Table of Contents
1 Ratings....................................................................................5
1.1 Thermal handling ratings................................................. 5
1.2 Moisture handling ratings................................................ 5
1.3 ESD handling ratings.......................................................5
1.4 Voltage and current operating ratings............................. 5
2 General................................................................................... 6
2.1 AC electrical characteristics.............................................6
2.2 Nonswitching electrical specifications..............................7
2.2.1 Voltage and current operating requirements....... 7
2.2.2 LVD and POR operating requirements................7
2.2.3 Voltage and current operating behaviors.............8
2.2.4 Power mode transition operating behaviors........ 9
2.2.5 Power consumption operating behaviors............ 10
2.2.6 EMC radiated emissions operating behaviors.....20
2.2.7 Designing with radiated emissions in mind..........21
2.2.8 Capacitance attributes.........................................21
2.3 Switching specifications...................................................21
2.3.1 Device clock specifications..................................21
2.3.2 General switching specifications......................... 22
2.4 Thermal specifications.....................................................22
2.4.1 Thermal operating requirements......................... 22
2.4.2 Thermal attributes................................................23
3 Peripheral operating requirements and behaviors.................. 24
3.1 Core modules.................................................................. 24
3.1.1 SWD electricals .................................................. 24
3.2 System modules.............................................................. 25
3.3 Clock modules................................................................. 25
3.3.1 MCG-Lite specifications.......................................25
3.3.2 Oscillator electrical specifications........................27
3.4 Memories and memory interfaces................................... 29
3.4.1 Flash electrical specifications..............................29
3.5 Security and integrity modules........................................ 31
3.6 Analog............................................................................. 31
3.6.1 ADC electrical specifications............................... 31
3.6.2 Voltage reference electrical specifications.......... 36
3.6.3 CMP and 6-bit DAC electrical specifications....... 37
3.6.4 12-bit DAC electrical characteristics....................39
3.7 Timers..............................................................................42
3.8 Communication interfaces............................................... 42
3.8.1 USB electrical specifications............................... 42
3.8.2 USB VREG electrical specifications.................... 43
3.8.3 SPI switching specifications................................ 43
3.8.4 I2C.......................................................................48
3.8.5 UART...................................................................50
3.8.6 I2S/SAI switching specifications..........................50
4 Dimensions............................................................................. 54
4.1 Obtaining package dimensions....................................... 54
5 Pinouts and Packaging........................................................... 55
5.1 KL27 Signal Multiplexing and Pin Assignments...............55
5.2 KL27 Family Pinouts........................................................57
6 Ordering parts......................................................................... 61
6.1 Determining valid orderable parts....................................61
7 Part identification.....................................................................61
7.1 Description.......................................................................61
7.2 Format............................................................................. 62
7.3 Fields............................................................................... 62
7.4 Example...........................................................................62
8 Terminology and guidelines.................................................... 63
8.1 Definitions........................................................................63
8.2 Examples.........................................................................63
8.3 Typical-value conditions.................................................. 64
8.4 Relationship between ratings and operating
requirements....................................................................64
8.5 Guidelines for ratings and operating requirements..........65
9 Revision History...................................................................... 65
4Kinetis KL27 Microcontroller, Rev.5, 08/2015.
Freescale Semiconductor, Inc.