S-89430/89431 Series
www.sii-ic.com
MINI ANALOG SERIES
0.5
μ
A Rail-to-Rail CMOS OPERATIONAL AMPLIFIER
© SII Semiconductor Corporation, 2009-2015 Rev.2.1_01
1
The mini-analog series is a group of ICs that incorporate a general purpose analog circuit in a small package.
The S-89430/89431 Series is a CMOS type operational amplifier that feature Rail-to-Rail*1 I/O and an internal phase
compensation circuit, and operates at a lower voltage with lower current consumption. These features make this product
the ideal solution for small battery-powered portable equipment.
These features enable driving at a lower voltage (from 0.9 V) and with lower current consumption (0.5 μA).
The S-89430A/89431A Series is a single operational amplifier (one circuit).
The S-89430B/89431B Series is a dual operational amplifier (two circuits).
*1. Rail-to-Rail is a trademark of Motorola, Inc.
Features
• Lower operating voltage than the conventional general-purpose:
V
DD = 0.9 V to 5.5 V
• Low current consumption (per circuit): IDD = 0.5 μA Typ.
• Wide I/O voltage range (Rail-to-Rail): VCMR = VSS to VDD
• Low input offset voltage: VIO = 10.0 mV Max. (S-89430 Series)
V
IO = 5.0 mV Max. (S-89431 Series)
• No external capacitors required for internal phase compensation
• Lead-free, Sn 100%, halogen-free*1
*1. Refer to “ Product Name Structure” for details.
Applications
• Mobile phone
• Notebook PC
• Digital camera
• Digital video camera
Packages
• SC-88A
• SOT-23-5
• SNT-8A
• TMSOP-8
MINI ANALOG SERIES 0.5
μ
A Rail-to-Rail CMOS OPERATIONAL AMPLIFIER
S-89430/89431 Series Rev.2.1_01
2
Block Diagrams
1. S-89430A/89431A Series single operational amplifier (one circuit)
VDD
VSS
IN(+)
IN(−)
＋
－
OUT
Figure 1
2. S-89430B/89431B Series dual operational amplifier (two circuits)
VDD
VSS
IN1(+)
IN1(−)
＋
－
OUT1
IN2(+)
IN2(−)
＋
－
OUT2
Figure 2
MINI ANALOG SERIES 0.5
μ
A
Rail-to-Rail CMOS OPERATIONAL AMPLIFIER
Rev.2.1_01 S-89430/89431 Series
3
Product Name Structure
Users can select the product type for the S-89430/89431 Series. Refer to “1. Product name” regarding the contents
of product name, “2. Packages” regarding the package drawings and “3. Product name list” regarding the product
type.
1. Product name
(1) SC-88A
S-8943 x A C NC - xxx TF x
IC direction in tape specifications*1
Environmental code
S: Lead-free, halogen-free
G: Lead-free (for details, please contact our sales office)
Product code (abbreviation)*2
Package name (abbreviation)
NC: SC-88A
Number of circuits
A: 1
Input offset voltage
0: VIO = 10.0 mV Max.
1: VIO = 5.0 mV Max.
*1. Refer to the tape drawing.
*2. Refer to “3. Product name list”.
MINI ANALOG SERIES 0.5
μ
A Rail-to-Rail CMOS OPERATIONAL AMPLIFIER
S-89430/89431 Series Rev.2.1_01
4
(2) SOT-23-5
S-8943 x A C MC - xxx T2 x
IC direction in tape specifications*1
Environmental code
U: Lead-free (Sn 100%), halogen-free
G: Lead-free (for details, please contact our sales office)
Product code (abbreviation)*2
Package name (abbreviation)
MC: SOT-23-5
Number of circuits
A: 1
Input offset voltage
0: VIO = 10.0 mV Max.
1: V
IO
= 5.0 mV Max.
*1. Refer to the tape drawing.
*2. Refer to “3. Product name list”.
(3) SNT-8A, TMSOP-8
S-8943 x B C xx - xxx TF U
IC direction in tape specifications*1
Environmental code
U: Lead-free (Sn 100%), halogen-free
Product code (abbreviation)*2
Package name (abbreviation)
PH: SNT-8A
FM: TMSOP-8
Number of circuits
B: 2
Input offset voltage
0: VIO = 10.0 mV Max.
1: VIO = 5.0 mV Max.
*1. Refer to the tape drawing.
*2. Refer to “3. Product name list”.
