May 2005 / C
SEMICONDUCTOR
TAK CHEONG
®
500 mW DO-35 Hermetically
Sealed Glass Zener Voltage
Regulators
Absolute Ma ximum Ra ti ng s TA = 25°C unless otherwise noted
Parameter Value Units
Power Dissipation 500 mW
Storage Temperature Range -65 to +200 °C
Operating Junction Temperature +200 °C
Lead Temperature (1/16” from case for 10 seconds) +230 °C
These ratings are limiting values above which the serviceability of the diode may be impaired.
Specification Features:
Zener Voltage Range 2.0 to 56 Volts
DO-35 Package (JEDEC)
Through-Hole Device Type Mounting
Hermetically Sealed Glass
Compression Bonded Construction
All external surfaces are corrosion resistant and leads are readily solderable
Cathode indicated by polarity band
Electrical Characteristics TA = 25°C unless otherwise noted
VZ @ IZT
(Volts)
Device Type VZ
Min VZ
Max
IZT
(mA)
ZZT @ IZT
(Ω)
Max
IZK
(mA)
ZZK @ IZK
(Ω)
Max
IR @ VR
(µA)
Max
VR
(Volts)
TCBZX79C 2V0 1.88 2.12 5 100 1 600 150 1
TCBZX79C 2V2 2.08 2.33 5 100 1 600 150 1
TCBZX79C 2V4 2.28 2.56 5 100 1 600 100 1
TCBZX79C 2V7 2.51 2.89 5 100 1 600 75 1
TCBZX79C 3V0 2.8 3.2 5 95 1 600 50 1
TCBZX79C 3V3 3.1 3.5 5 95 1 600 25 1
TCBZX79C 3V6 3.4 3.8 5 90 1 600 15 1
TCBZX79C 3V9 3.7 4.1 5 90 1 600 10 1
TCBZX79C 4V3 4 4.6 5 90 1 600 5 1
TCBZX79C 4V7 4.4 5 5 80 1 500 3 2
TCBZX79C 5V1 4.8 5.4 5 60 1 480 2 2
TCBZX79C 5V6 5.2 6 5 40 1 400 1 2
TCBZX79C 6V2 5.8 6.6 5 10 1 150 3 4
TCBZX79C 6V8 6.4 7.2 5 15 1 80 2 4
TCBZX79C 7V5 7 7.9 5 15 1 80 1 5
TCBZX79C 8V2 7.7 8.7 5 15 1 80 0.7 5
TCBZX79C 9V1 8.5 9.6 5 15 1 100 0.5 6
TCBZX79C 10 9.4 10.6 5 20 1 150 0.2 7
TCBZX79C 11 10.4 11.6 5 20 1 150 0.1 8
TCBZX79C 12 11.4 12.7 5 25 1 150 0.1 8
TCBZX79C 13 12.4 14.1 5 30 1 170 0.1 8
TCBZX79C 15 13.8 15.6 5 30 1 200 0.05 10.5
TCBZX79C 16 15.3 17.1 5 40 1 200 0.05 11.2
TCBZX79C 18 16.8 19.1 5 45 1 225 0.05 12.6
Cathode Anode
ELECTRICAL SYMBOL
TCBZX79C 2V0 through TCBZX79C56 Series
L
79C
xxx
DEVICE MARKING DIAGRAM
L : Logo
Device Code : TCBZX79Cxxx
AXIAL LEAD
DO35
May 2005 / C
SEMICONDUCTOR
TAK CHEONG
®
Electrical Characteristics TA = 25°C unless otherwise noted
VZ @ IZT
(Volts)
Device Type VZ
Min VZ
Max
IZT
(mA)
ZZT @ IZT
(Ω)
Max
IZK
(mA)
ZZK @ IZK
(Ω)
Max
IR @ VR
(µA)
Max
VR
(Volts)
TCBZX79C 20 18.8 21.2 5 55 1 225 0.05 14
TCBZX79C 22 20.8 23.3 5 55 1 250 0.05 15.4
TCBZX79C 24 22.8 25.6 5 70 1 250 0.05 16.8
TCBZX79C 27 25.1 28.9 2 80 0.5 300 0.05 18.9
TCBZX79C 30 28 32 2 80 0.5 300 0.05 21
TCBZX79C 33 31 35 2 80 0.5 325 0.05 23.1
TCBZX79C 36 34 38 2 90 0.5 350 0.05 25.2
TCBZX79C 39 37 41 2 130 0.5 350 0.05 27.3
TCBZX79C 43 40 46 2 150 0.5 375 0.05 30.1
TCBZX79C 47 44 50 2 170 0.5 375 0.05 32.9
TCBZX79C 51 48 54 2 180 0.5 400 0.05 35.7
TCBZX79C 56 52 60 2 200 0.5 425 0.05 39.2
VF Forward Voltage = 1.5 V Maximum @ IF = 100 mA for all types
Notes:
