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RevH,.011508
PD-94640 RevH
IRAMS10UP60A
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Internal Electrical Schematic - IRAMS10UP60A
23 VS1
24 HO1
25 VB1
1 VCC
2 HIN1
3 HIN2
4 HIN3
5 LIN1 LIN2
6LIN3
7F
8ITRIP
9EN
10 RCIN
11 VSS
12 COM
13
22
VB2 21
HO2 20
VS2 19
VB3 18
HO3 17
VS3
VRU (12)
VRW (1 4)
VR V (13)
VB1 (7)
U, VS1 (8)
VB2 (4)
V, VS 2 (5)
VB3 (1)
W, VS3 (2)
THERMISTOR
R3
VDD (22)
VSS (23)
R1
R2
C
Rg1 Rg3 Rg5
Driver IC
RT
LO1 16
LO3 14
LO2 15
Rg2
Rg4
Rg6
T/ITRIP (21)
HIN1 (15)
HIN2 (16)
HIN3 (17)
LIN1 (18)
LIN2 (19)
LIN3 (20)
V (10 )+
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Thermal Resistance
Inverter Section Electrical Characteristics @ TJ = 25°C
Inverter Section Switching Characteristics
Symbol Parameter Min Typ Max Units
Eon T u rn-On Switchi n g L oss --- 200 235
Eoff T urn-Off Sw i tch i ng Loss --- 75 100
Etot Total Switching Loss --- 275 335 TJ=25°C
Eon T u rn-on S wti chi n g L oss --- 300 360 T J=150°C
Eoff T urn -off Switching L oss --- 135 165
Etot Total Switching Loss --- 435 525
Erec D iod e Rever se Rec overy
energy --- 30 40 µJ
trr D i ode Reverse Recovery ti me --- 100 145 ns
RBSOA Revers e B ias S afe Oper ati n g
Area
SCSOA Short Circui t Safe Operati ng
Area 10 --- --- µs
FULL SQUARE TJ=150°C, IC=5A, VP=600V
V+=480V , V DD=+15V to 0V
See CT3
Conditions
IC=5A, V +=400V
VDD=15V , L =1mH
See CT1
En ergy losses i nclude " tai l " and
diode r everse rec over y
TJ=150°C, V P=600V,
V+=360V,
VDD=+15V to 0V See CT2
µJ
µJ
TJ=150°C, V + =400V V DD=15V,
IF=5A, L =1mH
Symbol Parameter Min Typ Max Units Conditions
Rth(J-C)
Ju n c tio n to c as e th er ma l
resi stan ce, eac h I GBT un der
inverter o per ation. --- 4.2 4.7 °C/W
Rth(J-C)
Ju n c tio n to c as e th er ma l
resi stan ce, each D i od e und er
inverter o per ation. --- 5.5 6.5 °C/W
Rth(C-S) Th ermal Resi stance case to
sink --- 0.1 --- °C/W
Flat ,
g
reased surface.
Heatsi nk compound thermal
conducti vity - 1W/mK
Symbol Parameter Min Typ Max Units Conditions
V(BR)CES Co ll e c tor - to - E mitte r Br eakd o w n
Voltage 600 --- --- V VIN=0V , IC=20µA
∆V(BR)CES / ∆TT emp eratu re Co eff. Of
Breakdown Voltage --- 0.57 --- V/°C VIN=0V , IC=1.0mA
(25° C - 150° C)
--- 1.7 2.0 IC=5A TJ=25°C, V DD=15V
--- 2.0 2.4 IC=5A TJ=150°C
--- 5 15 VIN=5V , V +=600V
--- 10 40 VIN=5V , V +=600V , T J=150°C
Ilk_module Zero Gate Phase-to-Phase
Current -- -- 50 µAV
IN=5V , V +=600V
--- 1.8 2.35 IC=5A
--- 1.3 1.7 IC=5A, T J=150°C
V
µA
V
VCE(ON)
ICES
VFM
Co ll e c tor - to - E mitte r S a tu r atio n
Voltage
Zero Gate Voltage Coll ector
Current-to-Emitter
D iod e For w ard Vol tag e D r op
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Recommended Operating Conditions Driver Function
The Input/Output logic timing diagram is shown in Figure 1. For proper operation the device should be used within the
recommended conditions. All voltages are absolute referenced to VSS. The VS offset is tested with all supplies biased
at 15V differential (Note 1). All input pin (VIN ) and ITRIP are clamped with a 5.2V zener diode and pull-up resistor to
VDD
Symbol Definition Min Max Units
VB1,2,3 H igh side fl oati ng sup pl y vol tag e V S+12 VS+20
VS1,2,3 H i gh si d e fl oati n g su pply offset voltage N ote 2 450
