February 2010 Doc ID 6115 Rev 7 1/10
10
STPS2H100
Power Schottky rectifier
Features
■Negligible switching losses
■High junction temperature capability
■Low leakage current
■Good trade-off between leakage current and
forward voltage drop
■Avalanche capability specified
Description
Schottky rectifiers designed for high frequency
miniature switched mode power supplies such as
adaptators and on board DC/DC converters.
Available in SMA, SMB, low-profile SMB.
Table 1. Device summary
Symbol Value
IF(AV) 2 A
VRRM 100 V
Tj (max) 175 °C
VF (max) 0.65 V
K
A
SMA
STPS2H100A
SMB
STPS2H100U
K
A
K
A
SMB flat
STPS2H100UF
www.st.com
Characteristics STPS2H100
2/10 Doc ID 6115 Rev 7
1 Characteristics
Table 2. Absolute ratings (limiting values)
Symbol Parameter Value Unit
VRRM Repetitive peak reverse voltage 100 V
IF(AV) Average forward current SMA / SMB TL = 130 °C δ = 0.5 2A
SMB flat TL = 150 °C δ = 0.5
IFSM Surge non repetitive forward current tp =10 ms sinusoidal 75 A
PARM Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 2400 W
Tstg Storage temperature range -65 to + 175 °C
TjOperating junction temperature (1) 175 °C
1. condition to avoid thermal runaway for a diode on its own heatsink
dPtot
dTj <1
Rth(j-a)
Table 3. Thermal resistance
Symbol Parameter Value Unit
Rth(j-l) Junction to lead
SMA 30 °C/W
SMB 25
SMB flat 15
Table 4. Static electrical characteristics
Symbol Parameter Test conditions Min. Typ. Max. Unit
IR(1) Reverse leakage current Tj = 25 °C VR = VRRM
1µA
Tj = 125 °C 0.4 1 mA
VF(2) Forward voltage drop
Tj = 25 °C IF = 2 A 0.79
V
Tj = 125 °C 0.6 0.65
Tj = 25 °C IF = 4 A 0.88
Tj = 125 °C 0.69 0.74
1. Pulse test: tp = 5 ms, δ < 2%
2. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation: P = 0.56 x IF(AV) + 0.045 IF2(RMS)
STPS2H100 Characteristics
Doc ID 6115 Rev 7 3/10
Figure 1. Average forward power dissipation
versus average forward current
Figure 2. Average forward current versus
ambient temperature (δ = 0.5)
(SMA / SMB)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2
P (W)
F(AV)
T
δ=tp/T tp
δ= 1
δ= 0.1
δ= 0.05
I (A)
F(AV)
δ= 0.5
δ= 0.2
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
0 25 50 75 100 125 150 175
I (A)
F(AV)
T
δ=tp/T tp
SMB
R =80°C/W
S =1.5cm
th(j-a)
(CU) 2
T (°C)
amb
R=R
th(j-a) th(j-I)
SMA
R =100°C/W
S =1.5cm
th(j-a)
(CU) 2
SMA
SMB
Figure 3. Average forward current versus
ambient temperature (δ = 0.5)
(SMB flat)
Figure 4. Normalized avalanche power
derating versus pulse duration
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
0 25 50 75 100 125 150 175
SMB flat
R=R
th(j-a) th(j-l)
R =40°C/W
. S =2.5 cm
th(j-a)
CU 2
I (A)
F(AV)
T
δ=tp/T tp T (°C)
amb
0.001
0.01
0.10.01 1
0.1
10 100 1000
1
t (µs)
p
P(t
p)
P (1 µs)
ARM
ARM
Figure 5. Normalized avalanche power
derating versus junction
temperature
Figure 6. Non repetitive surge peak forward
current versus overload duration
(maximum values) (SMA)
0
0.2
0.4
0.6
0.8
1
1.2
25 50 75 100 125 150
T (°C)
j
P(T
j)
P (25 °C)
ARM
ARM
0
1
2
3
4
5
6
7
8
9
10
1.E-03 1.E-02 1.E-01 1.E+00
I (A)
M
IM
t
δ=0.5 t(s)
T =125°C
a
T =25°C
a
T =75°C
a
SMA
Characteristics STPS2H100
4/10 Doc ID 6115 Rev 7
Figure 7. Non repetitive surge peak forward
current versus overload duration
(maximum values) (SMB)
Figure 8. Non repetitive surge peak forward
current versus overload duration
(maximum values) (SMB flat)
0
1
2
3
4
5
6
7
8
9
10
1.E-03 1.E-02 1.E-01 1.E+00
I (A)
M
IM
t
δ=0.5 t(s)
T =125°C
a
T =25°C
a
T =75°C
a
SMB
0
5
10
15
20
25
30
1.E-03 1.E-02 1.E-01 1.E+00
I (A)
M
IM
t
δ=0.5 t(s)
T =125°C
L
T =25°C
L
T =75°C
L
SMB flat
Figure 9. Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMA / SMB)
Figure 10. Relative variation of thermal
impedance junction to lead
versus pulse duration (SMB flat)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Z/R
th(j-a) th(j-a)
T
δ=tp/T tp
t (s)
p
Single pulse
SMA
SMB
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
SMB flat
(non exposed pad)
Z/R
th(j-l) th(j-l)
