LVDS Interface ICs 56bit LVDS Transmitter 56:8 Serializer No.12057EAT05 BU7988KVT Description LVDS Interface IC of ROHM "Serializer" "Deserializer" operate from 8MHz to 150MHz wide clock range, and number of bits range is from 35 to 70. Data is transmitted seven times (7X) stream and reduce cable number by 3(1/3) or less. The ROHM's LVDS has low swing mode to be able to expect further low EMI. Features 1) Wide dot clock range : Single(112MHz)/Dual(224MHz)(NTSC, VGA, SVGA, WXGA UXGA) 2) Support spread spectrum clock generator. 3) Clock edge selectable. 4) Support reduced swing LVDS for low EMI. 5) Power down mode. 6) Package TQFP100V Applications Flat Plane Display Precaution This chip is not designed to protect from radioactivity. www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. 1/27 2011.12 - Rev.A Technical Note BU7988KVT Block Diagram LVCMOS Input CLK_IN LVDS Output PLL B10B17 8 8 8 8 8 R20R27 8 8 G20G27 8 8 B20B27 8 PARALLEL TO SERIAL G10G17 8 MUX R10R17 PARALLEL TO SERIAL (4150MHz) 8 HSYNC VSYNC DE TCLK1 P/N (8112MHz) TA1 P/N TB1 P/N TC1 P/N TD 1 P/N TCLK2 P/N (8112MHz) TA2 P/N TB2 P/N TC2 P/N TD2 P/N MODE0 MODE1 XRST OE SEL_BIT RF RS MAP FLIP Fig.1 Block Diagram www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. 2/27 2011.12 - Rev.A Technical Note BU7988KVT TQFP100V Package Outline and Specification Product No. 16.00.3 14.00.2 51 75 76 50 16.00.3 14.00.2 BU7988KVT 1PIN MARK 100 26 0.5 Lot No. 25 1 1.2MAX 1.00.1 0.10.1 0.1250.1 0.20.1 Fig.2 www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. 0.5 0.1 TQFP100V Package Outline and Specification 3/27 2011.12 - Rev.A Technical Note BU7988KVT 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 100-Pin TQFP (Top View) 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 LVDS GND TA1N TA1P TB1N TB1P LVDS VDD TC1N TC1P TCLK1N TCLK1P TD1N TD1P LVDS GND TA2N TA2P TB2N TB2P LVDS VDD TC2N TC2P TCLK2N TCLK2P TD2N TD2P LVDS GND B24 B25 VDD GND B26 B27 HSYNC VSYNC DE CLKIN RF RS Reserved0 MAP MODE1 MODE0 OE SEL_BIT XRST Reserved1 FLIP N/C PLL GND PLL VCC PLL GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 B15 B16 B17 R20 R21 R22 R23 R24 R25 R26 R27 VDD GND G20 G21 G22 G23 G24 G25 G26 G27 B20 B21 B22 B23 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 B14 B13 B12 GND VDD B11 B10 G17 G16 G15 G14 G13 G12 G11 G10 R17 R16 R15 R14 GND VDD R13 R12 R11 R10 Pin configuration Fig.3 Pin Diagram (Top View) www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. 4/27 2011.12 - Rev.A Technical Note BU7988KVT Pin Description Table 1 : Pin Description Pin Name Pin No. Type Descriptions TA1P, TA1N 48, 49 LVDS OUT TB1P, TB1N 46, 47 LVDS OUT TC1P, TC1N 43, 44 LVDS OUT TD1P, TD1N 39, 40 LVDS OUT TCLK1P, TCLK1N 41, 42 LVDS OUT TA2P, TA2N 36, 37 LVDS OUT TB2P, TB2N 34, 35 LVDS OUT TC2P TC2N 31, 32 LVDS OUT TD2P, TD2N 27, 28 LVDS OUT TCLK2P, TCLK2N 29, 30 LVDS OUT R17R10 60, 59, 58, 57, 54, 53, 52, 51 IN G17G10 68, 67, 66, 65, 64, 63, 62, 