ASMT-Ax00 1W Power LED Light Source Data Sheet Description Features The ASMT-Ax00 series of 1W Power LEDs are high performance energy efficient devices which can handle high driving current and high temperatures. The exposed pad design enables excellent heat transfer from the package to the motherboard. An electrically isolated metal slug option is also available. Available in Red, Red Orange, Amber, Blue, Royal Blue, Cyan, Green, Cool White, Neutral White and Warm White color The White Power LED is available with color temperatures ranging from 2700K to 10000K. The low profile package design is suitable for a wide variety of applications especially where height is a constraint and the package foot print is compatible with most high power LEDs available in the market today. This package is compatible with reflow soldering process. Energy efficient Exposed metal slug for excellent heat transfer Compatible with reflow soldering process High current operation Long operation life Wide viewing angle at 140 Silicone encapsulation Non-ESD sensitive (threshold > 16 kV) MSL 2a products Applications Architectural lighting Channel backlighting Contour lighting Retail Display lighting Decorative lighting Garden lighting Package Dimensions 7.4 1.1 O 6.0 7.4 1.5 2.3 O 8.0 Metal Slug BOTTOM VIEW TOP VIEW Anode Lead 0.5 4.1 (ref:) 3.0 2.0 Cathode Lead 6.0 Metal Slug 13.8 0.2 Figure 1. ASMT-Ax00 package outline drawing. Notes: 1. All dimensions in millimeters. 2. Metal slug is connected to anode for electrically non-isolated option. 3. Tolerance is 0.1 mm unless otherwise specified. 4 . Terminal Finish: Ag plating Part Numbering System ASMT - A x100 - x 2 x3 x4 x5 x6 Packaging Option Color Bin Selection Maximum Flux Bin Selection Minimum Flux Bin Selection Dice Type N - InGaN A - AllnGaP Color R - Red H - Red Orange A - Amber G - Green C - Cyan B - Blue L - Royal Blue W - Cool White N - Neutral White Y - Warm White Note: 1. Please refer to Page 10 for selection details. 2 Lens Body Device Selection Guide (Tj = 25C) Luminous Flux (lm) / Radiometric Power (mW), V [1,2] Part Number Color Min. Typ. Max. Test Current (mA) ASMT-AR00-ARS00 Red 39.8 50.0 67.2 350 AllnGaP No [3] 51.7 65.0 87.4 ASMT-AR00-AST00 Dice Technology Electrically Isolated Metal Slug ASMT-AH00-ARS00 Red Orange 39.8 50.0 67.2 350 AllnGaP No [3] ASMT-AA00-ARS00 Amber 39.8 50.0 67.2 350 AllnGaP No [3] ASMT-AB00-NMP00 Blue 13.9 20.0 30.6 350 InGaN Yes ASMT-AL00-NMP00 Royal Blue 225 mW 320 mW 435 mW 350 InGaN Yes 275 mW 350 mW 435 mW ASMT-AC00-NST00 Cyan 51.7 58 87.4 350 InGaN Yes ASMT-AG00-NST00 Green 51.7 65.0 87.4 350 InGaN Yes ASMT-AW00-NUV00 Cool White 350 InGaN Yes ASMT-AL00-NNP00 ASMT-AW00-NUW00 ASMT-AN00-NUV00 Neutral White ASMT-AY00-NTU00 Warm White ASMT-AY00-NTV00 87.4 90.0 113.6 87.4 95.0 129.5 87.4 90.0 113.6 350 InGaN Yes 350 InGaN Yes 67.2 80.0 99.6 67.2 85.0 113.6 Notes: 1. V is the total luminous flux / radiometric power output as measured with an integrating sphere at 25ms mono pulse condition. 