JD54F373BSA - NATIONAL SEMICONDUCTOR

54F373,74F373

54F373 Octal Transparent Latch with TRI-STATE(RM) Outputs

Literature Number: SNOS189A

TL/F/9523

54F/74F373 Octal Transparent Latch with TRI-STATE Outputs

May 1995

54F/74F373

Octal Transparent Latch with TRI-STATEÉOutputs

General Description

The ’F373 consists of eight latches with TRI-STATE outputs

for bus organized system applications. The flip-flops appear

transparent to the data when Latch Enable (LE) is HIGH.

When LE is LOW, the data that meets the setup times is

latched. Data appears on the bus when the Output Enable

(OE) is LOW. When OE is HIGH the bus output is in the high

impedance state.

Features

YEight latches in a single package

YTRI-STATE outputs for bus interfacing

YGuaranteed 4000V minimum ESD protection

Commercial Military Package Package Description

Number

74F373PC N20A 20-Lead (0.300×Wide) Molded Dual-In-Line

54F373DM (QB) J20A 20-Lead Ceramic Dual-In-Line

74F373SC (Note 1) M20B 20-Lead (0.300×Wide) Molded Small Outline, JEDEC

74F373SJ (Note 1) M20D 20-Lead (0.300×Wide) Molded Small Outline, EIAJ

74F373MSA (Note 1) MSA20 20-Lead Molded Shrink Small Outline, EIAJ Type II

54F373FM (QB) W20A 20-Lead Cerpack

54F373LM (QB) E20A 20-Lead Ceramic Leadless Chip Carrier, Type C

Note 1: Devices also available in 13×reel. Use suffix eSCX, SJX, and MSAX.

Logic Symbols Connection Diagrams

IEEE/IEC

TL/F/9523–4

TL/F/9523–1

Pin Assignment

for DIP, SOIC, SSOP and Flatpak

TL/F/9523–2

Pin Assignment

for LCC

TL/F/9523–3

TRI-STATEÉis a registered trademark of National Semiconductor Corporation.

C1995 National Semiconductor Corporation RRD-B30M75/Printed in U. S. A.

Obsolete

Unit Loading/Fan Out

54F/74F

Pin Names Description U.L. Input IIH/IIL

HIGH/LOW Output IOH/IOL

D0–D7Data Inputs 1.0/1.0 20 mA/b0.6 mA

LE Latch Enable Input (Active HIGH) 1.0/1.0 20 mA/b0.6 mA

OE Output Enable Input (Active LOW) 1.0/1.0 20 mA/b0.6 mA

O0–O7TRI-STATE Latch Outputs 150/40 (33.3) b3 mA/24 mA (20 mA)

Functional Description

The ’F373 contains eight D-type latches with TRI-STATE

output buffers. When the Latch Enable (LE) input is HIGH,

data on the Dninputs enters the latches. In this condition

the latches are transparent, i.e., a latch output will change

state each time its D input changes. When LE is LOW, the

latches store the information that was present on the D in-

puts a setup time preceding the HIGH-to-LOW transition of

LE. The TRI-STATE buffers are controlled by the Output

Enable (OE) input. When OE is LOW, the buffers are in the

bi-state mode. When OE is HIGH the buffers are in the high

impedance mode but this does not interfere with entering

new data into the latches.

Truth Table

Inputs Output

LE OE DnOn

HLH H

HLL L

LLXO

(no change)

XHX Z

HIGH Voltage Level

LeLOW Voltage Level

XeImmaterial

ZeHigh Impedance State

Logic Diagram

TL/F/9523–5

Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.

Obsolete

Absolute Maximum Ratings (Note 1)

If Military/Aerospace specified devices are required,

please contact the National Semiconductor Sales

Office/Distributors for availability and specifications.

Storage Temperature b65§Ctoa

150§C

Ambient Temperature under Bias b55§Ctoa

125§C

Junction Temperature under Bias b55§Ctoa

175§C

Plastic b55§Ctoa

150§C

VCC Pin Potential to

Ground Pin b0.5V to a7.0V

Input Voltage (Note 2) b0.5V to a7.0V

Input Current (Note 2) b30 mA to a5.0 mA

Note 1: Absolute maximum ratings are values beyond which the device may

be damaged or have its useful life impaired. Functional operation under

these conditions is not implied.

Note 2: Either voltage limit or current limit is sufficient to protect inputs.