61 IN B17B10 78, 77, 76, 75, 74, 73, 70, 69 IN R27R20 86, 85, 84, 83, 82, 81, 80, 79 IN G27G20 96, 95, 94, 93, 92, 91, 90, 89 IN B27B20 6, 5, 2, 1, 100, 99, 98, 97 IN DE 9 IN DATA-ENABLE input. VSYNC 8 IN VSYNC input. HSYNC 7 IN HSYNC input. CLKIN 10 IN Clock Input. MAP 14 IN LVDS mapping table select. See Table11-14 and Figure11-14. XRST 19 IN H : Normal operation, L : Power down (all outputs are Hi-Z) FLIP 21 IN LVDS output pin select. See Table10. LVDS data out LVDS clock out LVDS data out www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. 5/27 LVDS clock out 1 Pixel data input. 2 Pixel data inputs. 2011.12 - Rev.A Technical Note BU7988KVT Pin Name Pin No. Type Descriptions LVDS swing mode, RS select. RS RS 12 LVDS Swing IN VDD 350mV GND 200mV Pixel Data Mode MODE1 MODE0 MODE1, MODE0 15, 16 IN Mode L L Dual-in/Dual-out L H Dual-in/Single-out H L Single-in/Dual-out H H Single-in/Single-out SEL_BIT 18 IN 6bit/8bit color select. *1 H:6bit (TDxP/N are Hi-Z), L8bit. OE 17 IN Outputs enable. H:Outputs enable, L:Output disable (all outputs are Hi-Z) RF 11 IN Input Clock Triggering Select H : Rising edge, L : Falling edge N/C 22 Reserved1 20 IN Must be tied to GND Reserved0 13 IN Must be open VDD 3, 55, 71, 87 Power Power Supply Pins for CMOS inputs, output and digital circuitry. GND 4, 56, 72, 88 Ground Ground Pins for CMOS inputs, outputs and digital circuitry. LVDS VDD 33, 45 Power Power Supply Pins for LVDS Outputs. LVDS GND 26, 38, 50 Ground Ground Pins for LVDS Outputs. PLL VDD 24 Power Power Supply for PLL circuitry. PLL GND 23, 25 Ground Ground Pin for PLL circuitry. Must be open *1: X=1,2 www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. 6/27 2011.12 - Rev.A Technical Note BU7988KVT Electrical characteristics Rating Table 2 : Absolute Maximum Rating Rating Parameter Symbol Min Max Units Supply Voltage VDD -0.3 4.0 V Input Voltage VIN -0.3 VDD+0.3 V VOUT -0.3 VDD+0.3 V Tstg -55 125 Output Voltage Storage Temperature Range Table 3 : Package Power PACKAGE Power Dissipation (mW) De-rating (mW/) *1 900 9.0 1400*2 14.0*2 TQFP100V *1: *2: At temperature Ta >25 Package power when mounting on the PCB board. The size of PCB board :70x70x1.6(mm3) The material of PCB board : The FR4 glass epoxy board.(3% or less copper foil area) (It is recommended to apply the above package power requirement to PCB board when the small swing input mode is used) Table 4 : Recommended Operating Conditions Parameter Supply Voltage Operating Temperature Range www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. Symbol VDD Rating Units Conditions Min Typ Max 3.0 3.3 3.6 V VDD,LVDSVDD,PLLVDD -20 - 85 0 - 70 Clock frequency from 8MHz up to 90MHz Clock frequency from 90MHz up to 112MHz Topr 7/27 2011.12 - Rev.A Technical Note BU7988KVT DC characteristics Table 5 : CMOS DC Specifications(VDD=3.0V3.6V, Ta=-20+85) Limits Parameter Symbol Min Typ Max Units High Level Input Voltage VIH VDDx0.8 - VDD V Low Level