F-213 HSEC8-110-01-L-DV-A-PE HSEC8-120-01-L-DV-A-PE (0,80 mm) .0315" HSEC8-PE SERIES TM PASS-THROUGH EDGE RATE CARD SOCKET SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?HSEC8 Insulator Material: Black Liquid Crystal Polymer Contact: BeCu Plating: Au or Sn over 50" (1,27 m) Ni Current Rating: 1.9A per contact @ 30C Temperature Rise (See website for details) Operating Temp: -55C to +125C RoHS Compliant: Yes Processing: Lead-Free Solderable: Yes SMT Lead Coplanarity: (0,10 mm) .004" max (10-20) ALSO AVAILABLE Mates with: 1,60 mm thick cards, HSC8 Contacts optimized for Signal Integrity performance TM BOARD-TO-BOARD APPLICATIONS -EM to -DV (0,80 mm) .0315" pitch -DV to -DV Surface Mount -DV to -PE to -DV HSEC8 1 POSITIONS PER ROW CARD THICKNESS PLATING OPTION -01 SAL1 = (1,60 mm) .062" thick card 10, 13, 20 See SAL1 Series for other card pass-through options. DV -L = 10" (0,25 m) Gold on contact, Matte Tin on tail Note: Other Gold plating options available. Contact Samtec. No. of Positions x (0,80) .0315 + (7,00) .276 (1,75) .070 02 (0,80) .0315 (5,60) .220 (7,00) .276 01 (4,60) .180 (7,98) .314 (7,80) .307 Note: While optimized for 50 applications, this connector with alternative signal/ground patterns may also perform well in certain 75 applications. Contact Samtec for further information Pass-through (1,32) .052 (1,12) .044 DIA No. of Positions x (0,80) .0315 + (3,60) .142 Note: Some lengths, styles and options are non-standard, non-returnable. WWW.SAMTEC.COM (4,25) .167 A PE OTHER OPTION -K = (5,50 mm) .217" DIA Polyimide Film Pick & Place Pad -TR = Tape & Reel Packaging