UPD750104GB-XXX-3BS-MTX - NEC Electronics - Datasheet.Directory

DATA SHEET

MOS INTEGRATED CIRCUIT

©1990

1997

4 BIT SINGLE-CHIP MICROCONTROLLER

The

µ

PD750108 is one of the 75XL series 4-bit single-chip microcontrollers, which provide data processing

capability equal to that of an 8-bit microcontroller.

The

µ

PD750108 is produced by replacing the main system clock oscillator of the

µ

PD750008 with an RC oscillator,

enabling operation at a relatively low voltage of 1.8 V. In addition, it is best suited to applications using batteries.

The

µ

PD750108(A) has a higher reliability than the

µ

PD750108.

A built-in one-time PROM product,

µ

PD75P0116, is also available. It is suitable for small-scale production and

evaluation of application systems.

The following user’s manual describes the details of the functions of the

µ

PD750108. Be sure to read it

before designing application systems.

µ

PD750108 User’s Manual: U11330E

FEATURES

• Built-in RC oscillator

• Enables the immediate start of processing after the

release of standby mode

• Capable of low-voltage operation: VDD = 1.8 to 5.5 V

• Internal memory

Program memory (ROM)

: 4,096 × 8 bits (

µ

PD750104 and

µ

PD750104(A))

: 6,144 × 8 bits (

µ

PD750106 and

µ

PD750106(A))

: 8,192 × 8 bits (

µ

PD750108 and

µ

PD750108(A))

Data memory (RAM)

: 512 × 4 bits

APPLICATIONS

•

µ

PD750104,

µ

PD750106, and

µ

PD750108

Cameras, meters, and pagers

•

µ

PD750104(A),

µ

PD750106(A), and

µ

PD750108(A)

Electrical equipment for automobiles

The

µ

PD750104,

µ

PD750106,

µ

PD750108,

µ

PD750104(A),

µ

PD750106(A), and

µ

PD750108(A) differ only in

quality grade. In this manual, the

µ

PD750108 is described unless otherwise specified. Users of other than the

µ

PD750108 should read

µ

PD750108 as referring to the pertinent product.

When the description differs among

µ

PD750104,

µ

PD750106, and

µ

PD750108, they also refer to the pertinent

(A) products.

µ

PD750104 →

µ

PD750104(A),

µ

PD750106 →

µ

PD750106(A),

µ

PD750108 →

µ

PD750108(A)

The information in this document is subject to change without notice.

Document No. U12301EJ1V0DS00 (1st edition)

Date Published July 1997 J

Printed in Japan

µ

PD750104,750106,750108,750104(A),750106(A),750108(A)

•

Function for specifying the instruction execution time

(useful for saving power)

4

µ

s, 8

µ

s, 16

µ

s, 64

µ

s (when operating at 1.0 MHz)

2

µ

s, 4

µ

s, 8

µ

s, 32

µ

s (when operating at 2.0 MHz)

122

µ

s (when operating at 32.768 kHz)

• Enhanced timer function (4 channels)

• Can be easily substituted for the

µ

PD750008 because

this product succeeds to the functions and instructions

of the

µ

PD750008.

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

2

ORDERING INFORMATION

Part number Package Quality grade

µ

PD750104CU-××× 42-pin plastic shrink DIP (600 mil, 1.778-mm pitch) Standard

µ

PD750104GB-×××-3BS-MTX 44-pin plastic QFP (10 × 10 mm, 0.8-mm pitch) Standard

µ

PD750106CU-××× 42-pin plastic shrink DIP (600 mil, 1.778-mm pitch) Standard

µ

PD750106GB-×××-3BS-MTX 44-pin plastic QFP (10 × 10 mm, 0.8-mm pitch) Standard

µ

PD750108CU-××× 42-pin plastic shrink DIP (600 mil, 1.778-mm pitch) Standard

µ

PD750108GB-×××-3BS-MTX 44-pin plastic QFP (10 × 10 mm, 0.8-mm pitch) Standard

µ

PD750104CU(A)-××× 42-pin plastic shrink DIP (600 mil, 1.778-mm pitch) Special

µ

PD750104GB(A)-×××-3BS-MTX 44-pin plastic QFP (10 × 10 mm, 0.8-mm-pitch) Special

µ

PD750106CU(A)-××× 42-pin plastic shrink DIP (600 mil, 1.778-mm pitch) Special

µ

PD750106GB(A)-×××-3BS-MTX 44-pin plastic QFP (10 × 10 mm, 0.8-mm pitch) Special

µ

PD750108CU(A)-××× 42-pin plastic shrink DIP (600 mil, 1.778-mm pitch) Special

µ

PD750108GB(A)-×××-3BS-MTX 44-pin plastic QFP (10 × 10 mm, 0.8-mm pitch) Special

Remark ××× is a mask ROM code number.

DIFFERENCES BETWEEN

µ

PD75010× AND

µ

PD75010×(A)

Product number

Item

Quality grade Standard Special

µ

PD750104

µ

PD750106

µ

PD750108

µ

PD750104(A)

µ

PD750106(A)

µ

PD750108(A)

Please refer to "Quality Grades on NEC Semiconductor Devices" (Document No. C11531E) published by

NEC Corporation to know the specification of

q

ualit

y

g

rade on the devices and its recommended applications.

3

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

ROM

RAM

FUNCTIONS

CMOS input

CMOS I/O

N-ch open

drain I/O

Total

8

18

8

34

Can incorporate 7 pull-up resistors that are specified with the software.

Can directly drive the LED.

Can incorporate 18 pull-up resistors that are specified with the software.

Can directly drive the LED.

Can withstand 13 V.

Can incorporate pull-up resistors that are specified with the mask option.

Serial interface

Clock output (PCL)

Buzzer output (BUZ)

Vectored interrupt

Test input

System clock oscillator

Standby

Operating ambient

temperature range

Supply voltage

Package

Item

Command execution

time

Internal memory

General-purpose

register

I/O port

Timer

Bit sequential buffer (BSB)

4 channels

•8-bit timer/event counter: 1 channel

•8-bit timer counter: 1 channel

•Basic interval timer/watchdog timer: 1 channel

•lock timer: 1 channel

•Three-wire serial I/O mode ... switchable between the start LSB and the start MSB

•Two-wire serial I/O mode

•SBI mode

16 bits

•

Φ

, 125, 62.5, or 15.6 kHz (when the main system clock operates at 1.0 MHz)

•

Φ

, 250, 125, or 31.3 kHz (when the main system clock operates at 2.0 MHz)

•2, 4, or 32 kHz (when the subsystem clock operates at 32.768 kHz)

• 0.488, 0.977, or 7.813 kHz (when the main system clock operates at 1.0 MHz)

• 0.977, 1.953, or 15.625 kHz (when the main system clock operates at 2.0 MHz)

External : 3

Internal : 4

External : 1

Internal : 1

•RC oscillator for main system clock (with external resistor and capacitor)

•Crystal oscillator for subsystem clock

STOP/HALT mode

TA = -40 to +85 °C

VDD = 1.8 to 5.5 V

42-pin plastic shrink DIP (600 mil, 1.778-mm pitch)

44-pin plastic QFP (10 × 10 mm, 0.8-mm pitch)

Function

• 4, 8, 16, or 64

µ

s (when the main system clock operates at 1.0 MHz)

• 2, 4, 8, or 32

µ

s (when the main system clock operates at 2.0 MHz)

• 122

µ

s (when the subsystem clock operates at 32.768 kHz)

4,096 × 8 bits (

µ

PD750104)

6,144 × 8 bits (

µ

PD750106)

8,192 × 8 bits (

µ

PD750108)

512 × 4 bits

• When operating in 4 bits: 8 × 4 banks

• When operating in 8 bits: 4 × 4 banks

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

4

CONTENTS

1. PIN CONFIGURATION (TOP VIEW) ......................................................................................... 6

2. BLOCK DIAGRAM ..................................................................................................................... 8

3. PIN FUNCTIONS ........................................................................................................................ 9

3.1 Port Pins ......................................................................................................................................... 9

3.2 Non-Port Pins ................................................................................................................................. 10

3.3 Pin Input/Output Circuits.............................................................................................................. 11

3.4 Connection of Unused Pins ......................................................................................................... 13

4. Mk Ι MODE/Mk ΙΙ MODE SWITCH FUNCTION........................................................................ 14

4.1 Differences between Mk Ι Mode and Mk ΙΙ Mode ...................................................................... 14

4.2 Setting of the Stack Bank Selection Register (SBS) ................................................................ 15

5. MEMORY CONFIGURATION .................................................................................................... 16

6. PERIPHERAL HARDWARE FUNCTIONS................................................................................ 21

6.1 Digital I/O Ports.............................................................................................................................. 21

6.2 Clock Generator ............................................................................................................................. 21

6.3 Control Functions of Subsystem Clock Oscillator ................................................................... 23

6.4 Clock Output Circuit...................................................................................................................... 24

6.5 Basic Interval Timer/Watchdog Timer ........................................................................................ 25

6.6 Clock Timer..................................................................................................................................... 26

6.7 Timer/Event Counter ..................................................................................................................... 27

6.8 Serial Interface ............................................................................................................................... 30

6.9 Bit Sequential Buffer ..................................................................................................................... 32

7. INTERRUPT FUNCTIONS AND TEST FUNCTIONS ............................................................... 33

8. STANDBY FUNCTION ............................................................................................................... 35

9. RESET FUNCTION..................................................................................................................... 36

10. MASK OPTION ........................................................................................................................... 39

11. INSTRUCTION SET.................................................................................................................... 40

12. ELECTRICAL CHARACTERISTICS ......................................................................................... 53

13. CHARACTERISTIC CURVE (REFERENCE VALUES) ............................................................ 65

5

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

14. EXAMPLES OF RC OSCILLATOR FREQUENCY CHARACTERISTICS (REFERENCE

VALUES)..................................................................................................................................... 66

15. PACKAGE DRAWINGS ............................................................................................................. 68

16. RECOMMENDED SOLDERING CONDITIONS ........................................................................ 70

APPENDIX A FUNCTIONS OF THE

µ

PD750008,

µ

PD750108, AND

µ

PD75P0116.................. 71

APPENDIX B DEVELOPMENT TOOLS........................................................................................ 73

APPENDIX C RELATED DOCUMENTS........................................................................................ 77

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

6

1. PIN CONFIGURATION (TOP VIEW)

• 42-pin plastic shrink DIP (600 mil, 1.778-mm pitch)

µ

PD750104CU-×××,

µ

PD750104CU(A)-×××

µ

PD750106CU-×××,

µ

PD750106CU(A)-×××

µ

PD750108CU-×××,

µ

PD750108CU(A)-×××

IC : Internally connected (Connect directly to VDD.)

VSS

P40

P41

P42

P43

P50

P51

P52

P53

P60/KR0

P61/KR1

P62/KR2

P63/KR3

P70/KR4

P71/KR5

P72/KR6

P73/KR7

P20/PTO0

P21/PTO1

P22/PCL

P23/BUZ

XT1

XT2

RESET

CL1

CL2

P33

P32

P31

P30

P81

P80

P03/SI/SB1

P02/SO/SB0

P01/SCK

P00/INT4

P13/TI0

P12/INT2

P11/INT1

P10/INT0

IC

VDD

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

42

41

40

39

38

37

36

35

34

33

32

31

30

29

28

27

26

25

24

23

22

7

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

• 44-pin plastic QFP (10 × 10 mm, 0.8-mm pitch)

µ

PD750104GB-×××-3BS-MTX,

µ

PD750104GB(A)-×××-3BS-MTX

µ

PD750106GB-×××-3BS-MTX,

µ

PD750106GB(A)-×××-3BS-MTX

µ

PD750108GB-×××-3BS-MTX,

µ

PD750108GB(A)-×××-3BS-MTX

IC : Internally connected (Connect directly to V DD.)

PIN NAMES

BUZ : Buzzer Clock P70-P73 : Port 7

CL1, CL2 : Main System Clock (RC) P80, P81 : Port 8

IC : Internally Connected PCL : Programmable Clock

INT0, 1, 4 : External Vectored Interrupt 0, 1, 4 PTO0, PTO1 : Programmable Timer Output 0, 1

INT2 : External Test Input 2 RESET : Reset

KR0-KR7 : Key Return 0-7 SB0, SB1 : Serial Bus 0, 1

NC : No connection SCK : Serial Clock

P00-P03 : Port 0 SI : Serial Input

P10-P13 : Port 1 SO : Serial Output

P20-P23 : Port 2 TI0 : Timer Input 0

P30-P33 : Port 3 VDD : Positive Power Supply

P40-P43 : Port 4 VSS : Ground

P50-P53 : Port 5 XT1, XT2 : Subsystem Clock (Crystal)

P60-P63 : Port 6

P72/KR6

P71/KR5

P70/KR4

P63/KR3

P62/KR2

P61/KR1

P60/KR0

P53

P52

P51

P50

1

2

3

4

5

6

7

8

9

10

11

33

32

31

30

29

28

27

26

25

24

23

P13/TI0

P00/INT4

P01/SCK

P02/SO/SB0

P03/SI/SB1

P80

P81

P30

P31

P32

P33

NC

P43

P42

P41

P40

VSS

XT1

XT2

RESET

CL1

CL2

P73/KR7

P20/PTO0

P21/PTO1

P22/PCL

P23/BUZ

VDD

IC

P10/INT0

P11/INT1

P12/INT2

NC

12 13 14 15 16 17 18 19 20 21 22

44 43 42 41 40 39 38 37 36 35 34

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

8

2. BLOCK DIAGRAM

Note The ROM capacity depends on the product.

BIT SEQ.

BUFFER (16)

PORT 0 P00 - P034

PORT 1

PORT 2 4

PORT 3 P30 - P334

PORT 4 P40 - P434

PORT 5 P50 - P534

PORT 6 P60 - P634

VSSVDD RESET

IC

CPU CLOCK

Φ

STAND BY

CONTROL

CL2CL1XT2XT1

SYSTEM CLOCK

GENERATOR

MAINSUB

CLOCK

DIVIDER

CLOCK

OUTPUT

CONTROL

fx/2N

PCL/P22

GENERAL

REGISTER

DATA

MEMORY

(RAM)

512 × 4 BITS

BANK

SBS

SP (8)

CY

ALU

PROGRAM

COUNTER

PROGRAM

MEMORYNote

(ROM) DECODE

AND

CONTROL

BASIC INTERVAL

TIMER/

WATCHDOG

TIMER

TI0/P13

INTBT RESET

8-BIT

TIMER/EVENT

COUNTER #0

PTO0/P20

INTT0 TOUT0

8-BIT TIMER

COUNTER #1

INTT1

TOUT0

CLOCKED

SERIAL

INTERFACE

SI/SB1/P03

INTERRUPT

CONTROL

INT0/P10

SO/SB0/P02

SCK/P01

INT1/P11

INT2/P12

INT4/P00

KR0/P60-

KR7/P73

WATCH

TIMER

8PORT 7 P70 - P734

PORT 8 P80, P812

P10 - P134

P20 - P23

PTO1/P21

INTCSI

INTW

BUZ/P23

9

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

3. PIN FUNCTIONS

3.1 Port Pins

Notes 1. The circle ( ) indicates the Schmitt trigger input.

2. When pull-up resistors that can be specified with the mask option are not incorporated (when pins are

used as N-ch open-drain input ports), the input leak low current increases when an input instruction or

bit operation instruction is executed.

I/O circuit

type

Note 1

-A

-B

-C

-C

E-B

E-B

M-D

M-D

-A

-A

E-B

When reset

Input

Input

Input

Input

High level (when

pull-up resistors

are provided) or

high impedance

High level (when

pull-up resistors

are provided) or

high impedance

Input

Input

Input

8-bit

I/O

×

×

×

×

×

Function

4-bit input port (PORT0).

