Soldering heat
AB
※1
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STANDARD SPECIFICATIONS
Operating temperature range
Storage temperature range
Sealing
Net weight
−40 ~ 85 °C
Non- Washable
0.21 g (CL-SB-12*-0*)
0.22 g (CL-SB-22*-0*)
0.26 g (CL-SB-13*-0*)
0.28 g (CL-SB-23*-0*)
0.21 g (CL-SB-12*-1*)
0.23 g (CL-SB-22*-1*)
0.27 g (CL-SB-13*-1*)
0.29 g (CL-SB-23*-1*)
No. of positions
Operation force
Stop strength
Solderability
Shear
Substrate bending
Pull-off strength
2, 3
A⇔B ※1
1.5 ± 1.0 N {0.153 ± 0.102kgf}
A →B / C →B ※2
1.5 ± 1.0 N {0.153 ± 0.102kgf}
B →A / B →C
2.5 ± 1.5 N {0.255 ± 0.153kgf}
Stroke 2 mm
20 N {2.04 kgf} 15 s
245 ± 3 °C, 2 ~ 3 s
5 N {0.51 kgf} 10 s
Width 90 mm, bend 3 mm, 5 s, 1 time
5 N {0.51 kgf} 10s
Contact rating
Non-switching
Switching
Minimum
Contact resistance
Insulation resistance
Dielectric strength
DC50 V 200 mA
DC12 V 200 mA
DC20 mV 1 μA (Gold contacts)
DC5 V 10 mA (Silver contacts)
100 M Ω minimum (DC500 V)
1.5 mA 1 kHz
20 mV maximum
70m Ω maximum
(Gold contacts)
50m Ω maximum
(Silver contacts)
Contact timing Non-shorting
AC500 V, 60 s
Vibration
Shock
Load life
Humidity
High temperature exposure
Low temperature exposure
Thermal shock
(Amplitude) 1.5 mmor
(Acceleration) 98 m/s2,
10-500-10 Hz, 3 directions for 2 h each
490 m/s2, 11 ms
6 directions for 3 times each
10000 cycles,
DC12 ± 0.5V, 200 ± 10mA
85 °C, 96 h,
No load
40 °C, Relative humidity 90 ~ 95 %,
240 h, No load
−40 °C, 96 h,
No load
−40 (0.5 h) ~ 85 °C ( 0.5 h ), 5 cycles
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ENVIRONMENTAL CHARACTERISTICS
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ELECTRICAL CHARACTERISTICS
{ } : Reference only
〈
Reflow profile for soldering heat evaluation
〉
Reflow : two times maximum
Peak : 250
Over 230 ℃
Pre Heating Zone
180 ℃
(℃)
250
200
150
100
50
150 ℃
90 ± 30 s
30 ± 10 s
Soldering Zone
Heating time
Temperature
℃
+5
0
Flow : 260 ± 3 °C, 5 ~ 6 s
Reflow:255 °C (Peak temperature)
(
Please refer to the profile below)
Manual soldering:350 ± 10 °C, 3 ~ 4 s
2 Contacts
(CL-SB-*2*-**)
3 Contacts
(CL-SB-*3*-**)
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MECHANICAL CHARACTERISTICS
※1
ABC
※2
CL-SB
SLIDE SWITCHES