MINI ANALOG SERIES 0.5
μ
A
Rail-to-Rail CMOS OPERATIONAL AMPLIFIER
Rev.2.1_01 S-89430/89431 Series
5
2. Packages
Package Name Drawing Code
Package Tape Reel Land
SC-88A NP005-B-P-SD NP005-B-C-SD NP005-B-R-SD −
SOT-23-5 MP005-A-P-SD MP005-A-C-SD MP005-A-R-SD −
SNT-8A PH008-A-P-SD PH008-A-C-SD PH008-A-R-SD PH008-A-L-SD
TMSOP-8 FM008-A-P-SD FM008-A-C-SD FM008-A-R-SD −
3. Product name list
Table 1
Product name Input offset voltage Number of circuits Package
S-89430ACNC-HBUTFz 10 mV Max. 1 SC-88A
S-89430ACMC-HBUT2x 10 mV Max. 1 SOT-23-5
S-89430BCPH-H4CTFU 10 mV Max. 2 SNT-8A
S-89430BCFM-H4CTFU 10 mV Max. 2 TMSOP-8
S-89431ACNC-HBVTFz 5 mV Max. 1 SC-88A
S-89431ACMC-HBVT2x 5 mV Max. 1 SOT-23-5
S-89431BCPH-H4DTFU 5 mV Max. 2 SNT-8A
S-89431BCFM-H4DTFU 5 mV Max. 2 TMSOP-8
Remark 1. x: G or U
2. z: G or S
3. Please select products of environmental code = U for Sn 100%, halogen-free products.
MINI ANALOG SERIES 0.5
μ
A Rail-to-Rail CMOS OPERATIONAL AMPLIFIER
S-89430/89431 Series Rev.2.1_01
6
Pin Configurations
1. SC-88A
132
45
Top view
Figure 3
Table 2
(Product with 1 circuit)
Pin No. Symbol Description
1 IN(+) Non-inverted input pin
2 VSS GND pin
3 IN(−) Inverted input pin
4 OUT Output pin
5 VDD Positive power supply pin
2. SOT-23-5
132
45
Top view
Figure 4
Table 3
(Product with 1 circuit)
Pin No. Symbol Description
1 IN(+) Non-inverted input pin
2 VSS GND pin
3 IN(−) Inverted input pin
4 OUT Output pin
5 VDD Positive power supply pin
3. SNT-8A
7
6
5
8
2
3
4
1
Top view
Figure 5
Table 4
(Product with 2 circuits)
Pin No. Symbol Description
1 OUT1 Output pin 1
2 IN1(−) Inverted input pin 1
3 IN1(+) Non-inverted input pin 1
4 VSS GND pin
5 IN2(+) Non-inverted input pin 2
6 IN2(−) Inverted input pin 2
7 OUT2 Output pin 2
8 VDD Positive power supply pin
4. TMSOP-8
7
6
5
8
2
3
4
1
Top view
Figure 6
Table 5
(Product with 2 circuits)
Pin No. Symbol Description
1 OUT1 Output pin 1
2 IN1(−) Inverted input pin 1
3 IN1(+) Non-inverted input pin 1
4 VSS GND pin
5 IN2(+) Non-inverted input pin 2
6 IN2(−) Inverted input pin 2
7 OUT2 Output pin 2
8 VDD Positive power supply pin
MINI ANALOG SERIES 0.5
μ
A
Rail-to-Rail CMOS OPERATIONAL AMPLIFIER
Rev.2.1_01 S-89430/89431 Series
7
Absolute Maximum Ratings
Table 6
(Ta = +25°C unless otherwise specified)
Parameter Symbol Absolute Maximum Rating Unit
Power supply voltage VDD V
SS − 0.3 to VSS + 7.0 V
Input voltage VIN V
SS − 0.3 to VSS + 7.0 (7.0 Max.) V
Output voltage VOUT V
SS − 0.3 to VDD + 0.3 (7.0 Max.) V
Differential input voltage VIND ±5.5 V
Output pin current ISOURCE 7.0 mA
ISINK 7.0 mA
Power dissipation
SC-88A
PD
350*1 mW
SOT-23-5 600*1 mW
SNT-8A 450*1 mW
TMSOP-8 650*1 mW
Operating ambient temperature Topr −40 to +85 °C
Storage temperature Tstg −55 to +125 °C
*1. When mounted on board
[Mounted board]
(1) Board size: 114.3 mm × 76.2 mm × t1.6 mm
(2) Board name: JEDEC STANDARD51-7
Caution The absolute maximum ratings are rated values exceeding which the product could suffer
physical damage. These values must therefore not be exceeded under any conditions.
