LM56 LM56 Dual Output Low Power Thermostat Literature Number: SNIS120F LM56 Dual Output Low Power Thermostat General Description Features The LM56 is a precision low power thermostat. Two stable temperature trip points (VT1 and VT2) are generated by dividing down the LM56 1.250V bandgap voltage reference using 3 external resistors. The LM56 has two digital outputs. OUT1 goes LOW when the temperature exceeds T1 and goes HIGH when the the temperature goes below (T1-THYST). Similarly, OUT2 goes LOW when the temperature exceeds T2 and goes HIGH when the temperature goes below (T2-THYST). THYST is an internally set 5C typical hysteresis. The LM56 is available in an 8-lead Mini-SO8 surface mount package and an 8-lead small outline package. Applications VREF Hysteresis Temperature Microprocessor Thermal Management Appliances Portable Battery Powered 3.0V or 5V Systems Fan Control Industrial Process Control HVAC Systems Remote Temperature Sensing Electronic System Protection Digital outputs support TTL logic levels Internal temperature sensor 2 internal comparators with hysteresis Internal voltage reference Available in 8-pin SO and Mini-SO8 plastic packages Key Specifications Power Supply Voltage 2.7V-10V Power Supply Current 230 A (max) 1.250V 1% (max) 5C Internal Temperature Sensor Output Voltage: (+6.20 mV/C x T) + 395 mV Temperature Trip Point Accuracy: LM56BIM LM56CIM +25C 2C (max) 3C (max) +25C to +85C 2C (max) 3C (max) -40C to +125C 3C (max) 4C (max) Simplified Block Diagram and Connection Diagram 1289302 1289301 Order Number NS Package Number Transport Media Package Marking LM56BIM LM56BIMX LM56CIM LM56CIMX LM56BIMM LM56BIMMX LM56CIMM LM56CIMMX M08A M08A M08A M08A MUA08A MUA08A MUA08A MUA08A SOP-8 SOP-8 SOP-8 SOP-8 MSOP-8 MSOP-8 MSOP-8 MSOP-8 Rail 2500 Units Tape & Reel Rail LM56BIM LM56BIM LM56CIM (c) 2011 National Semiconductor Corporation 12893 2500 Units 1000 Units 3500 Units 1000 Units 3500 Units Tape & Reel Tape & Reel Tape & Reel Tape & Reel Tape & Reel LM56CIM T02B T02B T02C T02C www.national.com LM56 Dual Output Low Power Thermostat August 22, 2009 LM56 Typical Application 1289303 VT1 = 1.250V x (R1)/(R1 + R2 + R3) VT2 = 1.250V x (R1 + R2)/(R1 + R2 + R3) where: (R1 + R2 + R3) = 27 k and VT1 or T2 = [6.20 mV/C x T] + 395 mV therefore: R1 = VT1/(1.25V) x 27 k R2 = (VT2/(1.25V) x 27 k) - R1 R3 = 27 k - R1 - R2 FIGURE 1. Microprocessor Thermal Management www.national.com 2 Input Voltage Input Current at any pin (Note 2) Package Input Current(Note 2) Package Dissipation at TA = 25C (Note 4) ESD Susceptibility (Note 5) Human Body Model - Pin 3 Only: All other pins 12V 5 mA 20 mA 125V -65C to + 150C Operating Ratings (Note 1) TMIN TA TMAX Operating Temperature Range -40C TA +125C LM56BIM, LM56CIM 900 mW Positive Supply Voltage (V+) Maximum VOUT1 and VOUT2 800V 1000V +2.7V to +10V +10V Soldering process must comply with National Semiconductor's Reflow Temperature Profile specifications. Refer to www.national.com/packaging.(Note 3) LM56 Electrical Characteristics The following specifications apply for V+ = 2.7 VDC, and VREF load current = 50 A unless otherwise specified. Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = 25C unless otherwise specified. Symbol Parameter Conditions Typical (Note 6) LM56BIM Limits (Note 7) LM56CIM Limits (Note 7) Units (Limits) 3 3 C (max) C (max) C (max) Temperature Sensor Trip Point Accuracy (Includes VREF, Comparator Offset, and +25C TA +85C 2 2 Temperature Sensitivity errors) -40C TA +125C 3 4 Trip Point Hysteresis TA = -40C 3 3 C (min) 6 6 C (max) 3.5 3.5 C (min) 6.5 6.5 C (max) 4.5 4.5 C (min) 7.5 7.5 C (max) 4 4 C (min) 8 8 C (max) 4 TA = +25C 5 TA = +85C 6 TA = +125C 6 Internal Temperature Sensitivity +6.20 Temperature Sensitivity Error mV/C 2 3 3 4 C (max) C (max) Output Impedance -1 A IL +40 A 1500 1500 (max) Line Regulation +3.0V -0.72/ +0.36 -0.72/ +0.36 mV/V (max) -1.14/ +0.61 -1.14/ +0.61 mV/V (max) 2.3 2.3 mV (max) 300 300 nA (max) V+ +10V, +25 C TA +85 C +3.0V V+ +10V, -40 C TA <25 C +2.7V V+ +3.3V VT1 and VT2 Analog Inputs IBIAS VIN Analog Input Bias Current 150 V+ Analog Input Voltage Range -1 V GND VOS Comparator Offset 2 V 8 8 mV (max) VREF Output VREF VREF Nominal 1.250V VREF Error VREF/V+ Line Regulation +3.0V V+ +10V 3 0.13 V 1 1 % (max) 12.5 12.5 mV (max) 0.25 0.25 mV/V (max) www.national.com LM56 Machine Model Storage Temperature Absolute Maximum Ratings (Note 1) LM56 Symbol Parameter Conditions Typical (Note 6) LM56BIM Limits (Note 7) LM56CIM Limits (Note 7) Units (Limits) 0.15 1.1 1.1 mV (max) 0.15 0.15 mV/A (max) +2.7V V+ +3.3V VREF/IL Load Regulation Sourcing Symbol +30 A IL +50 A Parameter Conditions Typical (Note 6) Limits (Note 7) Units (Limits) V+ = +10V 230 A (max) V+ 230 A (max) 1 A (max) 0.4 V (max) V+ Power Supply IS Supply Current = +2.7V Digital Outputs IOUT("1") Logical "1" Output Leakage V+ = +5.0V Current VOUT("0") Logical "0" Output Voltage IOUT = +50 A Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. Note 2: When the input voltage (VI) at any pin exceeds the power supply (VI < GND or VI > V+), the current at that pin should be limited to 5 mA. The 20 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 5 mA to four. Note 3: Reflow temperature profiles are different for lead-free and non-lead-free packages. Note 4: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature), JA (junction to ambient thermal resistance) and TA (ambient temperature). The maximum allowable power dissipation at any temperature is PD = (TJmax-TA)/JA or the number given in the Absolute Maximum Ratings, whichever is lower. For this device, TJmax = 125C. For this device the typical thermal resistance (JA) of the different package types when board mounted follow: Package Type JA M08A 110C/W MUA08A 250C/W Note 5: The human body model is a 100 pF capacitor discharge through a 1.5 k resistor into each pin. The machine model is a 200 pF capacitor discharged directly into each pin. Note 6: Typicals are at TJ = TA = 25C and represent most likely parametric norm. Note 7: Limits are guaranteed to National's AOQL (Average Outgoing Quality Level). www.national.com 4 LM56 Typical Performance Characteristics Quiescent Current vs Temperature VREF Output Voltage vs Load Current 1289304 1289305 OUT1 and OUT2 Voltage Levels vs Load Current Trip Point Hysteresis vs Temperature 1289307 1289332 Temperature Sensor Output Voltage vs Temperature Temperature Sensor Output Accuracy vs Temperature 1289308 1289309 5 www.national.com LM56 Trip Point Accuracy vs Temperature Comparator Bias Current vs Temperature 1289310 1289311 OUT1 and OUT2 Leakage Current vs Temperature VTEMP Output Line Regulation vs Temperature 1289331 1289312 VREF Start-Up Response VTEMP Start-Up Response 1289313 www.national.com 1289314 6 LM56 Functional Description 1289315 Pin Descriptions V+ This is the positive supply voltage pin. This pin should be bypassed with a 0.1 F capacitor to ground. GND This is the ground pin. VREF This is the 1.250V bandgap voltage reference output pin. In order to maintain trip point accuracy this pin should source a 50 A load. VTEMP This is the temperature sensor output pin. OUT1 This is an open collector digital output. OUT1 is active LOW. It goes LOW when the temperature is greater than T1 and goes HIGH when the temperature drops below T1- 5C. This output is not intended to directly drive a fan motor. OUT2 This is an open collector digital output. OUT2 is active LOW. It goes LOW when the temperature is greater than the T2 set point and goes HIGH when the temperature is less than T2- 5C. This output is not intended to directly drive a fan motor. VT1 This is the input pin for the temperature trip point voltage for OUT1. VT2 This is the input pin for the low temperature trip point voltage for OUT2. 