2. Flux and power tolerance is 10 % 3. Electrically isolated metal slug option is also available. Please contact your Avago sale representative. Absolute Maximum Ratings Parameter AllnGaP InGaN InGaN Cyan Units 500 500 mA 1000 1000 mA 1980 mW DC Forward Current [1] 500 Peak Pulsing Current [2] 1000 Power Dissipation 1230 1830 LED Junction Temperature 125 135 135 C Operating Ambient Temperature Range at 350mA -40 to +115 -40 to +120 -40 to +120 C Storage Temperature Range -40 to +120 -40 to +120 -40 to +120 C Soldering Temperature Reverse Volttage [3] Notes: 1. Derate linearly based on Figure 10 for AlInGaP and Figure 22 for InGaN. 2. Pulse condition duty factor = 10%, Frequency = 1 kHz. 3. Not designed for reverse bias operation 3 Refer to Figure 26 Not recommended Optical Characteristics at 350 mA (TJ = 25 C) Peak Wavelength, PEAK (nm) Dominant Wavelength, D [1] (nm) Viewing Angle, 21/2 [2] () Luminous Efficiency (lm/W) Part Number Color Typ. Typ. Typ. Typ. ASMT-AR00-ARS00 Red 635 625 140 68 635 625 140 88 625 615 140 68 ASMT-AR00-AST00 ASMT-AH00-ARS00 Red Orange ASMT-AA00-ARS00 Amber 598 590 140 68 ASMT-AG00-NST00 Green 519 525 140 58 ASMT-AC00-NST00 Cyan 497 500 140 49 ASMT-AB00-NMP00 Blue 454 460 140 18 ASMT-AL00-NMP00 Royal Blue 450 455 140 Not applicable 450 455 140 Not applicable Correlated Color Temperature, CCT (Kelvin) Viewing Angle, 21/2 [2] () Luminous Efficiency (lm/W) ASMT-AL00-NNP00 Part Number Color Min. Max. Typ. Typ. ASMT-AW00-NUV00 Cool White 4500 10000 140 80 ASMT-AW00-NUW00 4500 10000 140 85 ASMT-AN00-NUV00 Neutral White 3500 4500 140 80 ASMT-AY00-NTU00 Warm White 2700 3500 140 71 2700 3500 140 76 ASMT-AY00-NTV00 Notes: 1. The dominant wavelength, D, is derived from the CIE Chromaticity Diagram and represents the color of the device. 2. 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Electrical Characteristic at 350 mA (TJ = 25C) Forward Voltage, VF (Volts) Thermal Resistance, Rj-ms(C/W) [1] Dice Type Min. Typ Max. Typ. AllnGaP 1.7 2.1 2.3 10 InGaN (non-Cyan colors) 2.8 3.2 3.5 10 InGaN Cyan 3.0 3.4 3.8 10 Notes: 1. Rj-ms is Thermal Resistance from LED junction to metal slug. 4 1 0.9 AMBER 0.8 RED ORANGE RED 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 530 545 560 575 590 605 620 635 650 665 680 WAVELENGTH - nm 500 450 400 350 300 250 200 150 100 50 0 1.4 0 0.5 1 1.5 2 FORWARD VOLTAGE - V Figure 4. Forward Current vs. Forward Voltage. 2.5 0.6 0.4 100 200 300 400 DC FORWARD CURRENT - mA 500 Figure 3. Relative Luminous Flux vs. Mono Pulse Current. 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES 90 Figure 5. Radiation Pattern for Red, Red Orange and Amber. 1.4 D= tp T tp 1.2 IF T D= 0.05 0.10 0.25 0.50 1.00 1.0 0.8 PULSE CURRENT, IP - A PULSE CURRENT, IP - A 0.8 0 3 0.6 0.4 tp T tp IF T D= 0.05 0.10 0.25 0.50 1.00 1.0 0.8 0.6 0.4 0.0 0.0 0.00001 0.0001 D= 0.2 0.2 0.001 0.01 0.1 1 PULSE DURATION, tp - sec Figure 6. Maximum pulse current vs. pulse duration. Derated based on TA = 25C, RJ-A = 50C/W. 5 1 0 1.4 1.2 1.2 0.2 NORMALIZED INTENSITY FORWARD CURRENT - mA Figure 2. Relative Intensity vs. Wavelength for Red, Red Orange and Amber. 