0 50 100 150
Ambient Temperature (Ta) [°C]
700
600
500
400
300
200
100
0
Power Dissipation (P
D
) [mW]
TMSOP-8
SOT-23-5
SC-88A
SNT-8A
Figure 7 Power Dissipation of Package (When Mounted on Board)
MINI ANALOG SERIES 0.5
μ
A Rail-to-Rail CMOS OPERATIONAL AMPLIFIER
S-89430/89431 Series Rev.2.1_01
8
Electrical Characteristics
Table 7
(Ta = +25°C unless otherwise specified)
Parameter Symbol Conditions Min. Typ. Max. Unit
Test
Circuit
Range of operating power
supply voltage VDD − 0.9 − 5.5 V −
1. VDD = 3.0 V
Table 8
DC Electrical Characteristics (VDD = 3.0 V) (Ta = +25°C unless otherwise specified)
Parameter Symbol Conditions Min. Typ. Max. Unit
Test
Circuit
Current consumption
(per circuit)*1 IDD V
CMR = VOUT = 1.5 V − 0.50 0.75 μA 6
Input offset voltage VIO V
CMR = 1.5 V S-89430 Series −10 ±5 +10 mV 2
S-89431 Series −5 ±3 +5 mV 2
Input offset current IIO − − 1 − pA −
Input bias current IBIAS − − 1 − pA −
Common-mode input voltage
range VCMR − 0 − 3 V 3
Voltage gain (open loop) AVOL VSS + 0.1 V ≤ VOUT ≤ VDD − 0.1 V,
VCMR = 1.5 V, RL = 1.0 MΩ 70 80 − dB 9
Maximum output
swing voltage
VOH R
L = 100 kΩ 2.95 − − V 4
VOL R
L = 100 kΩ − − 0.05 V 5
Common-mode input signal
rejection ratio CMRR VSS ≤ VCMR ≤ VDD 45 65 − dB 3
Power supply voltage
rejection ratio PSRR VDD = 0.9 V to 5.5 V 70 80 − dB 1
Source current ISOURCE VOUT = VDD − 0.1 V 400 500 − μA 7
VOUT = 0 V 4800 6000 − μA 7
Sink current ISINK VOUT = 0.1 V 400 550 − μA 8
VOUT = VDD 4800 6000 − μA 8
*1. When the output is saturated on the VDD side, a current consumption of up to 3 μA to 5 μA may flow.
Refer to “4. Current consumption (per circuit) vs. Common-mode input voltage range characteristics (voltage
follower configuration)” in “ Characteristics (Typical Data)”.
Table 9
AC Electrical Characteristics (VDD = 3.0 V) (Ta = +25°C unless otherwise specified)
Parameter Symbol Conditions Min. Typ. Max. Unit
Slew rate SR RL = 1.0 MΩ, CL = 15 pF (Refer to Figure 17) − 5 − V/ms
Gain-bandwidth product GBP CL = 0 pF − 4.8 − kHz
Maximum load capacitance CL − − 47 − pF
MINI ANALOG SERIES 0.5
μ
A
Rail-to-Rail CMOS OPERATIONAL AMPLIFIER
Rev.2.1_01 S-89430/89431 Series
9
2. VDD = 1.8 V
Table 10
DC Electrical Characteristics (VDD = 1.8 V) (Ta = +25°C unless otherwise specified)
Parameter Symbol Conditions Min. Typ. Max. Unit
Test
Circuit
Current consumption
(per circuit)*1 IDD V
CMR = VOUT = 0.9 V − 0.50 0.75 μA 6
Input offset voltage VIO V
CMR = 0.9 V S-89430 Series −10 ±5 +10 mV 2
S-89431 Series −5 ±3 +5 mV 2
Input offset current IIO − − 1 − pA −
Input bias current IBIAS − − 1 − pA −
Common-mode input voltage
range VCMR − 0 − 1.8 V 3
Voltage gain (open loop) AVOL VSS + 0.1 V ≤ VOUT ≤ VDD − 0.1 V,
VCMR = 0.9 V, RL = 1.0 MΩ 66 75 − dB 9
Maximum output
swing voltage
VOH R
L = 100 kΩ 1.75 − − V 4
VOL R
L = 100 kΩ − − 0.05 V 5
Common-mode input signal
rejection ratio CMRR VSS ≤ VCMR ≤ VDD 35 55 − dB 3
VSS ≤ VCMR ≤ VDD − 0.3 V 45 60 − dB 3
Power supply voltage
rejection ratio PSRR VDD = 0.9 V to 5.5 V 70 80 − dB 1
Source current ISOURCE VOUT = VDD − 0.1 V 220 300 − μA 7
VOUT = 0 V 1200 1800 − μA 7
Sink current ISINK VOUT = 0.1 V 220 300 − μA 8
VOUT = VDD 1200 1800 − μA 8
*1. When the output is saturated on the VDD side, a current consumption of up to 3 μA to 5 μA may flow.