For P01 - P03, built-in pull-up resistors

can be connected by software in units

of 3 bits.

4-bit input port (PORT1).

Built-in pull-up resistors can be

connected by software in units of 4 bits.

A noise eliminator can be selected only

when the P10/INT0 pin is used.

4-bit I/O port (PORT2).

Built-in pull-up resistors can be

connected by software in units of 4 bits.

Programmable 4-bit I/O port (PORT3).

I/O can be specified bit by bit. Built-in

pull-up resistors can be connected by

software in units of 4 bits.

N-ch open-drain 4-bit I/O port (PORT4).

A pull-up resistor can be provided bit by

bit (mask option). Withstand voltage is

13 V in open-drain mode.

N-ch open-drain 4-bit I/O port (PORT5).

A pull-up resistor can be provided bit by

bit (mask option). Withstand voltage is

13 V in open-drain mode.

Programmable 4-bit I/O port (PORT6).

I/O can be specified bit by bit. Built-in

pull-up resistors can be connected by

software in units of 4 bits.

4-bit I/O port (PORT7).

Built-in pull-up resistors can be

connected by software in units of 4 bits.

2-bit I/O port (PORT8).

Built-in pull-up resistors can be

connected by software in units of 2

bits.

B

F

F

M

B

Pin name

P00

P01

P02

P03

P10

P11

P12

P13

P20

P21

P22

P23

P30 - P33

P40 - P43

Note 2

P50 - P53

Note 2

P60

P61

P62

P63

P70

P71

P72

P73

P80

P81

Input/

output

Input

I/O

I/O

I/O

Input

I/O

I/O

I/O

I/O

I/O

I/O

I/O

F

F

Shared

pin

INT4

SCK

SO/SB0

SI/SB1

INT0

INT1

INT2

TI0

PTO0

PTO1

PCL

BUZ

-

-

-

KR0

KR1

KR2

KR3

KR4

KR5

KR6

KR7

-

-

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

10

3.2 Non-Port Pins

Notes 1. The circle ( ) indicates the Schmitt trigger input.

2. With a noise eliminator/asynchronously selectable

3. Asynchronous

B

B

F

F

M

B

Function

Inputs external event pulse to the timer/event

counter

Timer/event counter output

Timer counter output

Clock output

Arbitrary frequency output (for buzzer output or

system clock trimming)

Serial clock I/O

Serial data output

Serial data bus I/O

Serial data input

Serial data bus I/O

Edge detection vectored interrupt input (both

rising and falling edges are detected)

Rising edge detection testable input

Falling edge detection testable input

Falling edge detection testable input

Pin for connecting a resistor (R) or capacitor (C)

for main system clock oscillation. An external

clock cannot be input.

Crystal connection pin for subsystem clock

generation. When external clock signal is used, it

is applied to XT1, and it reverse phase signal is

applied to XT2.

XT1 can be used as a 1-bit input (test).

System reset input (active low)

Internally connected. (To be connected directly to

VDD)

Positive power supply

Ground potential

Input/

output

Input

Output

I/O

Input

Input

Input

Input

Input

-

-

Input

-

Input

-

-

-

When reset

Input

Input

Input

Input

Input

Input

-

-

-

-

-

-

Edge detection vectored interrupt input

(detection edge selectable). A noise eliminator

can be selected when INT0/P10 is used.

Shared

pin

P13

P20

P21

P22

P23

P01

P02

P03

P00

P10

P11

P12

P60 - P63

P70 - P73

-

-

-

-

-

-

Note 3

Note 2

Note 3

I/O circuit

type

Note 1

-C

E-B

-A

-B

-C

-C

-A

-A

-

-

-

-

-

B

Pin name

TI0

PTO0

PTO1

PCL

BUZ

SCK

SO/SB0

SI/SB1

INT4

INT0

INT1

INT2

KR0 - KR3

KR4 - KR7

CL1

CL2

XT1

XT2

RESET

IC

VDD

VSS

F

F

11

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

3.3 Pin Input/Output Circuits

The input/output circuit of each

µ

PD750108 pin is shown below in a simplified manner.

Type A Type D

Type B Type E-B

Type B-C Type F-A

(1/2)

CMOS input buffer

VDD

IN P-ch

N-ch

Schmitt trigger input with hysteresis

IN

P.U.R.: Pull-Up Resistor

IN

P-ch P.U.R.

enable

P.U.R.

VDD

P.U.R.: Pull-Up Resistor

P.U.R.

VDD

P.U.R.

enable P-ch

IN/OUT

Data

Output

disable

Type D

Type A

Push-pull output which can be set to high-impedance output

(off for both P-ch and N-ch)

VDD

P-ch

N-ch

OUT

Data

Output

disable

P.U.R.

VDD

P.U.R.

enable P-ch

IN/OUT

Data

Output

disable

Type D

Type B

P.U.R.: Pull-Up Resistor

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

12

Type F-B Type M-C

Type M-D

(2/2)

P.U.R.: Pull-Up Resistor

VDD

P-ch

N-ch

IN/OUT

VDD

P-ch

P.U.R.

P.U.R.

enable

Output

disable

(P)

Data

Output

disable Output

disable

(N)

P.U.R.: Pull-Up Resistor

N-ch

P.U.R.

Data

Output

disable

P.U.R.

enable

VDD

P-ch

IN/OUT

P.U.R.: Pull-Up Resistor

N-ch

(Withstand

voltage:

+13 V)

IN/OUT

Data

VDD

Output

disable

P.U.R.

(Mask option)

Note

P.U.RNote

VDD

P-ch

Input

instruction

Pull-up resistor that operates only when pull-up resistors

that can be specified with the mask option are not

incorporated and an input instruction is executed.

(When the pin is low, the current flows from VDD to the pin.)

Voltage

restriction

circuit

(Withstand voltage: +13 V)

13

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

Input state : To be connected to VSS or VDD

through a separate resistor

Output state : To be left open

Input state : To be connected to VSS or VDD

through a separate resistor

Output state : To be left open

Input state : To be connected to VSS

Output state : To be connected to VSS

(Do not connect to a pull-up

resistor specified with a mask

option.)

3.4 Connection of Unused Pins

Table 3-1. Connection of Unused Pins

Note When the subsystem clock is not used, set SOS.0 to 1 (not to use the built-

in feedback resistor).

Pin name Recommended connection

P00/INT4 To be connected to VSS or VDD

P01/SCK

P02/SO/SB0

P03/SI/SB1 To be connected to VSS

P10/INT0 - P12/INT2 To be connected to VSS or VDD

P13/TI0

P20/PTO0

P21/PTO1

P22/PCL

P23/BUZ

P30 - P33

P40 - P43

P50 - P53

P60/KR0 - P63/KR3

P70/KR4 - P73/KR7

P80, P81

XT1Note To be connected to VSS or VDD

XT2Note To be left open

IC To be connected directly to VDD

To be connected to VSS or VDD through a

separate resistor

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

14

4. Mk Ι MODE/Mk ΙΙ MODE SWITCH FUNCTION

4.1 Differences between Mk Ι Mode and Mk ΙΙ Mode

The CPU of the

µ

PD750108 has two modes (Mk Ι mode and Mk ΙΙ mode) and which mode is used is selectable.

Bit 3 of the stack bank selection register (SBS) determines the mode.

• Mk Ι mode: This mode has the upward compatibility with the 75X series.

It can be used in the 75XL CPUs having a ROM of up to 16 KB.

• Mk ΙΙ mode: This mode is not compatible with the 75X series.

It can be used in all 75XL CPUs, including those having a ROM of 16 KB or more.

Table 4-1 shows the differences between Mk Ι mode and Mk ΙΙ mode.

Table 4-1. Differences between Mk Ι Mode and Mk ΙΙ Mode

Caution Mk ΙΙ mode can be used to support a program area larger than 16K bytes in the 75X series or 75XL

series. This mode enhances a software compatibility with products whose program area is larger

than 16K bytes. If Mk ΙΙ mode is selected, when the subroutine call instruction is executed, the

number of stack bytes (use area) will be increased by one byte for each stack, compared to Mk

Ι mode. When a CALL !addr or CALLF !faddr instruction is executed, it takes one more machine

cycle. Therefore, Mk Ι mode should be used for applications for which RAM efficiency or

processing capabilities is more critical than a software compatibility.

Number of stack bytes in a

subroutine instruction

BRA !addr1 instruction

CALLA !addr1 instruction

CALL !addr instruction

CALLF !faddr instruction

2 bytes

None

3 machine cycles

2 machine cycles

3 bytes

Available

4 machine cycles

3 machine cycles

Mk Ι mode Mk ΙΙ mode

15

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

4.2 Setting of the Stack Bank Selection Register (SBS)

The Mk Ι mode and Mk ΙΙ mode are switched by stack bank selection register. Figure 4-1 shows the register

configuration.

The stack bank selection register is set with a 4-bit memory operation instruction. To use the CPU in Mk Ι mode,

initialize the register to 100×BNote at the beginning of the program. To use the CPU in Mk ΙΙ mode, initialize it to

000×BNote.

Note Specify the desired value in ×.

Figure 4-1. Stack Bank Selection Register Format

Caution The CPU operates in Mk Ι mode after the RESET signal is issued, because bit 3 of SBS is set to

1. Set bit 3 of SBS to 0 (Mk ΙΙ mode) to use the CPU in Mk ΙΙ mode.

SBS0SBS1SBS2SBS3

0123

F84H

Address

SBS

Symbol

0

0

0

1

Memory bank 0

Memory bank 1

Other settings are inhibited.

0

1

Mk ΙΙ mode

Mk Ι mode

Mode switching designation

Bit 2 must be set to 0.

Stack area designation

0

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

16

5. MEMORY CONFIGURATION

• Program memory (ROM) : 4,096 × 8 bits (0000H-0FFFH):

µ

PD750104

6,144 × 8 bits (0000H-17FFH):

µ

PD750106

8,192 × 8 bits (0000H-1FFFH):

µ

PD750108

•0000H to 0001H

Vector address table for holding the RBE and MBE values and program start address when a RESET signal is

issued (allowing a reset start at an arbitrary address)

•0002H to 000DH

Vector address table for holding the RBE and MBE values and program start address for each vectored interrupt

(allowing interrupt processing to be started at an arbitrary address)

•0020H to 007FH

Table area referenced by the GETI instructionNote

Note The GETI instruction requires only one byte to represent an arbitrary two-byte or three-byte instruction or

two one-byte instructions, reducing the number of program bytes.

• Data memory (RAM)

•Data area : 512 × 4 bits (000H to 1FFH)

•Peripheral hardware area : 128 × 4 bits (F80H to FFFH)

17

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

Figure 5-1. Program Memory Map (in

µ

PD750104)

Note Can be used only in the Mk ΙΙ mode.

Remark In addition to the above, the BR PCDE and BR PCXA instructions can cause a branch to an address

with only the 8 low-order bits of the PC changed.

000H

Address 7654

MBE RBE 0 0 Internal reset start address (high-order 4 bits)

0

002H MBE RBE 0 0 INTBT/INT4 (high-order 4 bits)start address

004H MBE RBE 0 0 INT0 (high-order 4 bits)start address

006H MBE RBE 0 0 INT1 (high-order 4 bits)start address

008H MBE RBE 0 0 INTCSI (high-order 4 bits)start address

00AH MBE RBE 0 0 INTT0 (high-order 4 bits)start address

00CH MBE RBE 0 0 INTT1 (high-order 4 bits)start address

020H

07FH

080H

7FFH

800H

FFFH

GETI instruction reference table

(low-order 8 bits)

(low-order 8 bits)

(low-order 8 bits)

(low-order 8 bits)

(low-order 8 bits)

(low-order 8 bits)

(low-order 8 bits)

CALLF

! faddr

instruction

entry

address Branch address

of BR BCXA, BR

BCDE, BR !addr,

BRA !addr1Note or

CALLA !addr1Note

instruction

CALL !addr

instruction

subroutine entry

address

BR $addr

instruction relative

branch address

BRCB

!caddr

instruction

branch

address

-15 to -1,

+2 to +16

Branch destination

address and

subroutine entry

address when

GETI instruction

is executed

Internal reset start address

INTBT/INT4 start address

INT0 start address

INT1 start address

INTCSI start address

INTT0 start address

INTT1 start address

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

18

Figure 5-2. Program Memory Map (in

µ

PD750106)

Note Can be used only in the Mk ΙΙ mode.

Remark In addition to the above, the BR PCDE and BR PCXA instructions can cause a branch to an address

with only the 8 low-order bits of the PC changed.

0000H

Address

0002H MBE RBE 0 INTBT/INT4 (high-order 5 bits)start address

0004H MBE RBE 0 INT0 (high-order 5 bits)start address

0006H MBE RBE 0 INT1 (high-order 5 bits)start address

0008H MBE RBE 0 INTCSI (high-order 5 bits)start address

000AH MBE RBE 0 INTT0 (high-order 5 bits)start address

0020H

007FH

0080H

07FFH

0800H

MBE RBE 0 Internal reset start address (high-order 5 bits)

0FFFH

1000H

17FFH

GETI instruction reference table

000CH MBE RBE 0 INTT1 (high-order 5 bits)start address

(low-order 8 bits)

(low-order 8 bits)

(low-order 8 bits)

(low-order 8 bits)

(low-order 8 bits)

(low-order 8 bits)

(low-order 8 bits)

CALLF

!faddr

instruction

entry

address

BRCB !caddr

instruction

branch

address

Branch address

of BR BCXA, BR

BCDE, BR !addr,

BRA !addr1Note or

CALLA !addr1Note

instruction

CALL !addr

instruction

subroutine entry

address

BR $addr

instruction relative

branch address

-15 to -1,

+2 to +16

Branch destination

address and

subroutine entry

address when GETI

instruction is executed

BRCB !caddr

instruction

branch

address

765 0

Internal reset start address

INTBT/INT4

INT0

INT1

INTCSI

INTT0

INTT1

start address

start address

start address

start address

start address

start address

19

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

Figure 5-3. Program Memory Map (in

µ

PD750108)

Note Can be used only in the Mk ΙΙ mode.

Remark In addition to the above, the BR PCDE and BR PCXA instructions can cause a branch to an address

with only the 8 low-order bits of the PC changed.

0000H

Address

0002H MBE RBE 0 INTBT/INT4 (high-order 5 bits)start address

0004H MBE RBE 0 INT0 (high-order 5 bits)start address

0006H MBE RBE 0 INT1 (high-order 5 bits)start address

0008H MBE RBE 0 INTCSI (high-order 5 bits)start address

000AH MBE RBE 0 INTT0 (high-order 5 bits)start address

0020H

007FH

0080H

07FFH

0800H

MBE RBE 0 Internal reset start address (high-order 5 bits)

0FFFH

1000H

1FFFH

GETI instruction reference table

000CH MBE RBE 0 INTT1 (high-order 5 bits)start address

(low-order 8 bits)

(low-order 8 bits)

(low-order 8 bits)

(low-order 8 bits)

(low-order 8 bits)

(low-order 8 bits)

(low-order 8 bits)

CALLF

!faddr

instruction

entry

address

BRCB !caddr

instruction

branch

address

Branch address

of BR BCXA, BR

BCDE, BR !addr,

BRA !addr1Note or

CALLA !addr1Note

instruction

CALL !addr

instruction

subroutine entry

address

BR $addr

instruction relative

branch address

-15 to -1,

+2 to +16

Branch destination

address and

subroutine entry

address when GETI

instruction is executed

BRCB !caddr

instruction

branch

address

765 0

Internal reset start address

INTBT/INT4

INT0

INT1

INTCSI

INTT0

INTT1

start address

start address

start address

start address

start address

start address

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

20

Figure 5-4. Data Memory Map

Note Memory bank 0 or 1 can be selected as the stack area.