1289316 VT1 = 1.250V x (R1)/(R1 + R2 + R3) VT2 = 1.250V x (R1 + R2)/(R1 + R2 + R3) where: (R1 + R2 + R3) = 27 k and VT1 or T2 = [6.20 mV/C x T] + 395 mV therefore: R1 = VT1/(1.25V) x 27 k R2 = (VT2/(1.25V) x 27 k)-R1 R3 = 27 k - R1 - R2 7 www.national.com LM56 Trip Point Error Voltage = VTPE, Comparator Offset Error for VT1E Temperature Sensor Error = VTSE Reference Output Error = VRE Application Hints 1.0 LM56 TRIP POINT ACCURACY SPECIFICATION For simplicity the following is an analysis of the trip point accuracy using the single output configuration show in Figure 2 with a set point of 82C. 1289317 FIGURE 2. Single Output Configuration 1. VTPE = VT1E - VTSE + VRE Where: 2. VT1E = 8 mV (max) 3. VTSE = (6.20 mV/C) x (3C) = 18.6 mV 4. VRE = 1.250V x (0.01) R2/(R1 + R2) Using Equations from page 1 of the datasheet. VT1=1.25VxR2/(R1+R2)=(6.20 mV/C)(82C) +395 mV Solving for R2/(R1 + R2) = 0.7227 then, 5. VRE = 1.250V x (0.01) R2/(R1 + R2) = (0.0125) x (0.7227) = 9.03 mV The individual errors do not add algebraically because, the odds of all the errors being at their extremes are rare. This is proven by the fact the specification for the trip point accuracy stated in the Electrical Characteristic for the temperature range of -40C to +125C, for example, is specified at 3C for the LM56BIM. Note this trip point error specification does not include any error introduced by the tolerance of the actual resistors used, nor any error introduced by power supply variation. If the resistors have a 0.5% tolerance, an additional error of 0.4C will be introduced. This error will increase to 0.8C when both external resistors have a 1% tolerance. flow into the resistor network. When the temperature sensor output is equal to the trip point level the bias current will be 150 nA (max). Once the temperature is well above the trip point level the bias current will be 300 nA (max). Therefore, the first trip point will be affected by 150 nA of bias current. The leakage current is very small when the comparator input transistor of the different pair is off (see Figure 3) . The effect of the bias current on the first trip point can be defined by the following equations: where IB = 300 nA (the maximum specified error). The effect of the bias current on the second trip point can be defined by the following equations: 2.0 BIAS CURRENT EFFECT ON TRIP POINT ACCURACY Bias current for the comparator inputs is 300 nA (max) each, over the specified temperature range and will not introduce considerable error if the sum of the resistor values are kept to about 27 k as shown in the typical application of Figure 1 . This bias current of one comparator input will not flow if the temperature is well below the trip point level. As the temperature approaches trip point level the bias current will start to www.national.com where IB = 300 nA (the maximum specified error). The closer the two trip points are to each other the more significant the error is. Worst case would be when VT1 = VT2 = VREF/2. 8 LM56 1289318 FIGURE 3. Simplified Schematic As with any IC, the LM56 and accompanying wiring and circuits must be kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit operates at cold temperatures where condensation can occur. Printed-circuit coatings are often used to ensure that moisture cannot corrode the LM56 or its connections. 3.0 MOUNTING CONSIDERATIONS The majority of the temperature that the LM56 is measuring is the temperature of its leads. Therefore, when the LM56 is placed on a printed circuit board, it is not sensing the temperature of the ambient air. It is actually sensing the temperature difference of the air and the lands and printed circuit board that the leads are attached to. The most accurate temperature sensing is obtained when the ambient temperature is equivalent to the LM56's lead temperature. 