VDD L ow si de and l ogi c fi xed suppl y voltage 12 20
VITRIP T/ITRIP input voltage VSS VSS+5
VIN L ogi c i nput vol tage L IN, H IN V SS VSS+5 V
V
V
Static Electrical Characteristics Driver Function
VBIAS (VCC, VBS1,2,3)=15V, unless otherwise specified. The VIN and IIN parameters are referenced to VSS and are appli-
cable to all six channels. (Note 1)
Absolute Maximum Ratings Driver Function
Absolute Maximum Ratings indicate substaines limits beyond which damage to the device may occur. All voltage param-
eters are absolute voltages referenced to (Note 1)
VSS
Symbol Definition Min Max Units
VS1,2,3 H i gh S i de offset vol tage -0.3 600 V
VB1,2,3 H i gh Si de fl oati ng suppl y vol tage -0.3 20 V
VDD L ow Si de and l ogi c fi xed suppl y voltage -0.3 20 V
VIN Input voltage LIN, HIN, T/ITRIP -0.3 7 V
TJJucti on T emp erature -40 150 °C
Symbol Definition Min Typ Max Units
VIN,th+ Posi ti ve goi ng i nput threshol d 3.0 --- --- V
VIN,th- N egati ve goi n g i nput threshol d --- --- 0.8 V
IQBS Qu iesc en t V BS suppl y cu rren t --- 70 120 µA
IQCC Qu i s cen t VCC supp l y c urrent --- 1.6 2.3 mA
ILK Offset S u p p l y L eakag e Cur ren t -- - - - - 5 0 µA
IIN+ In put bi as current (OUT =L O) --- 100 220 µA
IIN+ In put bi as current (OUT =H I) --- 200 300 µA
V(ITRIP)I
TRIP th reshol d V ol tage (OUT =H I or OU T =L O) 3.85 4.3 4.75 V
11.4
---
V
V
V
10.9
0.2
10.4
---
VCCUV+
VBSUV+
VCCUV-
VBSUV-
VCC and V BS suppl y u ndervoltage
N egati ve goi ng threshol d
VCCUVH
VBSUVH
VCC and V BS suppl y u ndervoltage
Ilockout hysteresis
10.6 11.1 11.6
VCC and V BS suppl y u ndervoltage
Positi ve g oi n g threshold
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Note 3: The Maximum recommended sense voltage at the T/ITRIP terminal under normal operating conditions is 3.3V.
Thermistor Built-in IRAMS10UP60A
Internal NTC - Thermistor Characteristics
Note 1: For more details, see IR21365 data sheet
Note 2: Logic operational for Vs from V--5V to V-+600V. Logic stata held for VS from V--5V to V--VBS. (Please refer to
DT97-3 for more details)
Symbol Definition Min Typ Max Units
TON In p u t to ou tp u t p ro p ag ation tu r n -o n d elay time ( s ee fig.11 ) - 4 70 - n s
TOFF I n p u t to o u tpu t p r op ag atio n tur n - off delay ti me ( se e fi g . 1 1 ) - 6 15 - n s
DTD ead T i me - 300 - ns
I/TTrip T/ITrip to six switch to turn-off propagation delay (see fig. 2) - 750 - ns
TFCLTRL Post ITrip to s ix swi tc h to tu r n -o ff clear ti me ( see fig . 2 ) - 9 - ms
Typ Units Conditions
R25 Resi stance 100 + /- 5 % k ΩTC = 25°C
R125 Resi stance 2.522 + 17.3 % /- 14 .9% k ΩTC = 125°C
BB -Constan t (25-50 °C) 4250 +/- 3% k R2 = R1e [B (1 /T2 - 1/T1)]
-40 / 125 °C
1mW/°CT
C = 25° C
Parameter
T emperature Range
T yp. D i ssi pati on constant
IR21365
12K
NTC
VCC (22)
T/ITRIP (21)
VSS (23)
4.3k
Dynamic Electrical Characteristics
VDD=VBS=VBIAS=15V, Io=1A, VD=9V, PWMIN=2kHz, VIN_ON=VIN_th+, VIN_OFF=VIN_th-
TA=25°C, unless otherwise specified
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Figure1. Input/Output Timing Diagram
Note 4: The shaded area indicates that both high-side and low-side switches are off and therefore the half-
bridge output voltage would be determined by the direction of current flow in the load.
