UCC5619 27-Line SCSI Terminator With Reverse Disconnect FEATURES DESCRIPTION * Complies with SCSI, SCSI-2, SCSI-3, SPI and FAST-20 (Ultra) Standards UCC5619 provides 27 lines of active termination for a SCSI (Small Computer Systems Interface) parallel bus. The SCSI standard recommends active termination at both ends of the cable. * 2.5pF Channel Capacitance during Disconnect * 100A Supply Current in Disconnect Mode * 4V To 7V Operation * 110 Termination * Completely Meets SCSI Hot Plugging * -900mA Sourcing Current for Termination * +500mA Sinking Current for Active Negation * Logic Command Disconnects all Termination Lines * Trimmed Impedance to 5% * Current Limit and Thermal Shutdown Protection BLOCK DIAGRAM The UCC5619 is ideal for high performance 5V SCSI systems. During disconnect the supply current is typically only 100A, which makes the IC attractive for lower powered systems. The UCC5619 is designed with a low channel capacitance of 2.5pF, which eliminates effects on signal integrity from disconnected terminators at interim points on the bus. The power amplifier output stage allows the UCC5619 to source full termination current and sink active negation current when all termination lines are actively negated. The UCC5619, as with all Unitrode terminators, is completely hot pluggable and appears as high impedance at the teminating channels with VTRMPWR = 0V or open. Internal circuit trimming is utilized, first to trim the 110 impedance, and then most importantly, to trim the output current as close to the maximum SCSI-3 specification as possible, which maximizes noise margin in fast SCSI operation. Other features include thermal shutdown and current limit. This device is offered in low thermal resistance versions of the industry standard 36 pin wide body QSSOP (MWP). Consult SSOP-36 (MWP QSSOP-36) Packaging Diagram for exact dimensions. Circuit Design Patented SLUS265A - OCTOBER 1998 - REVISED - APRIL 2002 UDG-96108 UCC5619 CONNECTION DIAGRAM ABSOLUTE MAXIMUM RATINGS TRMPWR Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7V Signal Line Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to +7V Regulator Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5A Storage Temperature . . . . . . . . . . . . . . . . . . . -65 C to +150 C Junction Temperature . . . . . . . . . . . . . . . . . . . -55 C to +150 C Lead Temperature (Soldering, 10 Sec.). . . . . . . . . . . . . +300 C QSSOP-36 (Top View) MWP Package Currents are positive into, negative out of the specified terminal. Consult Packaging Section of Databook for thermal limitations and considerations of packages. LINE8 1 36 LINE7 LINE9 2 35 LINE6 LINE23 3 34 LINE5 LINE24 4 33 LINE22 LINE25 5 32 LINE21 LINE26 6 31 LINE20 LINE27 7 30 LINE19 GND* 8 29 REG GND* 9 28 GND* GND* 10 27 GND* DISCNCT 11 26 GND* LINE10 12 25 TRMPWR LINE11 13 24 LINE18 LINE12 14 23 LINE17 LINE13 15 22 LINE16 LINE14 16 21 LINE15 LINE1 17 20 LINE4 LINE2 18 19 LINE3 * MWP package pins 8 - 10 and 26 - 28 serve as heatsink/ ground. ELECTRICAL CHARACTERISTICS Unless otherwise stated, these specifications apply for TA = 0C to 70C, TRMPWR = 4.75V, DISCNCT = 4.75V, TA = TJ. PARAMETER TEST CONDITIONS MIN TYP MAX UNITS 1 2 mA Supply Current Section TRMPWR Supply Current Power Down Mode All Termination Lines = Open All Termination Lines = 0.2V 630 650 mA DISCNCT = 0V 100 200 A 110 115.5 Output Section (Termination Lines) Termination Impedance (Note 3) 104.5 Output High Voltage (Note 1) 2.6 2.8 3.0 V Max Output Current VLINE = 0.2V, TJ = 25C -22.1 -23.3 -24 mA VLINE = 0.2V -20.7 -23.3 -24 mA VLINE = 0.2V, TRMPWR = 4V, TJ = 25C (Note 1) -21 -23 -24 mA VLINE = 0.2V, TRMPWR = 4V (Note 1) -20 -23 VLINE = 0.5V -24 mA 22.4 mA Output Leakage DISCNCT = 0V, TRMPWR = 0V to 5.25V 10 400 nA Output Capacitance DISCNCT = 0V (Note 2) 2.5 4 pF 2 UCC5619 ELECTRICAL CHARACTERISTICS Unless otherwise stated, these specifications apply for TA = 0C to 70C, TRMPWR = 4.75V, DISCNCT = 4.75V, TA = TJ. PARAMETER TEST CONDITIONS MIN TYP MAX UNITS 2.6 2.8 3.0 V 0.4 0.8 V Regulator Section Regulator Output Voltage Drop Out Voltage All Termination Lines = 0.2V Short Circuit Current VREG = 0V -650 -900 -1300 mA Sinking Current Capability VREG = 3.5V 300 500 900 mA Thermal Shutdown 170 C Thermal Shutdown Hysteresis 10 C Disconnect Section Disconnect Threshold 0.8 DISCNCT = 0V Input Current 1.5 2.0 V -20 -60 A Note 1: Measuring each termination line while other 26 are low (0.2V). Note 2: Ensured by design. Not 100% tested in production. Note 3: Tested by measuring IOUT with VOUT = 0.2V and VOUT with no load, then calculate: Z = VOUT N . L.- 0 . 2V IOUT at 0 . 2V PIN DESCRIPTIONS DISCNCT: Taking this pin low causes all channels to become high impedance, and the chip to go into low-power mode; a high state or leaving it open allows the channels to provide normal termination. LINE1 - LINE27: 110 termination channels. REG: Output of the internal 2.7V regulator; bypass with a 4.7 F capacitor to GND. TRMPWR: Power for the IC; bypass with a 4.7 F capacitor to GND. GND: Ground reference for the IC. UCC5619 11 DISCNCT TERMPWR 25 REG 29 TERMPWR 4.7F LINE1 LINE27 17 7 DATA BYTES 1 AND 2 +2 PARITY BITS 4.7F CONTROL BYTES TO DRIVERS AND RECEIVERS TO SCSI BUS Figure 1. Typical wide SCSI bus configuration using the UCC5619 3 UDG-98072 PACKAGE OPTION ADDENDUM www.ti.com 5-Feb-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty UCC5619MWP ACTIVE SSOP DCE 36 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC5619MWPG4 ACTIVE SSOP DCE 36 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC5619MWPTR ACTIVE SSOP DCE 36 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC5619MWPTRG4 ACTIVE SSOP DCE 36 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 30-Jan-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device UCC5619MWPTR Package Package Pins Type Drawing SSOP DCE 36 SPQ Reel Reel Diameter Width (mm) W1 (mm) 1000 330.0 24.4 Pack Materials-Page 1 A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 10.85 15.8 2.7 12.0 24.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 30-Jan-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) UCC5619MWPTR SSOP DCE 36 1000 346.0 346.0 41.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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