1.6 RELATIVE LUMINOUS FLUX (NORMALIZED AT 350 mA) RELATIVE INTENSITY AlInGaP 10 100 0.00001 0.0001 0.001 0.01 0.1 1 PULSE DURATION, tp - sec Figure 7. Maximum pulse current vs. pulse duration. Derated based on TA = 85C, RJ-A = 50C/W. 10 100 0.1 0.05 FORWARD VOLTAGE SHIFT - V (NORMALIZED AT 25C) RELATIVE LIGHT OUTPUT (%) (NORMALIZED AT 25C) 120 110 100 90 80 70 60 50 40 30 20 10 0 AMBER RED-ORANGE RED 25 50 75 100 JUNCTION TEMPERATURE, TJ -C -0.15 AMBER RED RED-ORANGE -0.2 -0.3 25 50 75 100 JUNCTION TEMPERATURE, TJ -C 125 Figure 9. Forward Voltage Shift vs. Junction Temperature. 600 MAX ALLOWABLE DC CURRENT - mA MAX ALLOWABLE DC CURRENT - mA -0.1 125 600 500 400 300 RJ-A = 30C/W RJ-A = 40C/W RJ-A = 50C/W 200 100 0 20 40 60 80 100 AMBIENT TEMPERATURE, T A - C 120 Figure 10. Maximum Forward Current vs. Ambient Temperature. Derated based on TJMAX = 125C, RJ-A = 30C/W, 40C/W and 50C/W. 6 -0.05 -0.25 Figure 8. Relative Light Output vs. Junction Temperature. 0 0 140 500 400 RJ-MS = 10C/W 300 200 100 0 0 20 40 60 80 100 120 METAL SLUG TEMPERATURE, T MS - C Figure 11. Maximum Forward Current vs. Metal Slug Temperature. Derated based on TJMAX = 125C, RJ-MS = 10C/W. 140 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 COOL WHITE NEUTRAL WHITE WARM WHITE 380 480 580 WAVELENGTH - nm 680 RELATIVE INTENSITY RELATIVE INTENSITY InGaN 780 Figure 12. Relative Intensity vs. Wavelength for Cool and Warm White. Figure 13. Relative Intensity vs. Wavelength for Blue, Royal Blue, Cyan and Green. 1.4 FORWARD CURRENT - mA RELATIVE LUMINOUS FLUX (NORMALIZED AT 350 mA) 1.2 1 0.8 0.6 0.4 0.2 0 0 100 200 300 400 DC FORWARD CURRENT - mA 500 -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES Figure 16. Radiation Pattern for Blue, Royal Blue, Cyan and Green. 7 500 450 400 350 300 250 200 150 100 50 0 GREEN WHITE BLUE ROYAL BLUE CYAN 0 0.5 1 1.5 2 2.5 FORWARD VOLTAGE - V 3 3.5 4 Figure 15. Forward Current vs. Forward Voltage. NORMALIZED INTENSITY NORMALIZED INTENSITY Figure 14. Relative Luminous Flux vs. Mono Pulse Current. 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 1 0.9 GREEN 0.8 CYAN 0.7 BLUE ROYAL BLUE 0.6 0.5 0.4 0.3 0.2 0.1 0 380 405 430 455 480 505 530 555 580 605 630 WAVELENGTH - nm 90 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES 90 Figure 17. Radiation Pattern for Cool White, Neutral White and Warm White. 1.4 1.4 PULSE CURRENT, IP - A 1.2 tp IF 1.2 D= 0.05 0.10 0.25 0.50 1.00 T 1.0 0.8 PULSE CURRENT, IP - A t D= p T 0.6 0.4 D= tp tp T IF T D= 0.05 0.10 0.25 0.50 1.00 1.0 0.8 0.6 0.4 0.2 0.2 0.0 0.0 0.00001 0.0001 0.001 0.01 0.1 1 10 0.00001 0.0001 100 FORWARD VOLTAGE SHIFT - V (NORMALIZED AT 25C) RELATIVE LIGHT OUTPUT (%) (NORMALIZED AT 25C) BLUE ROYAL BLUE CYAN GREEN WHITE 0.05 10 100 WHITE BLUE ROYAL BLUE -0.05 -0.15 -0.25 GREEN CYAN -0.35 25 50 75 100 125 JUNCTION TEMPERATURE,TJ - C -0.45 150 25 50 75 100 125 JUNCTION TEMPERATURE,TJ - C 150 Figure 21. Forward Voltage Shift vs. Junction Temperature. 600 MAX ALLOWABLE DC CURRENT - mA 600 MAX ALLOWABLE DC CURRENT - mA 1 0.15 Figure 20. Relative Light Output vs. Junction Temperature. 