UCC5619
DESCRIPTION
UCC5619 provides 27 lines of active termination for a SCSI (Small Com-
puter Systems Interface) parallel bus. The SCSI standard recommends ac-
tive termination at both ends of the cable.
The UCC5619 is ideal for high performance 5V SCSI systems. During dis-
connect the supply current is typically only 100µA, which makes the IC at-
tractive for lower powered systems.
The UCC5619 is designed with a low channel capacitance of 2.5pF, which
eliminates effects on signal integrity from disconnected terminators at in-
terim points on the bus.
The power amplifier output stage allows the UCC5619 to source full termi-
nation current and sink active negation current when all termination lines
are actively negated.
The UCC5619, as with all Unitrode terminators, is completely hot pluggable
and appears as high impedance at the teminating channels with VTRMPWR
= 0V or open.
Internal circuit trimming is utilized, first to trim the 110Ωimpedance, and
then most importantly, to trim the output current as close to the maximum
SCSI-3 specification as possible, which maximizes noise margin in fast
SCSI operation.
Other features include thermal shutdown and current limit. This device is
offered in low thermal resistance versions of the industry standard 36 pin
wide body QSSOP (MWP).
Consult SSOP-36 (MWP QSSOP-36) Packaging Diagram for exact dimen-
sions.
27-Line SCSI Terminator With Reverse Disconnect
BLOCK DIAGRAM
FEATURES
•Complies with SCSI, SCSI-2, SCSI-3,
SPI and FAST-20 (Ultra) Standards
•2.5pF Channel Capacitance during
Disconnect
•100µA Supply Current in Disconnect
Mode
•4V To 7V Operation
•110 Termination
•Completely Meets SCSI Hot Plugging
•–900mA Sourcing Current for
Termination
•+500mA Sinking Current for Active
Negation
•Logic Command Disconnects all
Termination Lines
•Trimmed Impedance to 5%
•Current Limit and Thermal Shutdown
Protection
SLUS265A - OCTOBER 1998 - REVISED - APRIL 2002
UDG-96108
Circuit Design Patented
2
UCC5619
ABSOLUTE MAXIMUM RATINGS
TRMPWR Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7V
Signal Line Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to +7V
Regulator Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5A
Storage Temperature . . . . . . . . . . . . . . . . . . . −65 C to +150 C
Junction Temperature. . . . . . . . . . . . . . . . . . . −55 C to +150 C
Lead Temperature (Soldering, 10 Sec.). . . . . . . . . . . . . +300 C
Currents are positive into, negative out of the specified terminal.
Consult Packaging Section of Databook for thermal limitations
and considerations of packages.
LINE5
LINE6
LINE7
LINE22
LINE21
LINE19
LINE20
REG
LINE9
LINE8
GND*
LINE26
LINE27
LINE23
LINE24
LINE25
GND*
GND* GND*
36
35
34
33
32
31
30
29
28
27
1
2
3
4
5
6
7
8
9
10 GND*
11
12
13
14
15
26
25
24
23
22
16
17
18
21
20
19
LINE12
LINE11
LINE10
DISCNCT
LINE13
LINE14
LINE1
LINE2
LINE17
LINE18
TRMPWR
GND*
LINE16
LINE15
LINE4
LINE3
* MWP package pins 8 - 10 and 26 - 28 serve as heatsink/
ground.
CONNECTION DIAGRAM
QSSOP-36 (Top View)
MWP Package
ELECTRICAL CHARACTERISTICS Unless otherwise stated, these specifications apply for TA= 0°C to 70°C,
TRMPWR = 4.75V, DISCNCT = 4.75V, TA=T
J.
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
Supply Current Section
TRMPWR Supply Current All Termination Lines = Open 1 2 mA
All Termination Lines = 0.2V 630 650 mA
Power Down Mode DISCNCT = 0V 100 200 µA
Output Section (Termination Lines)
Termination Impedance (Note 3) 104.5 110 115.5 Ω
Output High Voltage (Note 1) 2.6 2.8 3.0 V
Max Output Current VLINE = 0.2V, TJ= 25°C −22.1 −23.3 −24 mA
VLINE = 0.2V −20.7 −23.3 −24 mA
VLINE = 0.2V, TRMPWR = 4V, TJ= 25°C (Note 1) −21 −23 −24 mA
VLINE = 0.2V, TRMPWR = 4V (Note 1) −20 −23 −24 mA
VLINE = 0.5V 22.4 mA
Output Leakage DISCNCT = 0V, TRMPWR = 0V to 5.25V 10 400 nA
Output Capacitance DISCNCT = 0V (Note 2) 2.5 4 pF
3
UCC5619
PIN DESCRIPTIONS
DISCNCT: Taking this pin low causes all channels to
become high impedance, and the chip to go into
low-power mode; a high state or leaving it open allows
the channels to provide normal termination.
GND: Ground reference for the IC.
LINE1 - LINE27: 110Ωtermination channels.
REG: Output of the internal 2.7V regulator; bypass with a
4.7 F capacitor to GND.
TRMPWR: Power for the IC; bypass with a 4.7 F
capacitor to GND.
ELECTRICAL CHARACTERISTICS Unless otherwise stated, these specifications apply for TA= 0°C to 70°C,
TRMPWR = 4.75V, DISCNCT = 4.75V, TA=T
J.
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
Regulator Section
Regulator Output Voltage 2.6 2.8 3.0 V
Drop Out Voltage All Termination Lines = 0.2V 0.4 0.8 V
Short Circuit Current VREG = 0V −650 −900 –1300 mA
Sinking Current Capability VREG = 3.5V 300 500 900 mA
Thermal Shutdown 170 °C
Thermal Shutdown Hysteresis 10 °C
Disconnect Section
Disconnect Threshold 0.8 1.5 2.0 V
Input Current DISCNCT = 0V –20 –60 µA
Note 1: Measuring each termination line while other 26 are low (0.2V).
Note 2: Ensured by design. Not 100% tested in production.
Note 3: Tested by measuring I
OUT
with V
OUT
= 0.2V and V
OUT
with no load, then calculate: ZVNL V
IatV
OUT
OUT
=..– .
.
02
02
11
29
25TERMPWRDISCNCT
DATA BYTES
1AND2
+2 PARITY BITS
7
REG
4.7µF
4.7µF
TO SCSI BUS
TERMPWR
17
LINE1 LINE27
CONTROL
BYTES
TO DRIVERS
AND
RECEIVERS
UCC5619
Figure 1. Typical wide SCSI bus configuration using the UCC5619
UDG-98072
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
UCC5619MWP ACTIVE SSOP DCE 36 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC5619MWPG4 ACTIVE SSOP DCE 36 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC5619MWPTR ACTIVE SSOP DCE 36 1000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UCC5619MWPTRG4 ACTIVE SSOP DCE 36 1000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 5-Feb-2007
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm) W
(mm) Pin1
Quadrant
UCC5619MWPTR SSOP DCE 36 1000 330.0 24.4 10.85 15.8 2.7 12.0 24.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 30-Jan-2009
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
UCC5619MWPTR SSOP DCE 36 1000 346.0 346.0 41.0
PACKAGE MATERIALS INFORMATION
www.ti.com 30-Jan-2009
Pack Materials-Page 2
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