PRODUCT SPECIFICATION
REVISION: ECR/ECN INFORMATION: SHEET No.
EC No:UCP2009-1724
F DATE:2009/05/01
TITLE:
PRODUCT SPECIFICATION FOR HIGH
DENSITY METRIC (HDM) INTERCONNECT
SYSTEM (MIDPLANE & STACKING) 1 of 7
DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
PS-73780-999 S. DANNELLEY B. SMART S. MILLER
FILENAME: PS73780C.DOC
PRODUCT SPECIFICATION FOR
HIGH DENSITY METRIC (HDM)
BACKPLANE AND DAUGHTERCARD
INTERCONNECT SYSTEM
(STACKING AND MIDPLANE)
PRODUCT SPECIFICATION
REVISION: ECR/ECN INFORMATION: SHEET No.
EC No:UCP2009-1724
F DATE:2009/05/01
TITLE:
PRODUCT SPECIFICATION FOR HIGH
DENSITY METRIC (HDM) INTERCONNECT
SYSTEM (MIDPLANE & STACKING) 2 of 7
DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
PS-73780-999 S. DANNELLEY B. SMART S. MILLER
FILENAME: PS73780C.DOC
1.0 SCOPE
This specification covers the performance requirements and test methods for the following
products listed by series numbers:
* 73642, 73643, 73644, 73650, 73942, HDM Backplane Signal Module
73943, 73944, 74992, 74349, 74301
* 73650, 73769, 73770, 73771, 73781, HDM Backplane Signal Stacking Module
73782, 73783, 74428, 74993
* 73650, 73797, 73798, 73799, 74349, HDM Backplane Signal Single-End Midplane
74992 Module
* 73650, 73800, 73801, 73802, 74349, HDM Backplane Signal Double-End Midplane
74992 Module
* 73656 HDM Midplane Backplane Power
* 73780, 74300 HDM Daughtercard Signal Stacking Module
* 73998 HDM Daughtercard Power Stacking Module
The HDM backplane stacking and midplane interconnect systems consist of 6-row, 2mm grid
modules providing 30 contacts per linear centimeter (over 75 per inch). The stacking
connectors are used for parallel board packaging with stack heights from 15mm to 32mm.
The midplane backplane modules allow rear-side mating of cards. Both the daughtercard
receptacles and the backplane headers are through-hole connectors with solder tail or eye-
of-the-needle compliant pin terminals.
2.0 PRODUCT DESCRIPTION
2.1 PRODUCT NAMES
HDM (High Density Metric)
2.2 DIMENSIONS, MATERIALS, PLATINGS AND MARKINGS
Refer to the appropriate sales drawings for information on dimensions, materials,
platings and markings.
2.3 SAFETY AGENCY APPROVALS
UL File Number: E29179
CSA File Number: 152514 (LR19980)
PRODUCT SPECIFICATION
REVISION: ECR/ECN INFORMATION: SHEET No.
EC No:UCP2009-1724
F DATE:2009/05/01
TITLE:
PRODUCT SPECIFICATION FOR HIGH
DENSITY METRIC (HDM) INTERCONNECT
SYSTEM (MIDPLANE & STACKING) 3 of 7
DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
PS-73780-999 S. DANNELLEY B. SMART S. MILLER
FILENAME: PS73780C.DOC
3.0 APPLICABLE DOCUMENTS AND SPECIFICATIONS
AS-73642-9998 Application Specification HDM Compliant Backplane Connectors
AS-73656-1998 Application Specification HDM Compliant BP Power Modules
AS-73670-9996 Application Specification HDM Compliant Terminal Performance
AS-73670-9997 Application Specification HDM Backplane and Daughtercard Trace
Routing Guidelines
AS-73670-9998 Application Specification HDM Compliant and Solder Tail Daughtercard
Connectors
Refer to the appropriate sales drawings and other sections of this specification for the
necessary referenced documents and specifications.
4.0 RATINGS
4.1 CURRENT
Signal Contact: 1 Amp
Power: 15 Amps per blade at 30°C rise from ambient temperature
Midplane Power: 11 Amps per blade at 30°C rise from ambient temperature
4.2 VOLTAGE
Signal Contact: 250VAC
Power Contact: 500VAC
4.3 TEMPERATURE RANGE
Operating: -55°C to 105°C
Non-operating: -55°C to 85°C
4.4 CONTACT WIPE LENGTH
5.0mm Backplane Pin 1.75mm
5.5mm Backplane Pin 2.25mm
6.0mm Backplane Pin 2.75mm
Short Power Blade 3.75mm
Medium Power Blade 4.75mm
Long Power Blade 5.75mm
PRODUCT SPECIFICATION
REVISION: ECR/ECN INFORMATION: SHEET No.