9 www.national.com LM56 4.0 VREF AND VTEMP CAPACITIVE LOADING 1289319 FIGURE 4. Loading of VREF and VTEMP The LM56 VREF and VTEMP outputs handle capacitive loading well. Without any special precautions, these outputs can drive any capacitive load as shown in Figure 4 . 5.0 NOISY ENVIRONMENTS Over the specified temperature range the LM56 VTEMPoutput has a maximum output impedance of 1500. In an extremely noisy environment it may be necessary to add some filtering to minimize noise pickup. It is recommended that 0.1 F be added from V+ to GND to bypass the power supply voltage, as shown in Figure 4 . In a noisy environment it may be necessary to add a capacitor from the VTEMP output to ground. A 1 F output capacitor with the 1500 output impedance will form a 106 Hz lowpass filter. Since the thermal time constant of the VTEMP output is much slower than the 9.4 ms time constant formed by the RC, the overall response time of the VTEMP output will not be significantly affected. For much larger capacitors this additional time lag will increase the overall response time of the LM56. 6.0 APPLICATIONS CIRCUITS 1289320 FIGURE 5. Reducing Errors Caused by Bias Current The circuit shown in Figure 5 will reduce the effective bias current error for VT2 as discussed in Section 3.0 to be equivalent to the error term of VT1. For this circuit the effect of the www.national.com bias current on the first trip point can be defined by the following equations: 10 where IB = 300 nA (the maximum specified error). Similarly, bias current affect on VT2 can be defined by: where IB = 300 nA (the maximum specified error). 1289321 FIGURE 6. Audio Power Amplifier Overtemperature Detector 11 www.national.com LM56 The current shown in Figure 6 is a simple overtemperature detector for power devices. In this example, an audio power amplifier IC is bolted to a heat sink and an LM56 Celsius temperature sensor is mounted on a PC board that is bolted to the heat sink near the power amplifier. To ensure that the sensing element is at the same temperature as the heat sink, the sensor's leads are mounted to pads that have feed throughs to the back side of the PC board. Since the LM56 is sensing the temperature of the actual PC board the back side of the PC board also has large ground plane to help conduct the heat to the device. The comparator's output goes low if the heat sink temperature rises above a threshold set by R1, R2, and the voltage reference. This fault detection output from the comparator now can be used to turn on a cooling fan. The circuit as shown in design to turn the fan on when heat sink temperature exceeds about 80C, and to turn the fan off when the heat sink temperature falls below approximately 75C. LM56 1289322 FIGURE 7. Simple Thermostat www.national.com 12 LM56 Physical Dimensions inches (millimeters) unless otherwise noted 8-Lead (0.150 Wide) Molded Small Outline Package, JEDEC Order Number LM56BIM, LM56BIMX, LM56CIM or LM56CIMX NS Package Number M08A 8-Lead Molded Mini Small Outline Package (MSOP) (JEDEC REGISTRATION NUMBER M0-187) Order Number LM56BIMM, LM56BIMMX, LM56CIMM, or LM56CIMMX NS Package Number MUA08A 13 www.national.com LM56 Dual Output Low Power Thermostat Notes For more National Semiconductor product information and proven design tools, visit the following Web sites at: www.national.com Products Design Support Amplifiers www.national.com/amplifiers WEBENCH(R) Tools www.national.com/webench Audio www.national.com/audio App Notes www.national.com/appnotes Clock and Timing www.national.com/timing Reference Designs www.national.com/refdesigns Data Converters www.national.com/adc Samples www.national.com/samples Interface www.national.com/interface Eval Boards www.national.com/evalboards LVDS www.national.com/lvds Packaging www.national.com/packaging Power Management www.national.com/power Green Compliance www.national.com/quality/green Switching Regulators