Input Voltage VIL GND - VDDx0.2 V Input Leak Current IINC -10 - +10 A Conditions 0V VIN VDD Table 6 : LVDS Transmitter DC Specifications(VDD=3.0V3.6V, Ta=-20+85) Limits Parameter Symbol Units Min Typ Max Conditions Normal swing RS=VDD Reduced swing RS=GND 250 350 450 mV 120 200 300 mV VOD - - 35 mV VOC 1.125 1.25 1.375 V Change in VOC between complementary output states VOC - - 35 mV Output Short Circuit Current IOS - - -24 mA VOUT=0V, RL=100 Output TRI-STATE Current IOZ -10 - +10 A XRST=0V, VOUT=0V to VDD Differential Output Voltage Change in VOD between complementary output states Common Mode Voltage www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. VOD RL=100 8/27 RL=100 2011.12 - Rev.A Technical Note BU7988KVT Supply Current Table 7 : Supply Current (VDD=3.3V, Ta=25,RL=100,CL=15pF) Parameter Symbol Rating Min Typ Max - 98 - - 70 - Units MODE[1:0]=L L 87 - MODE[1:0]=H L CLKIN = 150MHz - 62 - MODE[1:0]=H H CLKIN = 112MHz - 76 - MODE[1:0]=L L - 57 - ITCCG CLKIN = 112MHz MODE[1:0]=L H CLKIN = 56MHz RS=L - 67 - MODE[1:0]=H L CLKIN = 150MHz - 49 - MODE[1:0]=H H CLKIN = 112MHz - 101 - MODE[1:0]=L L - 87 - CLKIN = 112MHz MODE[1:0]=L H CLKIN = 56MHz mA RS=H - 91 - MODE[1:0]=H L CLKIN = 150MHz - 65 - MODE[1:0]=H H CLKIN = 112MHz - 79 - MODE[1:0]=L L - 63 - ITCCW ITCCS www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. CLKIN = 112MHz MODE[1:0]=L H CLKIN = 56MHz mA Transmitter Power Down Supply Current RS=H - mA Transmitter Supply Current (Worst Case pattern) CLKIN = 112MHz MODE[1:0]=L H CLKIN = 56MHz mA Transmitter Supply Current (Gray Scale Pattern) Conditions RS=L - 68 - MODE[1:0]=H L CLKIN = 150MHz - 55 - MODE[1:0]=H H CLKIN = 112MHz - - 10 9/27 A XRST=L 2011.12 - Rev.A Technical Note BU7988KVT Gray Scale Pattern CLK_IN Rx0/Gx0/Bx0 Rx1/Gx1/Bx1 Rx2/Gx2/Bx2 Rx3/Gx3/Bx3 Rx4/Gx4/Bx4 Rx5/Gx5/Bx5 Rx6/Gx6/Bx6 Rx7/Gx7/Bx7 x=1.2 Fig.4 Gray scale pattern Worst Case Pattern (Maximum Power condition) CLK_IN Rx0/Gx0/Bx0 Rx1/Gx1/Bx1 Rx2/Gx2/Bx2 Rx3/Gx3/Bx3 Rx4/Gx4/Bx4 Rx5/Gx5/Bx5 Rx6/Gx6/Bx6 Rx7/Gx7/Bx7 x=1.2 Fig.5 www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. Worst Case Pattern 10/27 2011.12 - Rev.A Technical Note BU7988KVT AC characteristics Table 8 : Switching Characteristics (VDD=3.3V, Ta=25) Parameter Symbol Min Typ Max Units tTCIT - - 5.0 ns 8.9 - 125.0 ns 17.8 - 62.5 Single In / Dual Out 6.7 - 250.0 Single In / Single Out 8.9 CLK IN Transition time Dual In /Dual Out Dual In / Single Out CLK IN Period tTCP 125.0 CLK IN High Time tTCH 0.35tTCP 0.5tTCP 0.65tTCP ns CLK IN Low Time tTCL 0.35tTCP 0.5tTCP 0.65tTCP ns - TBD - ns - TBD - - TBD - Dual In /Dual Out Single In/Single Out CLK IN to TCLK+/-Delay Dual In / Single Out tTCD Single In / Dual Out CMOS Data Setup to CLK IN tTS 2.5 - - ns CMOS Data Hold from CLK IN tTH 0 - - ns 8.9 - 125.0 8.9 - 125.0 Single In / Dual Out 13.3 - 125.0 Single In / Single Out 8.9 Dual In /Dual Out Dual In / Single Out CLK OUT Period tTCOP 125.0 LVDS Transition