Refer to “4. Current consumption (per circuit) vs. Common-mode input voltage range characteristics (voltage
follower configuration)” in “ Characteristics (Typical Data)”.
Table 11
AC Electrical Characteristics (VDD = 1.8 V) (Ta = +25°C unless otherwise specified)
Parameter Symbol Conditions Min. Typ. Max. Unit
Slew rate SR RL = 1.0 MΩ, CL = 15 pF (Refer to Figure 17) − 4.5 − V/ms
Gain-bandwidth product GBP CL = 0 pF − 5 − kHz
Maximum load capacitance CL − − 47 − pF
MINI ANALOG SERIES 0.5
μ
A Rail-to-Rail CMOS OPERATIONAL AMPLIFIER
S-89430/89431 Series Rev.2.1_01
10
3. VDD = 0.9 V
Table 12
DC Electrical Characteristics (VDD = 0.9 V) (Ta = +25°C unless otherwise specified)
Parameter Symbol Conditions Min. Typ. Max. Unit
Test
Circuit
Current consumption
(per circuit)*1 IDD V
CMR = VOUT = 0.45 V − 0.50 0.75 μA 6
Input offset voltage VIO V
CMR = 0.45 V S-89430 Series −10 ±5 +10 mV 2
S-89431 Series −5 ±3 +5 mV 2
Input offset current IIO − − 1 − pA −
Input bias current IBIAS − − 1 − pA −
Common-mode input voltage
range VCMR − 0 − 0.9 V 3
Voltage gain (open loop) AVOL VSS + 0.1 V ≤ VOUT ≤ VDD − 0.1 V,
VCMR = 0.45 V, RL = 1.0 MΩ 60 75 − dB 9
Maximum output
swing voltage
VOH R
L = 100 kΩ 0.85 − − V 4
VOL R
L = 100 kΩ − − 0.05 V 5
Common-mode input signal
rejection ratio CMRR VSS ≤ VCMR ≤ VDD 25 55 − dB 3
VSS ≤ VCMR ≤ VDD − 0.35 V 40 60 − dB 3
Power supply voltage
rejection ratio PSRR VDD = 0.9 V to 5.5 V 70 80 − dB 1
Source current ISOURCE VOUT = VDD − 0.1 V 25 65 − μA 7
VOUT = 0 V 40 140 − μA 7
Sink current ISINK VOUT = 0.1 V 10 65 − μA 8
VOUT = VDD 12 120 − μA 8
*1. When the output is saturated on the VDD side, a current consumption of up to 3 μA to 5 μA may flow.
Refer to “4. Current consumption (per circuit) vs. Common-mode input voltage range characteristics (voltage
follower configuration)” in “ Characteristics (Typical Data)”.
Table 13
AC Electrical Characteristics (VDD = 0.9 V) (Ta = +25°C unless otherwise specified)
Parameter Symbol Conditions Min. Typ. Max. Unit
Slew rate SR RL = 1.0 MΩ, CL = 15 pF (Refer to Figure 17) − 4 − V/ms
Gain-bandwidth product GBP CL = 0 pF − 5 − kHz
Maximum load capacitance CL − − 47 − pF
MINI ANALOG SERIES 0.5
μ
A
Rail-to-Rail CMOS OPERATIONAL AMPLIFIER
Rev.2.1_01 S-89430/89431 Series
11
Test Circuit (Per Circuit)
1. Power supply voltage rejection ratio
RF
RS
RS
RF
+
−
VOUT
VDD
0.45 V
• Power supply voltage rejection ratio (PSRR)
The power supply voltage rejection ratio (PSRR) can be
calculated by the following expression, with VOUT measured at
each VDD.