EC No:UCP2009-1724
F DATE:2009/05/01
TITLE:
PRODUCT SPECIFICATION FOR HIGH
DENSITY METRIC (HDM) INTERCONNECT
SYSTEM (MIDPLANE & STACKING) 4 of 7
DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
PS-73780-999 S. DANNELLEY B. SMART S. MILLER
FILENAME: PS73780C.DOC
5.0 PERFORMANCE
5.1 ELECTRICAL PERFORMANCE
ITEM TEST CONDITION REQUIREMENT
CONTACT
RESISTANCE
(LOW LEVEL)
Mated,
100mA max, 20mV
per EIA-364-TP-23
10 milliohm
maximum change
INSULATION
RESISTANCE
Unmated, 500VDC
per EIA-364-TP-21
Initial: 5000 megohms
minimum
Final: 1000 megohms
minimum
DIELECTRIC
WITHSTANDING
VOLTAGE
Unmated, 1500VAC for
signal, 2000VAC for
power, per EIA-364-TP-20
No breakdown
or flashover
SIGNAL
CONTINUITY
Mated per
EIA-364-TP-87
No interrupts greater
than 10 nanoseconds
COMPLIANT PIN
INTERFACE
RESISTANCE
Contact inserted into PCB
per EIA-364-TP-23
1 milliohm
maximum
PRODUCT SPECIFICATION
REVISION: ECR/ECN INFORMATION: SHEET No.
EC No:UCP2009-1724
F DATE:2009/05/01
TITLE:
PRODUCT SPECIFICATION FOR HIGH
DENSITY METRIC (HDM) INTERCONNECT
SYSTEM (MIDPLANE & STACKING) 5 of 7
DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
PS-73780-999 S. DANNELLEY B. SMART S. MILLER
FILENAME: PS73780C.DOC
5.2 MECHANICAL PERFORMANCE
ITEM TEST CONDITION REQUIREMENT
MATING
FORCE
Mate daughtercard and
backplane assembly
per EIA-364-TP-13
0.6N per signal pin
1.3N per power blade
(nominal values)
DURABILITY
250 Cycles,
mated and unmated
per EIA-364-TP-09
10 milliohm max
change in LLCR
VIBRATION
Mated, 10-100Hz,
10g’s, 24 hr, 3 axis
per EIA-364-TP-28
10 milliohm max
change in LLCR
MECHANICAL
SHOCK
Mated, 30g half-sine,
11ms, 3 axis
per EIA-364-TP-27
10 milliohm max
change in LLCR
NORMAL FORCE/
SPRING RATE
Apply perpendicular force
to terminal at rate of
25+/-6mm per minute
Signal: 0.5N (50 g) min
Spring rate: 12.5g/mil
deflection (nominal)
Power: 1.0N (100 g) min
GUIDE PIN STRENGTH
Apply perpendicular force
to guide pin tip at rate of
12.7+/-6mm per minute.
Record force at 1mm pin
displacement
Guide pin in plastic
housing: 75N
(nominal value)
PRODUCT SPECIFICATION
REVISION: ECR/ECN INFORMATION: SHEET No.
EC No:UCP2009-1724
F DATE:2009/05/01
TITLE:
PRODUCT SPECIFICATION FOR HIGH
DENSITY METRIC (HDM) INTERCONNECT
SYSTEM (MIDPLANE & STACKING) 6 of 7
DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
PS-73780-999 S. DANNELLEY B. SMART S. MILLER
FILENAME: PS73780C.DOC
5.3 ENVIRONMENTAL PERFORMANCE
ITEM TEST CONDITION REQUIREMENT
THERMAL
SHOCK
Mated, 5 cycles
from -55°C to 85°C
per EIA-364-TP-32
10 milliohm max
change in LLCR
TEMPERATURE
LIFE
Mated, +105°C for
1000 hours
per EIA-364-TP-17
10 milliohm max
change in LLCR
HUMIDITY
Mated, 600 hours
from +25°C to +65°C
per EIA-364-TP-31
10 milliohm max
change in LLCR
DUST Unmated
per EIA-364-TP-50
10 milliohm max
change in LLCR
MIXED
FLOWING
GAS
10 days unmated,
10 days mated,
per EIA-364-TP-65
and ASTM B827
10 milliohm max
change in LLCR
PRODUCT SPECIFICATION
REVISION: ECR/ECN INFORMATION: SHEET No.
EC No:UCP2009-1724
F DATE:2009/05/01
TITLE:
PRODUCT SPECIFICATION FOR HIGH
DENSITY METRIC (HDM) INTERCONNECT
SYSTEM (MIDPLANE & STACKING) 7 of 7
DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
PS-73780-999 S. DANNELLEY B. SMART S. MILLER
FILENAME: PS73780C.DOC
6.0 TEST SEQUENCE
Bellcore Test Plan
GROUP 1 GROUP 2 GROUP 3 GROUP 4 GROUP 5
Visual Exam Visual Exam Visual Exam Visual Exam Visual Exam
Separation Force
Mate/Unmate Forces Mate/Unmate Forces Separation Force
Mate/Unmate Forces LLCR/CPIR Normal Force
LLCR/CPIR LLCR/CPIR LLCR/CPIR Durability
(100 cycles) Plating Thickness
Durability
(100 cycles) Thermal Shock Temperature Life Mate/Unmate Forces Porosity
Separation Force Humidity LLCR/CPIR LLCR
LLCR LLCR/CPIR Separation Force
Mate/Unmate Forces
MFG
(10 days Unmated)
Dust Mate/Unmate Forces Visual Exam LLCR
(After 5 & 10 days)
LLCR Visual Exam Normal Force MFG
(10 days Mated)
Vibration
(3 axis) Normal Force LLCR
(After 5 & 10 days)
LLCR Disturbance
Mechanical Shock
(3 axis) LLCR
LLCR/CPIR Durability
(100 cycles)
Separation Force
Mate/Unmate Forces LLCR/CPIR
Visual Exam Visual Exam
Normal Force Normal Force
LLCR = Low Level Contact Resistance
CPIR = Compliant Pin Interface Resistance