t (s)
p
Single pulse
Figure 11. Reverse leakage current versus
reverse voltage applied
(typical values)
Figure 12. Junction capacitance versus
reverse voltage applied
(typical values)
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
0 20406080100
T
j
=150°C
T
j
=125°C
T
j
=25°C
T
j
=100°C
T
j
=75°C
T
j
=50°C
V (V)
R
I (µA)
R
10
100
1 10 100
C(pF)
V (V)
R
F=1MHz
V =30mV
T =25°C
OSC RMS
j
STPS2H100 Characteristics
Doc ID 6115 Rev 7 5/10
Figure 17. Thermal resistance junction to ambient versus copper surface under each lead
(SMB flat)
Figure 13. Forward voltage drop versus
forward current (low level)
Figure 14. Forward voltage drop versus
forward current (high level)
I (A)
FM
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2
T
j
=25°C
(Maximum values)
T
j
=125°C
(Maximum values)
T
j
=125°C
(Maximum values)
T
j
=125°C
(Typical values)
T
j
=125°C
(Typical values)
V (V)
FM
I (A)
FM
1
10
100
0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8
T
j
=25°C
(Maximum values)
T
j
=125°C
(Maximum values)
T
j
=125°C
(Maximum values)
T
j
=125°C
(Typical values)
T
j
=125°C
(Typical values)
V (V)
FM
Figure 15. Thermal resistance junction to
ambient versus copper surface
under each lead (SMA)
Figure 16. Thermal resistance junction to
ambient versus copper surface
under each lead (SMB)
0
10
20
30
40
50
60
70
80
90
100
110
120
130
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R (°C/W)
th(j-a)
S (cm²)
CU
SMA
Epoxy printed circuit board FR4,
Copper thickness = 35 µm
0
10
20
30
40
50
60
70
80
90
100
110
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R (°C/W)
th(j-a)
S (cm²)
CU
SMB
Epoxy printed circuit board FR4,
Copper thickness = 35 µm
0
10
20
30
40
50
60
70
80
90
100
110
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R (°C/W)
th(j-a)
S (cm²)
CU
SMB flat
Epoxy printed circuit board FR4,
Copper thickness = 35 µm
Package information STPS2H100
6/10 Doc ID 6115 Rev 7
2 Package information
●Epoxy meets UL94, V0
●Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 18. SMA footprint (dimensions in mm)
Table 5. SMA dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.094
A2 0.05 0.20 0.002 0.008
b 1.25 1.65 0.049 0.065
c 0.15 0.40 0.006 0.016
D 2.25 2.90 0.089 0.114
E 4.80 5.35 0.189 0.211
E1 3.95 4.60 0.156 0.181
L 0.75 1.50 0.030 0.059
E
CL
E1
D
A1
A2
b
2.63
5.43
1.4
1.64
1.4
STPS2H100 Package information
Doc ID 6115 Rev 7 7/10
Figure 19. SMB footprint (dimensions in mm)
Table 6. SMB dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.096
A2 0.05 0.20 0.002 0.008
b 1.95 2.20 0.077 0.087
c 0.15 0.40 0.006 0.016
E 5.10 5.60 0.201 0.220
E1 4.05 4.60 0.159 0.181
D 3.30 3.95 0.130 0.156
L 0.75 1.50 0.030 0.059
E
C
L
E1
D
A1
A2
b
2.60
5.84
1.62
2.18
1.62
Package information STPS2H100
8/10 Doc ID 6115 Rev 7
Figure 20. SMB flat footprint (dimensions in mm)
Table 7. SMB flat dimensions
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 0.90 1.10 0.035 0.043
b(1)
1. Applies to plated leads
1.95 2.20 0.077 0.087
c(1) 0.15 0.40 0.006 0.016
D 3.30 3.95 0.130 0.156
E 5.10 5.60 0.200 0.220
E1 4.05 4.60 0.189 0.181
L 0.75 1.50 0.029 0.059
L1 0.40 0.016
L2 0.60 0.024
D
A
L
L
L1
L2
EE1
b
c
1.20 1.203.44
5.84
2.07
STPS2H100 Ordering information
Doc ID 6115 Rev 7 9/10
3 Ordering information
4 Revision history
Table 8. Ordering information
Order code Marking Package Weight Base qty Delivery mode
STPS2H100A S21 SMA 0.068 g 5000 Tape and reel
STPS2H100U G21 SMB 0.107 g 2500 Tape and reel
STPS2H100UF FG21 SMB flat 0.050 g 5000 Tape and reel
Table 9. Document revision history
Date Revision Changes
Jul-2003 4A Last update.
Aug-2004 5 SMA package dimensions update. Reference A1 max.
changed from 2.70 (0.106 inches) to 2.03 mm (0.080 inches).
08-Feb-2007 6 Reformatted to current standards. Added ECOPACK
statement. Added SMB flat package.
15-Feb-2010 7 Updated weight for SMB flat in Table 8.
STPS2H100
10/10 Doc ID 6115 Rev 7
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