HO1,2,3
LO1,2,3
Itrip
U,V,W
LIN1,2,3
HIN1,2,3
Ho
Lo
U,V,W
IC
Driver
V+
Hin1,2,3
Lin1,2,3
(15,16,17)
(18,19,20)
(8,5,2)
Itrip U,V,W
001Vbus
0100
011X
1XXX
HIN1,2,3 LIN1,2,3
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Note 5: The shaded area indicates that both high-side and low-side switches are off and therefore the half-
bridge output voltage would be determined by the direction of current flow in the load.
Figure 2. T/ITrip Timing Waveform
T/Itrip
LIN1,2,3
HIN1,2,3
tfltclr
50%
50%
U,V,W
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Module Pin-Out Description
Pin Name Description
1 V B 3 H i gh Si de Fl oating S uppl y V oltage 3
2 W,V S3 Ou tput 3 - Hi gh Si de Fl oati ng Suppl y Offset V ol tage
3nanone
4 V B 2 H i gh Si de Fl oating S uppl y vol tage 2
5 V ,VS 2 Output 2 - Hi gh Si de Fl oating Suppl y Offset Vol tage
6nanone
7 V B 1 H i gh Si de Fl oating S uppl y vol tage 1
8 U,V S1 Output 1 - H i gh Si de Fl oating Supply Offset V ol tage
9nanone
10 V + Positi ve Bus In pu t Vol tag e
11 na none
12 L E1 L ow Si de Emi tter Connecti on - Phase 1
13 L E2 L ow Si de Emi tter Connecti on - Phase 2
14 L E3 L ow Si de Emi tter Connecti on - Phase 3
15 HIN1 Logic Input High Side Gate Driver - Phase 1
16 HIN2 Logic Input High Side Gate Driver - Phase 2
17 HIN3 Logic Input High Side Gate Driver - Phase 3
18 LIN1 Logic Input Low Side Gate Driver - Phase 1
19 LIN2 Logic Input Low Side Gate Driver - Phase 2
20 LIN3 Logic Input Low Side Gate Driver - Phase 3
21 T / Itri p T emperature M on i tor and S hu t-d own Pi n
22 V CC +15V M ain Suppl y
23 VSS Negative Main Supply
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Typical Application Connection IRAMS10UP60A
VDD(15 V)
T/ITRIP
VSS
3.3 V NTC 12k
5k
1m
CONTROLLER
3-ph AC
MOTOR
LINW
HINW
LINU
LINV
LeW
HINU
HINV
LeU
LeV
V+
VSU
VBU
VSV
VBV
VSW
VBW
Driver IC
DC BUS
CAPACITORS
PHASE LEG
CURRENT
SENSE
TEMP
SENSE
BOOT-STRAP
CAPACITORS
O/C
SENSE
(ACTIVE LOW)
10m
6.8K
10.2k
U
V
W
CURRENT SENSING CAN USE A
SINGLE SENSE RESISTOR OR PHASE
LEG SENSING AS S HO WN
0.1
m
1. Electrolytic bus capacitors should be mounted as close to the module bus terminals as possible to reduce ringing and
EMI problems. Additional high frequency ceramic capacitor mounted close to the module pins will further improve perfor-
mance.
2. In order to provide good decoupling between VCC-Gnd and VB-VSS terminals, the capacitors shown connected be-
tween these terminals should be located very close to the module pins. Additional high frequency capacitors, typically
0.1µF, are strongly recommended.
3. Value of the boot-strap capacitors depends upon the switching frequency. Their selection should be made based on
IR design tip DN 98-2a, application note AN-1044 or Figure 9.
4. Low inductance shunt resistors shuld be used for phase leg current sensing. Similarly, the length of the traces be-
tween pins 12, 13 and 14 to the corrisponding shunt resistors should be kept as small as possible.
5. Over-current sense signal can be obtained from external hardware detecting excessive instantaneous current in in-
verter.