Voltage Applied to Output

in HIGH State (with VCC e0V)

Standard Output b0.5V to VCC

TRI-STATE Output b0.5V to a5.5V

Current Applied to Output

in LOW State (Max) twice the rated IOL (mA)

ESD Last Passing Voltage (Min) 4000V

Recommended Operating

Conditions

Free Air Ambient Temperature

Military b55§Ctoa

125§C

Commercial 0§Ctoa

70§C

Supply Voltage

Military a4.5V to a5.5V

Commercial a4.5V to a5.5V

DC Electrical Characteristics

Symbol Parameter 54F/74F Units VCC Conditions

Min Typ Max

VIH Input HIGH Voltage 2.0 V Recognized as a HIGH Signal

VIL Input LOW Voltage 0.8 V Recognized as a LOW Signal

VCD Input Clamp Diode Voltage b1.2 V Min IIN eb

18 mA

VOH Output HIGH 54F 10% VCC 2.5 IOH eb

1mA

Voltage 54F 10% VCC 2.4 IOH eb

3mA

74F 10% VCC 2.5 V Min IOH eb

1mA

74F 10% VCC 2.4 IOH eb

3mA

74F 5% VCC 2.7 IOH eb

1mA

74F 5% VCC 2.7 IOH eb

3mA

OL Output LOW 54F 10% VCC 0.5 V Min IOL e20 mA

Voltage 74F 10% VCC 0.5 IOL e24 mA

IIH Input HIGH Current 54F 20.0

mA Max VIN e2.7V

74F 5.0

IBVI Input HIGH Current 54F 100

mA Max VIN e7.0V

Breakdown Test 74F 7.0

ICEX Output HIGH 54F 250

mA Max VOUT eVCC

Leakage Current 74F 50

VID Input Leakage 74F 4.75 V 0.0 IID e1.9 mA

Test All Other Pins Grounded

IOD Output Leakage 74F 3.75 mA 0.0 VIOD e150 mV

Circuit Current All Other Pins Grounded

IIL Input LOW Current b0.6 mA Max VIN e0.5V

IOZH Output Leakage Current 50 mA Max VOUT e2.7V

IOZL Output Leakage Current b50 mA Max VOUT e0.5V

IOS Output Short-Circuit Current b60 b150 mA Max VOUT e0V

IZZ Bus Drainage Test 500 mA 0.0V VOUT e5.25V

ICCZ Power Supply Current 38 55 mA Max VOeHIGH Z

Obsolete

AC Electrical Characteristics

74F 54F 74F

TAea

25§CTA,V

CC eMil TA,V

CC eCom

Symbol Parameter VCC ea

5.0V CLe50 pF CLe50 pF Units

CLe50 pF

Min Typ Max Min Max Min Max

tPLH Propagation Delay 3.0 5.3 7.0 3.0 8.5 3.0 8.0 ns

tPHL Dnto On2.0 3.7 5.0 2.0 7.0 2.0 6.0

tPLH Propagation Delay 5.0 9.0 11.5 5.0 15.0 5.0 13.0 ns

tPHL LE to On3.0 5.2 7.0 3.0 8.5 3.0 8.0

tPZH Output Enable Time 2.0 5.0 11.0 2.0 13.5 2.0 12.0 ns

tPZL 2.0 5.6 7.5 2.0 10.0 2.0 8.5

tPHZ Output Disable Time 1.5 4.5 6.5 1.5 10.0 1.5 7.5 ns

tPLZ 1.5 3.8 5.0 1.5 7.0 1.5 6.0

AC Operating Requirements

74F 54F 74F

Symbol Parameter TAea

25§CTA,V

CC eMil TA,V

CC eCom Units

VCC ea

5.0V

Min Max Min Max Min Max

ts(H) Setup Time, HIGH or LOW 2.0 2.0 2.0

ts(L) Dnto LE 2.0 2.0 2.0 ns

th(H) Hold Time, HIGH or LOW 3.0 3.0 3.0

th(L) Dnto LE 3.0 4.0 3.0

tw(H) LE Pulse Width, HIGH 6.0 6.0 6.0 ns

Ordering Information

The device number is used to form part of a simplified purchasing code where the package type and temperature range are

defined as follows:

74F 373 S C X

Temperature Range Family Special Variations

74FeCommercial QB eMilitary grade device with

54FeMilitary environmental and burn-in

processing

Device Type XeDevices shipped in 13×reel

Package Code Temperature Range

PePlastic DIP CeCommercial (0§Ctoa

70§C)