Test conditions:
When VDD = 0.9 V: VDD = VDD1, VOUT = VOUT1,
When VDD = 5.5 V: VDD = VDD2, VOUT = VOUT2
PSRR = 20 log
VDD1 − VDD2
VOUT1 − VOUT2 × RF + RS
RS
Figure 8
2. Input offset voltage
RF
RS
RS
RF
+
−
VOUT
VDD
VCMR = VDD / 2
• Input offset voltage (VIO)
VIO =
VOUT − VDD
2 × RS
RF + RS
Figure 9
MINI ANALOG SERIES 0.5
μ
A Rail-to-Rail CMOS OPERATIONAL AMPLIFIER
S-89430/89431 Series Rev.2.1_01
12
3. Common-mode input signal rejection ratio, common-mode input voltage range
RF
RS
RS
RF
+
−
VOUT
VDD
VIN VDD / 2
• Common-mode input signal rejection ratio (CMRR)
The common-mode input signal rejection ratio (CMRR) can be
calculated by the following expression, with VOUT measured at
each VIN.
Test conditions:
When VIN = VCMR Max.: VIN = VIN1, VOUT = VOUT1,
When VIN = VCMR Min.: VIN = VIN2, VOUT = VOUT2
CMRR = 20 log
VIN1 − VIN2
VOUT1 − VOUT2 × RF + RS
RS
• Common-mode input voltage range (VCMR)
The common-mode input voltage range is the range of VIN in
which VOUT satisfies the common-mode input signal rejection
ratio specifications.
Figure 10
4. Maximum output swing voltage (VOH)
+
−VOH
VDD
VIN1 VIN2
RL
VDD / 2
• Maximum output swing voltage (VOH)
Test conditions:
VIN1 = VDD
2 − 0.1 V
VIN2 = VDD
2 + 0.1 V
RL = 100 kΩ
Figure 11
5. Maximum output swing voltage (VOL)
+
−VOL
VDD
VIN1 VIN2
RL
VDD / 2 • Maximum output swing voltage (VOL)
Test conditions:
VIN1 = VDD
2 + 0.1 V
VIN2 = VDD
2 − 0.1 V
RL = 100 kΩ
Figure 12
MINI ANALOG SERIES 0.5
μ
A
Rail-to-Rail CMOS OPERATIONAL AMPLIFIER
Rev.2.1_01 S-89430/89431 Series
13
6. Current consumption
VDD
VCMR = VDD / 2
A
+
−
• Current consumption (IDD)
Figure 13
7. Source current
+
−
VDD
VIN1 VIN2
A
VOUT • Source current (ISOURCE)
Test conditions:
VOUT = VDD − 0.1 V or VOUT = 0 V
VIN1 = VDD
2 − 0.1 V
VIN2 = VDD
2 + 0.1 V
Figure 14
8. Sink current
+
−
VDD
VIN1 VIN2
A
VOUT
• Sink current (ISINK)
Test conditions:
VOUT = 0.1 V or VOUT = VDD
VIN1 = VDD
2 + 0.1 V
VIN2 = VDD
2 − 0.1 V
Figure 15
MINI ANALOG SERIES 0.5
μ
A Rail-to-Rail CMOS OPERATIONAL AMPLIFIER
S-89430/89431 Series Rev.2.1_01
14
9. Voltage gain (open loop)
RF
RS
+
−
RL
VOUT
VM
VDD / 2
VDD
−
+
VDDN
VSSN
NULL
D.U.T
RS
RF
VCMR = VDD / 2
Figure 16
• Voltage gain (open loop) (AVOL)
The voltage gain (AVOL) can be calculated by the following expression, with VOUT measured at each VM.
Test conditions:
When VM = VDD − 0.1 V: VM = VM1, VOUT = VOUT1,
When VM = VSS − 0.1 V: VM = VM2, VOUT = VOUT2
RL = 1 MΩ
AVOL = 20 log
VM1 − VM2
VOUT1 − VOUT2 × RF + RS
RS
10. Slew rate (SR)
Measured by the voltage follower circuit.
VDD
VSS
(= 0 V)
tTHL
VDD × 0.9
tR = tF = 1 μs (VSS to VDD)
tTLH
VDD × 0.1
VIN(+)
VOUT
(= VIN(－))
At fall
SR = VDD × 0.8
tTHL
At rise
SR = VDD × 0.8
tTLH
Figure 17
MINI ANALOG SERIES 0.5
μ
A
Rail-to-Rail CMOS OPERATIONAL AMPLIFIER
Rev.2.1_01 S-89430/89431 Series
15
Precautions
• When the output is saturated on the VDD side, a current consumption of up to 3 μA to 5 μA may flow.