Time tLVT - 0.6 1.5 ns Output Data Position 0 tTOP1 -0.2 0.0 +0.2 ns Output Data Position 1 tTOP0 Output Data Position 2 tTOP6 Output Data Position 3 tTOP5 Output Data Position 4 tTOP4 Output Data Position 5 tTOP3 Output Data Position 6 tTOP2 tTCP -0.2 7 tTCP 2 -0.2 7 tTCP 3 -0.2 7 tTCP -0.2 4 7 tTCP 5 -0.2 7 tTCP 6 -0.2 7 tTCP 7 tTCP 2 7 tTCP 3 7 tTCP 4 7 tTCP 5 7 tTCP 6 7 tTCP +0.2 7 tTCP 2 +0.2 7 tTCP 3 +0.2 7 tTCP 4 +0.2 7 tTCP 5 +0.2 7 tTCP 6 +0.2 7 Skew Time between TCLKXP and TCLKYP Tck12 - - 0.5 ns Phase Lock Loop Set Time tTPLL - - 10.0 ms www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. 11/27 ns ns ns ns ns ns 2011.12 - Rev.A Technical Note BU7988KVT AC Timing AC Timing Diagrams LVCMOS Input 90% CLK IN 90% 10% 10% LVDS Output tTCIT tTCIT Vdiff=(TAP)-(TAN) 80% 80% TAP 5pF Vdiff 100O 20% TAN LVDS Output Load 20% tLVT tLVT LVCMOS Input tTCP tTCH CLKIN VDD/2 VDD/2 VDD/2 tTCP Rxn/Gxn/ Bxn HSYNC, VSYNC,DE tTCH VDD/2 RF=L RF=H tTH VDD/2 tTCD TCLK1/2P VOC TCLK1/2N x=1, 2 y=0-7 Fig.6 AC Timing Diagrams www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. 12/27 2011.12 - Rev.A Technical Note BU7988KVT AC Timing Diagrams tTOP2 tTOP3 tTOP4 tTOP5 tTOP6 tTOP0 tTOP1 Tyx+/- Tyx6 Tyx5 Tyx4 Tyx3 Tyx2 Tyx1 Tyx0 Tyx6 Tyx5 Tyx4 Tyx2 Tyx1 Vdiff = 0V Vdiff = 0V TCLK1+ Tyx3 tTCOP Vdiff = 0V TCLK1P+ tCK12 TCLK2P+ Vdiff = 0V Note: Vdiff = (Tyx+) - (Tyx-), (TCLK1P) - (TCLK1N) Fig.7 AC Timing Diagrams Phase Lock Loop Set Time XRST V DD /2 3.6V 3.0V VDD t TPLL CLKIN V diff=0V TCLKP/N Fig.8 Phase Lock Loop Set Time www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. 13/27 2011.12 - Rev.A Technical Note BU7988KVT Pixel Map Table for Dual Link Table 9 : Pixel Map Table for Dual Link 1st Pixel Data 2nd Pixel Data TFT Panel Data TFT Panel Data BU7988KVT Input 18Bit R20 - R20 R11 R21 - R21 R10 R12 R22 R20 R22 R13 R11 R13 R23 R21 R23 R14 R12 R14 R24 R22 R24 R15 R13 R15 R25 R23 R25 R16 R14 R16 R26 R24 R26 MSB R17 R15 R17 MSB R27 R25 R27 LSB G10 - G10 LSB G20 - G20 G11 - G11 G21 - G21 G12 G10 G12 G22 G20 G22 G13 G11 G13 G23 G21 G23 G14 G12 G14 G24 G22 G24 G15 G13 G15 G25 G23 G25 G16 G14 G16 G26 G24 G26 MSB G17 G15 G17 MSB G27 G25 G27 LSB B10 - B10 LSB B20 - B20 B11 - B11 B21 - B21 B12 B10 B12 B22 B20 B22 B13 B11 B13 B23 B21 B23 B14 B12 B14 B24 B22 B24 B15 B13 B15 B25 B23 B25 B16 B14 B16 B26 B24 B26 B17 B15 B17 B27 B25 B27 MSB 18Bit R10 - R10 R11 - R12 BU7988KVT Input 24Bit LSB 24Bit www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. LSB MSB 14/27 2011.12 - Rev.A Technical Note BU7988KVT LVDS Data Output Table for Function of FLIP pin Table 10 : LVDS Data Output Pin Name Output Pin Names Pin No FLIP=L FLIP=H 49 TA1N TD2P 48 TA1P TD2N 47 TB1N TCLK2P 46 TB1P TCLK2N 44 TC1N TC2P 43 TC1P TC2N 42 TCLK1N TB2P 41 TCLK1P TB2N 40 TD1N TA2P 39 TD1P TA2N 37 TA2N TD1P 36 TA2P TD1N 35 TB2N TCLK1P 34 TB2P TCLK1N 32 TC2N TC1P 31 TC2P TC1N 30 TCLK2N TB1P 29 TCLK2P TB1N 28 TD2N TA1P 27 TD2P TA1N www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. 