1. The type numbers listed have zener voltage min/max limits as shown.
2. For detailed information on price, availability and delivery of nominal zener voltages between the voltages sho wn and tighter
voltage tolerances, contact your nearest Tak Cheong Electronics representative.
3. The z ener impedance is derived from the 60-cycle ac voltage, which results when an ac current having an rms value equal to
10% of the dc zener current (IZT or IZK) is superimposed to IZT or IZK.
Electrical Symbol Definition Typical Characteristics
Symbol Parameter
VZ Reverse Zener Voltage @ IZT
IZT Reverse Current
ZZT Maximum Zener Impedance @ IZT
IZK Reverse Current
ZZK Maximum Zener Impedance @ IZK
IR Reverse Leakage Current @ VR
VR Breakdown Voltage
IF Forward Current
VF Forward Voltage @ IF
Ordering Information
Device Package Quantity
TCBZX79Cxxx Bulk 10,000
TCBZX79Cxxx.TB Tape and Ammo 5,000
TCBZX79Cxxx.TR Tape and Reel 10,000
TCBZX79Cxxx Others (…contact Tak Cheong sales representatives)
Axial-Lead Tape Packaging Standards
This axial-lead component’s packaging requirements use in automatic testing and assembly equipment. And this standard practices for
lead-tape packaging of axial-lead components meets the require ments of EIA Stan dard RS-296-D “Lead-taping of C omponents on A xial
Lead Configuration for Automatic Insertion”.
V
I
(mV)
(V)
(mA)
(mA)
VF
IF
VR IR
VZ
IZT
(nA)
May 2005 / C
SEMICONDUCTOR
TAK CHEONG
®
Tape & Reel Packaging Information
Tape & Reel Outline
Reel Dimensions
DIM Millimeters
D1 356
D2 30
D3 84
W1 77.5
Quantity Per Reel
PKG Type Quantity Per Reel
DO-35 10,000
May 2005 / C
SEMICONDUCTOR
TAK CHEONG
®
Tape & Ammo Packaging Information
Tape & Ammo
Outline
Quantity Per Ammo
Box
PKG Type Quantity Per Box
DO-35 5,000
Taping Dimensions
Description Millimeters
Standard Width 52 26
Tape Spacing (B) 52 ± 0.69 26 +0.5 / -0
Component Pitch (C) 5.08 ± 0.4 5.08 ± 0.4
Untaped Lead (L1 – L2) ± 0.69 ± 0.69
Glass Offse t (F ) ± 0.69 ± 0. 69
Bent (D) 1.2 Max 1.2 Max
Tape Width (G) 6.138 ± 0.576 6.138 ± 0.576
Tape Mismatch (E) 0.55 Max 0.55 Max
Taped Lead (G) 3.2 Min 3.2 Min
Lead Beyond Tape (H) 0 0
250mm x 80mm x 80mm
May 2005 / C
SEMICONDUCTOR
TAK CHEONG
®
Bulk Packaging Information
Bulk Outline
Quantity Per Box
PKG Type Quantity Per Box
DO-35 10,000
Plastic Bag
DO-35 500 x 20 Plastic Bag
Quantity Per Plastic Bag
190mm x 150mm x 65mm
May 2005 / C
SEMICONDUCTOR
TAK CHEONG
®
Package Outline
Package Case Outline
DO-35 DO-35
Millimeters Inches
DIM
Min Max Min Max
A 0.46 0.55 0.018 0.022
B 3.05 5.08 0.120 0.200
C 25.40 38.10 1.000 1.500
D 1.53 2.28 0.060 0.090
Notes: 1. All dimensions are within JEDEC standard.
2. DO35 polarity denoted by cathode band.