Refer to “4. Current consumption (per circuit) vs. Common-mode input voltage range characteristics
(voltage follower configuration)” in “ Characteristics (Typical Data)”.
• Do not apply an electrostatic discharge to this IC that exceeds performance ratings of the built-in electrostatic
protection circuit.
• Use this IC with the output current 7 mA or less.
• SII Semiconductor Corporation claims no responsibility for any disputes arising out of or in connection with any
infringement by products including this IC of patents owned by a third party.
MINI ANALOG SERIES 0.5
μ
A Rail-to-Rail CMOS OPERATIONAL AMPLIFIER
S-89430/89431 Series Rev.2.1_01
16
Characteristics (Typical Data)
1. Current consumption (per circuit) vs. Power supply voltage
IDD−VDD, VSS = 0 V, VCMR = VOUT = VDD
2
01234
I
DD
[μA]
0.0
0.2
0.4
0.6
0.8
V
DD
[V]
56
1.0
Ta = −40
°
C
25
°
C85
°
C
2. Voltage gain vs. Frequency
AVOL−f, VDD = 3.0 V, VSS = 0 V
0.01 0.1 1 10 100
AVOL [dB]
0
20
40
60
80
f [Hz]
1000 10000
100
Ta = −40
°
C
25
°
C
85
°
C
AVOL−f, VDD = 1.8 V, VSS = 0 V
0.01 0.1 1 10 100
AVOL [dB]
0
20
40
60
80
f [Hz]
1000 10000
100
Ta = −40
°
C
25
°
C
85
°
C
AVOL−f, VDD = 0.9 V, VSS = 0 V
0.01 0.1 1 10 100
A
VOL
[dB]
0
20
40
60
80
f [Hz]
1000 10000
100
Ta = −40
°
C
25
°
C
85
°
C
MINI ANALOG SERIES 0.5
μ
A
Rail-to-Rail CMOS OPERATIONAL AMPLIFIER
Rev.2.1_01 S-89430/89431 Series
17
3. Output current
3. 1 ISOURCE vs. Power supply voltage
ISOURCE−VDD, VOUT = VDD − 0.1 V, VSS = 0 V
0
500
1000
1500
0 1 2 3 4 5 6
VDD [V]
ISOURCE [μA]
25°C
85°C
Ta = −40°C
3. 2 ISINK vs. Power supply voltage
ISINK−VDD, VOUT = 0.1 V, VSS = 0 V
0
500
1000
1500
0 1 2 3 4 5 6
VDD [V]
ISINK [μA]
25°C
85°C
Ta = −40°C
MINI ANALOG SERIES 0.5
μ
A Rail-to-Rail CMOS OPERATIONAL AMPLIFIER
S-89430/89431 Series Rev.2.1_01
18
3. 3 Output voltage (VOUT) vs. ISOURCE
VOUT−ISOURCE, VDD = 3.0 V, VSS = 0 V
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0 500 1000 1500 2000
ISOURCE [
μ
A]
VOUT [V]
25°C
85°C
Ta = −40°C
VOUT−ISOURCE, VDD = 1.8 V, VSS = 0 V
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
0 500 1000 1500 2000
ISOURCE [
μ
A]
25°C
85°C
Ta = −40°C
VOUT [V]
VOUT−ISOURCE, VDD = 0.9 V, VSS = 0 V
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
0 50 100 150 200
ISOURCE [
μ
A]
25°C
85°C
Ta = −40°C
VOUT [V]
3. 4 Output voltage (VOUT) vs. ISINK
VOUT−ISINK, VDD = 3.0 V, VSS = 0 V
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0 500 1000 1500 2000
ISINK [
μ
A]
25°C
85°C
Ta = −40°C
VOUT [V]
VOUT−ISINK, VDD = 1.8 V, VSS = 0 V
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
0 500 1000 1500 2000
ISINK [
μ
A]
25°C
85°C
Ta = −40°C
VOUT [V]
VOUT−ISINK, VDD = 0.9 V, VSS = 0 V
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
0 50 100 150 200
ISINK [
μ
A]
25°C 85°C
Ta = −40°C
VOUT [V]
MINI ANALOG SERIES 0.5
μ
A
Rail-to-Rail CMOS OPERATIONAL AMPLIFIER
Rev.2.1_01 S-89430/89431 Series
19
4. Current consumption (per circuit) vs. Common-mode input voltage range
(voltage follower configuration)
IDD−VCMR, VDD = 3.0 V, VSS = 0 V
0
2
4
6
8
10
12
14
16
18
20
-0.5 0 0.5 1 1.5 2 2.5 3 3.5
VCMR [V]
IDD [μA]
25°C
85°C
Ta = −40°C
No.
