2003 Microchip Technology Inc. DS80140C-page 1
HCS362
Clarifications/Corrections to the Data Sheet:
In the Device Data Sheet (DS40189D), the following
clarifications and corrections should be noted.
1. Module: Low Voltage Detector
In Section 2.1.3, Low Voltage Detector, page 6, typical
levels have been adjusted to more accurately reflect
actual device performance. MPLAB® 5.70.40 and
higher will match these modified typical values.
2.1.3 LOW VOLTAGE DETECTOR
A low battery voltage detector onboard the HCS362
can indicate when the operating voltage drops below a
predetermined value. There are eight options available
depending on the VLOW[0..2] configuration options.
The options provided are:
000 - 2.15V 100 - 4.20V
001 - 2.25V 101 - 4.40V
010 - 2.35V 110 - 4.60V
011 - 2.45V 111 - 4.80V
HCS362 Data Sheet Errata
HCS362
DS80140C-page 2 2003 Microchip Technology Inc.
TABLE 1: CONFIG_0
Bit Address Field Description Values
0OSC_0 Oscillator adjust 0000 - nominal
1000 - fastest
0111 - slowest
1OSC_1
2OSC_2
3OSC_3
4VLOW_0 VLOW select nominal values
000 - 2.15V
001 - 2.25V
010 - 2.35V
011 - 2.45V
100 - 4.20V
101 - 4.40V
110 - 4.60V
111 - 4.80V
5VLOW_1
6VLOW_2
7BSEL_0 Bitrate select 00 - TE = 100 µs
01 - TE = 200 µs
02 - TE = 400 µs
03 - TE = 800 µs
8BSEL_1
9MTX_0 Minimum number of code
words
00 - 1
01 - 2
10 - 4
11 - 8
10 MTX_1
11 GUARD_0 Guard time select 00 - 0 ms (1 TE)
01 - 6.4 ms + 2 TE
10 - 25.6 ms + 2 TE
11 - 76.8 ms + 2 TE
12 GUARD_1
13 TIMOUT_0 00 - No Timeout
01 - 0.8 s to 0.8 s + 1 code word
10 - 3.2 s to 3.2 s + 1 code word
11 - 25.6 s to 25.6 s + 1 code word
14 TIMOUT_1
15 CTSEL CTSEL 0 = TIME bits
1 = CRC bits
2003 Microchip Technology Inc. DS80140C-page 3
HCS362
2. Module: Transmission Modulation
Format
Corrections to Figure 3-3 and 3-4, page 9. Clock
count should be 12 not 16, and 31 TE preamble
should be 23 TE preamble.
Corrections to Figure 3-5, page 11. The CTSEL bit
values should be changed as follows:
•XSER = 0, CTSEL = 0 to CTSEL = 1
•XSER = 1, CTSEL = 0 to CTSEL = 1
•XSER = 0, CTSEL = 1 to CTSEL = 0
•XSER = 1, CTSEL = 1 to CTSEL = 0
FIGURE 3-3: TRANSMISSION FORMAT (PWM)
FIGURE 3-4: TRANSMISSION FORMAT (MANCHESTER)
LOGIC "1"
Guard
Time
23 TEEncrypted
Portion
Fixed Code
Portion
LOGIC "0"
Preamble 3-10
Header
T
E
T
E
T
E
TE
112
T
BP
GuardPreamble Header Encrypted Fixed Code
12
START bit STOP bit
TimePortion Portion
12
bit 0
bit 1 bit 2
LOGIC "0"
LOGIC "1"
TETE
TBP
HCS362
DS80140C-page 4 2003 Microchip Technology Inc.
