2 (6)
DA1016.003
31 October, 2000
PAD LAYOUT
DIE size = 1.79 x 1.79 mm; PAD size = 100 x 100 µm
Substrate is connected to Vdd.
Note: Coordinates are calculated using Vdd as a centre point
Pad Identification Name X-coordinate Y-coordinate Note
Power Supply Voltage VDD 0 µm0 µm
Quarz Filter Output QO 306 µm19 µm
Quarz Filter Input QI 587 µm19 µm
AGC Capacitor AGC 866 µm19 µm
Receiver Output OUT 1143 µm19 µm3
Demodulator Capacitor DEC 1111 µm1436 µm
AGC On Control AON 868 µm1436 µm2
Power Down Input PDN 551 µm1436 µm1
Receiver Input RFI 309 µm1436 µm
Power Supply Ground VSS 16 µm1415 µm
Notes:
1) Level = VSS means receiver on; VDD = receiver off
2) Level = VSS means AGC hold; VDD = AGC on (working)
-Internal pull-up with current < 1 µA which is switched off in power down
-During AGC hold the receiver output OUT is hold down to VSS
3) 100% AM results in Level = VSS; 25% AM results in Level = VDD
- the output is a current source/sink with |IOUT| > 5 µA
- at power down the output is tri-state
MAS1016
VDD QO QI AGC OUT
VSS RFI PDN AON DEC
1788 µm
1786 µm