(32 × 4)

Data memory

000H

01FH

020H

0FFH

100H

1FFH

F80H

FFFH

256 × 4

(224 × 4)

256 × 4

128 × 4

0

1

15

Stack

areaNote

Area for

general-purpose

register

Data area

Static RAM

(512 × 4)

Peripheral

hardware area

Not contained

Memory bank

21

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

When the serial interface function is used, dual-function pins

function as output pins in some operation modes.

4-bit input port

Allows input or output mode setting in units of 4 bits.

Allows input or output mode setting in units of 1 bit.

Operation and feature

Port name

PORT0

PORT1

PORT2

PORT3

PORT4

PORT5

PORT6

PORT7

PORT8

6. PERIPHERAL HARDWARE FUNCTIONS

6.1 Digital I/O Ports

The

µ

PD750108 has the following three types of I/O port:

• 8 CMOS input pins (PORT0 and PORT1)

• 18 CMOS I/O pins (PORT2, PORT3, and PORT6 to PORT8)

• 8 N-ch open-drain I/O pins (PORT4 and PORT5)

Total: 34 pins

Table 6-1. Digital Ports and Their Features

6.2 Clock Generator

The clock generator generates clocks which are supplied to the peripheral hardware in the CPU. Figure 6-1 shows

the configuration of the clock generator.

Operation of the clock generator is specified by the processor clock control register (PCC) and system clock control

register (SCC).

The main system clock and subsystem clock are used.

The instruction execution time can be made variable.

• 4, 8, 16, or 64

µ

s (when the main system clock is at 1.0 MHz)

• 2, 4, 8, or 32

µ

s (when the main system clock is at 2.0 MHz)

• 122

µ

s (when the subsystem clock is at 32.768 kHz)

Allows input or output mode setting in

units of 4 bits. Whether to use pull-up

resistors can be specified bit by bit with

the mask option.

Allows input or output mode setting in

units of 1 bit.

Allows input or output mode setting in

units of 4 bits.

Ports 4 and 5 can be

paired, allowing data

I/O in units of 8 bits.

Ports 6 and 7 can be

paired, allowing data

I/O in units of 8 bits.

4-bit input

4-bit I/O

4-bit I/O (N-ch

open-drain can

withstand 13 V)

4-bit I/O

2-bit I/O

Also used as INT4, SCK,

SO/SB0, or SI/SB1.

Also used as INT0, INTI,

INT2 or TI0.

Also used as PTO0,

PTO1, PCL, or BUZ.

-

Also used as one of KR0

to KR3.

Also used as one of KR4

to KR7.

-Allows input or output mode setting in units of 2 bits.

Function Remarks

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

22

Figure 6-1. Clock Generator Block Diagram

Note Instruction execution

Remarks 1. fCC = Main system clock frequency

2. fXT = Subsystem clock frequency

3.

Φ

= CPU clock

4. PCC: Processor clock control register

5. SCC: System clock control register

6. One clock cycle (tCY) of the CPU clock (

Φ

) is equal to one machine cycle of an instruction.

Subsystem

clock generator

Main system

clock generator

RC oscillation

Clock timer

• Basic interval timer (BT)

• Timer/event counter

• Timer counter

• Serial interface

• Clock timer

• INT0 noise eliminator

• Clock output circuit

1/1 to 1/4096

Frequency divider

Selec-

tor

Selec-

tor

Frequency

divider

Φ

Oscillator

disable

signal

Internal bus

HALTNote

STOPNote

PCC2, PCC3

clear signal Wait release signal from BT

Standby release signal from

interrupt control circuit

RESET signal

XT1

XT2

CL1

CL2

4

SCC

SCC3

SCC0

PCC

PCC0

PCC1

PCC2

PCC3

STOP flip-flop

QS

R

HALT flip-flop

S

Q

R

fXT

fCC

1/2 1/16

1/4

1/4

WM.3

• CPU

• INT0 noise

eliminator

• Clock

output

circuit















23

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

6.3 Control Functions of Subsystem Clock Oscillator

The subsystem clock oscillator of the

µ

PD750108 has two control functions to decrease the supply current.

• The function to select with the software whether to use the built-in feedback resistorNote

• The function to suppress the supply current by reducing the drive current of the built-in inverter when the supply

voltage is high (VDD ≥ 2.7 V)

Note When the subsystem clock is not used, set SOS.0 to 1 (not to use the built-in feedback resistor), connect

XT1 to VSS or V DD, and open XT2. This makes it possible to reduce the supply current required by the

subsystem clock oscillator.

Each function can be used by switching bits 0 and 1 in the sub-oscillator control register (SOS). (See Figure 6-

2.)

Figure 6-2. Subsystem Clock Oscillator

SOS.0

SOS.1

XT1 XT2

Inverter

Feedback resistor

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

24

6.4 Clock Output Circuit

The clock output circuit outputs a clock pulse from the P22/PCL pin. This clock pulse is used for remote control

waveform output, peripheral LSIs, etc.

• Clock output (PCL):

Φ

, 125, 62.5, or 15.6 kHz (at 1.0 MHz)

Φ

, 250, 125, or 31.3 kHz (at 2.0 MHz)

Figure 6-3. Clock Output Circuit Configuration

Remark Measures are taken to prevent outputting a narrow pulse when selecting clock output enable/disable.

From the clock

generator

CLOM

Selector

Output

buffer

Port 2 input/

output mode

specification bit

P22 output

latch

PCL/P22

Internal bus

4

PORT2.2 Bit 2 of PMGB

CLOM0CLOM10CLOM3

Φ

fCC/23

fCC/24

fCC/26

25

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

6.5 Basic Interval Timer/Watchdog Timer

The basic interval timer/watchdog timer has these functions:

• Interval timer operation which generates a reference timer interrupt

• Operation as a watchdog timer for detecting program crashes and resetting the CPU

• Selection of wait time for releasing the standby mode and counting the wait time

• Reading out the count value

Figure 6-4. Block Diagram of the Basic Interval Timer/Watchdog Timer

Note Instruction execution

From the clock

generator

Internal bus

4

fCC/25

fCC/27

fCC/29

fCC/212

MPX Basic interval timer

(8-bit frequency divider)

Clear signal Clear signal

BT interrupt

request flag Vectored

interrupt

request

signal

IRQBT

Wait release

signal for standby

release

Set

signal

BT

8

BTM3 BTM2 BTM1 BTM0 BTM

SET1Note

3

1

WDTM

Internal

reset signal

SET1Note

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

26

6.6 Clock Timer

The

µ

PD750108 contains one channel for a clock timer. The clock timer provides the following functions:

• Sets the test flag (IRQW) with a 0.5 sec interval (when WM0 = 1).

• The standby mode can be released by IRQW.

• The 0.5 second interval can be generated from the subsystem clock (32.768 kHz).

• The time interval can be made 128 times faster by selecting the fast mode. This is convenient for program

debugging, testing, etc.

• Any of the frequencies (fW/24, fW/23, or fW can be output to the P23/BUZ pin. This can be used for beep and

system clock frequency trimming.

• The clock can be started from zero seconds by clearing the frequency divider.

Figure 6-5. Clock Timer Block Diagram

Note When a frequency-divided main system clock is used, 32.768 kHz cannot be selected as the source clock

frequency.

Remark The values in parentheses in the figure above are for fCC = 1.0 MHz, fXT = 32.768 kHz.

P23/BUZ

Internal bus

8

Selector

From the

clock

generator

fCC

128

(7.8125 kHz)

fXT

(32.768 kHz)

Selector Frequency divider

Selector INTW

IRQW

set signal

WM7 0 WM5 WM4 WM3 WM2 WM1 WM0 P23 output

latch

Bit 2 of PMGBPORT2.3

Output buffer

Clear

fW

32.768 kHz

or

7.8125 kHz

Bit test instruction

Port 2 input/

output mode

WM

fw

27

fw

214

fw

23fw

24

Note

27

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

6.7 Timer/Event Counter

The

µ

PD750108 contains one channel for a timer/event counter and one channel for a timer counter. Figures

6-6 and 6-7 show their configurations.

The timer/event counter provides the following functions:

• Programmable interval timer operation

• Outputs square-wave signal of an arbitrary frequency to the PTOn pin (n = 0, 1)

• Event counter operation (channel 0 only)

• Divides the TI0 pin input by N and outputs to the PTO0 pin (frequency divider operation) (channel 0 only)

• Supplies serial shift clock to the serial interface circuit (channel 0 only)

• Count read function

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

28

Figure 6-6. Timer/Event Counter Block Diagram

Count register (8)

TI0/P13

MPX

Timer operation start signal

888

From the clock

generator

Internal bus

TM06 TM05 TM04 TM03 TM02

Port input

buffer Comparator (8)

Modulo register (8) T0 enable

flag

P20

output

latch

signal

Port 2

input/

output

mode

Clear signal

T0

TMOD0 Bit 2 of PMGB

PTO0/P20

Output

buffer

Reset

RESET

IRQT0 clear

signal

TOUT

flip-flop

TM0

Input buffer

IRQT0

set signal

INTT0

PORT2.0

TOUT0 To serial

interface

CP

Match

8

8

TOE0

SET1Note

fCC/24

fCC/26

fCC/28

fCC/210

Note Instruction execution

29

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

Figure 6-7. Timer Counter Block Diagram

Count register (8)

MPX

Timer operation start signal











888

From the clock

generator

Internal bus

TM16 TM15 TM14 TM13 TM12

Comparator (8)

Modulo register (8)

T1 enable

flag P21

output

latch

Port 2

input/

output

mode

Clear signal

T1

TMOD1 Bit 2 of PMGB

PTO1/P21

Output

buffer

Reset

RESET

IRQT1 clear

signal

TOUT

flip-flop

TM1

SET1

Note

IRQT1

set signal

INTT1

PORT2.1TOE1

CP

Match

8

8

f

CC

/2

6

f

CC

/2

8

f

CC

/2

10

f

CC

/2

12

Note Instruction execution

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

30

6.8 Serial Interface

µ

PD750108 has an 8-bit synchronous serial interface. The serial interface has the following four types of mode.

• Operation stop mode

• Three-wire serial I/O mode

• Two-wire serial I/O mode

• SBI mode

31

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

Figure 6-8. Serial Interface Block Diagram

Internal bus

88 8

8/4

P03/SI/SB1

P02/SO/SB0

P01/SCK

(8)

fCC/23

fCC/24

fCC/26

TOUT0

(from timer/event counter)

CSIM

RELD

CMDD

ACKD

ACKT

ACKE

BSYE

RELT

CMDT

DQ

SET CLR

(8)

(8)

SBIC

Bit

test

Slave address register (SVA)

Address comparator

Coincidence

signal

Bit manipulation

SO latch

Bit test

Selec-

tor

Selec-

tor

Busy/

acknowledge

output circuit

Bus release/

command/

acknowledge

detection circuit

Serial clock

counter

Serial clock

control circuit

INTCSI

control circuit IRQCSI

set signal

INTCSI

P01

output latch Serial clock

selector

External SCK

Shift register (SIO)

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

32

6.9 Bit Sequential Buffer: 16 Bits

The bit sequential buffer (BSB) is a data memory specifically provided for bit manipulation. With this buffer,

addresses and bit specifications can be sequentially updated by bit manipulation operation. Therefore, this buffer

is very useful for processing long data in bit units.

Figure 6-9. Bit Sequential Buffer Format

Remarks 1. In pmem.@L addressing, bit specification is shifted according to the L register.

2. In pmem.@L addressing, the bit sequential buffer can be manipulated at any time regardless of MBE/

MBS specification.

3210321032103210

BSB3 BSB2 BSB1 BSB0

FC3H FC2H FC1H FC0H

L = FH L = CH L = BH L = 8H L = 7H L = 4H L = 3H L = 0H

DECS L

INCS L

Address

Bit

L register

Symbol

33

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

7. INTERRUPT FUNCTIONS AND TEST FUNCTIONS

The

µ

PD750108 has seven interrupt sources and two test sources. One test source, INT2, has two types of edge

detection testable input pins.

The interrupt control circuit of the

µ

PD750108 has the following functions.

(1) Interrupt functions

• Hardware controlled vectored interrupt function which can control whether or not to accept an interrupt using

the interrupt flag (IE×××) and interrupt master enable flag (IME).

• The interrupt start address can be set arbitrarily.

• Multiple interrupt function which can specify the priority by the interrupt priority specification register (IPS)

• Test function of an interrupt request flag (IRQ×××)

(The software can confirm that an interrupt occurred.)

• Release of the standby mode (Interrupts released by an interrupt enable flag can be selected.)

(2) Test functions

• Whether test request flags (IRQ×××) are issued can be checked with software.

• Release of the standby mode (A test source to be released can be selected with test enable flags.)

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

34

Figure 7-1. Interrupt Control Circuit Block Diagram

Note Noise eliminator (Standby release is not possible when the noise eliminator is selected.)

2

IM2

14

IRQBT

IRQ4

IRQ0

IRQ1

IRQCSI

IRQT0

IRQT1

IRQW

IRQ2

INTBT

INT4/P00

INT0/P10

INT1/P11

INTCSI

INTT0

INTT1

INTW

INT2/P12

Both-edge

detector

IM0

Edge

detector

Edge

detector

Rising edge

detector

Falling edge

detector

KR0/P60

KR7/P73

Selec-

tor

IM2

Interrupt enable flag (IE×××)IPS IST0

IME

Priority control circuit

Decoder

VRQn

Vector table

address

generator

Standby release signal

Internal bus

Selector

Note

IM1 IST1

35

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

8. STANDBY FUNCTION

The

µ

PD750108 has two different standby modes (STOP mode and HALT mode) to reduce power dissipation while

waiting for program execution.

Table 8-1. Standby Mode Statuses

Notes 1. Operation is possible only when the main system clock operates.

2. Operation is possible only when the noise eliminator is not selected by bit 2 of the edge detection mode

register (IM0) (when IM02 = 1).

Instruction for setting

System clock for setting

Clock oscillator

Basic interval

timer/watchdog

timer

Serial interface

Timer/event

counter

Timer counter

Clock timer

External interrupt

CPU

Release signal

STOP mode

STOP instruction

Can be set only when operating on the

main system clock.

The main system clock stops its operation.

Does not operate.

Can operate only when the external SCK

input is selected for the serial clock.

Can operate only when the TI0 pin input is

selected for the count clock.

Does not operate.

Can operate when fXT is selected as the

count clock.

INT1, INT2, and INT4 can operate.

Only INT0 cannot operate. Note 2

Does not operate.

Opera-

tion

status

Item Mode

An interrupt request signal from hardware whose operation is enabled by the interrupt

enable flag or the generation of a RESET signal

HALT mode

HALT instruction

Can be set either with the main system

clock or the subsystem clock.

Only the CPU clock Φ stops its operation

(oscillation continues).

Can operate only at main system clock

oscillation.

BT mode : IRQBT is set at the reference

interval.

WT mode : A reset signal is generated

when the BT overflows.

Can operate only when external SCK input

is selected as the serial clock or at main

system clock oscillation.

Can operate only when TI0 pin input is

specified as the count clock or at main

system clock oscillation.

Can operate.Note 1

Can operate.

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

36

9. RESET FUNCTION

The

µ

PD750108 is reset with the external reset signal (RESET) or the reset signal received from the basic interval

timer/watchdog timer. When either reset signal is input, the internal reset signal is generated. Figure 9-1 shows the

configuration of the reset circuit.

Figure 9-1. Configuration of Reset Functions

When the RESET signal is generated, all hardware is initialized as indicated in Table 9-1. Figure 9-2 shows the

reset operation timing.