FIGURE 3-5: CODE WORD DATA FORMAT CONFIGURATION WORDS
Transmission Direction LSB First
Fixed Portion (32 bits)
QUE
2 bits
CRC
2 bits
VLOW
1-bit
SERIAL NUMBER
(32 bits)
Q1 Q0 C1 C0
BUT
4 bits
Counter
Overflow
2 bits
DISC
10 bits
Synchronization
16 bits
Counter
15 0
S2 S1 S0 S3 OVR1 OVR0
Encrypted Portion (32 bits)
With XSER = 1, CTSEL = 1
Status Information
(5 bits)
Fixed Portion (32 bits)
QUE
2 bits
TIME
2 bits
VLOW
1-bit
SERIAL NUMBER
(28 bits)
Q1 Q0 T1 T0 S2 S1 S0 S3
With XSER = 1, CTSEL = 0
Status Information
(5 bits)
BUT
4 bits
BUT
4 bits
Counter
Overflow
2 bits
DISC
10 bits
Synchronization
16 bits
Counter
15 0
S2 S1 S0 S3 OVR1 OVR0
Encrypted Portion (32 bits)
Fixed Code Portion (32 bits)
QUE
2 bits
CRC
2 bits
VLOW
1-bit
SERIAL NUMBER
(28 bits)
Q1 Q0 C1 C0 S2 S1 S0 S3
Status Information
(5 bits)
BUT
4 bits
BUT
4 bits
Counter
Overflow
2 bits
DISC
10 bits
Synchronization
16 bits
Counter
15 0
S2 S1 S0 S3 OVR1 OVR0
Encrypted Portion (32 bits)
With XSER = 0, CTSEL = 1
Fixed Portion (32 bits)
QUE
2 bits
TIME
2 bits
VLOW
1-bit
SERIAL NUMBER
(32 bits)
Q1 Q0 T1 T0
BUT
4 bits
Counter
Overflow
2 bits
DISC
10 bits
Synchronization
16 bits
Counter
15 0
S2 S1 S0 S3 OVR1 OVR0
Encrypted Portion (32 bits)
Status Information
(5 bits)
With XSER = 0, CTSEL = 0
2003 Microchip Technology Inc. DS80140C-page 5
HCS362
3. Module: LED Output
Corrections to Figure 3-7, page 12. The duty cycle
TLEDON should be 100 ms not 25 ms and
TLEDOFF should be 400 ms not 500 ms.
Correction to Figure 3-8, page 12. Duty cycle TLEDOFF
should be 820 ms not 800 ms.
FIGURE 3-7: LED OPERATION (LED = 1)
FIGURE 3-8: LED OPERATION (LED = 0)
S[3210]
LED
VDD > VLOW
TLEDON = 100 ms
TLEDOFF
LED
VDD < VLOW
TLEDON
TLEDOFF = 400 ms
LED
VDD < VLOW
S[3210]
LED
VDD > VLOW TLEDON TLEDOFF
TLEDON = 200 ms TLEDOFF = 820 ms
HCS362
DS80140C-page 6 2003 Microchip Technology Inc.
4. Module: Configuration Words
Correction to Table 4-4, page 18. Bit 12 values should
be changed as shown below:
TABLE 4-4: SEED_3
Bit
Address Field Description Values
0SEED_48 Seed Most Significant word
1SEED_49
2SEED_50
... ...
9SEED_57
10 SEED_58
11 SEED_59
12 LED LED output timing 0 = VBAT>VLOW
LED blink 200/820 ms
VBAT<VLOW
LED not blinking
1 = VBAT>VLOW
LED blink 100/400 ms
VBAT<VLOW
LED blink once
13 MOD Modulation Format 0 = PWM
1 = MANCHESTER
14 RFEN RF Enable/S3 multiplexing 0 - Enabled
(S3 only sensed 2 seconds after the last
button is released)
1 - Disabled
(S3 same as other S inputs)
15 HEADER Header Length 0 = short Header, TH = 3 x TE
1 = standard Header, TH = 10 x TE
2003 Microchip Technology Inc. DS80140C-page 7
HCS362
5. Module: Electrical Characteristics
Corrections to Figure 7-2, 7-3, 7-5 and 7-6, page
27 and 28. Clock count should be 12 not 16, and
31 TE preamble should be 23 TE preamble.
Corrections to Table 7-4 and 7-5, page 29. TP
BSEL values should be 23 not 31.
FIGURE 7-2: PWM FORMAT SUMMARY (MOD=0)
FIGURE 7-3: PWM PREAMBLE/HEADER FORMAT (MOD=0)
FIGURE 7-5: MANCHESTER FORMAT SUMMARY (MOD=1)
LOGIC "1"
Guard
Time
23 TEEncrypted Portion Fixed Portion
LOGIC "0"
Preamble
Header
T
E
T
E
T
E
10xTE
112
of Transmission
of Transmission
Preamble
50% Duty Cycle
T
BP
50% Duty Cycle Preamble
P1 P12
23 TE3 or 10xTE Header Data Bits
bit 0 bit 1
Guard
Preamble Header
Encrypted Portion Fixed Portion
12
START bit STOP bit
Time
12
bit 0
bit 1
bit 2
LOGIC "0"
LOGIC "1"
TETE
4XTE
23 TE
of Transmission of Transmission
Preamble
50% Duty Cycle
TPB
HCS362
DS80140C-page 8 2003 Microchip Technology Inc.
