LED CL-170IR-X CL-170IR-X Infrared Chip LED Applications 1. Optical communication 1. Absolute Maximum Rating Item Power dissipation Forward current Pulse forward current Reverse voltage Operating temperature range Storage temperature range 2.0L x1.25W x1.1 H mm Ultra small size. (Ta 25) Symbol Pd IF IFP VR TOP TST Rating 80 50 11 5 -25+80 -30+85 Unit mW mA A V 1.Duty 1 f=1KHz Duty ratio1 Frequency=1KHz Electro-optical characteristics Item Symbol Forward voltage Reverse current Capacitance between terminals Response time Radiant intensity Peak wave length Spectrum width of half value VF IR Ct Tr,Tf Ie p (Ta 25) Conditions Min Typ Max Unit IF=20mA 1.2 1.6 V VR=5V - 100 A V=0V f=1MHz 13 pF IF=20mA 2 S IF=20mA 0.25 0.6 - mW/sr IF=20mA 950 nm IF=20mA 45 nm Outline drawing LED Cathode mark LED die Resin The following soldering patterns are recommended for Soldering terminal reflow-soldering: For reflow soldering (0.3) 1.2 Polarity 0.4 0.5 (0.625) 1.25 1.2 (1.4) (1.25) 2.0 (0.4) 1.1 0.9 1.2 PCB 1.2 Unit : mm Characteristics Ie-IF Ie-IF Characteristics IF-VF IF-VF Characteristics Ie-Ta Ie-Ta Characteristics 5 1000 VF-Ta VF-Ta Characteristics 10 IF=20mA 1.6 10 1.5 VF (V) 1 Relative le IF (mA) Ie(mw/sr) 100 1 1.4 1.3 IF=20mA 1.2 0.1 1 1.0 1.1 1 1.5 10 0.1 -40 100 VF(V) IF (mA) Spectral Distribution IFmax-Ta IFmax-Ta Characteristics -20 0 20 40 60 1.0 -40 80 -20 0 20 40 60 80 100 Ta (C) Ta(C) 100 80 IF=50mA Ta=25C Directive Characteristics 60 40 IFmax(mA) 50 60 40 40 50 30 60 10 0 880 900 920 940 960 980 1000 1020 nm 0 -40 40 50 80 20 20 30 20 10 0 10 20 30 120 100 0 20 40 60 80 60 70 40 70 80 20 80 90 -20 60 0 90 Ta(C) CITIZEN ELECTRONICS CO., LTD. JAPAN 2010.12 119