Figure 9-2. Reset Operation by Generation of RESET Signal

Note 56/fCC (28

µ

s at 2.0 MHz, 56

µ

s at 1.0 MHz)

WDTM

RESET Internal reset signal

Reset signal from basic

interval timer/watchdog timer

Internal bus

RESET signal is generated

Operating mode or

standby mode HALT mode Operating mode

Internal reset operation

WaitNote

37

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

Table 9-1. Status of the Hardware after a Reset (1/2)

Program counter (PC)

PSW

Stack pointer (SP)

Stack bank selection register (SBS)

Data memory (RAM)

General-purpose registers (X, A, H, L, D, E, B, C)

Bank selection register (MBS, RBS)

Timer/event

counter

Timer counter

Clock timer

Serial interface

4 low-order bits at address 0000H

in program memory are set in PC

bits 11 to 8, and the data at address

0001H are set in PC bits 7 to 0.

5 low-order bits at address 0000H

in program memory are set in PC

bits 12 to 8, and the data at address

0001H are set in PC bits 7 to 0.

Held

0

0

Bit 6 at address 0000H in

program memory is set in RBE,

and bit 7 is set in MBE.

Undefined

1000B

Held

Held

0, 0

Undefined

0

0

0

FFH

0

0, 0

0

FFH

0

0, 0

0

Held

0

0

Held

4 low-order bits at address 0000H

in program memory are set in PC

bits 11 to 8, and the data at address

0001H are set in PC bits 7 to 0.

5 low-order bits at address 0000H

in program memory are set in PC

bits 12 to 8, and the data at address

0001H are set in PC bits 7 to 0.

Undefined

0

0

Bit 6 at address 0000H in program

memory is set in RBE, and bit 7 is

set in MBE.

Undefined

1000B

Undefined

Undefined

0, 0

Undefined

0

0

0

FFH

0

0, 0

0

FFH

0

0, 0

0

Undefined

0

0

Undefined

Generation of a RESET signal

during operation

Generation of a RESET signal in

a standby mode

Hardware

Carry flag (CY)

Skip flags (SK0 to SK2)

Interrupt status flags (IST0, IST1)

Bank enable flags (MBE, RBE)

µ

PD750104

µ

PD750106, 750108

Counter (BT)

Mode register (BTM)

Watchdog timer enable flag

(WDTM)

Counter (T0)

Modulo register (TMOD0)

Mode register (TM0)

TOE0, TOUT flip-flop

Counter (T1)

Modulo register (TMOD1)

Mode register (TM1)

TOE1, TOUT flip-flop

Mode register (WM)

Shift register (SIO)

Operation mode register (CSIM)

SBI control register (SBIC)

Slave address register (SVA)

Basic interval

timer/ watchdog

timer

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

38

Table 9-1. Status of the Hardware after a Reset (2/2)

0

0

0

0

Reset (0)

0

0

0, 0, 0

Off

Clear (0)

0

0

Undefined

Generation of a RESET signal

during operation

Clock generator,

clock output cir-

cuit

Interrupt

Digital ports

Processor clock control register (PCC)

System clock control register (SCC)

Clock output mode register (CLOM)

Interrupt request flag (IRQ×××)

Interrupt enable flag (IE×××)

Priority selection register (IPS)

INT0, INT1, and INT2 mode registers

(IM0, IM1, IM2)

Output buffer

Output latch

I/O mode registers (PMGA, PMGB,

PMGC)

Pull-up resistor specification registers

(POGA, POGB)

Generation of a RESET signal in

a standby mode

Hardware

Sub-oscillator control register (SOS)

0

0

0

0

Reset (0)

0

0

0, 0, 0

Off

Clear (0)

0

0

Held

Bit sequential buffers (BSB0 to BSB3)

39

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

10. MASK OPTION

The

µ

PD750108 has the following mask options:

•Mask option of P40 to P43 and P50 to P53

Can specify whether to incorporate the pull-up resistor.

The pull-up resistor is incorporated bit by bit.

The pull-up resistor is not incorporated.

•Mask option of standby function

Can specify the wait time when STOP mode was released by an interrupt.

29/fCC (256

µ

s at 2.0 MHz, 512

µ

s at 1.0 MHz)

No wait

•Mask option of subsystem clock

Can specify whether to enable the built-in feedback resistor.

The built-in feedback resistor is enabled (it is turned on or off by software).

The built-in feedback resistor is disabled (it is cut by hardware).

1

2

2

1

2

1

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

40

Description

Representation

format

11. INSTRUCTION SET

(1) Operand identifier and its descriptive method

The operands are described in the operand column of each instruction according to the descriptive method for

the operand format of the appropriate instructions. (For details, refer to the RA75X Assembler Package User's

Manual: Language (EEU-1363).) For descriptions in which alternatives exist, one element should be selected.

Capital letters and plus and minus signs are keywords; therefore, they should be described as they are.

For immediate data, the appropriate numerical values or labels should be described.

The symbols of register flags can be used as a label instead of mem, fmem, pmem, and bit. (For details, refer

to the

µ

PD750108 User’s Manual (U11330E).) However, there are some restrictions on usable labels for fmem

and pmem.

Note Only even address can be specified for 8-bit data processing.

X, A, B, C, D, E, H, L

X, B, C, D, E, H, L

XA, BC, DE, HL

BC, DE, HL

BC, DE

XA, BC, DE, HL, XA', BC', DE', HL'

BC, DE, HL, XA', BC', DE', HL'

HL, HL+, HL-, DE, DL

DE, DL

4-bit immediate data or label

8-bit immediate data or label

8-bit immediate data or labelNote

2-bit immediate data or label

FB0H - FBFH, FF0H - FFFH immediate data or label

FC0H - FFFH immediate data or label

0000H - 0FFFH immediate data or label (

µ

PD750104)

0000H - 17FFH immediate data or label (

µ

PD750106)

0000H - 1FFFH immediate data or label (

µ

PD750108)

0000H - 0FFFH immediate data or label (

µ

PD750104)

0000H - 17FFH immediate data or label (

µ

PD750106)

0000H - 1FFFH immediate data or label (

µ

PD750108)

12-bit immediate data or label

11-bit immediate data or label

20H - 7FH immediate data (however, bit 0 = 0) or label

PORT0 - PORT8

IEBT, IET0, IET1, IE0 - IE2, IE4, IECSI, IEW

RB0 - RB3

MB0, MB1, MB15

reg

reg1

rp

rp1

rp2

rp'

rp'1

rpa

rpa1

n4

n8

mem

bit

fmem

pmem

addr

addr1(for Mk ΙΙ

mode only)

caddr

faddr

taddr

PORTn

IE×××

RBn

MBn

41

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

(2) Symbol definitions in operation description

A : A register; 4-bit accumulator

B : B register

C : C register

D : D register

E : E register

H : H register

L : L register

X : X register

XA : Register pair (XA); 8-bit accumulator

BC : Register pair (BC)

DE : Register pair (DE)

HL : Register pair (HL)

XA' : Extended register pair (XA')

BC' : Extended register pair (BC')

DE' : Extended register pair (DE')

HL' : Extended register pair (HL')

PC : Program counter

SP : Stack pointer

CY : Carry flag; Bit accumulator

PSW : Program status word

MBE : Memory bank enable flag

RBE : Register bank enable flag

PORTn : Port n (n = 0 to 8)

IME : Interrupt master enable flag

IPS : Interrupt priority specification register

IE××× : Interrupt enable flag

RBS : Register bank selection register

MBS : Memory bank selection register

PCC : Processor clock control register

. : Address bit delimiter

(××) : Contents addressed by ××

××H : Hexadecimal data

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

42

(3) Symbols used for the addressing area column

Remarks 1. MB indicates the memory bank that can be accessed.

2. For *2, MB = 0 regardless of MBE and MBS settings.

3. For *4 and *5, MB = 15 regardless of MBE and MBS settings.

4. For *6 to *11, each addressable area is indicated.

(4) Description of machine cycle column

S indicates the number of machine cycles necessary for skipping any skip instruction. The value of S changes

as follows:

• When no skip is performed : S = 0

• When a 1-byte or 2-byte instruction is skipped: S = 1

• When a 3-byte instructionNote is skipped : S = 2

Note 3-byte instruction: BR !addr, BRA !addr1, CALL !addr, and CALLA !addr1 instructions.

Caution The GETI instruction is skipped in one machine cycle.

One machine cycle is equal to one cycle (= tCY) of the CPU clock (

Φ

), and four types of times are available for

selection according to the PCC setting.

* 1 MB = MBE • MBS (MBS = 0, 1, 15)

* 2 MB = 0

* 3 MBE = 0

MBE = 1

:

:

MB = 0 (000H - 07FH), MB = 15 (F80H - FFFH)

MB = MBS (MBS = 0, 1, 15)

* 4 MB = 15, fmem = FB0H - FBFH, FF0H - FFFH

* 5 MB = 15, pmem = FC0H - FFFH

* 6 addr = 0000H - 0FFFH ( PD750104), 0000H - 17FFH ( PD750106)

0000H - 1FFFH ( PD750108)

µ

µ

µ

* 7 addr, addr1 = (Current PC) - 15 to (Current PC) - 1

(Current PC) + 2 to (Current PC) + 16

* 8 caddr = 0000H - 0FFFH ( PD750104)

0000H - 0FFFH (PC12 = 0: PD750106, 750108)

1000H - 17FFH (PC12 = 1: PD750106)

1000H - 1FFFH (PC12 = 1: PD750108)

µ

µ

µ

* 9 faddr = 0000H - 07FFH

* 10 taddr = 0020H - 007FH

Data memory

addressing

Program memory

addressing

µ

Mk ΙΙ mode only

addr1 =

µ

µ

µ

0000H - 0FFFH ( PD750104)

0000H - 17FFH ( PD750106)

0000H - 1FFFH ( PD750108)

* 11

43

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

Group

Transfer

Table

reference

Mne-

monic

MOV

XCH

MOVT

Operand

A, #n4

reg1, #n4

XA, #n8

HL, #n8

rp2, #n8

A, @HL

A, @HL+

A, @HL-

A, @rpa1

XA, @HL

@HL, A

@HL, XA

A, mem

XA, mem

mem, A

mem, XA

A, reg

XA, rp'

reg1, A

rp'1, XA

A, @HL

A, @HL+

A, @HL-

A, @rpa1

XA, @HL

A, mem

XA, mem

A, reg1

XA, rp'

XA, @PCDE

XA, @PCXA

XA, @BCDE

XA, @BCXA

Bytes

1

2

2

2

2

1

1

1

1

2

1

2

2

2

2

2

2

2

2

2

1

1

1

1

2

2

2

1

2

1

1

1

1

Machin-

ing

cycle

1

2

2

2

2

1

2 + S

2 + S

1

2

1

2

2

2

2

2

2

2

2

2

1

2 + S

2 + S

1

2

2

2

1

2

3

3

3

3

Skip

condition

String A

String A

String B

L = 0

L = FH

L = 0

L = FH

Address-

ing area

*1

*1

*1

*2

*1

*1

*1

*3

*3

*3

*3

*1

*1

*1

*2

*1

*3

*3

*6

*6

Operation

A ← n4

reg1 ← n4

XA ← n8

HL ← n8

rp2 ← n8

A ← (HL)

A ← (HL), then L ← L + 1

A ← (HL), then L ← L - 1

A ← (rpa1)

XA ← (HL)

(HL) ← A

(HL) ← XA

A ← (mem)

XA ← (mem)

(mem) ← A

(mem) ← XA

A ← reg

XA ← rp'

reg1 ← A

rp'1 ← XA

A ↔ (HL)

A ↔ (HL), then L ← L + 1

A ↔ (HL), then L ← L - 1

A ↔ (rpa1)

XA ↔ (HL)

A ↔ (mem)

XA ↔ (mem)

A ↔ reg1

XA ↔ rp'

•

µ

PD750104

XA ← (PC11-8 + DE) ROM

•

µ

PD750106, 750108

XA ← (PC12-8 + DE) ROM

•

µ

PD750104

XA ← (PC11-8 + XA) ROM

•

µ

PD750106, 750108

XA ← (PC12-8 + XA) ROM

XA ← (BCDE) ROMNote

XA ← (BCXA) ROM Note

Note Set register B to 0 in the

µ

PD750104. Only the LSB is valid in register B in the

µ

PD750106 and

µ

PD750108.

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

44

Group

Bit transfer

Arithme-

tic

Accumulator

manipulation

Increment/

decrement

Mne-

monic

MOV1

ADDS

ADDC

SUBS

SUBC

AND

OR

XOR

RORC

NOT

INCS

DECS

Operand

CY, fmem.bit

CY, pmem.@L

CY, @H+mem.bit

fmem.bit, CY

pmem.@L, CY

@H+mem.bit, CY

A, #n4

XA, #n8

A, @HL

XA, rp'

rp'1, XA

A, @HL

XA, rp'

rp'1, XA

A, @HL

XA, rp'

rp'1, XA

A, @HL

XA, rp'

rp'1, XA

A, #n4

A, @HL

XA, rp'

rp'1, XA

A, #n4

A, @HL

XA, rp'

rp'1, XA

A, #n4

A, @HL

XA, rp'

rp'1, XA

A

A

reg

rp1

@HL

mem

reg

rp'

Bytes

2

2

2

2

2

2

1

2

1

2

2

1

2

2

1

2

2

1

2

2

2

1

2

2

2

1

2

2

2

1

2

2

1

2

1

1

2

2

1

2

Machin-

ing

cycle

2

2

2

2

2

2

1 + S

2 + S

1 + S

2 + S

2 + S

1

2

2

1 + S

2 + S

2 + S

1

2

2

2

1

2

2

2

1

2

2

2

1

2

2

1

2

1 + S

1 + S

2 + S

2 + S

1 + S

2 + S

Skip

condition

carry

carry

carry

carry

carry

borrow

borrow

borrow

reg = 0

rp1 = 00H

(HL) = 0

(mem) = 0

reg = FH

rp' = FFH

Address-

ing area

*4

*5

*1

*4

*5

*1

*1

*1

*1

*1

*1

*1

*1

*1

*3

Operation

CY ← (fmem.bit)

CY ← (pmem 7-2 + L 3-2.bit(L1-0))

CY ← (H + mem3-0.bit)

(fmem.bit) ← CY

(pmem7-2 + L3-2.bit(L1-0)) ← CY

(H + mem3-0.bit) ← CY

A ← A + n4

XA ← XA + n8

A ← A + (HL)

XA ← XA + rp'

rp'1 ← rp'1 + XA

A, CY ← A + (HL) + CY

XA, CY ← XA + rp' + CY

rp'1, CY ← rp'1 + XA + CY

A ← A - (HL)

XA ← XA - rp'

rp'1 ← rp'1 - XA

A, CY ← A - (HL) - CY

XA, CY ← XA - rp' - CY

rp'1, CY ← rp'1 - XA - CY

A ← A

∧

n4

A ← A

∧

(HL)

XA ← XA

∧

rp'

rp'1 ← rp'1

∧

XA

A ← A

∨

n4

A ← A

∨

(HL)

XA ← XA

∨

rp'

rp'1 ← rp'1

∨

XA

A ← A ∨ n4

A ← A ∨ (HL)

XA ← XA ∨ rp'

rp'1 ← rp'1 ∨ XA

CY ← A0, A3 ← CY, An-1 ← An

A ← A

reg ← reg + 1

rp1 ← rp1 + 1

(HL) ← (HL) + 1

(mem) ← (mem) + 1

reg ← reg - 1

rp' ← rp' - 1

45

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

Group

Compari-

son

Carry flag

manipula-

tion

Memory

bit

manipula-

tion

Mne-

monic

SKE

SET1

CLR1

SKT

NOT1

SET1

CLR1

SKT

SKF

SKTCLR

AND1

OR1

XOR1

Operand

reg, #n4

@HL, #n4

A, @HL

XA, @HL

A, reg

XA, rp'