FIGURE 7-6: MANCHESTER PREAMBLE/HEADER FORMAT (MOD=1)
TABLE 7-4: CODE WORD TRANSMISSION TIMING PARAMETERS – PWM MODE(1,3)
TABLE 7-5: CODE WORD TRANSMISSION TIMING PARAMETERS—MANCHESTER MODE(1,3)
VDD = +2.0V to 6.3V
Commercial (C): TAMB = 0 °C to +70 °C
Industrial (I): TAMB = -40 °C to +85 °C
BSEL Value
11 10 01 00
Symbol Characteristic Typical Typical Typical Typical Units
TEBasic pulse element 800 400 200 100 µs
TBP Bit width 3333TE
TPPreamble duration 23 23 23 23 TE
THHeader duration(4) 10 10 10 10 TE
TCData duration 207 207 207 207 TE
TGGuard time(2) 27.2 26.4 26 25.8 ms
Total transmit time 220 122 74 50 ms
Data Rate 417 833 1667 3334 bps
Note 1: The timing parameters are not tested but derived from the oscillator clock.
2: Assuming GUARD = 10 option selected in CONFIG_0 Configuration Word.
3: Allow for a +/- 14% tolerance on the encoder internal oscillator after calibration.
4: Assuming HEADER = 1 option selected in SEED_3 Configuration Word.
VDD = +2.0V to 6.3V
Commercial (C): TAMB = 0 °C to +70 °C
Industrial (I): TAMB = -40 °C to +85 °C
BSEL Value
11 10 01 00
Symbol Characteristic Typical Typical Typical Typical Units
TEBasic pulse element(3) 800 400 200 100 µs
TBP Bit width 2222TE
TPPreamble duration 23 23 23 23 TE
THHeader duration 4 4 4 4 TE
TCData duration 138 138 138 138 TE
TGGuard time(2) 26.8 26.4 26 25.8 ms
Total transmit time 166 96 61 43 ms
Data Rate 625 1250 2500 5000 bps
Note 1: The timing parameters are not tested but derived from the oscillator clock.
2: Assuming GUARD = 10 option selected in CONFIG_0 Configuration Word.
3: Allow for a +/- 14% tolerance on the encoder internal oscillator after calibration.
Preamble
Header
23 TE
4 x TE
bit 0 bit 1
Data Word
Transmission
P1 P12
2003 Microchip Technology Inc. DS80140C-page 9
HCS362
6. Module: Internal RC Oscillator
Corrections to text in Section 2.1.2 paragraph.
Change "±10%” to “±14%” and change “(once
calibrated over....3.5V - 6.3V)” to “once calibrated
over a voltage range of 2V - 6.3V.” The oscillator
frequency varies ± 10% (once calibrated over a
voltage range of 2.2V - 3.5V).
Corrections to Figure 2-3: HCS362 Normalized TE
vs. Temperature. Replace Figure 2-3 with the
figure below.
FIGURE 2-3: HCS362 TE VS. TEMPERATURE
HCS362 Tuned Oscillator Frequency vs. Temperature
355
360
365
370
375
380
385
390
395
400
405
410
415
420
425
430
435
440
8525
-40
Temperature (°C)
TE (µs)
2.0V
2.2V
2.5V
3.5V
5.5V
6.3V
HCS362
DS80140C-page 10 2003 Microchip Technology Inc.
REVISION HISTORY
Rev. A Document - 8/02
Item 1 - First revision of this document
Rev. B Document - 8/02
Item 2 - Added corrections to Figures 3-3, 3-4 & 3-5.
Item 3 - Added corrections to Figures 3-7 & 3-8.
Item 4 - Added corrections to Table 4-4.
Item 5 - Added corrections to Figures 7-2, 7-3, 7-5 &
7-6 and to Tables 7-4 & 7-5.
Rev. C Document - 2/03
Item 5 -Changed In Tables 7-4 and 7-5, +/- 10% to
+/- 14%.
Item 6 - Added corrections to Section 2.1.2, including
text change from +/- 10% to +/- 14% and new graph.
2003 Microchip Technology Inc. DS80140C - page 11
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DS80140C-page 12 2003 Microchip Technology Inc.
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