fax id: 7036 1CY 74FCT2 245 T CY74FCT2245T 8-Bit Transceiver Features Functional Description * Function and pinout compatible with FCT and F logic * 25 output series resistors to reduce transmission line reflection noise * FCT-C speed at 4.1 ns max. FCT-A speed at 4.6 ns max. * Edge-rate control circuitry for significantly improved noise characteristics * Power-off disable feature * Fully compatible with TTL input and output logic levels * ESD > 2000V * Sink current 12 mA Source current 15 mA * Extended commercial temp. range of -40C to +85C * Three-state outputs The FCT2245T contains eight non-inverting, bidirectional buffers with three-state outputs intended for bus oriented applications. On-chip termination resistors have been added to the outputs to reduce system noise caused by reflections. For this reason, the FCT2245T can be used in an existing design to replace the FCT245T. The FCT2245T current sinking capability is 12 mA at the A and B ports. The Transmit/Receive (T/R) input determines the direction of data flow through the bidirectional transceiver. Transmit (Active HIGH) enables data from A ports to B ports; receive (Active LOW) enables data from B ports to A ports. The output enable (OE) input, when HIGH, disables both the A and B ports by putting them in a High Z condition. The outputs are designed with a power-off disable feature to allow for live insertion of boards. Logic Block Diagram Pin Configurations T/R OE DIP/SOIC/QSOP Top View A0 B0 A1 B1 A2 B2 A3 B3 T/R 1 20 VCC A0 2 19 OE A1 3 18 B0 A2 4 17 B1 A3 5 16 B2 A4 6 15 B3 A5 7 14 A6 8 13 B4 B5 A7 9 12 B6 10 11 B7 GND A4 FCT2245T-3 B4 A5 B5 A6 B6 A7 B7 FCT2245T-1 Function Table[1] Inputs OE T/R Output L L Bus B Data to Bus A L H Bus A Data to Bus B H X High Z State Note: 1. H = HIGH Voltage Level. L = LOW Voltage Level. X = Don't Care. Cypress Semiconductor Corporation * 3901 North First Street * San Jose * CA 95134 * 408-943-2600 July 1994 - Revised October 1996 CY74FCT2245T Maximum Ratings[2,3] Power Dissipation.......................................................... 0.5W Static Discharge Voltage ........................................... >2001V (per MIL-STD-883, Method 3015) (Above which the useful life may be impaired. For user guidelines, not tested.) Storage Temperature ................................. -65C to +150C Operating Range Ambient Temperature with Power Applied............................................. -65C to +135C Range Supply Voltage to Ground Potential ............... -0.5V to +7.0V DC Input Voltage............................................ -0.5V to +7.0V DC Output Voltage ......................................... -0.5V to +7.0V Range Commercial DT Commercial T, AT, CT Ambient Temperature VCC 0C to +70C 5V 5% -40C to +85C 5V 5% DC Output Current (Maximum Sink Current/Pin)....... 120 mA Electrical Characteristics Over the Operating Range Parameter Description Test Conditions Min. Typ.[5] 2.4 3.3 VOH Output HIGH Voltage VCC=Min., IOH=-15 mA Com'l VOL Output LOW Voltage VCC=Min., IOL=12 mA Com'l ROUT Output Resistance VCC=Min., IOL=12 mA Com'l VIH Input HIGH Voltage VIL Input LOW Voltage VH Hysteresis[6] All inputs 0.2 VIK Input Clamp Diode Voltage VCC=Min., IIN=-18 mA -0.7 II Input HIGH Current IIH Input HIGH Current IIL Input LOW Current IOS Output Short Circuit IOFF Power-Off Disable 20 Max. V 0.3 0.55 V 25 40 2.0 V 0.8 Current[7] Unit V V -1.2 V VCC=Max., VIN=VCC 5 A VCC=Max., VIN=2.7V 1 A VCC=Max., VIN=0.5V 1 A -225 mA 1 A Typ.[5] VCC=Max., VOUT=0.0V -60 -120 VCC=0V, VOUT=4.5V Capacitance[6] Parameter Description Test Conditions Max. Unit CIN Input Capacitance 5 10 pF COUT Output Capacitance 9 12 pF Notes: 2. Unless otherwise noted, these limits are over the operating free-air temperature range. 3. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground. 4. TA is the "instant on" case temperature. 5. Typical values are at V CC=5.0V, TA=+25C ambient. 6. This parameter is guaranteed but not tested. 7. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter tests, IOS tests should be performed last. 2 CY74FCT2245T Power Supply Characteristics Parameter Description Test Conditions Typ.[5] Max. Unit ICC Quiescent Power Supply Current VCC=Max., VIN < 0.2V, VIN > VCC-0.2V 0.1 0.2 mA ICC Quiescent Power Supply Current (TTL inputs) VCC=Max., VIN=3.4V,[8] f1=0, Outputs Open 0.5 2.0 mA ICCD Dynamic Power Supply Current[9] VCC=Max., One Input Toggling, 50% Duty Cycle, Outputs Open, T/R=OE=GND, VIN < 0.2V or VIN > VCC-0.2V 0.06 0.12 mA/MHz IC Total Power Supply Current[10] VCC=Max., 50% Duty Cycle, Outputs Open, One Bit Toggling at f1=10 MHz, T/R=OE=GND, VIN < 0.2V or VIN > VCC-0.2V 0.7 1.4 mA VCC=Max., 50% Duty Cycle, Outputs Open, One Bit Toggling at f1=10 MHz, T/R=OE=GND, VIN=3.4V or VIN=GND 1.0 2.4 mA VCC=Max., 50% Duty Cycle, Outputs Open, Eight Bits Toggling at f1=2.5 MHz, T/R=OE=GND, VIN < 0.2V or VIN > VCC-0.2V 1.3 2.6[11] mA VCC=Max., 50% Duty Cycle, Outputs Open, Eight Bits Toggling at f1=2.5 MHz, T/R=OE=GND, VIN=3.4V or VIN=GND 3.3 10.6[11] mA Notes: 8. Per TTL driven input (VIN=3.4V); all other inputs at VCC or GND. 9. This parameter is not directly testable, but is derived for use in Total Power Supply calculations. 10. IC = IQUIESCENT + IINPUTS + IDYNAMIC IC = ICC+ICCDHNT+I CCD(f0/2 + f1N1) ICC = Quiescent Current with CMOS input levels ICC = Power Supply Current for a TTL HIGH input (VIN=3.4V) DH = Duty Cycle for TTL inputs HIGH = Number of TTL inputs at DH NT ICCD = Dynamic Current caused by an input transition pair (HLH or LHL) = Clock frequency for registered devices, otherwise zero f0 f1 = Input signal frequency = Number of inputs changing at f1 N1 All currents are in milliamps and all frequencies are in megahertz. 11. Values for these conditions are examples of the ICC formula. These limits are guaranteed but not tested. 3 CY74FCT2245T ] Switching Characteristics--Over the Operating Range[12] Parameter Description FCT2245T FCT2245AT FCT2245CT FCT2245DT Commercial Commercial Commercial Commercial Min. Max. Min. Max. Min. Max. Min. Max. Unit Fig. No.[13] tPLH tPHL Propagation Delay An to Bn or Bn to An 1.5 7.0 1.5 4.6 1.5 4.1 1.5 3.8 ns 1, 3 tPZH tPZL Output Enable Time 1.5 9.5 1.5 6.2 1.5 5.8 1.5 5.0 ns 1, 7, 8 tPHZ tPLZ Output Disable Time 1.5 7.5 1.5 5.0 1.5 4.5 1.5 4.3 ns 1, 7, 8 Ordering Information--FCT2245T Speed (ns) 3.8 4.1 4.6 7.5 Ordering Code Package Name Package Type CY74FCT2245DTQC Q5 20-Lead (150-Mil) QSOP CY74FCT2245DTSOC S5 20-Lead (300-Mil) Molded SOIC CY74FCT2245CTQC Q5 20-Lead (150-Mil) QSOP CY74FCT2245CTSOC S5 20-Lead (300-Mil) Molded SOIC CY74FCT2245ATPC P5 20-Lead (300-Mil) Molded DIP CY74FCT2245ATQC Q5 20-Lead (150-Mil) QSOP CY74FCT2245ATSOC S5 20-Lead (300-Mil) Molded SOIC CY74FCT2245TPC P5 20-Lead (300-Mil) Molded DIP CY74FCT2245TQC Q5 20-Lead (150-Mil) QSOP CY74FCT2245TSOC S5 20-Lead (300-Mil) Molded SOIC Shaded areas contain preliminary information. Notes: 12. Minimum limits are guaranteed but not tested on Propagation Delays. 13. See "Parameter Measurement Information" in the General Information section. Document #: 38-00349-B 4 Operating Range Commercial Commercial Commercial Commercial CY74FCT2245T Package Diagrams 20-Lead (300-Mil) Molded DIP P5 20-Lead Quarter Size Outline Q5 5 CY74FCT2245T Package Diagrams (continued) 20-Lead (300-Mil) Molded SOIC S5 (c) Cypress Semiconductor Corporation, 1996. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.