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Figure 3. Maximum sinusoidal phase current as function of switching frequency
VBUS=400V, Tj=150°C, Modulation Depth=0.8, PF=0.6
Figure 4. Maximum sinusoidal phase current as function of modulation frequency
VBUS=400V, Tj=150°C, Tc=100°C, Modulation Depth=0.8, PF=0.6
0
1
2
3
4
5
6
7
8
9
10
02468101214161820
PWM Sw itchi ng Frequency ( kH z)
Maximum RMS Output Current/Phase (A) .
Tc=100°C
Tc=110°C
Tc=120°C
0
1
2
3
4
5
6
7
110100
Motor Current Modulation Frequency (Hz)
Maximum RMS Phase Current (A) .
12 k H z
16 k H z
20 k H z
Swi tchi ng Frequency:
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Figure 5. IGBT Turn-on. Typical turn-on waveform @Tj=125°C, VBUS=400V
Figure 6. IGBT Turn-off. Typical turn-off waveform @Tj=125°C, VBUS=400V
-1
0
1
2
3
4
5
6
7
8
9
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Time (µs)
Current (A)
-50
0
50
100
150
200
250
300
350
400
450
Voltage (V)
Current
Volta
g
e
-1
0
1
2
3
4
5
6
7
8
9
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Time (µs)
Current (A)
-50
0
50
100
150
200
250
300
350
400
450
Voltage (V)
Current
Volta
g
e
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Figure 7. Variation of thermistor resistance with temperature
Figure 8. Variation of temperature sense voltage with thermistor tempera-
ture using external bias resistance of 4.3KΩ, VCC=15V
1
10
100
1000
0 20 40 60 80 100 120 140
T emp eratu re ( ° C)
Thermistor Resistance (k_Ω)
Minimum
Nominal
Maximum
0
1
2
3
4
0 20 40 60 80 100 120 140
Thermistor Temperature (°C)
V sense (V) .
Maximum
Nominal
Minimum
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Figure 10. Recommended minimum Bootstrap Capacitor value Vs Switching
Frequency
Figure 9. Estimated maximum IGBT junction temperature with thermistor
temperature
2.2
4.7
15
0
2.5
5
7.5
10
12.5
15
17.5
20
0 1.5 3 4.5 6 7.5 9 10.51213.51516.51819.5
Swi tchi ng Frequency (k H z)
Capacitance (µF)
6.8
3.3
5101520
60
80
100
120
140
160
180
80 90 100 110 120 130 140 150
T h er mi s tor Temper atu re ( ° C)
IGBT Junction Temperature (°C) .
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Figure 11. Switching Parameter Definitions
Figure 11a. Input to Output propaga-
tion turn-on delay time Figure 11b. Input to Output
propagation turn-off delay timet
Figure 11c. Diode Reverse Recovery
VCE
IF
HIN/LIN
trr
Irr
VCE IC
HIN/LIN
TON tr
50%
HIN/LIN 90% IC
10% IC
50%
HIN/LIN
VCE
IC
HIN/LIN
TOFF tf
90% IC
10% IC
10%
VCE
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Figure CT1. Switching Loss Circuit
Figure CT2. S.C.SOA Circuit
Ho
Lo
U,V,W
IC
Driver
Vbus
Lin1,2,3
5V
Hin1,2,3
IN
Io
PWM=4µs
Ho
Lo
U,V,W
IC
Driver
Vbus
Lin1,2,3
Hin1,2,3
IN
10k
1k
5VZD
VCC
Io
Figure CT3. R.B.SOA Circuit
IN
Io
Ho
Lo
U,V,W
IC
Driver
Vbus
Lin1,2,3
Hin1,2,3
IN
10k
1k
5VZD
VCC
Io
VP=Peak Voltage on the IGBT die
VP=Peak Voltage on the IGBT die
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Standard pin leadforming option
Notes:
Dimensions in mm
1 - Marking for pin 1 identification
2- Product Part Number
3- Lot and Date code marking
Package Outline
027-E2D24
note 1
note 2 note 3
For mounting instruction see AN-1049
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Package Outline
Pin leadforming option -2
Notes:
Dimensions in mm
1 - Marking for pin 1 identification
2- Product Part Number
3- Lot and Date code marking
027-E2D24
note 1
note 2 note 3
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TAC Fax: (310) 252-7903
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Rev.H, 01/08
Data and Specifications are subject to change without notice
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