BAV199DW
Document number: DS30417 Rev. 9 - 2 1 of 4
www.diodes.com August 2009
© Diodes Incorporated
BAV199DW
QUAD SURFACE MOUNT LOW LEAKAGE DIODE
Features
• Surface Mount Package Ideally Suited for Automated Insertion
• Very Low Leakage Current
• Lead Free/RoHS Compliant (Note 3)
• "Green" Device (Notes 4 and 5)
• Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
• Case: SOT-363
• Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminals: Finish - Matte Tin annealed over Alloy 42 leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
• Polarity: See Diagram
• Marking Information: See Page 2
• Ordering Information: See Page 2
• Weight: 0.008 grams (approximate)
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR 85 V
RMS Reverse Voltage VR
(
RMS
)
60 V
Forward Continuous Current (Note 2) Single diode
Double diode IFM 160
140 mA
Repetitive Peak Forward Current (Note 2) IFRM 500 mA
Non-Repetitive Peak Forward Surge Current @ t = 1.0
μ
s
@ t = 1.0ms
@ t = 1.0s IFSM 4.0
1.0
0.5 A
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 2) PD 200 mW
Thermal Resistance Junction to Ambient Air (Note 2) R
θ
JA 625 °C/W
Operating and Storage Temperature Range TJ , TSTG -65 to +150 °C
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic Symbol Min Typ Max Unit Test Condition
Reverse Breakdown Voltage (Note 1) V
(
BR
)
R 85 ⎯ ⎯ V IR = 100μA
Forward Voltage VF ⎯ ⎯
0.90
1.0
1.1
1.25
V
IF = 1.0mA
IF = 10mA
IF = 50mA
IF = 150mA
Leakage Current (Note 1) IR ⎯ ⎯ 5.0
80 nA
nA VR = 75V
VR = 75V, TJ = 150°C
Total Capacitance CT ⎯ 2 ⎯ pF VR = 0, f = 1.0MHz
Reverse Recovery Time trr ⎯ ⎯ 3.0 μs IF = IR = 10mA,
Irr = 0.1 x IR, RL = 100Ω
Notes: 1. Short duration pulse test used to minimize self-heating effect.
2. Part mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
TOP VIEW
SOT-363
Internal Schematic
TOP VIEW
AC
1
AC
2
C
2
A
1
A
2
C
1
BAV199DW
Document number: DS30417 Rev. 9 - 2 2 of 4
www.diodes.com August 2009
© Diodes Incorporated
BAV199DW
0
50
100
0 25 50 75 100 125 150
P
,
P
O
WE
R
DISSI
P
A
T
I
O
N
(mW)
D
T , AMBIENT TEMPERA TURE (°C)
Fig. 1 Power Derating Curve, Total Package
A
150
200
250
300
10
1.0
100
1,000
0.1
0.01
I, INS
T
AN
T
ANE
O
U
S
F
O
R
WA
R
D
C
U
R
R
EN
T
(mA)
F
V , INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 2 Typical Forward Characteristics, Per Element
F
02.0
0.4 0.8 1.2 1.6
0.1
1
10
050 150100 200
I , INS
T
AN
T
ANE
O
U
S
R
EVE
R
SE
C
U
R
R
EN
T
(nA)
R
T , AMBIENT TEMPERA TURE ( C)
Fi g. 3 Typi c al Rever se Cha r act e r istic s, P e r Elem en t
A
°
Device mounted on an
FR4 printed-circuit board
0 50 100 150 200
300
200
250
100
150
50
0
T , AMBIENT TEMPERATURE ( C)
Fig. 4 Current Derating Curve, Per Element
A
°
I, F
O
R
WA
R
D
C
U
R
R
EN
T
(mA)
F
Ordering Information (Notes 5 & 6)
Part Number Case Packaging
BAV199DW-7-F SOT-363 3000/Tape & Reel
Notes: 6. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
Marking Information
Date Code Key
Year 2006 2007 2008 2009 2010 2011 2012
Code T U V W X Y Z
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
K52 = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: T = 2006)
M = Month (ex: 9 = September)
K52
K52
YM
YM
BAV199DW
Document number: DS30417 Rev. 9 - 2 3 of 4
www.diodes.com August 2009
© Diodes Incorporated
BAV199DW
Package Outline Dimensions
Suggested Pad Layout
SOT-363
Dim Min Max
A 0.10 0.30
B 1.15 1.35
C 2.00 2.20
D 0.65 Typ
F 0.40 0.45
H 1.80 2.20
J 0 0.10
K 0.90 1.00
L 0.25 0.40
M 0.10 0.22
α 0° 8°
All Dimensions in mm
Dimensions Value (in mm)
Z 2.5
G 1.3
X 0.42
Y 0.6
C1 1.9
C2 0.65
A
M
JL
D
B C
H
K
F
X
Z
Y
C1
C2
C2
G
BAV199DW
Document number: DS30417 Rev. 9 - 2 4 of 4
www.diodes.com August 2009
© Diodes Incorporated
BAV199DW
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
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written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
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acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their pro ducts and an y
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2009, Diodes Incorporated
www.diodes.com
