
IRK.L132.. Series
3
Bulletin I27095 rev. A 08/97
www.irf.com
TJMax. junction operating -40 to 150 ° C
temperature range
Tstg Max. storage temperature range -40 to 150 °C
RthJC Max. thermal resistance, 0.20 K/W Per junction, DC operation
junction to case
RthCS Max. thermal resistance, 0.035 K/W
case to heatsink
T Mounting torque ±10%
IAP to heatsink 4 t o 6 Nm
busbar to IAP 4 t o 6
wt Approximate weight 500 (17.8) g (oz)
IRK D L 13 2 - 14 S20 N
123
1- Module type
2- Circuit configuration (see Outline Table)
3- L = Fast recovery diode
4- Current rating: IF(AV) x 10 rounded
5- 1 = option with spacers and longer terminal screws
2 = option with standard terminal screws
6- Voltage code: Code x 100 = VRRM (see Voltage Rating Table)
7-t
rr code (see Recovery Characteristics Table)
8- None = Standard devices
N = Aluminum nitrade substrate
4
Device Code
Ordering Information Table
5 6
IRRM Max. peak reverse leakage
current
VINS RMS isolation voltage 3000 V 50 Hz, circuit to base, all terminals shorted, t = 1 sec
Blocking
40 mA TJ = 150oC
Parameter IRK.L132.. Units Conditions
7 8
S10 = 1000ns
S20 = 2000ns
Parameter IRK.L132.. Units Conditions
Thermal and Mechanical Specifications
A mounting compound is recommended and
the torque should be rechecked after a period
of 3 hours to allow for the spread of the
compound
Mounting surface flat, smooth and greased
Per module
∆RthJC Conduction
(The following table shows the increment of thermal resistence RthJC when devices operate at different conduction angles than DC)
180° 0.011 0.012 TJ = TJ max.
120° 0.016 0.019
90° 0.021 0.023 K/W
60° 0.029 0.030
30° 0.041 0.041
Conduction angle Sinusoidal conduction Rectangular conduction Units Conditions