DeCeramic DIP MeMilitary (b55§Ctoa

125§C)

FeFlatpak NOTE:

LeLeadless Chip Carrier (LCC) Not required for MSA package code

SeSmall Outline SOIC JEDEC

SJ eSmall Outline SOIC EIAJ

MSA eShrink Small Outline (EIAJ SSOP)

Obsolete

Physical Dimensions inches (millimeters)

20-Lead Ceramic Leadless Chip Carrier (L)

NS Package Number E20A

20-Lead Ceramic Dual-In-Line Package (D)

NS Package Number J20A

Obsolete

Physical Dimensions inches (millimeters) (Continued)

20-Lead (0.300×Wide) Molded Small Outline Package, JEDEC (S)

NS Package Number M20B

20-Lead (0.300×Wide) Small Outline Package, EIAJ (SJ)

NS Package Number M20D

Obsolete

Physical Dimensions inches (millimeters) (Continued)

20-Lead Molded Shrink Small Outline Package, EIAJ, Type II (MSA)

NS Package Number MSA20

20-Lead (0.300×Wide) Molded Dual-In-Line Package (P)

NS Package Number N20A

Obsolete

54F/74F373 Octal Transparent Latch with TRI-STATE Outputs

Physical Dimensions inches (millimeters) (Continued)

20-Lead Ceramic Flatpak (F)

NS Package Number W20A

LIFE SUPPORT POLICY

NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT

DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL

SEMICONDUCTOR CORPORATION. As used herein:

1. Life support devices or systems are devices or 2. A critical component is any component of a life

systems which, (a) are intended for surgical implant support device or system whose failure to perform can

into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life

failure to perform, when properly used in accordance support device or system, or to affect its safety or

with instructions for use provided in the labeling, can effectiveness.

be reasonably expected to result in a significant injury

to the user.

National Semiconductor National Semiconductor National Semiconductor National Semiconductor National Semiconductores National Semiconductor

Corporation GmbH Japan Ltd. Hong Kong Ltd. Do Brazil Ltda. (Australia) Pty, Ltd.

2900 Semiconductor Drive Livry-Gargan-Str. 10 Sumitomo Chemical 13th Floor, Straight Block, Rue Deputado Lacorda Franco Building 16

P.O. Box 58090 D-82256 F4urstenfeldbruck Engineering Center Ocean Centre, 5 Canton Rd. 120-3A Business Park Drive

Santa Clara, CA 95052-8090 Germany Bldg. 7F Tsimshatsui, Kowloon Sao Paulo-SP Monash Business Park

Tel: 1(800) 272-9959 Tel: (81-41) 35-0 1-7-1, Nakase, Mihama-Ku Hong Kong Brazil 05418-000 Nottinghill, Melbourne

TWX: (910) 339-9240 Telex: 527649 Chiba-City, Tel: (852) 2737-1600 Tel: (55-11) 212-5066 Victoria 3168 Australia

Fax: (81-41) 35-1 Ciba Prefecture 261 Fax: (852) 2736-9960 Telex: 391-1131931 NSBR BR Tel: (3) 558-9999

Tel: (043) 299-2300 Fax: (55-11) 212-1181 Fax: (3) 558-9998

Fax: (043) 299-2500

National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.

Obsolete

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,

and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should

obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are

sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard

warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where

mandated by government requirements, testing of all parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and

applications using TI components. To minimize the risks associated with customer products and applications, customers should provide

adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,

or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information

published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a

warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual

property of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied

by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive

business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional

restrictions.

Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all

express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not

responsible or liable for any such statements.

TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably

be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing

such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and

acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products

and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be

provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in

such safety-critical applications.

TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are

specifically designated by TI as military-grade or "enhanced plastic."Only products designated by TI as military-grade meet military

specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at

the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.

TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are

designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated

products in automotive applications, TI will not be responsible for any failure to meet such requirements.

Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

Products Applications

Audio www.ti.com/audio Communications and Telecom www.ti.com/communications

Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers

Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps

DLP®Products www.dlp.com Energy and Lighting www.ti.com/energy

DSP dsp.ti.com Industrial www.ti.com/industrial

Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical

Interface interface.ti.com Security www.ti.com/security

Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense

Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive

Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video

RFID www.ti-rfid.com

OMAP Mobile Processors www.ti.com/omap

Wireless Connectivity www.ti.com/wirelessconnectivity

TI E2E Community Home Page e2e.ti.com

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265