Connectivity and Integration D e l p h i D D R 2 D I M M S o c k e t s Description - 1mm centerline sockets for DDR2 DIMM (Double Data Rate 2, Dual In-line Memory Modules). These sockets are provided with dual eject latches for easy module removal, voltage keys to enable proper module insertion, and color keyed latches for visual end-user identification. Typical Applications - Desktop computers Servers Network routers, switches and hubs Other Properties Benefits/Features: Flexible System . . . The 240 position socket is available in . . . . . . . . . . . . . . several solder tail lengths to accommodate . . . . . . . . . . . . . . various PCB thicknesses. . . . . . . . . . . . . . . Latches are available in different colors for . . . . . . . . . . . . . . visual identification. Industry Standard . . Meets JEDEC MO-237C module mating . . . . . . . . . . . . . . requirements for DDR2 DIMM. Reliability . . . . . . . . Several gold plating options are available . . . . . . . . . . . . . . for improved reliability. Selectable Features Product Type DDR2 DIMM Sockets Total No. of Positions Centerline Spacing Orientation Mounting Style Voltage Insertion Style Contact Style Contact Area Plating Height Above Board Housing Color 240 1.0 mm [.039 in.] Vertical Through Hole 1.8 V & 2.5 V Vertical Formed Gold-plated (see product print for thickness) 5.2 mm [.205 in.] Black Latch Color White, black or blue PCB Retention Feature Yes Packaging Type Housing Material Applicable Soldering Process Contact Base Material Latch Base Material Floating Tab Material Insulation Resistance Withstanding Voltage Current Rating Contact Resistance Voltage Rating Temperature Range Normal Force Contact Retention Force Durability (Mating Cycles) PCB Mating Force Plating (Contact Area) Underplating Standards Tray LCP IR, vapor phase, wave Copper alloy Stainless steel Copper alloy 250 M (initial) 500 VAC (initial) 0.5 amp max. per contact 30 m (initial) 25 VAC -55C to +85C 0.69 N [70 gf] min. 4.90 N [500 gf] min. 25 111.20 N [25 lbf] max. Gold (thickness varies per Delphi spec.) over nickel underplating 2.54 m [100 in.] tin-lead over nickel underplating 2.54 m [100 in.] tin-lead over nickel underplating 1.27 m [50 in.] nickel JEDEC MO-237C Approvals and Certification UL approved Plating (Soldering End) Plating (Floating Tab) www.delphi.com/connect Connection Systems 19200 Asheville Highway P.O. Box 519, Landrum, SC 29356 U.S.A. Tel: [1] 864.457.3824 Fax: [1] 864.457.2535 D e l p h i D D R 2 D I M M S o c k e t s Ordering Nomenclature 15496530 - 1 3 2 Plating: Tail Length (Dim. "B"): 1 = Gold flash 2 = 0.38 m [15 in.] gold 1 = 2.54 mm [0.100 in.] 2 = 3.00 mm [0.118 in.] Voltage/Color: 1= 2= 3= 4= 5= 6= 1.8 V - black housing/white latch 2.5 V - black housing/white latch 1.8 V - black housing/black latch 2.5 V - black housing/black latch 1.8 V - black housing/blue latch 2.5 V - black housing/blue latch Unless otherwise specified, dimensions are shown in millimeters and [inches]. Printed on Recycled Paper (c) 2004 Delphi. All rights reserved. DP-04-E-136 804/3M-OG