CY

CY

CY

CY

mem.bit

fmem.bit

pmem.@L

@H+mem.bit

mem.bit

fmem.bit

pmem.@L

@H+mem.bit

mem.bit

fmem.bit

pmem.@L

@H+mem.bit

mem.bit

fmem.bit

pmem.@L

@H+mem.bit

fmem.bit

pmem.@L

@H+mem.bit

CY, fmem.bit

CY, pmem.@L

CY, @H+mem.bit

CY, fmem.bit

CY, pmem.@L

CY, @H+mem.bit

CY, fmem.bit

CY, pmem.@L

CY, @H+mem.bit

Bytes

2

2

1

2

2

2

1

1

1

1

2

2

2

2

2

2

2

2

2

2

2

2

2

2

2

2

2

2

2

2

2

2

2

2

2

2

2

2

Machin-

ing

cycle

2 + S

2 + S

1 + S

2 + S

2 + S

2 + S

1

1

1 + S

1

2

2

2

2

2

2

2

2

2 + S

2 + S

2 + S

2 + S

2 + S

2 + S

2 + S

2 + S

2 + S

2 + S

2 + S

2

2

2

2

2

2

2

2

2

Skip

condition

reg = n4

(HL) = n4

A = (HL)

XA = (HL)

A = reg

XA = rp'

CY = 1

(mem.bit) = 1

(fmem.bit) = 1

(pmem.@L) = 1

(@H + mem.bit) = 1

(mem.bit) = 0

(fmem.bit) = 0

(pmem.@L) = 0

(@H + mem.bit) = 0

(fmem.bit) = 1

(pmem.@L) = 1

(@H + mem.bit) = 1

Address-

ing area

*1

*1

*1

*3

*4

*5

*1

*3

*4

*5

*1

*3

*4

*5

*1

*3

*4

*5

*1

*4

*5

*1

*4

*5

*1

*4

*5

*1

*4

*5

*1

Operation

Skip if reg = n4

Skip if (HL) = n4

Skip if A = (HL)

Skip if XA = (HL)

Skip if A = reg

Skip if XA = rp'

CY ← 1

CY ← 0

Skip if CY = 1

CY ← CY

(mem.bit) ← 1

(fmem.bit) ← 1

(pmem7-2 + L3-2.bit(L1-0)) ← 1

(H + mem3-0.bit) ← 1

(mem.bit) ← 0

(fmem.bit) ← 0

(pmem7-2 + L3-2.bit(L1-0)) ← 0

(H + mem3-0.bit) ← 0

Skip if (mem.bit) = 1

Skip if (fmem.bit) = 1

Skip if (pmem7-2 + L3-2.bit(L1-0)) = 1

Skip if (H + mem3-0.bit) = 1

Skip if (mem.bit) = 0

Skip if (fmem.bit) = 0

Skip if (pmem7-2 + L3-2.bit(L1-0)) = 0

Skip if (H + mem3-0.bit) = 0

Skip if (fmem.bit) = 1 and clear

Skip if (pmem

7-2

+ L

3-2

.bit(L

1-0

)) = 1 and clear

Skip if (H + mem

3-0

.bit) = 1 and clear

CY ←CY ∧ (fmem.bit)

CY ←CY

∧

(pmem

7-2

+ L

3-2

.bit(L

1-0

))

CY ←CY ∧ (H + mem3-0.bit)

CY ←CY ∨ (fmem.bit)

CY ←CY

∨

(pmem

7-2

+ L

3-2

.bit(L

1-0

))

CY ←CY ∨ (H + mem3-0.bit)

CY ←CY ∨ (fmem.bit)

CY ←CY

∨

(pmem

7-2

+ L

3-2

.bit(L

1-0

))

CY ←CY ∨ (H + mem3-0.bit)

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

46

Group

Branch

Mne-

monic

BRNote

Operand

addr

addr1

!addr

$addr

$addr1

Skip

condition

Address-

ing area

*6

*11

*6

*7

Note The shaded portion is supported in Mk ΙΙ mode only. The other portions are supported in Mk Ι mode only.

Bytes

-

-

3

1

1

Machin-

ing

cycle

-

-

3

2

2

Operation

•

µ

PD750104

PC11-0 ← addr

The assembler selects the most

adequate instruction from BR !addr,

BRCB !caddr, or BR $addr.

•

µ

PD750106, 750108

PC12-0 ← addr

The assembler selects the most

adequate instruction from BR !addr,

BRCB !caddr, or BR $addr.

•

µ

PD750104

PC11-0 ← addr1

The assembler selects the most

adequate instruction from

instructions below.

• BR !addr

• BRA !addr1

• BRCB !caddr

• BR $addr1

•

µ

PD750106, 750108

PC12-0 ← addr1

The assembler selects the most

adequate instruction from

instructions below.

• BR !addr

• BRA !addr1

• BRCB !caddr

• BR $addr1

•

µ

PD750104

PC11-0 ← addr

•

µ

PD750106, 750108

PC12-0 ← addr

•

µ

PD750104

PC11-0 ← addr

•

µ

PD750106, 750108

PC12-0 ← addr

•

µ

PD750104

PC11-0 ← addr1

•

µ

PD750106, 750108

PC12-0 ← addr1

47

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

Group

Branch

Subrou-

tine stack

control

Mne-

monic

BR

BRA

Note 3

BRCB

CALLA

Note 3

Operand

PCDE

PCXA

BCDE

BCXA

!addr1

!caddr

!addr1

Bytes

2

2

2

2

3

2

3

Machin-

ing

cycle

3

3

3

3

3

2

3

Skip

condition

Address-

ing area

*6

*6

*11

*8

*11

Operation

•

µ

PD750104

PC11-0 ← PC11-8 + DE

•

µ

PD750106, 750108

PC12-0 ← PC12-8 + DE

•

µ

PD750104

PC11-0 ← PC11-8 + XA

•

µ

PD750106, 750108

PC12-0 ← PC12-8 + XA

•

µ

PD750104

PC11-0 ← BCDENote 1

•

µ

PD750106, 750108

PC12-0 ← BCDENote 2

•

µ

PD750104

PC11-0 ← BCXANote 1

•

µ

PD750106, 750108

PC12-0 ← BCXANote 2

•

µ

PD750104

PC11-0 ← addr1

•

µ

PD750106, 750108

PC12-0 ← addr1

•

µ

PD750104

PC11-0 ← caddr11-0

•

µ

PD750106, 750108

PC12-0 ← PC12 + caddr11-0

•

µ

PD750104

(SP - 2) ← ×, ×, MBE, RBE

(SP - 6) (SP - 3) (SP - 4) ← PC11-0

(SP - 5) ← 0, 0, 0, 0

PC11-0 ← addr1, SP ← SP - 6

•

µ

PD750106, 750108

(SP - 2) ← ×, ×, MBE, RBE

(SP - 6) (SP - 3) (SP - 4) ← PC11-0

(SP - 5) ← 0, 0, 0, PC12

PC12-0 ← addr1, SP ← SP - 6

Notes 1. Set register B to 0.

2. Only the LSB is valid in register B.

3. The shaded portion is supported in Mk ΙΙ mode only. The other portions are supported in Mk Ι mode

only.

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

48

Group

Subrou-

tine stack

control

Mne-

monic

CALL

Note

CALLF

Note

Operand

!addr

!faddr

Bytes

3

2

Machin-

ing

cycle

3

4

2

3

Skip

condition

Address-

ing area

*6

*9

Operation

•

µ

PD750104

(SP - 3) ← MBE, RBE, 0, 0

(SP - 4) (SP - 1) (SP - 2) ← PC11-0

PC11-0 ← addr, SP ← SP - 4

•

µ

PD750106, 750108

(SP - 3) ← MBE, RBE, 0, PC12

(SP - 4) (SP - 1) (SP - 2) ← PC11-0

PC12-0 ← addr, SP ← SP - 4

•

µ

PD750104

(SP - 2) ← ×, ×, MBE, RBE

(SP - 6) (SP - 3) (SP - 4) ← PC11-0

(SP - 5) ← 0, 0, 0, 0

PC11-0 ← addr, SP ← SP - 6

•

µ

PD750106, 750108

(SP - 2) ← ×, ×, MBE, RBE

(SP - 6) (SP - 3) (SP - 4) ← PC11-0

(SP - 5) ← 0, 0, 0, PC12

PC12-0 ← addr, SP ← SP - 6

•

µ

PD750104

(SP - 3) ← MBE, RBE, 0, 0

(SP - 4) (SP - 1) (SP - 2) ← PC11-0

PC11-0 ← 0 + faddr, SP ← SP - 4

•

µ

PD750106, 750108

(SP - 3) ← MBE, RBE, 0, PC12

(SP - 4) (SP - 1) (SP - 2) ← PC11-0

PC12-0 ← 00 + faddr, SP ← SP - 4

•

µ

PD750104

(SP - 2) ← ×, ×, MBE, RBE

(SP - 6) (SP - 3) (SP - 4) ← PC11-0

(SP - 5) ← 0, 0, 0, 0

PC11-0 ← 0 + faddr, SP ← SP - 6

•

µ

PD750106, 750108

(SP - 2) ← ×, ×, MBE, RBE

(SP - 6) (SP - 3) (SP - 4) ← PC11-0

(SP - 5) ← 0, 0, 0, PC12

PC12-0 ← 00 + faddr, SP ← SP - 6

Note The shaded portion is supported in Mk ΙΙ mode only. The other portions are supported in Mk Ι mode only.

49

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

Group

Subrou-

tine stack

control

Mne-

monic

RET

Note

RETSNote

Operand Bytes

1

1

Machin-

ing

cycle

3

3

3 + S

3 + S

Skip

condition

Uncondition

Address-

ing area

Operation

•

µ

PD750104

PC11-0 ← (SP) (SP + 3) (SP + 2)

MBE, RBE, 0, 0 ← (SP + 1), SP ← SP + 4

•

µ

PD750106, 750108

PC11-0 ← (SP) (SP + 3) (SP + 2)

MBE, RBE, 0, PC12 ← (SP + 1)

SP ← SP + 4

•

µ

PD750104

×, ×, MBE, RBE ← (SP + 4)

0, 0, 0, 0 ← (SP + 1)

PC11-0 ← (SP) (SP + 3) (SP + 2)

SP ← SP + 6

•

µ

PD750106, 750108

×, ×, MBE, RBE ← (SP + 4)

MBE, 0, 0, PC 12 ← (SP + 1)

PC11-0 ← (SP) (SP + 3) (SP + 2)

SP ← SP + 6

•

µ

PD750104

MBE, RBE, 0, 0 ← (SP + 1)

PC11-0 ← (SP) (SP + 3) (SP + 2)

SP ← SP + 4

then skip unconditionally

•

µ

PD750106, 750108

MBE, RBE, 0 ← PC12 ← (SP + 1)

PC11-0 ← (SP) (SP + 3) (SP + 2)

SP ← SP + 4

then skip unconditionally

•

µ

PD750104

0, 0, 0, 0 ← (SP + 1)

PC11-0 ← (SP) (SP + 3) (SP + 2)

×, ×, MBE, RBE ← (SP + 4)

SP ← SP + 6

then skip unconditionally

•

µ

PD750106, 750108

0, 0, 0, PC12 ← (SP + 1)

PC11-0 ← (SP) (SP + 3) (SP + 2)

×, ×, MBE, RBE ← (SP + 4)

SP ← SP + 4

then skip unconditionally

Note The shaded portion is supported in Mk ΙΙ mode only. The other portions are supported in Mk Ι mode only.

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

50

Group

Subrou-

tine stack

control

Interrupt

control

Input/

output

CPU

control

Mne-

monic

RETI

Note 1

PUSH

POP

EI

DI

INNote 2

OUT

Note 2

HALT

STOP

NOP

Operand

rp

BS

rp

BS

IE×××

IE×××

A, PORTn

XA, PORTn

PORTn, A

PORTn, XA

Bytes

1

1

2

1

2

2

2

2

2

2

2

2

2

2

2

1

Machin-

ing

cycle

3

1

2

1

2

2

2

2

2

2

2

2

2

2

2

1

Skip

condition

Address-

ing area

Operation

•

µ

PD750104

MBE, RBE, 0, 0 ← (SP + 1)

PC11-0 ← (SP) (SP + 3) (SP + 2)

PSW ← (SP + 4) (SP + 5), SP ← SP + 6

•

µ

PD750106, 750108

MBE, RBE, 0, PC12 ← (SP + 1)

PC11-0 ← (SP) (SP + 3) (SP + 2)

PSW ← (SP + 4) (SP + 5), SP ← SP + 6

•

µ

PD750104

0, 0, 0, 0 ← (SP + 1)

PC11-0 ← (SP) (SP + 3) (SP + 2)

PSW ← (SP + 4) (SP + 5), SP ← SP + 6

•

µ

PD750106, 750108

0, 0, 0, PC12 ← (SP + 1)

PC11-0 ← (SP) (SP + 3) (SP + 2)

PSW ← (SP + 4) (SP + 5), SP ← SP + 6

(SP - 1)(SP - 2) ← rp, SP ← SP - 2

(SP - 1) ← MBS, (SP - 2) ← RBS,

SP ← SP - 2

rp ← (SP + 1)(SP), SP ← SP + 2

MBS ← (SP + 1), RBS ← (SP),

SP ← SP + 2

IME (IPS.3) ← 1

IE××× ← 1

IME (IPS.3) ← 0

IE××× ← 0

A ← PORTn (n = 0 - 8)

XA ← PORTn+1,PORTn (n = 4, 6)

PORTn ← A (n = 2 - 8)

PORTn+1,PORTn ← XA (n = 4, 6)

Set HALT Mode (PCC.2 ← 1)

Set STOP Mode (PCC.3 ← 1)

No Operation

Notes 1. The shaded portion is supported in Mk ΙΙ mode only. The other portions are supported in Mk Ι mode

only.

2. When executing the IN/OUT instruction, MBE must be set to 0 or MBE and MBS must be set to 1 and

15, respectively.

51

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

Group

Special

Mne-

monic

SEL

GETI

Notes 1, 2

Operand

RBn

MBn

taddr

Bytes

2

2

1

Machin-

ing

cycle

2

2

3

3

4

3

Skip

condition

Depends

on the

referenced

instruction.

Depends

on the

referenced

instruction.

Depends

on the

referenced

instruction.

Address-

ing area

*10

*10

Operation

RBS ← n (n = 0 - 3)

MBS ← n (n = 0, 1, 15)

•

µ

PD750104

When the TBR instruction is used

PC11-0 ← (taddr)3-0 + (taddr + 1)

When the TCALL instruction is used

(SP - 4) (SP - 1) (SP - 2) ← PC11-0

(SP - 3) ← MBE, RBE, 0, 0

PC11-0 ← (taddr)3-0 + (taddr + 1)

SP ← SP - 4

When an instruction other than the

TBR and TCALL instructions is used

Execution of (taddr)(taddr + 1)

instruction

•

µ

PD750106, 750108

When the TBR instruction is used

PC12-0 ← (taddr)4-0 + (taddr + 1)

When the TCALL instruction is used

(SP - 4) (SP - 1) (SP - 2) ← PC11-0

(SP - 3) ← MBE, RBE, 0, PC12

PC12-0 ← (taddr)4-0 + (taddr + 1)

SP ← SP - 4

When an instruction other than the

TBR and TCALL instructions is used

Execution of (taddr)(taddr + 1)

instruction

•

µ

PD750104

When the TBR instruction is used

PC11-0 ← (taddr)3-0 + (taddr + 1)

When the TCALL instruction is used

(SP - 6) (SP - 3) (SP - 4) ← PC11-0

(SP - 5) ← 0, 0, 0, 0

(SP - 2) ← ×, ×, MBE, RBE

PC11-0 ← (taddr)3-0 + (taddr + 1)

SP ← SP - 6

When an instruction other than the TBR

and TCALL instructions is used

Execution of (taddr)(taddr + 1)

instruction

Notes 1. The shaded portion is supported in Mk ΙΙ mode only. The other portions are supported in Mk Ι mode

only.

