
Bin Range Of Luminous Intensity
Bin Min Max Unit Condition
S1 180 225
mcd I
F
=20mA
S2 225 285
T1 285 360
T2 360 450
Bin Range Of Forward Voltage
Groups Bin Min Max Unit Condition
M
5 2.75 3.05
nm I
F
=20mA
6 3.05 3.35
7 3.35 3.65
8 3.65 3.95
Notes:
1.Tolerance of Luminous Intensity ±
±±
±11%
2.Tolerance of Dominant Wavelength ±
±±
±1nm
3.Tolerance of Forward Voltage ±
±±
±0.1V
Everlight Electronics Co., Ltd. http://www.everlight.com Rev.2 Page: 5 of 10
Device No. : DSE-000 Prepared date:30-Jun.-2011 Prepared by:ZhouChen
17-21/GHC-XS1T2M/3T
Typical Electro-Optical Characteri
Ta=25°C
Relative luminous intensity
Ambient Temperature T (°C )
a
% )
(Relative luminous intensity()%
Wavelength λ(nm)
Ta=25°C
Forward Voltage V (V)
F
Forward Current I (mA)
Relative luminous intensity ()%
Forward Current I (mA)
Ta=25°C
Ambient Temperature T (°C
a)
Forward Current I (mA)
Ta=25°C
1.0
0.9
0.8
0.7
0.5 0.3 0.1 0.2 0.4 0.6
10°
40°
50°
60°
70°
80°
90°
Everlight Electronics Co., Ltd. http://www.everlight.com Rev.2 Page: 6 of 10
Device No. : DSE-000 Prepared date:30-Jun.-2011 Prepared by:ZhouChen
17-21/GHC-XS1T2M/3T
Label explanation
CAT: Luminous Intensity (mcd)
HUE: Dom. Wavelength (nm)
REF: Forward Voltage (V)
Reel Dimensions
Note: The tolerances unless mentioned is ±0.1mm,Unit = mm
Everlight Electronics Co., Ltd. http://www.everlight.com Rev.2 Page: 7 of 10
Device No. : DSE-000 Prepared date:30-Jun.-2011 Prepared by:ZhouChen
17-21/GHC-XS1T2M/3T
Carrier Tape Dimensions: Loaded quantity 3000 PCS per reel
Note: The tolerances unless mentioned is ±0.1mm , Unit = mm
Moisture Resistant Packaging
Everlight Electronics Co., Ltd. http://www.everlight.com Rev.2 Page: 8 of 10
Device No. : DSE-000 Prepared date:30-Jun.-2011 Prepared by:ZhouChen
17-21/GHC-XS1T2M/3T
Reliability Test Items And Conditions
The reliability of products shall be satisfied with items listed below.
Confidence level : 90 %
LTPD : 10 %
No. Items Test Condition Test
Hours/Cycles
Sample
Size Ac/Re
1 Reflow Soldering Temp. : 260℃±5℃
Min. 5sec. 6 Min. 22 PCS.
0/1
2 Temperature Cycle
H : +100℃ 15min
∫ 5 min
L : -40℃ 15min
300 Cycles
22 PCS.
0/1
3 Thermal Shock
H : +100℃ 5min
∫ 10 sec
L : -10℃ 5min
300 Cycles
22 PCS.
0/1
4 High Temperature
Storage Temp. : 100℃ 1000 Hrs. 22 PCS.
0/1
5 Low Temperature
Storage Temp. : -40℃ 1000 Hrs. 22 PCS.
0/1
6 DC Operating Life I
F
= 20 mA 1000 Hrs. 22 PCS.
0/1
7 High Temperature /
High Humidity 85℃/ 85%RH 1000 Hrs. 22 PCS.
0/1
Everlight Electronics Co., Ltd. http://www.everlight.com Rev.2 Page: 9 of 10
Device No. : DSE-000 Prepared date:30-Jun.-2011 Prepared by:ZhouChen
17-21/GHC-XS1T2M/3T
Precautions For Use
1. Over-current-proof
Customer must apply resistors for protection , otherwise slight voltage shift
will cause big current change ( Burn out will happen ).
2. Storage time
2.1 Do not open moisture proof bag before the products are ready to use.
2.2 Before opening the package: The LEDs should be kept at 30℃ or less and 90%RH or less.
2.3 After opening the package: The LED's floor life is 1 year under 30℃ or less and 60% RH or less.
If unused LEDs remain, it should be stored in moisture proof packages.
2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the
storage time, baking treatment should be performed using the following conditions.
Baking treatment : 60±5℃ for 24 hours.
3. Soldering Condition
3.1 Pb-free solder temperature profile
3.2 Reflow soldering should not be done more than two times.
3.3 When soldering, do not put stress on the LEDs during heating.
3.4 After soldering, do not warp the circuit board.
Everlight Electronics Co., Ltd. http://www.everlight.com Rev.2 Page: 10 of 10
Device No. : DSE-000 Prepared date:30-Jun.-2011 Prepared by:ZhouChen
17-21/GHC-XS1T2M/3T
4.Soldering Iron
Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds
within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do
soldering of each terminal. Be careful because the damage of the product is often started at the time of the
hand solder.
5.Repairing
Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a
double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether
the characteristics of the LEDs will or will not be damaged by repairing.
EVERLIGHT ELECTRONICS CO., LTD. Tel: 886-2-2267-2000, 2267-9936
Office: No 25, Lane 76, Sec 3, Chung Yang Rd, Fax: 886-2267-6244, 2267-6189, 2267-6306
Tucheng, Taipei 236, Taiwan, R.O.C http://www.everlight.com