TITLE
SCALE
UNIT
SII Semiconductor Corporation
mm
2.0±0.2
1.3±0.1
0.15+0.1
-0.05
0.2+0.1
-0.05
0.650.65
13
45
2
No. NP005-B-P-SD-1.1
SC88A-B-PKG Dimensions
NP005-B-P-SD-1.1
No.
TITLE
SCALE
UNIT
SII Semiconductor Corporation
mm
(2.25)
4.0±0.1 2.0±0.1
4.0±0.1
ø1.55±0.05
ø1.05±0.1
0.2±0.05
1.1±0.1
0.3
2.05±0.1
1
2
3
45
No. NP005-B-C-SD-2.0
NP005-B-C-SD-2.0
SC88A-B-Carrier Tape
Feed direction
No.
TITLE
SCALE
UNIT
SII Semiconductor Corporation
mm
QTY. 3000
No. NP005-B-R-SD-2.1
NP005-B-R-SD-2.1
SC88A-B-Reel
12.5max.
9.0±0.3
ø13±0.2
(60°) (60°)
Enlarged drawing in the central part
No.
TITLE
SCALE
UNIT
SII Semiconductor Corporation
2.9±0.2
1.9±0.2
0.95±0.1
0.4±0.1
0.16 +0.1
-0.06
123
4
5
No. MP005-A-P-SD-1.2
MP005-A-P-SD-1.2
SOT235-A-PKG Dimensions
mm
No.
TITLE
SCALE
UNIT
SII Semiconductor Corporation
ø1.5 +0.1
-0 2.0±0.05
ø1.0 +0.2
-0 4.0±0.1
1.4±0.2
0.25±0.1
3.2±0.2
123
45
No. MP005-A-C-SD-2.1
MP005-A-C-SD-2.1
SOT235-A-Carrier Tape
Feed direction
4.0±0.1(10 pitches:40.0±0.2)
mm
No.
TITLE
SCALE
UNIT
SII Semiconductor Corporation
12.5max.
9.0±0.3
ø13±0.2
(60°) (60°)
QTY. 3,000
No. MP005-A-R-SD-1.1
MP005-A-R-SD-1.1
SOT235-A-Reel
Enlarged drawing in the central part
mm
SII Semiconductor Corporation
No.
TITLE
SCALE
UNIT
1.97±0.03
0.2±0.05
0.48±0.02
0.08
mm
SNT-8A-A-PKG Dimensions
PH008-A-P-SD-2.0
No. PH008-A-P-SD-2.0
0.5
+0.05
-0.02
123 4
56
78
SII Semiconductor Corporation
No.
TITLE
SCALE
UNIT mm
PH008-A-C-SD-1.0
SNT-8A-A-Carrier Tape
No. PH008-A-C-SD-1.0
Feed direction
4.0±0.1
2.0±0.05
4.0±0.1
ø1.5 +0.1
-0
ø0.5±0.1
2.25±0.05
0.65±0.05
0.25±0.05
2134
7865
5°
SII Semiconductor Corporation
No.
TITLE
SCALE
UNIT
12.5max.
9.0±0.3
ø13±0.2
(60°) (60°)
Enlarged drawing in the central part
QTY.
PH008-A-R-SD-1.0
mm
SNT-8A-A-Reel
No. PH008-A-R-SD-1.0
5,000
SII Semiconductor Corporation
No.
TITLE
SCALE
UNIT mm
SNT-8A-A
-Land Recommendation
PH008-A-L-SD-4.1
0.3
0.2
0.52
2.01
0.52
No. PH008-A-L-SD-4.1
Caution 1. Do not do silkscreen printing and solder printing under the mold resin of the package.
2. The thickness of the solder resist on the wire pattern under the package should be 0.03 mm
or less from the land pattern surface.
3. Match the mask aperture size and aperture position with the land pattern.
4. Refer to "SNT Package User's Guide" for details.
1. (0.25 mm min. / 0.30 mm typ.)
2. (1.96 mm ~ 2.06 mm)
1.
2. 0.03 mm
3.
4. SNT
1. Pay attention to the land pattern width (0.25 mm min. / 0.30 mm typ.).
2. Do not widen the land pattern to the center of the package (1.96 mm to 2.06mm).
1
2
1.
