D5V0P4UR6SO
Document number: DS38235 Rev. 1 - 2
1 of 5
www.diodes.com
May 2016
© Diodes Incorporated
D5V0P4UR6SO
ADVANCE INFO R MA T I O N
4 CHANNEL LOW CAPACITANCE TVS DIODE ARRAY
Product Summary
VBR (Min)
IPP (Max)
4.5V
45A
Description
The D5V0P4UR6SO is a high-performance device suitable for
protecting four high-speed I/Os. These devices are assembled in
SOT26 package and have high ESD surge capability and low
capacitance.
Applications
Typically used at high-speed ports such as USB 2.0, IEEE1394
(Firewire®, iLink™), Serial ATA, DVI, HDMI and PCI.
Features
Low Clamping Voltage: Typical 7.5V at 12A 100ns, TLP, I/O to
VSS; Typical 5.8V at 12A 100ns, TLP, VCC to VSS
IEC 61000-4-2 (ESD): Air – ±30kV, Contact – ±30kV
IEC 61000-4-4 (EFT): ±80A (5/50ns)
IEC 61000-4-5 (Lighting): 20A, I/O to VSS; 45A, VCC to VSS
TLP Dynamic Resistance: 0.15Ω, I/O to VSS; 0.07Ω, VCC to VSS
Low Channel Input Capacitance of 2.1pF Typical
4 Channels of ESD Protection
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Mechanical Data
Case: SOT26
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: See Schematic
Terminals – Finish – Matte Tin Pleated Leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.016 grams (Approximate)
Ordering Information (Note 4)
Product
Compliance
Marking
Reel Size (inches)
Tape Width (mm)
Quantity per Reel
D5V0P4UR6SO-7
Standard
DE1
7
8
3,000/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
Date Code Key
Year
2016
2017
2018
2019
2020
2021
Code
D
E
F
G
H
I
Month
Jan
Feb
Mar
Apr
May
Jun
Jul
Aug
Sep
Oct
Nov
Dec
Code
1
2
3
4
5
6
7
8
9
O
N
D
Top View
Device Schematic
DE1 = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: D = 2016)
M = Month (ex: 9 = September)
Note: “ ” Represents Internal Code
SOT26
A17
YM
DE1
FireWire is a registered trademark of Apple Computer, Inc.
iLink is a trademark of CEM Corporation.
D5V0P4UR6SO
Document number: DS38235 Rev. 1 - 2
2 of 5
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May 2016
© Diodes Incorporated
D5V0P4UR6SO
ADVANCE INFO R MA T I O N
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Unit
Conditions
Peak Pulse Current, per IEC 61000-4-5
IPP
20
A
I/O to VSS, 8/20μs
Peak Pulse Current, per IEC 61000-4-5
IPP
45
A
VCC to VSS, 8/20μs
Peak Pulse Power, per IEC 61000-4-5
PPP
180
W
I/O to VSS, 8/20μs
Operating Supply Voltage (DC)
VDC
3.6
V
VCC to VSS
ESD Protection – Contact Discharge, per IEC 61000-4-2
VESD_CONTACT
±30
kV
I/O to VSS, VCC to VSS
ESD Protection – Air Discharge, per IEC 61000-4-2
VESD_AIR
±30
kV
I/O to VSS, VCC to VSS
Operating Temperature
TOP
-55 to +85
°C
—
Storage Temperature
TSTG
-55 to +150
°C
—
Thermal Characteristics
Characteristic
Symbol
Value
Unit
Power Dissipation Typical (Note 5)
PD
300
mW
Thermal Resistance, Junction to Ambient Typical (Note 5)
RθJA
417
°C/W
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Conditions
Reverse Working Voltage
VRWM
—
—
3.3
V
VCC to VSS
Reverse Leakage Current (Note 6)
ILEAK
—
—
5
μA
VCC = 3.3V, VCC to VSS
Channel Leakage Current (Note 6)
ICH-LEAK
—
—
1
μA
VI/O = 3.3V, I/O to VSS
Reverse Breakdown Voltage
VBR
4.5
—
7
V
IBR = 1mA, VCC to VSS
Forward Clamping Voltage
VF
—
0.8
1.2
V
IF = 15mA, VSS to VCC
Reverse Clamping Voltage (Note 7)
VC_5A
—
6
—
V
IPP = 5A, I/O to VSS, 8/20μs
—
4.8
—
V
IPP = 5A, VCC to VSS, 8/20μs
ESD Clamping Voltage
VESD
—
7.5
—
V
TLP, 12A, tP = 100ns, I/O to VSS
—
5.8
—
TLP, 12A, tP = 100ns, VCC to VSS
Dynamic Resistance
RDIF
—
0.15
—
Ω
TLP, 12A, tP = 100ns, I/O to VSS
—
0.07
—
TLP, 12A, tP = 100ns, VCC to VSS
Channel Input Capacitance
CI/O
—
2.1
2.5
pF
VI/O = 1.65V, VCC = 3.3V, f = 1MHz
—
2.4
3.0
0
pF
VI/O = 1.65V, VCC = floated, f = 1MHz
Variation of Channel Input Capacitance
CI/O
—
0.05
—
pF
VSS = 0V, I/O = 1.65V, VCC = 3.3V, f = 1MHz,
I/O_x to VSS – I/O_y to VSS
—
0.04
—
pF
VSS = 0V, I/O = 1.65V, VCC = floated, f = 1MHz,
I/O_x to VSS – I/O_y to VSS
Notes: 5. Device mounted on FR-4 PCB pad layout (2oz copper) as shown on Diodes, Inc. website at http://www.diodes.com/package-outlines.html.