15/27 2011.12 - Rev.A Technical Note BU7988KVT LVCMOS Data Input Timing for Dual Link Example : SXGA+(1400x1050) HSYNC DE C L K _IN R 1x/G 1x/B 1x #1 #3 #5 #7 1395 #1397 #1399 R 2x/G 2x/B 2x #2 #4 #6 #8 1396 #1398 #1400 #1 #2 #1399 #1400 x=0 9 TFT P anel (1 4 0 0 x 1 0 5 0 ) Fig.9 LVCMOS Data Input Timing for Dual Link LVCMOS Data Input Timing for Single Link Example : SXGA+(1400x1050) HSYNC DE C L K _IN R 1x/G 1x/B 1x #1 #2 #1 #2 #3 #4 1398 #1399 #1400 #1399 #1400 x=0 9 TFT P anel (1 4 0 0 x 1 0 5 0 ) Fig.10 LVCMOS Data Input Timing for Single Link www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. 16/27 2011.12 - Rev.A Technical Note BU7988KVT LVDS Output Data Mapping (Dual Link / Single Link) Previous Cycle Current Cycle TCLK1+ TA1+/- TA14-1 TA13-1 TA12-1 TA11-1 TA10-1 TA16 TA15 TA14 TA13 TA12 TA11 TA10 TA16+1 TB1+/- TB14-1 TB13-1 TB12-1 TB11-1 TB10-1 TB16 TB15 TB14 TB13 TB12 TB11 TB10 TB16+1 VSYNC HSYNC TC13 TC12 TC11 TC10 DE+1 TD15 TD14 TD13 TD12 TD11 TD10 L TC1/- HSYNC-1 TD1+/- TD13-1 TD12-1 TC11-1 TC10-1 TD14-1 TD13-1 TD12-1 TD11-1 TD10-1 DE L TCLK2+ TA2+/- TA24-1 TA23-1 TA22-1 TA21-1 TA20-1 TA26 TA25 TA24 TA23 TA22 TA21 TA20 TA26+1 TB2+/- TB24-1 TB23-1 TB22-1 TB21-1 TB20-1 TB26 TB25 TB24 TB23 TB22 TB21 TB20 TB26+1 TC2+/- HSYNC-1 VSYNC HSYNC TC23 TC22 TC21 TC20 DE+1 TD2+/- TD24-1 TD23-1 TD22-1 TD21-1 TD20-1 TD25 TD22 TD21 TD20 L TD23-1 TD22-1 TC21-1 TC20-1 DE L TD24 TD23 LVDS Data Output R1n,~ B1 nn=0~ 7 R2n,~ B2n n=0~ 7 DATA1n -1 DATA2n-1 DATA1n DATA2n DATA1n +1 DATA2n+1 VDD GND VDD GND LVCMOS Data Input Fig.11 LVDS Output Data Mapping www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. 17/27 2011.12 - Rev.A Technical Note BU7988KVT LVCMOS Data Inputs Timing in Dual Link Dual-in / Dual-out Mode (MODE<1:0>=LL , FLIP=L) Table 11 : LVCMOS Data Inputs Timing Diagrams in Dual Link 1st Pixel Data 2nd Pixel Data LVDS Output Data (1st Pixel Data) MAP=H Input Pin Name MAP=L Input Pin Name LVDS Output Data (2nd Pixel Data) MAP=H Input Pin Name MAP=L Input Pin Name TA10 R12 R10 TA20 R22 R20 TA11 R13 R11 TA21 R23 R21 TA12 R14 R12 TA22 R24 R22 TA13 R15 R13 TA23 R25 R23 TA14 R16 R14 TA24 R26 R24 TA15 R17 R15 TA25 R27 R25 TA16 G12 G10 TA26 G22 G20 TB10 G13 G11 TB20 G23 G21 TB11 G14 G12 TB21 G24 G22 TB12 G15 G13 TB22 G25 G23 TB13 G16 G14 TB23 G26 G24 TB14 G17 G15 TB24 G27 G25 TB15 B12 B10 TB25 B22 B20 TB16 B13 B11 TB26 B23 B21 TC10 B14 B12 TC20 B24 B22 TC11 B15 B13 TC21 B25 B23 TC12 B16 B14 TC22 B26 B24 TC13 B17 B15 TC23 B27 B25 TC14 HSYNC HSYNC TC24 HSYNC HSYNC TC15 VSYNC VSYNC TC25 VSYNC VSYNC TC16 DE DE TC26 DE DE TD10 R10 R16 TD20 R20 R26 TD11 R11 R17 TD21 R21 R27 TD12 G10 G16 TD22 G20 G26 TD13 G11 G17 TD23 G21 G27 TD14 B10 B16 TD24 B20 B26 TD15 B11 B17 TD25 B21 B27 TD16 L L TD26 L L www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. 