1. Product profile
1.1 General description
Schottky barrier quadruple diode with an integrated guard ring for stress protection. Two
electrically isolated dual Schottky barrier diodes series, encapsulated in a SOT363 very
small SMD plastic package.
1.2 Features
■Low forward voltage
■Ultra small SMD plastic package
■Low capacitance
1.3 Applications
■Ultra high-speed switching
■Voltage clamping
■Line termination
■Inverse-polarity protection
1.4 Quick reference data
[1] Pulse test: tp ≤ 30ms; δ ≤ 0.02.
BAT54XY
Schottky barrier quadruple diode in very small SOT363
package
Rev. 01 — 17 January 2005 Product data sheet
Table 1: Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VRcontinuous reverse voltage - - 30 V
IFcontinuous forward current - - 200 mA
VFforward voltage IF = 10 mA;
see Figure 1 [1] - - 400 mV
9397 750 14141 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 01 — 17 January 2005 2 of 9
Philips Semiconductors BAT54XY
Schottky barrier quadruple diode in very small SOT363 package
2. Pinning information
3. Ordering information
4. Marking
[1] * = -: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
5. Limiting values
Table 2: Pinning
Pin Description Simplified outline Symbol
1 anode 1
2 cathode 2
3 anode 3 / cathode 4
4 anode 4
5 cathode 3
6 cathode 1 / anode 2
132
4
56
006aaa256
654
123
Table 3: Ordering information
Type number Package
Name Description Version
BAT54XY SC-88 plastic surface mounted package; 6 leads SOT363
Table 4: Marking codes
Type number Marking code[1]
BAT54XY *C5
Table 5: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Per diode
VRcontinuous reverse voltage - 30 V
IFcontinuous forward current - 200 mA
IFRM repetitive peak forward
current tp≤ 1 s; δ ≤ 0.5 - 300 mA
IFSM non-repetitive peak forward
current tp < 10 ms - 600 mA
Tjjunction temperature - 125 °C
Tamb ambient temperature −65 +125 °C
Tstg storage temperature −65 +150 °C
9397 750 14141 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 01 — 17 January 2005 3 of 9
Philips Semiconductors BAT54XY
Schottky barrier quadruple diode in very small SOT363 package
6. Thermal characteristics
[1] Soldering point at pins 2, 3, 5 and 6.
7. Characteristics
[1] Pulse test: tp≤300 µs; δ≤0.02.
Table 6: Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-s) thermal resistance from junction
to soldering point in free air [1] - - 260 K/W
Table 7: Characteristics
T
amb
= 25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Per diode
VFforward voltage see Figure 1;[1]
IF = 0.1 mA - - 240 mV
IF = 1 mA - - 320 mV
IF = 10 mA - - 400 mV
IF = 30 mA - - 500 mV
IF = 100 mA - - 800 mV
IRreverse current VR = 25 V; see Figure 2 --2µA
Cddiode capacitance VR = 1 V; f = 1 MHz;
see Figure 3 - - 10 pF
9397 750 14141 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 01 — 17 January 2005 4 of 9
Philips Semiconductors BAT54XY
Schottky barrier quadruple diode in very small SOT363 package
(1) Tamb = 125 °C.
(2) Tamb =85°C.
(3) Tamb =25°C.
(1) Tamb = 125 °C.
(2) Tamb =85°C.
(3) Tamb =25°C.
Fig 1. Forward current as a function of forward
voltage; typical values. Fig 2. Reverse current as a function of reverse
voltage; typical values.
Tamb =25°C; f = 1 MHz.
Fig 3. Diode capacitance as a function of reverse voltage; typical values.
103
102
10−1
IF
(mA)
VF (V)
10
1
1.20.80.40
msa892
(3)(2)(1)
(3)(2)(1)
0102030
VR (V)
103
102
10−1
IR
(µA)
10
1
(1)
(2)
(3)
msa893
0102030
0
5
10
15
VR (V)
Cd
(pF)
msa891
9397 750 14141 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 01 — 17 January 2005 5 of 9
Philips Semiconductors BAT54XY
Schottky barrier quadruple diode in very small SOT363 package
8. Package outline
Fig 4. Package outline SOT363 (SC-88).
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
SOT363 SC-88
wBM
bp
D
e1
e
pin 1
index A
A1
Lp
Q
detail X
HE
E
vMA
AB
y
0 1 2 mm
scale
c
X
132
456
Plastic surface mounted package; 6 leads SOT363
UNIT A1
max bpcDEe1HELpQywv
mm 0.1 0.30
0.20 2.2
1.8
0.25
0.10 1.35
1.15 0.65
e
1.3 2.2
2.0 0.2 0.10.2
DIMENSIONS (mm are the original dimensions)
0.45
0.15 0.25
0.15
A
1.1
0.8
97-02-28
04-11-08
9397 750 14141 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 01 — 17 January 2005 6 of 9
Philips Semiconductors BAT54XY
Schottky barrier quadruple diode in very small SOT363 package
9. Packing information
[1] For further information and the availability of packing methods, see Section 14.
[2] T1: normal taping
[3] T2: reverse taping
Table 8: Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number Package Description Packing quantity
3000 10000
BAT54XY SOT363 4 mm pitch, 8 mm tape and reel; T1 [2] -115 -135
4 mm pitch, 8 mm tape and reel; T2 [3] -125 -165
Philips Semiconductors BAT54XY
Schottky barrier quadruple diode in very small SOT363 package
9397 750 14141 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 01 — 17 January 2005 7 of 9
10. Revision history
Table 9: Revision history
Document ID Release date Data sheet status Change notice Doc. number Supersedes
BAT54XY_1 20050117 Product data sheet - 9397 750 14141 -
Philips Semiconductors BAT54XY
Schottky barrier quadruple diode in very small SOT363 package
9397 750 14141 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 01 — 17 January 2005 8 of 9
11. Data sheet status
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
12. Definitions
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
13. Disclaimers
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
14. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
Level Data sheet status[1] Product status[2] [3] Definition
I Objective data Development This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
© Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.Date of release: 17 January 2005
Document number: 9397 750 14141
Published in The Netherlands
Philips Semiconductors BAT54XY
Schottky barrier quadruple diode in very small SOT363 package
15. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5
9 Packing information. . . . . . . . . . . . . . . . . . . . . . 6
10 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 7
11 Data sheet status. . . . . . . . . . . . . . . . . . . . . . . . 8
12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
13 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
14 Contact information . . . . . . . . . . . . . . . . . . . . . 8