2. (1.96 mm ~ 2.06 mm)
(0.25 mm min. / 0.30 mm typ.)
No.
TITLE
SCALE
UNIT
SII Semiconductor Corporation
2.90±0.2
85
0.2±0.1
0.65±0.1
0.13±0.1
14
TMSOP8-A-PKG Dimensions
No. FM008-A-P-SD-1.1
FM008-A-P-SD-1.1
mm
No.
TITLE
SCALE
UNIT
SII Semiconductor Corporation
0.30±0.05
1.00±0.1
1.05±0.05
1.5
2.00±0.05
4.00±0.1
3.25±0.05
4.00±0.1
1
4
58
TMSOP8-A-Carrier Tape
Feed direction
No. FM008-A-C-SD-2.0
FM008-A-C-SD-2.0
+0.1
-0
mm
No.
TITLE
SCALE
UNIT
SII Semiconductor Corporation
16.5max.
13.0±0.3
QTY. 4,000
(60°)
(60°)
13±0.2
Enlarged drawing in the central part
TMSOP8-A-Reel
No. FM008-A-R-SD-1.0
FM008-A-R-SD-1.0
mm
Disclaimers (Handling Precautions)
1. All the information described herein (product data, specifications, figures, tables, programs, algorithms and
application circuit examples, etc.) is current as of publishing date of this document and is subject to change without
notice.
2. The circuit examples and the usages described herein are for reference only, and do not guarantee the success of
any specific mass-production design.
SII Semiconductor Corporation is not responsible for damages caused by the reasons other than the products or
infringement of third-party intellectual property rights and any other rights due to the use of the information described
herein.
3. SII Semiconductor Corporation is not responsible for damages caused by the incorrect information described herein.
4. Take care to use the products described herein within their specified ranges. Pay special attention to the absolute
maximum ratings, operation voltage range and electrical characteristics, etc.
SII Semiconductor Corporation is not responsible for damages caused by failures and/or accidents, etc. that occur
due to the use of products outside their specified ranges.
5. When using the products described herein, confirm their applications, and the laws and regulations of the region or
country where they are used and verify suitability, safety and other factors for the intended use.
6. When exporting the products described herein, comply with the Foreign Exchange and Foreign Trade Act and all
other export-related laws, and follow the required procedures.
7. The products described herein must not be used or provided (exported) for the purposes of the development of
weapons of mass destruction or military use. SII Semiconductor Corporation is not responsible for any provision
(export) to those whose purpose is to develop, manufacture, use or store nuclear, biological or chemical weapons,
missiles, or other military use.
8. The products described herein are not designed to be used as part of any device or equipment that may affect the
human body, human life, or assets (such as medical equipment, disaster prevention systems, security systems,
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aviation equipment, aerospace equipment, and nuclear-related equipment), excluding when specified for in-vehicle
use or other uses. Do not use those products without the prior written permission of SII Semiconductor Corporation.
Especially, the products described herein cannot be used for life support devices, devices implanted in the human
body and devices that directly affect human life, etc.
Prior consultation with our sales office is required when considering the above uses.
SII Semiconductor Corporation is not responsible for damages caused by unauthorized or unspecified use of our
products.
9. Semiconductor products may fail or malfunction with some probability.
The user of these products should therefore take responsibility to give thorough consideration to safety design
including redundancy, fire spread prevention measures, and malfunction prevention to prevent accidents causing
injury or death, fires and social damage, etc. that may ensue from the products' failure or malfunction.
The entire system must be sufficiently evaluated and applied on customer's own responsibility.
10. The products described herein are not designed to be radiation-proof. The necessary radiation measures should be
taken in the product design by the customer depending on the intended use.
11. The products described herein do not affect human health under normal use. However, they contain chemical
substances and heavy metals and should therefore not be put in the mouth. The fracture surfaces of wafers and chips
may be sharp. Take care when handling these with the bare hands to prevent injuries, etc.
12. When disposing of the products described herein, comply with the laws and ordinances of the country or region where
they are used.
13. The information described herein contains copyright information and know-how of SII Semiconductor Corporation.
The information described herein does not convey any license under any intellectual property rights or any other
rights belonging to SII Semiconductor Corporation or a third party. Reproduction or copying of the information
described herein for the purpose of disclosing it to a third-party without the express permission of SII Semiconductor
Corporation is strictly prohibited.
14. For more details on the information described herein, contact our sales office.
1.0-2016.01
www.sii-ic.com