18/27 2011.12 - Rev.A Technical Note BU7988KVT LVCMOS Data Inputs Timing Diagrams in Dual Link Dual-in / Dual-out Mode (MODE<1:0>=LL, FLIP=L, MAP=H) Previous Cycle Current Cycle TCLK1+ TA1+/- R16-1 R15-1 R14-1 R13-1 R12-1 G12 R17 R16 R15 R14 R13 R12 G12+1 TB1+/- G17-1 G16-1 G15-1 G14-1 G13-1 B13 B12 G17 G16 G15 G14 G13 B13+1 B17-1 B16-1 B15-1 B14-1 DE VSYNC HSYNC B17 B16 B15 B14 DE+1 L B11 B10 G11 G10 R11 R10 L TC1/- TD1+/- HSYNC-1 B10-1 G11-1 G10-1 R11-1 R10-1 TCLK2+ TA2+/- R26-1 R25-1 R24-1 R23-1 R22-1 G22 R27 R26 R25 R24 R23 R22 G22+1 TB2+/- G27-1 G26-1 G25-1 G24-1 G23-1 B23 B22 G27 G26 G25 G24 G23 B23+1 TC2+/- HSYNC-1 B27-1 B26-1 B25-1 B24-1 DE VSYNC HSYNC B27 B26 B25 B24 DE+1 TD2+/- B20-1 G21-1 G20-1 R21-1 R20-1 L B21 B20 G21 G20 R21 R20 L LVDS Data Output R1n,~ B1 nn=0~ 7 R2n,~ B2n n=0~ 7 DATA1n -1 DATA2n-1 DATA1n DATA2n DATA1n +1 DATA2n+1 VDD GND VDD GND LVCMOS Data Input Fig.12 LVCMOS Data Inputs Timing Diagrams in Dual Link www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. 19/27 2011.12 - Rev.A Technical Note BU7988KVT LVCMOS Data Inputs Timing in Single Link Dual-in / Single-out Mode (MODE<1:0>=LH, FLIP=L) Table 12 : LVCMOS Data Inputs Timing Diagrams in Dual Link LVDS Output Data (1st Pixel Data) Mapping Mode1 (Input Pin Name) Mapping Mode2 (Input Pin Name) TA10 R12/R22 R10/R20 TA11 R13/R23 R11/R21 TA12 R14/R24 R12/R22 TA13 R15/R25 R13/R23 TA14 R16/R26 R14/R24 TA15 R17/R27 R15/R25 G10/G20 TA16 G12/G22 TB10 G13/G23 G11/G21 TB11 G14/G24 G12/G22 TB12 G15/G25 G13/G23 TB13 G16/G26 G14/G24 TB14 G17/G27 G15/G25 TB15 B12/B22 B10/B20 TB16 B13/B23 B11/B21 TC10 B14/B24 B12/B22 TC11 B15/B25 B13/B23 TC12 B16/B26 B14/B24 TC13 B17/B27 B15/B25 TC14 HSYNC HSYNC TC15 VSYNC VSYNC TC16 DE DE TD10 R10/R20 R16/R26 TD11 R11/R21 R17/R27 TD12 G10/G20 G16/G26 TD13 G11/G21 G17/G27 TD14 B10/B20 B16/B26 TD15 B11/B21 B17/B27 TD16 L L www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. 20/27 2011.12 - Rev.A Technical Note BU7988KVT LVCMOS Data Inputs Timing Diagrams in Single Link Dual-in / Single-out Mode (MODE<1:0>=LH, FLIP=L, MAP=H) Previous Cycle (2nd Pixel Data) Current Cycle (1st Pixel Data) TCLK1+ TA1+/- R26-1 R25-1 R24-1 R23-1 R22-1 G12 R17 R16 R15 R14 R13 R12 G22 TB1+/- G27-1 G26-1 G25-1 G24-1 G23-1 B13 B12 G17 G16 G15 G14 G13 B23 VSYNC HSYNC B17 B16 B15 B14 DE B11 B10 G11 G10 R11 R10 L TC1/- TD1+/- HSYNC-1 B27-1 B26-1 B25-1 B24-1 DE B20-1 G21-1 G20-1 R21-1 R20-1 L LVDS Data Output R1n,~ B1 nn=0~ 7 R2n,~ B2n n=0~ 7 DATA1n -1 DATA2n-1 DATA1n DATA2n DATA1n +1 DATA2n+1 VDD GND VDD GND LVCMOS Data Input Fig.13 LVCMOS Data Inputs Timing Diagrams in Single Link www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. 