6. Short duration pulse test used to minimize self-heating effect.
7. Clamping voltage value is based on an 8x20µs peak pulse current (IPP) waveform.
D5V0P4UR6SO
Document number: DS38235 Rev. 1 - 2
3 of 5
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May 2016
© Diodes Incorporated
D5V0P4UR6SO
ADVANCE INFO R MA T I O N
T , AMBIENT TEMPERATURE (°C)
Figure 1 Pulse Derating Curve
A
PEAK PULSE DERATING IN % OF
PEAK POWER OR CURRENT
Peak Value I PP
Half Value I /2
PP
8x20 Waveform
as defined by R.E.A.
tp
I , PEAK PULSE CURRENT (%I )
PP pp
t, TIME (µS)
Figure 2 Pulse Waveform
t = 8µS
R
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
I/O to V , f=1MHz
SS
V = Floated
CC
V = 3.3V
CC
C , INPUT CAPACITANCE (pF)
I/O
V , INPUT VOLTAGE (V)
I/O
Figure 3 Input Capacitance vs. Input Voltage
0
2
4
6
8
10
12
14
16
18
0 1 2 3 4 5 6 7 8 9
CURRENT FROM I/O TO V (A)
SS
VOLTAGE FROM I/O TO V (V)
SS
Figure 5 Current vs. Voltage
0
2
4
6
8
10
12
14
16
18
0 1 2 3 4 5 6 7 8
CURRENT FROM I/O TO V (A)
SS
VOLTAGE FROM I/O TO V (V)
SS
Figure 6 Current vs. Voltage
(oC)
t, Time (µs)
VCC = 3.3V
VCC = Floated
CURRENT FROM VCC TO VSS (A)
VOLTAGE FROM VCC TO VSS (V)
0
1
2
3
4
5
6
7
8
9
10
11
12
3 6 9 12 15 18 21 24 27 30 33 36 39 42 45 48
VC,CLAMPING VOLTAGE (V)
CURRENT FROM I/O TO VSS (A)
Figure 4 Clamping Voltage Characteristic
I/O pin to GND pin
IEC61000-4-5
(Lighting)
VCC pin to GND pin
D5V0P4UR6SO
Document number: DS38235 Rev. 1 - 2
4 of 5
www.diodes.com
May 2016
© Diodes Incorporated
D5V0P4UR6SO
ADVANC E INF O R MA TI O N
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
SOT26
SOT26
Dim
Min
Max
Typ
A1
0.013
0.10
0.05
A2
1.00
1.30
1.10
A3
0.70
0.80
0.75
b
0.35
0.50
0.38
c
0.10
0.20
0.15
D
2.90
3.10
3.00
e
–
–
0.95
e1
–
–
1.90
E
2.70
3.00
2.80
E1
1.50
1.70
1.60
L
0.35
0.55
0.40
a
–
–
8°
a1
–
–
7°
All Dimensions in mm
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
SOT26
Dimensions
Value (in mm)
C
2.40
C1
0.95
G
1.60
X
0.55
Y
0.80
Y1
3.20
a1
D
e
E1 E
b
A2 A1
Seating Plane
L
c
a
e1
A3
C1
Y1 G
X
Y
C
D5V0P4UR6SO
Document number: DS38235 Rev. 1 - 2
5 of 5
www.diodes.com
May 2016
© Diodes Incorporated
D5V0P4UR6SO
ADVANC E INF O R M A TIO N
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
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written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
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labeling can be reasonably expected to result in significant injury to the user.
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failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
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