www.national.com/switchers Distributors www.national.com/contacts LDOs www.national.com/ldo Quality and Reliability www.national.com/quality LED Lighting www.national.com/led Feedback/Support www.national.com/feedback Voltage References www.national.com/vref Design Made Easy www.national.com/easy www.national.com/powerwise Applications & Markets www.national.com/solutions Mil/Aero www.national.com/milaero PowerWise(R) Solutions Serial Digital Interface (SDI) www.national.com/sdi Temperature Sensors www.national.com/tempsensors SolarMagicTM www.national.com/solarmagic PLL/VCO www.national.com/wireless www.national.com/training PowerWise(R) Design University THE CONTENTS OF THIS DOCUMENT ARE PROVIDED IN CONNECTION WITH NATIONAL SEMICONDUCTOR CORPORATION ("NATIONAL") PRODUCTS. NATIONAL MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE ACCURACY OR COMPLETENESS OF THE CONTENTS OF THIS PUBLICATION AND RESERVES THE RIGHT TO MAKE CHANGES TO SPECIFICATIONS AND PRODUCT DESCRIPTIONS AT ANY TIME WITHOUT NOTICE. NO LICENSE, WHETHER EXPRESS, IMPLIED, ARISING BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. TESTING AND OTHER QUALITY CONTROLS ARE USED TO THE EXTENT NATIONAL DEEMS NECESSARY TO SUPPORT NATIONAL'S PRODUCT WARRANTY. EXCEPT WHERE MANDATED BY GOVERNMENT REQUIREMENTS, TESTING OF ALL PARAMETERS OF EACH PRODUCT IS NOT NECESSARILY PERFORMED. NATIONAL ASSUMES NO LIABILITY FOR APPLICATIONS ASSISTANCE OR BUYER PRODUCT DESIGN. BUYERS ARE RESPONSIBLE FOR THEIR PRODUCTS AND APPLICATIONS USING NATIONAL COMPONENTS. PRIOR TO USING OR DISTRIBUTING ANY PRODUCTS THAT INCLUDE NATIONAL COMPONENTS, BUYERS SHOULD PROVIDE ADEQUATE DESIGN, TESTING AND OPERATING SAFEGUARDS. EXCEPT AS PROVIDED IN NATIONAL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, NATIONAL ASSUMES NO LIABILITY WHATSOEVER, AND NATIONAL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO THE SALE AND/OR USE OF NATIONAL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. LIFE SUPPORT POLICY NATIONAL'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS PRIOR WRITTEN APPROVAL OF THE CHIEF EXECUTIVE OFFICER AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: Life support devices or systems are devices which (a) are intended for surgical implant into the body, or (b) support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in a significant injury to the user. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness. National Semiconductor and the National Semiconductor logo are registered trademarks of National Semiconductor Corporation. All other brand or product names may be trademarks or registered trademarks of their respective holders. Copyright(c) 2011 National Semiconductor Corporation For the most current product information visit us at www.national.com National Semiconductor Americas Technical Support Center Email: support@nsc.com Tel: 1-800-272-9959 www.national.com National Semiconductor Europe Technical Support Center Email: europe.support@nsc.com National Semiconductor Asia Pacific Technical Support Center Email: ap.support@nsc.com National Semiconductor Japan Technical Support Center Email: jpn.feedback@nsc.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Communications and Telecom www.ti.com/communications Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps DLP(R) Products www.dlp.com Energy and Lighting www.ti.com/energy DSP dsp.ti.com Industrial www.ti.com/industrial Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical Interface interface.ti.com Security www.ti.com/security Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive Microcontrollers microcontroller.ti.com Video and Imaging RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap Wireless Connectivity www.ti.com/wirelessconnectivity TI E2E Community Home Page www.ti.com/video e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2011, Texas Instruments Incorporated