21/27 2011.12 - Rev.A Technical Note BU7988KVT LVCMOS Data Inputs Timing in Single Link Single-in / Dual-out Mode (MODE<1:0>=HH, FLIP=L) Table 13 : LVCMOS Data Inputs Timing Diagrams in Single Link 1st Pixel Data 2nd Pixel Data LVDS Output Data (1st Pixel Data) MAP=H Input Pin Name MAP=L Input Pin Name LVDS Output Data (1st Pixel Data) MAP=H Input Pin Name MAP=L Input Pin Name TA10 R12 R10 TA20 R12+1 R10+1 TA11 R13 R11 TA21 R13+1 R11+1 +1 R12+1 TA12 R14 R12 TA22 R14 TA13 R15 R13 TA23 R15+1 R13+1 TA14 R16 R14 TA24 R16+1 R14+1 +1 R15+1 TA15 R17 R15 TA25 R17 TA16 G12 G10 TA26 G12+1 G10+1 TB10 G13 G11 TB20 G13+1 G11+1 +1 G12+1 TB11 G14 G12 TB21 G14 TB12 G15 G13 TB22 G15+1 G13+1 TB13 G16 G14 TB23 G16+1 G14+1 +1 G15+1 TB14 G17 G15 TB24 G17 TB15 B12 B10 TB25 B12+1 B10+1 TB16 B13 B11 TB26 B13+1 B11+1 +1 B12+1 TC10 B14 B12 TC20 B14 TC11 B15 B13 TC21 B15+1 B13+1 TC12 B16 B14 TC22 B16+1 B14+1 +1 B15+1 TC13 B17 B15 TC23 B17 TC14 HSYNC HSYNC TC24 HSYNC+1 HSYNC+1 TC15 VSYNC VSYNC TC25 VSYNC+1 VSYNC+1 +1 DE+1 TC16 DE DE TC26 DE TD10 R10 R16 TD20 R10+1 R16+1 TD11 R11 R17 TD21 R11+1 R17+1 +1 +1 TD12 G10 G16 TD22 G10 TD13 G11 G17 TD23 G11+1 G17+1 TD14 B10 B16 TD24 B10+1 B16+1 +1 B17+1 TD15 B11 B17 TD25 B11 TD16 L L TD26 L www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. 22/27 G16 L 2011.12 - Rev.A Technical Note BU7988KVT LVCMOS Data Inputs Timing in Dual Link Single-in / Dual-out Mode (MODE<1:0>=HL, FLIP=L, MAP=H) Previous Cycle Current Cycle TCLK1+ TA1+/- R16-2 R15-2 R14-2 R13-2 R12-2 G12 R17 R16 R15 R14 R13 R12 G12+2 TB1+/- G17-2 G16-2 G15-2 G14-2 G13-2 B13 B12 G17 G16 G15 G14 G13 B13+2 VSYNC HSYNC B17 B16 B15 B14 DE+2 B11 B10 G11 G10 R11 R10 L TC1/- TD1+/- HSYNC-2 B17-2 B16-2 B15-2 B14-2 DE B10-2 G11-2 G10-2 R11-2 R10-2 L TCLK2+ TA2+/- R16-1 R15-1 R14-1 R13-1 R12-1 G12+1 R17+1 R16+1 R15+1 R14+1 R13+1 R12+1 G12+3 TB2+/- G17-1 G16-1 G15-1 G14-1 G13-1 B13+1 B12+1 G17+1 G16+1 G15+1 G14+1 G13+1 B13+3 TC2+/- HSYNC-1 TD2+/- B10-1 G11-1 G10-1 R11-1 R10-1 B17-1 B16-1 B15-1 B14-1 DE+1 L VSYNC+1 HSYNC+1 B17+1 B16+1 B15+1 B14+1 DE+3 B11+1 B10+1 G11+1 G10+1 R11+1 R10+1 L LVDS Data Output R1n,G1n,B1n (n=0~7) -2 DATA1n -1 DATA1n DATA1n +1 DATA1n +2 DATA1n +3 DATA1n VDD GND LVCMOS Data Input Fig.14 LVCMOS Data Inputs Timing in Dual Link www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. 23/27 2011.12 - Rev.A Technical Note BU7988KVT LVCMOS Data Inputs Timing in Single Link Single-in / Single-out Mode (MODE<1:0>=HH, FLIP=L) Table 14 : LVCMOS Data Inputs Timing Diagrams in Single Link LVDS Output Data (1st Pixel Data) MAP=H Input Pin Name MAP=L Input Pin Name TA10 R12 R10 TA11 R13 R11 TA12 R14 R12 TA13 R15 R13 TA14 R16 R14 TA15 R17 R15 TA16 G12 G10 TB10 G13 G11 TB11 G14 G12 TB12 G15 G13 TB13 G16 G14 TB14 G17 G15 TB15 B12 B10 TB16 B13 B11 TC10 B14 B12 TC11 B15 B13 TC12 B16 B14 TC13 B17 B15 TC14 HSYNC HSYNC TC15 VSYNC VSYNC TC16 DE DE TD10 R10 R16 TD11 R11 R17 TD12 G10 G16 TD13 G11 G17 TD14 B10 B16 TD15 B11 B17 TD16 L L www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. 