2. TBR and TCALL instructions are assembler pseudo instructions to define tables used for GETI

instructions.

........................................................

........................................................

........................................................

........................................................ .....................

.....................

.......................................................................

....................................................................... .....................

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

52

Group

Special

Mne-

monic

GETI

Notes 1, 2

Operand

taddr

Bytes

1

Machin-

ing

cycle

3

4

3

Skip

condition

Depends

on the

referenced

instruction.

Address-

ing area

*10

Operation

•

µ

PD750106, 750108

When the TBR instruction is used

PC12-0 ← (taddr)4-0 + (taddr + 1)

When the TCALL instruction is used

(SP - 6) (SP - 3) (SP - 4) ← PC11-0

(SP - 5) ← 0, 0, 0, PC12

(SP - 2) ← ×, ×, MBE, RBE

PC12-0 ← (taddr)4-0 + (taddr + 1)

SP ← SP - 6

When an instruction other than the TBR

and TCALL instructions is used

Execution of (taddr)(taddr + 1)

instruction

Notes 1. The shaded portion is supported in Mk ΙΙ mode only.

2. TBR and TCALL instructions are assembler pseudo instructions to define tables used for GETI

instructions.

.......................................................................

....................................................................... .....................

53

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

12. ELECTRICAL CHARACTERISTICS

ABSOLUTE MAXIMUM RATINGS (TA = 25 °C)

Caution Absolute maximum ratings are rated values beyond which physical damage will be caused to the

product; if the rated value of any of the parameters in the above table is exceeded, even

momentarily, the quality of the product may deteriorate. Always use the product within its rated

values.

CAPACITANCE (TA = 25 °C, VDD = 0 V)

Unit

V

V

V

V

V

mA

mA

mA

mA

°C

°C

Rated value

-0.3 to +7.0

-0.3 to VDD + 0.3

-0.3 to VDD + 0.3

-0.3 to +14.0

-0.3 to VDD + 0.3

-10

-30

30

220

-40 to +85

-65 to +150

Conditions

Other than ports 4 and 5

Ports With a built-in pull-up resistor

4 and 5 With N-ch open drain

Each pin

Total of all pins

Each pin

Total of all pins

Parameter

Supply voltage

Input voltage

Output voltage

High-level output current

Low-level output current

Operating ambient temperature

Storage temperature

Symbol

VDD

VI1

VI2

VO

IOH

IOL

TA

Tstg

Parameter

Input capacitance

Output capacitance

I/O capacitance

Symbol

CIN

COUT

CIO

MAX.

15

15

15

Unit

pF

pF

pF

TYP.Conditions

f = 1 MHz

0 V for pins other than pins to be

measured

MIN.

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

54

Recommended

constant

CHARACTERISTICS OF THE MAIN SYSTEM CLOCK OSCILLATOR (TA = -40 to +85 °C, V DD = 1.8 to 5.5 V)

Note The oscillator frequency indicates only the oscillator characteristics. See AC characteristics for the

instruction execution time and oscillator frequency characteristics.

Caution When the main system clock oscillator is used, conform to the following guidelines when wiring

at the portions surrounded by dotted lines in the figures above to eliminate the influence of the

wiring capacity.

• The wiring must be as short as possible.

• Other signal lines must not run in these areas.

• Any line carrying a high fluctuating current must be kept away as far as possible.

• The grounding point of the capacitor of the oscillator must have the same potential as that

of VSS.

• It must not be grounded to ground patterns carrying a large current.

• No signal must be taken from the oscillator.

TYP.Parameter

Oscillator frequency (fCC)Note

MIN.

0.4

MAX.

2.0

Unit

MHz

ConditionsResonator

RC

oscillator CL1 CL2

55

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

Recommended

constant

Resonator Parameter

kHz

s

s

kHz

µ

s

Unit

35

2

10

100

15

32.768

1.0

32

32

5

Conditions

Crystal

External

clock

Oscillator frequency (fXT)Note 1

Oscillation settling timeNote 2

XT1 input frequency (fXT)Note 1

XT1 input high/low level width

(tXTH, tXTL)

CHARACTERISTICS OF THE SUBSYSTEM CLOCK OSCILLATOR (TA = -40 to +85 °C, VDD = 1.8 to 5.5 V)

Notes 1. The oscillator frequency and input frequency indicate only the oscillator characteristics. See the item

of AC characteristics for the instruction execution time.

2. The oscillation settling time means the time required for the oscillation to settle after VDD is applied.

Caution When the subsystem clock oscillator is used, conform to the following guidelines when wiring

at the portions of surrounded by dotted lines in the figures above to eliminate the influence of

the wiring capacity.

• The wiring must be as short as possible.

• Other signal lines must not run in these areas.

• Any line carrying a high fluctuating current must be kept away as far as possible.

• The grounding point of the capacitor of the oscillator must have the same potential as that of

VSS

• It must not be grounded to ground patterns carrying a large current.

• No signal must be taken from the oscillator.

When the subsystem clock is used, pay special attention to its wiring; the subsystem clock

oscillator has low amplification to minimize current consumption and is more likely to malfunc-

tion due to noise than the main system clock oscillator.

MIN. TYP. MAX.

C3 C4

R

XT1 XT2

XT1 XT2

VDD = 4.5 to 5.5 V

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

56

DC CHARACTERISTICS (TA = -40 to +85 °C, VDD = 1.8 to 5.5 V)

Parameter Symbol

mA

mA

V

V

V

V

V

V

V

V

V

V

V

V

V

V

V

V

V

V

µ

A

µ

A

µ

A

µ

A

µ

A

µ

A

µ

A

µ

A

µ

A

µ

A

µ

A

µ

A

kΩ

kΩ

IOL

VIH1

VIH2

VIH3

VIH4

VIL1

VIL2

VIL3

VOH

VOL1

VOL2

ILIH1

ILIH2

ILIH3

ILIL1

ILIL2

ILIL3

ILOH1

ILOH2

ILOL

RL1

RL2

0.7VDD

0.9VDD

0.8VDD

0.9VDD

0.7VDD

0.9VDD

0.7VDD

0.9VDD

VDD - 0.1

0

0

0

0

0

VDD - 0.5

50

15

SCK, SO,

and ports

2 to 8

VDD = 5.0 V

VDD = 3.0 V

0.2

-10

-3

100

30

15

150

VDD

VDD

VDD

VDD

VDD

VDD

13

13

VDD

0.3VDD

0.1VDD

0.2VDD

0.1VDD

0.1

2.0

0.4

0.2VDD

3

20

20

-3

-20

-3

-30

-27

-8

3

20

-3

200

60

MIN. TYP. MAX. Unit

Low-level output

current

High-level input

voltage

Low-level input

voltage

High-level output voltage

Low-level output

voltage

High-level input

leakage current

Low-level input

leakage current

High-level output

leakage current

Low-level output

leakage current

Built-in pull-up

resistor

Ports 4 and 5 (With N-ch

open drain)

When the input instruction

is executed

With a Built-in pull-up

resistor

With N-ch open drain

Each pin

Total of all pins

Ports 2, 3, and 8

Ports 0, 1, 6, and 7 and RESET

Ports 4 and

5

XT1

Ports 2 to 5, and 8

Ports 0, 1, 6, and 7 and RESET

XT1

SCK, SO, and ports 2, 3, and 6 to 8 IOH = -1.0 mA

SB0, SB1 N-ch open drain Pull-up resistor ≥ 1 kΩ

VIN = VDD Other than XT1

XT1

VIN = 13 V Ports 4 and 5 (With N-ch open drain)

VIN = 0 V Other than XT1 and ports 4 and 5

XT1

Ports 4 and 5 (With N-ch open drain)

At other than input instruction execution

VOUT = VDD SCK, SO/SB0, SB1, and ports 2, 3, and 6

to 8

Ports 4 and 5 (With a built-in pull-up resistor)

VOUT = 13 VPorts 4 and 5 (With N-ch open drain)

VOUT = 0 V

VIN = 0 V Ports 0 to 3 and 6 to 8 (except P00 pin)

Ports 4 and 5 (mask option)

Conditions

2.7 V ≤ VDD ≤ 5.5 V

1.8 V ≤ VDD < 2.7 V

2.7 V ≤ VDD ≤ 5.5 V

1.8 V ≤ VDD < 2.7 V

2.7 V ≤ VDD ≤ 5.5 V

1.8 V ≤ VDD < 2.7 V

2.7 V ≤ VDD ≤ 5.5 V

1.8 V ≤ VDD < 2.7 V

2.7 V ≤ VDD ≤ 5.5 V

1.8 V ≤ VDD < 2.7 V

2.7 V ≤ VDD ≤ 5.5 V

1.8 V ≤ VDD < 2.7 V

IOL = 15 mA, VDD = 5.0 V ± 10%

IOL = 1.6 mA

57

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

Parameter

Power supply

currentNote 1

Conditions

Low-current-

drain

modeNote 7

DC CHARACTERISTICS (TA = -40 to +85 °C, VDD = 1.8 to 5.5 V)

Notes 1. This current excludes the current which flows through the built-in pull-up resistors.

2. This value applies also when the subsystem clock oscillates.

3. Value when the processor clock control register (PCC) is set to 0011 and the

µ

PD750108 is operated

in the high-speed mode.

4. Value when the PCC is set to 0000 and the

µ

PD750108 is operated in the low-speed mode.

5. This value applies when the system clock control register (SCC) is set to 1001 to stop the main system

clock pulse and to start the subsystem clock pulse.

6. Mode when the sub-oscillator control register (SOS) is set to 0000.

7. Mode when the SOS is set to 0010.

8. This value applies when the SOS is set to 00×1 and the sub-oscillator feedback resistor is not used (×

= don’t care).

Symbol

IDD1

IDD2

IDD3

IDD4

IDD5

Unit

mA

µ

A

µ

A

µ

A

µ

A

µ

A

µ

A

µ

A

µ

A

µ

A

µ

A

µ

A

µ

A

µ

A

µ

A

µ

A

µ

A

µ

A

µ

A

VDD = 5.0 V ± 10%Note 3

VDD = 3.0 V ± 10%Note 4

HALT mode

Low-voltage

modeNote 6

HALT mode Low-vol-

tage

modeNote 6

VDD = 5.0 V ± 10%

VDD = 3.0 V ± 10%

Low-cur-

rent-drain

modeNote 7

XT1 =

0 VNote 8

STOP

mode

VDD = 3.0 V ± 10%

VDD = 3.0 V,

TA = -40 to +50 °C

VDD = 2.0 V ± 10%

VDD = 3.0 V, T A = 25 °C

VDD = 3.0 V ± 10%

VDD = 3.0 V,

TA = -40 to +50 °C

VDD = 3.0 V, T A = 25 °C

TA = 25 °C

VDD = 5.0 V ± 10%

VDD = 3.0 V ± 10%

VDD = 3.0 V ± 10%

VDD = 2.0 V ± 10%

VDD = 3.0 V, TA = 25 °C

VDD = 3.0 V ± 10%

VDD = 3.0 V, TA = 25 °C

1.0

MHzNote 2

RC

oscillation

R = 22 kΩ,

C = 22 pF

32.768

kHzNote 5

crystal

oscillation

MIN. TYP.

0.65

180

370

170

11.0

5.5

11.0

8.0

8.0

5.0

5.0

2.5

5.0

4.0

4.0

4.0

0.05

0.02

0.02

MAX.

1.6

360

920

340

40.0

18.0

18.0

24.0

14.0

30.0

12.0

10.0

10.0

15.0

8.0

7.0

5.0

2.5

0.2

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

58

AC CHARACTERISTICS (TA = -40 to +85 °C, V DD = 1.8 to 5.5 V)

CPU clock cycle

timeNote 1 (minimum

instruction execution time

= 1 machine cycle)

TI0 input frequency

TI0 input high/low level

width

Interrupt input high/low

level width

RESET low level width

RC oscillator frequency

IM02 = 0

IM02 = 1

Notes 1. When the main system clock is used, the

cycle time of the CPU clock (

Φ

) (minimum

instruction execution time) depends on the

time constants of connected resistors (R)

and capacitors (C) and the processor clock

control register (PCC).

When the subsystem clock is used, the cycle

time of the CPU clock (

Φ

) (minimum instruc-

tion execution time) depends on the fre-

quency of the connected resonator (and ex-

ternal clock), the system clock control regis-

ter (SCC), and the processor clock control

register (PCC).

The figure on the right side shows the cycle

time tCY characteristics for the supply voltage

VDD during main system clock operation.

2. This value becomes 2tCY or 128/fCC accord-

ing to the setting of the interrupt mode reg-

ister (IM0).

tCY

fTI

tTIH,

tTIL

tINTH,

tINTL

tRSL

fCC

Conditions MIN. TYP. MAX. Unit

Operated by main system clock pulse 2.0 128

µ

s

Operated by subsystem clock pulse 114 122 125

µ

s

VDD = 2.7 to 5.5 V 0 1 MHz

0 275 kHz

VDD = 2.7 to 5.5 V 0.48

µ

s

1.8

µ

s

INT0 Note 2

µ

s

10

µ

s

INT1, INT2, and INT4 10

µ

s

KR0 to KR7 10

µ

s

10

µ

s

MHz

MHz

Parameter Symbol

VDD = 2.7 to 5.5 V

VDD = 2.7 to 5.5 V

1.00

1.00

1.30

1.30

0.90

0.55

R = 22 kΩ,

C = 22 pF

1 1.8 2 3 4 5 5.5 60

0.5

1

2

3

4

5

6

128

tCY vs. VDD

(Main system clock in operation)

Cycle time tCY [ s]

µ

Power supply voltage VDD [V]

Operation guaranteed

range

59

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

Unit

ns

ns

ns

ns

ns

ns

ns

ns

ns

ns

Parameter

SCK cycle time

SCK high/low level

width

SINote 1 setup time

(referred to SCK↑)

SINote 1 hold time

(referred to SCK↑)

Delay time from SCK↓

to SONote 1 output

SERIAL TRANSFER OPERATION

Two-wire and three-wire serial I/O modes (SCK: Internal clock output): (TA = -40 to +85 °C, VDD = 1.8 to 5.5 V)

Notes 1. In two-wire serial I/O mode, SO should be read as SB0 or SB1.

2. RL is the resistance of the SO output line load, while CL is the capacitance.

Two-wire and three-wire serial I/O modes (SCK: External clock input): (TA = -40 to +85 °C, VDD = 1.8 to 5.5 V)

Notes 1. In two-wire serial I/O mode, SO should be read as SB0 or SB1.

2. RL is the resistance of the SO output line load, while CL is the capacitance.

TYP. MAX.

300

1,000

Unit

ns

ns

ns

ns

ns

ns

ns

ns

ns

ns

MIN.

800

3,200

400

1,600

100

150

400

600

0

0

Conditions

VDD = 2.7 to 5.5 V

VDD = 2.7 to 5.5 V

VDD = 2.7 to 5.5 V

VDD = 2.7 to 5.5 V

RL = 1 kΩNote 2 VDD = 2.7 to 5.5 V

CL = 100 pF

Symbol

tKCY2

tKL2,

tKH2

tSIK2

tKSI2

tKSO2

Parameter

SCK cycle time

SCK high/low level

width

SINote 1 setup time

(referred to SCK↑)

SINote 1 hold time

(referred to SCK↑)

Delay time from SCK↓

to SONote 1 output

MIN.

1,300

3,800

tKCY1/2 - 50

tKCY1/2 - 150

150

500

400

600

0

0

Conditions

VDD = 2.7 to 5.5 V

VDD = 2.7 to 5.5 V

VDD = 2.7 to 5.5 V

VDD = 2.7 to 5.5 V

RL = 1 kΩNote 2 VDD = 2.7 to 5.5 V

CL = 100 pF

Symbol

tKCY1

tKL1,

tKH1

tSIK1

tKSI1

tKSO1

TYP. MAX.

250

1,000

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

60

SBI mode (SCK: Internal clock output (master)): (TA = -40 to +85 °C, VDD = 1.8 to 5.5 V)

Note RL is the resistance of the SB0/SB1 output line load, while CL is the capacitance.

SBI mode (SCK: External clock input (slave)): (TA = -40 to +85 °C, VDD = 1.8 to 5.5 V)

Note RL is the resistance of the SB0/SB1 output line load, while CL is the capacitance.

TYP. MAX.

250

1,000

Unit

ns

ns

ns

ns

ns

ns

ns

ns

ns

ns

ns

ns

ns

MIN.

1,300

3,800

tKCY3/2 - 50

tKCY3/2 - 150

150

500

tKCY3/2

0

0

tKCY3

tKCY3

tKCY3

tKCY3

Conditions

VDD = 2.7 to 5.5 V

VDD = 2.7 to 5.5 V

VDD = 2.7 to 5.5 V

RL = 1 kΩNote VDD = 2.7 to 5.5 V

CL = 100 pF

Symbol

tKCY3

tKL3,

tKH3

tSIK3

tKSI3

tKSO3

tKSB

tSBK

tSBL

tSBH

Parameter

SCK cycle time

SCK high/low level

width

SB0/SB1 setup time

(referred to SCK↑)

SB0/SB1 hold time

(referred to SCK↑)

Delay time from SCK↓

to SB0/SB1 output

From SCK↑ to SB0/SB1↓

From SB0/SB1↓ to SCK↓

SB0/SB1 low level width

SB0/SB1 high level

width

TYP. MAX.

300

1,000

Unit

ns

ns

ns

ns

ns

ns

ns

ns

ns

ns

ns

ns

ns

MIN.

800

3,200

400

1,600

100

150

tKCY4/2

0

0

tKCY4

tKCY4

tKCY4

tKCY4

Conditions

VDD = 2.7 to 5.5 V

VDD = 2.7 to 5.5 V

VDD = 2.7 to 5.5 V

RL = 1 kΩNote VDD = 2.7 to 5.5 V

CL = 100 pF

Symbol

tKCY4

tKL4,

tKH4

tSIK4

tKSI4

tKSO4

tKSB

tSBK

tSBL

tSBH

Parameter

SCK cycle time

SCK high/low level

width

SB0/SB1 setup time

(referred to SCK↑)

SB0/SB1 hold time

(referred to SCK↑)

Delay time from SCK↓

to SB0/SB1 output

From SCK↑ to SB0/SB1↓

From SB0/SB1↓ to SCK↓

SB0/SB1 low level width

SB0/SB1 high level

width

61

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

AC timing measurement points (excluding XT1 input)

Clock timing

TI0 timing

tXTL tXTH

1/fXT

XT1 input VDD - 0.1 V

0.1 V

tTIL tTIH

1/fTI

TI0

VIL (MAX.)

VIH (MIN.)

VIL (MAX.)

VIH (MIN.)

VOL (MAX.)

VOH (MIN.)

VOL (MAX.)

VOH (MIN.)

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

62

Serial transfer timing

Three-wire serial I/O mode:

Two-wire serial I/O mode:

Input data

Output data

SCK

SI

SO

tKCY1

tKCY2

tSIK1

tSIK2 tKSI1

tKSI2

tKL1

tKL2 tKH1

tKH2

tKSO1

tKSO2

tKCY1

tKCY2

tKL1

tKL2 tKH1

tKH2

tSIK1

tSIK2 tKSI1

tKSI2

tKSO1

tKSO2

SCK

SB0 and SB1

63

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

Serial transfer timing

Bus release signal transfer:

Command signal transfer:

Interrupt input timing

RESET input timing

SCK

SB0 and SB1

t

KSB

t

SBL

t

SBH

t

SBK

t

KCY3

t

KCY4

t

KSO3

t

KSO4

t

KL3

t

KL4

t

KH3

t

KH4

t

KSI3

t

KSI4

t

SIK3

t

SIK4

SCK

SB0 and SB1

tKSB

tKL3

tKL4

tKCY3

tKCY4

tKSO3

tKSO4

tSBK

tKH3

tKH4

tSIK3

tSIK4 tKSI3

tKSI4

INT0, INT1, INT2,

and INT4

KR0 - KR7

tINTL tINTH

RESET

tRSL

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

64

Parameter Symbol

Release signal setting time

Oscillation settling timeNote 1

tSREL

tWAIT Release by RESET

Release by interrupt request

Conditions

DATA HOLD CHARACTERISTICS BY LOW SUPPLY VOLTAGE IN DATA MEMORY STOP MODE

(TA = -40 to +85 °C)

Notes 1. CPU operation stop time for preventing unstable operation at the beginning of oscillation.

2. Select either 512/fCC or no wait with the mask option.

Data hold timing (STOP mode release by RESET)

Data hold timing (standby release signal: STOP mode release by interrupt signal)

0

MIN. TYP. MAX. Unit

µ

s

µ

s

µ

s

56/fCC

Note 2

RESET

VDD tSREL

tWAIT

Internal reset operation

HALT mode Operation

mode

STOP instruction execution

Data hold mode

STOP mode

Standby release signal

(Interrupt request)

VDD tSREL

tWAIT

HALT mode Operation

mode

STOP instruction execution

Data hold mode

STOP mode

65

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

13. CHARACTERISTIC CURVE (REFERENCE VALUES)

CL1 CL2 XT1 XT2

RC

oscillation

22 kΩCrystal

32.768 kHz 220 kΩ

22 pF 33 pF 33 pF

0

0.001

0.005

0.01

0.05

Supply current I

DD

(mA)

0.1

0.5

1.0

5.0

10

1234

Suppl

y

volta

g

e V

DD

(

V

)

5678

I

DD

vs. V

DD

(When the main system clock is operating at 1.0 MHz with an RC oscillation)

(T

A

= 25 ˚C)

PCC = 0011

PCC = 0010

PCC = 0001

PCC = 0000

Main system clock HALT

mode + 32 kHz oscillation

Subsystem clock operating

mode (SOS.1 = 0)

Subsystem clock HALT mode

(SOS.1 = 0) and main system

clock STOP mode + 32 kHz

oscillation (SOS.1 =0)

Subsystem clock HALT mode

(SOS.1 = 1) and main system

clock STOP mode + 32 kHz

oscillation (SOS.1 =1)

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

66

14. EXAMPLES OF RC OSCILLATOR FREQUENCY CHARACTERISTICS (REFERENCE VALUES)

0

0.5

1.0

Main system clock frequency fCC (MHz)

Sample A

Sample B

Sample C

2.0

1234

Supply voltage VDD (V) 5678

CL1 CL2

22 kΩ

22 pF

fCC vs. VDD (RC oscillation , R = 22 kΩ, C = 22 pF)

(TA = -40 ˚C)

0

0.5

1.0

Main system clock frequency f

CC

(MHz)

Sample A

Sample B

Sample C

2.0

1234

Supply voltage V

DD

(V) 5678

CL1 CL2

22 kΩ

22 pF

(T

A

= 25 ˚C)

0

0.5

1.0

Main system clock frequency fCC (MHz)

Sample A

Sample B

Sample C

2.0

1234

Supply voltage VDD (V) 5678

CL1 CL2

22 kΩ

22 pF

(TA = 85 ˚C)

67

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

-60

0.5

1.0

Main system clock frequency fCC (MHz)

2.0

-40 -20 0 +20

Operatin

g

ambient temperature TA

(

˚C

)

+40 +60 +80 +100

CL1 CL2

22 kΩ

22 pF

(Sample A)

fCC vs. TA (RC oscillation, R = 22 kΩ, C = 22 pF)

VDD = 5.0 V

VDD = 3.0 V

VDD = 2.2 V

VDD = 1.8 V

-60

0.5

1.0

Main system clock frequency f

CC

(MHz)

2.0

-40 -20 0 +20

Operating ambient temperature T

A

(˚C)

+40 +60 +80 +100

CL1 CL2

22 kΩ

22 pF

(Sample B)

V

DD

= 5.0 V

V

DD

= 3.0 V

V

DD

= 2.2 V

V

DD

= 1.8 V

-60

0.5

1.0

Main system clock frequency fCC (MHz)

2.0

-40 -20 0 +20

Operating ambient temperature TA (˚C)

+40 +60 +80 +100

CL1 CL2

22 kΩ

22 pF

(Sample C)

VDD = 5.0 V

VDD = 3.0 V

VDD = 2.2 V

VDD = 1.8 V

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

68

15. PACKAGE DRAWINGS

44 PIN PLASTIC QFP ( 10)

S44GB-80-3BS

ITEM MILLIMETERS INCHES

N

P

Q 0.125±0.075

0.10

2.7 0.004

0.106

0.005±0.003

NOTE

Each lead centerline is located within 0.16 mm (0.007 inch) of

its true position (T.P.) at maximum material condition.

J

I

H

N

A 13.2±0.2 0.520+0.008

–0.009

B 10.0±0.2 0.394+0.008

–0.009

C 10.0±0.2 0.394+0.008

–0.009

D 13.2±0.2 0.520+0.008

–0.009

F

G

H

1.0

0.37

1.0 0.039

0.039

0.015+0.003

–0.004

I

J

K

0.8 (T.P.)

1.6±0.2

0.16 0.007

0.031 (T.P.)

0.063±0.008

L 0.8±0.2 0.031+0.009

–0.008

M 0.17 0.007+0.002

–0.003

S 3.0 MAX. 0.119 MAX.

R3°3°

+7°

–3°

+0.08

–0.07

+0.06

–0.05

+7°

–3°

detail of lead end

Q

F

G

K

M

L

R

M

33

34 22

44

112

11

23

S

P

CD

A

B

69

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

42PIN PLASTIC SHRINK DIP (600 mil)

ITEM MILLIMETERS INCHES

A

B

C

F

G

H

I

J

K

39.13 MAX.

1.778 (T.P.)

3.2±0.3

0.51 MIN.

4.31 MAX.

1.78 MAX.

0.17

15.24 (T.P.)

5.08 MAX.

N

0.9 MIN.

R

1.541 MAX.

0.070 MAX.

0.035 MIN.

0.126±0.012

0.020 MIN.

0.170 MAX.

0.200 MAX.

0.600 (T.P.)

0.007

0.070 (T.P.)

P42C-70-600A-1

A

C

D

G

NOTES

1) Each lead centerline is located within 0.17 mm (0.007 inch) of

its true position (T.P.) at maximum material condition.

D 0.50±0.10 0.020

M 0.25 0.010

+0.10

–0.05

0~15°0~15°

+0.004

–0.003

+0.004

–0.005

M

K

N

L 13.2 0.520

2) Item "K" to center of leads when formed parallel.

42

1

22

21

L

MR

B

F

H

J

I

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

70

16. RECOMMENDED SOLDERING CONDITIONS

The

µ

PD750104,

µ

PD750106, and

µ

PD750108 should be soldered and mounted under the conditions recom-

mended in the table below.

For detail of recommended soldering conditions, refer to the information document SMD Surface Mount

Technology Manual (C10535E).

For soldering methods and conditions other than those recommended below, contact our sales personnel.

Table 16-1. Surface Mounting Type Soldering Conditions

µ

PD750104GB-×××-3BS-MTX : 44-pin plastic QFP (10 × 10 mm, 0.8-mm pitch)

µ

PD750106GB-×××-3BS-MTX : 44-pin plastic QFP (10 × 10 mm, 0.8-mm pitch)

µ

PD750108GB-×××-3BS-MTX : 44-pin plastic QFP (10 × 10 mm, 0.8-mm pitch)

µ

PD750104GB(A)-×××-3BS-MTX : 44-pin plastic QFP (10 × 10 mm, 0.8-mm pitch)

µ

PD750106GB(A)-×××-3BS-MTX : 44-pin plastic QFP (10 × 10 mm, 0.8-mm pitch)

µ

PD750108GB(A)-×××-3BS-MTX : 44-pin plastic QFP (10 × 10 mm, 0.8-mm pitch)

Caution Use of more than one soldering method should be avoided (except for partial heating method).

Table 16-2. Insertion Type Soldering Conditions

µ

PD750104CU-××× : 42-pin plastic shrink DIP (600 mil, 1.778-mm pitch)

µ

PD750106CU-××× : 42-pin plastic shrink DIP (600 mil, 1.778-mm pitch)

µ

PD750108CU-××× : 42-pin plastic shrink DIP (600 mil, 1.778-mm pitch)

µ

PD750104CU(A)-×××: 42-pin plastic shrink DIP (600 mil, 1.778-mm pitch)

µ

PD750106CU(A)-×××: 42-pin plastic shrink DIP (600 mil, 1.778-mm pitch)

µ

PD750108CU(A)-×××: 42-pin plastic shrink DIP (600 mil, 1.778-mm pitch)

Package peak temperature: 235 °C

Duration: 30 seconds max. (at 210 °C or above)

Maximum allowable number of reflow processes: 3

Package peak temperature: 215 °C

Duration: 40 seconds max. (at 200 °C or above)

Maximum allowable number of reflow processes: 3

Solder bath temperature: 260 °C max.

Duration: 10 seconds max.

Number of times: 1

Preliminary heat temperature: 120 °C max. (package surface temperature)

Terminal temperature: 300 °C max.

Duration: 3 seconds max. (per device side)

IR35-00-3

VP15-00-3

WS60-00-1

-

Infrared reflow

VPS

Wave

soldering

Partial heating

method

Soldering

method Soldering conditions

Soldering method Soldering conditions

Wave soldering (terminal only)

Partial heating method

Solder bath temperature: 260 °C max., Duration: 10 seconds max.

Terminal temperature: 300 °C max., Duration: 3 seconds max. (for each pin)

Caution Apply wave soldering to terminals only. See to it that the jet solder does not contact with the

chip directly.