24/27 2011.12 - Rev.A Technical Note BU7988KVT LVCMOS Data Inputs Timing Diagrams in Single Link Single-in / Single-out Mode (MODE<1:0>=HH, FLIP=L, MAP=H) Previous Cycle Current Cycle TCLK1+ TA1+/- R16-1 R15-1 R14-1 R13-1 R12-1 G12 R17 R16 R15 R14 R13 R12 G12+1 TB1+/- G17-1 G16-1 G15-1 G14-1 G13-1 B13 B12 G17 G16 G15 G14 G13 B13+1 B17-1 B16-1 B15-1 B14-1 DE VSYNC HSYNC B17 B16 B15 B14 DE+1 L B11 B10 G11 G10 R11 R10 L TC1/- TD1+/- HSYNC-1 B10-1 G11-1 G10-1 R11-1 R10-1 LVDS Data Output R1n,G1n,B1n (n=0~ 7) DATA1n-1 DATA1n DATA1n+1 VDD GND LVCMOS Data Input Fig.15 LVCMOS Data Inputs Timing Diagrams in Single Link www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. 25/27 2011.12 - Rev.A Technical Note BU7988KVT About the Power On Reset Power On Reset is not mandatory for this device. (The PD pin should be set to high level when Power On Reset procedure is not used.) VDD XRST BU7988KVT Fig.16 terminal connection when Power On Reset is not used However, Power On Reset procedure is strongly recommend for internal logic initialization by following two methods. The method of using CR circuit. The method of using external specific IC. It is recommend to do enough examination for target application. VDD VDD schottky barrier diode 10KO VDD VT+ XRST 220O Be careful of temperature of the capacitor especially over and again. B characteristic ceramics and polymer aluminum are recommended. XRST Internal Reset 2.2F td td is approximately equal to 20ms when the left RC coleus are applied. Fig.17 Power On Reset by external a CR circuit VDD VDD power on IC (open drain output) VDD Detection voltage VDD 220KO XRST VOUT VT+ XRST 0.1F GND B Characteristic ceramics Internal Reset td Fig.18 Power On Reset by specific www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. 26/27 2011.12 - Rev.A Technical Note BU7988KVT Ordering Part Number B U 7 Part No. 9 8 8 K V T Part No. Packaging and forming specification None:Tray Package KVT: TQFP100V TQFP100V <Tape and Reel information> 16.00.3 14.00.2 50 100 26 14.00.2 Tray (with dry pack) Quantity 500pcs Direction of feed Direction of product is fixed in a tray 1pin 0.5 16.00.3 76 1 25 0.1250.1 1.00.1 0.10.1 1.2Max. Container 51 75 0.1 0.5 0.20.1 Order quantity needs to be multiple of the minimum quantity. (Unit : mm) www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. 27/27 2011.12 - Rev.A Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ("Specific Applications"), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM's Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASS CLASSb CLASS CLASS CLASS CLASS 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM's Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE (c) 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM's internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - GE (c) 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM's Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM's Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an "as is" basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice - WE (c) 2014 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet bu7988kvt - Web Page Buy Distribution Inventory Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS bu7988kvt TQFP100V 500 50 Tray inquiry Yes