Symbol

71

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

APPENDIX A FUNCTIONS OF THE

µ

PD750008,

µ

PD750108, AND

µ

PD75P0116

Instruction

execution time

(1/2)

Item

µ

PD750008

µ

PD750108

µ

PD75P0116

Program memory Masked ROM One-time PROM

0000H - 1FFFH 0000H - 3FFFH

(8,192 × 8 bits) (16,384 × 8 bits)

Data memory 000H - 1FFH

(512 × 4 bits)

CPU 75XL CPU

General-purpose register (4 bits × 8 or 8 bits × 4) × 4 banks

Main system clock oscillator Crystal/ceramic RC oscillator (with external resistor and

oscillator capacitor)

Time required for start after reset 2 17/fX, 215/fXFixed to 56/fCC

(selected using a mask

option)

Wait time applied when STOP 220/fX, 217/fX, 215/fX,29/fCC or no wait Fixed to 29/fCC

mode is released by an interrupt 213/fX (selected accord- (selected using a mask

ing to BTM setting) option)

Subsystem clock oscillator Crystal oscillator

When selecting the main •0.95, 1.91, 3.81, or 15.3 •4, 8, 16, or 64

µ

s (when operating at fCC = 1.0 MHz)

system clock

µ

s (when operating at

fX =4.19 MHz) •2, 4, 8, or 32

µ

s (when operating at fCC = 2.0 MHz)

•0.67, 1.33, 2.67, or 10.7

µ

s (when operating at

fX = 6.0 MHz)

When selecting the 122

µ

s (when operating at 32.768 kHz)

subsystem clock

CMOS input 8 (Built-in pull-up resistors that can be connected by software: 7)

CMOS I/O 18 (Built-in pull-up resistors that can be connected by software)

N-ch open-drain I/O 8 (Pull-up resistors that can be incorporated by 8 (No mask option)

mask option) Withstand voltage of

Withstand voltage of 13 V 13 V

Total 34

Timer 4 channels 4 channels

•8-bit timer counter: 1 •8-bit timer counter (clock timer output function

•8-bit timer/event provided): 1

counter: 1 •8-bit timer/event counter: 1

•Basic interval timer/ •Basic interval timer/watchdog timer: 1

watchdog timer: 1 •Clock timer: 1

•Clock timer: 1

I/O port

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

72

(2/2)

Item

µ

PD750008

µ

PD750108

µ

PD75P0116

Serial interface 3 modes supported

•Three-wire serial I/O mode: First transferred bit switchable between

LSB and MSB

•Two-wire serial I/O mode

•SBI mode

Clock output (PCL) •

Φ

, 524, 262, or 65.5 kHz •

Φ

, 125, 62.5, or 15.6 kHz (when the main system

(when the main system clock operates at 1.0 MHz)

clock operates at 4.19

MHz)

•

Φ

, 750, 375, or 93.8 kHz •

Φ

, 250, 125, or 31.3 kHz (when the main system

(when the main system clock operates at 2.0 MHz)

clock operates at 6.0

MHz)

Buzzer output (BUZ) • 2, 4, or 32 kHz (when the • 2, 4, or 32 kHz (when the subsystem clock

main system clock operates at 32.768 kHz)

operates at 4.19 MHz • 0.488, 0.977, or 7.813 kHz (when the main

or the subsystem clock system clock operates at 1.0 MHz)

operates at 32.768 kHz) • 0.977, 1.953, or 15.625 kHz (when the main

• 2.93, 5.86, or 46.9 kHz system clock operates at 2.0 MHz)

(when the main system

clock operates at 6.0

MHz)

Vectored interrupt External: 3, internal: 4

Test input External: 1, internal: 1

Supply voltage VDD = 2.2 to 5.5 V VDD = 1.8 to 5.5 V

Operating ambient temperature TA = -40 to +85 °C

Package •42-pin plastic shrink DIP (600 mil, 1.778-mm pitch)

•44-pin plastic QFP (10 × 10 mm, 0.8-mm pitch)

73

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

APPENDIX B DEVELOPMENT TOOLS

The following development tools are provided for the development of a system which employs the

µ

PD750108.

In the 75XL series, use the common relocatable assembler together with a device file of each model.

Language processors

Note These software products cannot use the task swap function, which is available in MS-DOS Ver. 5.00 or later.

Remark The operations of the assembler and device file are guaranteed only on the above host machines and

OSs.

OS

MS-DOSTM

Ver. 3.30

to

Ver. 6.2 Note

See " OS for IBM PC."

OS

MS-DOS

Ver. 3.30

to

Ver. 6.2Note

See " OS for IBM PC."

Part number

µ

S5A13DF750008

µ

S5A10DF750008

µ

S7B13DF750008

µ

S7B10DF750008

Host machine

PC-9800 series

IBM PC/AT and

compatibles

Host machine

PC-9800 series

IBM PC/ATTM and

compatibles

Device file

RA75X relocatable assembler Part number

µ

S5A13RA75X

µ

S5A10RA75X

µ

S7B13RA75X

µ

S7B10RA75X

Distribution media

3.5-inch 2HD

5.25-inch 2HD

3.5-inch 2HC

5.25-inch 2HC

Distribution media

3.5-inch 2HD

5.25-inch 2HD

3.5-inch 2HC

5.25-inch 2HC

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

74

PROM programming tools

Note These software products cannot use the task swap function, which is available in MS-DOS Ver. 5.00 or

later.

Remark Operation of the PG-1500 controller is guaranteed only on the above host machines and OSs.

Hardware

Software

PG-1500

PA-75P008CU

PG-1500 controller

OS

MS-DOS

Ver. 3.30

to

Ver. 6.2Note

See "OS for IBM PC."

Host machine

PC-9800 series

IBM PC/AT and

compatibles

Distribution media

3.5-inch 2HD

5.25-inch 2HD

3.5-inch 2HD

5.25-inch 2HC

Part number

µ

S5A13PG1500

µ

S5A10PG1500

µ

S7B13PG1500

µ

S7B10PG1500

The PG-1500 PROM programmer is used together with an accessory board and optional

program adapter. It allows the user to program a single chip microcontroller containing

PROM from a standalone terminal or a host machine. The PG-1500 can be used to

program typical 256K-bit to 4M-bit PROMs.

The PA-75P008CU is a PROM programmer adapter provided for the

µ

PD75P0116CU/GB.

It is used in conjunction with the PG-1500.

This program enables the host machine to control the PG-1500 through the serial and

parallel interfaces.

75

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

Hardware

Part number

µ

S5A13IE75X

µ

S5A10IE75X

µ

S7B13IE75X

µ

S7B10IE75X

Distribution media

3.5-inch 2HD

5.25-inch 2HD

3.5-inch 2HC

5.25-inch 2HC

Debugging tools

The in-circuit emulators (IE-75000-R and IE-75001-R) are provided to debug programs used for the

µ

PD750108.

The system configuration is shown below.

Notes 1. Maintenance service only

2. These software products cannot use the task swap function, which is available in MS DOS Ver. 5.00

or later.

Remarks 1. Operation of the IE control program is guaranteed only on the above host machines and OSs.

2. The

µ

PD750104,

µ

PD750106,

µ

PD750108, and

µ

PD75P0116 are collectively called the

µ

PD750108

subseries.

OS

MS-DOS

Ver. 3.30

to

Ver. 6.2Note 2

See "OS for IBM PC."

The IE-75000-R is an in-circuit emulator used to debug hardware and software when

developing an application system using the 75X series and 75XL series. Use this

emulator together with optional emulation board IE-75300-R-EM and emulation probe

EP-75008CU-R or EP-75008GB-R to develop application systems of the

µ

PD750108

subseries.

For efficient debugging, connect the emulator to the host machine and a PROM

programmer.

The IE-75000-R contains emulation board IE-75000-R-EM. The board is connected

to the IE-75000-R.

The IE-75001-R is an in-circuit emulator used to debug hardware and software when

developing an application system using the 75X series and 75XL series. Use this

emulator together with optional emulation board IE-75300-R-EM and emulation probe

EP-75008CU-R or EP-75008GB-R to develop application systems of the

µ

PD750108

subseries.

For efficient debugging, connect the emulator to the host machine and a PROM

programmer.

The IE-75300-R-EM is an emulation board used to evaluate an application system

using the

µ

PD750108 subseries.

Use this board together with the IE-75000-R or IE-75001-R.

The EP-75008CU-R is an emulation probe for the

µ

PD750108CU.

Connect this emulation probe to the IE-75000-R or IE-75001-R, and the IE-75300-R-

EM.

The EP-75008GB-R is an emulation probe for the

µ

PD750108GB.

Connect this emulation probe to the IE-75000-R or IE-75001-R, and the IE-75300-R-

EM.

A 44-pin conversion socket, the EV-9200G-44, supplied with this probe facilitates the

connection of the probe to the target system.

This program enables the host machine to control the IE-75000-R or IE-75001-R

through the RS-232-C and Centronics interface.

IE-75000-RNote 1

IE-75001-R

IE-75300-R-EM

EP-75008CU-R

EP-75008GB-R

IE control program

Software

EV-9200G-44

Host machine

PC-9800 series

IBM PC/AT and

compatibles

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

76

OS for IBM PC

The following IBM PC OSs are supported.

OS Version

PC DOSTM Ver. 5.02 to Ver. 6.3

J6.1/VNote to J6.3/VNote

MS-DOS Ver. 5.0 to Ver. 6.22

5.0/VNote to 6.2/VNote

IBM DOSTM J5.02/VNote

Note Only English version is supported.

Caution These software products cannot use the task swap function, which is available in MS-DOS

Ver. 5.0 or later.

77

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

Document number

Japanese English

Document number

Japanese English

Hardware

Software

IE-75000-R/IE-75001-R User's Manual

IE-75300-R-EM User's Manual

EP-75008CU-R User's Manual

EP-75008GB-R User's Manual

PG-1500 User's Manual

RA75X Assembler Package User's

Manual

PG-1500 Controller

User's Manual PC-9800 series (MS-DOS) base

IBM PC series (PC DOS) base

Operation

Language

Document number

Japanese English

C10535E

C11531E

C10983E

-

MEI-1202

-

IC Package Manual

Semiconductor Device Mounting Technology Manual

Quality Grade on NEC Semiconductor Devices

Reliability and Quality Control of NEC Semiconductor Devices

Electrostatic Discharge (ESD) Test

Semiconductor Device Quality Guarantee Guide

Microcontroller-Related Products Guide - by third parties

Document name

Document name

Document name

APPENDIX C RELATED DOCUMENTS

Some documents are preliminary editions, but they are not so specified in the tables below.

Documents related to devices

Documents related to development tools

Other related documents

Caution The above related documents are subject to change without notice. Be sure to use the latest

edition when you design your system.

U12301J

U12603J

U11330J

U11456J

U10453J

EEU-846

U11354J

EEU-699

EEU-698

U11940J

EEU-731

EEU-730

EEU-704

EEU-5008

EEU-1416

U11354E

EEU-1317

EEU-1305

EEU-1335

EEU-1346

EEU-1363

EEU-1291

U10540E

C10943X

C10535J

C11531J

C10983J

MEM-539

C11893J

U11416J

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A) Data

Sheet

µ

PD75P0116 Data Sheet

µ

PD750108 User’s Manual

µ

PD750008, 750108 Instruction List

75XL Series Selection Guide

U12301E (This manual)

U12603E

U11330E

-

U10453E

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

78

NOTES FOR CMOS DEVICES

1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS

Note: Strong electric field, when exposed to a MOS device, can cause destruction of

the gate oxide and ultimately degrade the device operation. Steps must be taken

to stop generation of static electricity as much as possible, and quickly dissipate

it once, when it has occurred. Environmental control must be adequate. When

it is dry, humidifier should be used. It is recommended to avoid using insulators

that easily build static electricity. Semiconductor devices must be stored and

transported in an anti-static container, static shielding bag or conductive

material. All test and measurement tools including work bench and floor should

be grounded. The operator should be grounded using wrist strap. Semiconduc-

tor devices must not be touched with bare hands. Similar precautions need to

be taken for PW boards with semiconductor devices on it.

2 HANDLING OF UNUSED INPUT PINS FOR CMOS

Note: No connection for CMOS device inputs can be cause of malfunction. If no

connection is provided to the input pins, it is possible that an internal input level

may be generated due to noise, etc., hence causing malfunction. CMOS device

behave differently than Bipolar or NMOS devices. Input levels of CMOS devices

must be fixed high or low by using a pull-up or pull-down circuitry. Each unused

pin should be connected to VDD or GND with a resistor, if it is considered to have

a possibility of being an output pin. All handling related to the unused pins must

be judged device by device and related specifications governing the devices.

3 STATUS BEFORE INITIALIZATION OF MOS DEVICES

Note: Power-on does not necessarily define initial status of MOS device. Production

process of MOS does not define the initial operation status of the device.

Immediately after the power source is turned ON, the devices with reset function

have not yet been initialized. Hence, power-on does not guarantee out-pin

levels, I/O settings or contents of registers. Device is not initialized until the

reset signal is received. Reset operation must be executed immediately after

power-on for devices having reset function.

79

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

NEC Electronics Inc. (U.S.)

Santa Clara, California

Tel: 800-366-9782

Fax: 800-729-9288

NEC Electronics (Germany) GmbH

Duesseldorf, Germany

Tel: 0211-65 03 02

Fax: 0211-65 03 490

NEC Electronics (UK) Ltd.

Milton Keynes, UK

Tel: 01908-691-133

Fax: 01908-670-290

NEC Electronics Italiana s.r.1.

Milano, Italy

Tel: 02-66 75 41

Fax: 02-66 75 42 99

NEC Electronics Hong Kong Ltd.

Hong Kong

Tel:2886-9318

Fax: 2886-9022/9044

NEC Electronics Hong Kong Ltd.

Seoul Branch

Seoul, Korea

Tel: 02-528-0303

Fax: 02-528-4411

NEC Electronics Singapore Pte. Ltd.

United Square, Singapore 1130

Tel:253-8311

Fax: 250-3583

NEC Electronics Taiwan Ltd.

Taipei, Taiwan

Tel: 02-719-2377

Fax: 02-719-5951

NEC do Brasil S.A.

Sao Paulo-SP, Brasil

Tel: 011-889-1680

Fax: 011-889-1689

NEC Electronics (Germany) GmbH

Benelux Office

Eindhoven, The Netherlands

Tel:040-2445845

Fax: 040-2444580

NEC Electronics (France) S.A.

Velizy-Villacoublay, France

Tel:01-30-67 58 00

Fax: 01-30-67 58 99

NEC Electronics (France) S.A.

Spain Office

Madrid, Spain

Tel: 01-504-2787

Fax: 01-504-2860

NEC Electronics (Germany) GmbH

Scandinavia Office

Taeby, Sweden

Tel: 08-63 80 820

Fax: 08-63 80 388

Regional Information

Some information contained in this document may vary from country to country. Before using any NEC

product in your application, please contact the NEC office in your country to obtain a list of authorized

representatives and distributors. They will verify:

• Device availability

• Ordering information

• Product release schedule

• Availability of related technical literature

• Development environment specifications (for example, specifications for third-party tools and

components, host computers, power plugs, AC supply voltages, and so forth)

• Network requirements

In addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary

from country to country.

J96. 8

µ

PD750104, 750106, 750108, 750104(A), 750106(A), 750108(A)

80

MS-DOS is a registered trademark or trademark of Microsoft Corporation in the United States and/or other countries.

IBM DOS, PC/AT, and PC DOS are trademarks of IBM Corporation.

No part of this document may be copied or reproduced in any form or by any means without the prior written

consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this

document.

NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual

property rights of third parties by or arising from use of a device described herein or any other liability arising

from use of such device. No license, either express, implied or otherwise, is granted under any patents,

copyrights or other intellectual property rights of NEC Corporation or others.

While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,

the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or

property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety

measures in its design, such as redundancy, fire-containment, and anti-failure features.

NEC devices are classified into the following three quality grades:

"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on

a customer designated "quality assurance program" for a specific application. The recommended applications

of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each

device before using it in a particular application.

Standard: Computers, office equipment, communications equipment, test and measurement equipment,

audio and visual equipment, home electronic appliances, machine tools, personal electronic

equipment and industrial robots

Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster

systems, anti-crime systems, safety equipment and medical equipment (not specifically designed

for life support)

Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life

support systems or medical equipment for life support, etc.

The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.

If customers intend to use NEC devices for applications other than those specified for Standard quality grade,

they should contact an NEC sales representative in advance.

Anti-radioactive design is not implemented in this product.

M4 96. 5

The export of this product from Japan is regulated by the Japanese government. To export this product may be prohibited

without governmental license, the need for which must be judged by the customer. The export or re-export of this product

from a country other than Japan may also be prohibited without a license from that country. Please call an NEC sales

representative.