500 400 300 RJ-A = 30C/W RJ-A = 40C/W RJ-A = 50C/W 200 100 500 400 25 50 75 100 AMBIENT TEMPERATURE, T A - C 125 150 RJ-MS = 10C/W 300 200 100 0 0 Figure 22. Maximum Forward Current vs. Ambient Temperature. Derated based on TJMAX = 135C, RJ-A = 30C/W, 40C/W and 50C/W. 8 0.1 Figure 19. Maximum pulse current vs. pulse duration. Derated based on TA = 85C, RJ-A = 50C/W. Figure 18. Maximum pulse current vs. pulse duration. Derated based on TA = 25C, RJ-A = 50C/W. 0 0.01 PULSE DURATION, tp - sec PULSE DURATION, tp - sec 120.0 110.0 100.0 90.0 80.0 70.0 60.0 50.0 40.0 30.0 20.0 10.0 0.0 0.001 0 25 50 75 100 125 METAL SLUG TEMPERATURE, T MS - C Figure 23. Maximum Forward Current vs. Metal Slug Temperature. Derated based on TJMAX = 135C, RJ-MS = 10C/W. 150 1.60 4.38 8.80 14.10 2.65 O 6.40 5.8 1.10 Figure 25. Recommended pick and place nozzle tip. Inner diameter = 5.8 mm. Figure 24. Recommended soldering land pattern TEMPERATURE 10 to 30 SEC. 217C 200C 255 - 260C 3C/SEC. MAX. 6C/SEC. MAX. 150C 3C/SEC. MAX. 100 SEC. MAX. 60 - 120 SEC. TIME (Acc. to J-STD-020C) Figure 26. Recommended Reflow Soldering Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN1060 Surface Mounting SMT LED Indicator Components. 9 Option Selection Details Flux / Power Bin Limit [x3, x4] Color Bin ID Luminous Flux (lm) / Radiometric Power (mW) at 350 mA Min. Max. Blue K 8.2 10.7 L 10.7 13.9 M 13.9 18.1 N 18.1 23.5 P 23.5 30.6 Q 30.6 39.8 R 39.8 51.7 ASMT-Ax100 - x2 x3 x4 x5 x6 x3 x4 x5 x6 - - - - Minimum Flux Bin Selection Maximum Flux Bin Selection Color Bin Selection Packaging Option Other Colors Royal Blue S 51.7 67.2 T 67.2 87.4 U 87.4 99.6 V 99.6 113.6 W 113.6 129.5 M 225.0 275.0 N 275.0 355.0 P 355.0 435.0 Tolerance for each bin limits is 10 % Color Bin Selection [x5] Individual reel will contain parts from one full bin only. Cool White Warm White Selection Bin ID Selection Bin ID 0 Full Distribution 0 Full Distribution E VM, UM, VN and UN E NM, MM, N1 and M1 F WM, VM, WN and VN F PM, NM, P1 and N1 G XM, WM, XN and WN G QM, PM, Q1 and P1 H UN, VN, U0 and V0 H M1, N1, M0 and N0 J WN, VN, W0 and V0 J P1, N1, P0 and N0 K XN, WN, X0 and W0 K Q1, P1, Q0 and P0 L V0, U0, VP and UP L N0, M0, NA and MA M W0, V0, WP, VP and WQ M P0, N0, PA and NA N X0, W0, XP, WP and WQ N Q0, P0, QA and PA P Y0 Q YA Neutral White Selection Bin ID 0 Full Distribution E SM, RM, S1 and R1 F TM, SM, TN and S1 G S1, R1, S0 and R0 H TN, S1, T0 and S0 J S0, R0, SA and RA K 10 T0, S0, TP and SA Other Colors Selection Bin ID 0 Full Distribution Z A and B Y B and C W C and D V D and E U E and F Q A, B and C P B, C and D N C, D and E M D, E and F 0.42 0.48 4500K 0.40 5000K 5650K 6300K 0.36 7000K 0.34 0.32 XM XN X0 10000K Y0 0.30 XP U0 VN V0 WM WN W0 0.44 UN VM Y-COORDINATE Y-COORDINATE 0.38 0.46 UM UP VP WP WQ 3500K NM Q0 P0 PA NA M1 N1 M0 N0 0.40 BLACK BODY CURVE PM P1 Q1 2700K MM QM 0.42 0.38 3050K 2850K 3250K MA QA BLACK BODY CURVE 0.36 YA 0.28 0.26 0.26 0.34 0.28 0.30 0.32 0.34 X-COORDINATE 0.36 0.38 0.40 Figure 27. Color bin structure for Cool White. 0.44 3500K 3800K 4100K Y-COORDINATE RM 4500K 0.40 SM TM R1 S1 TN 0.38 R0 S0 T0 RA SA 0.36 BLACK BODY CURVE TP 0.34 0.32 0.34 0.36 0.38 0.40 X-COORDINATE Figure 29. Color bin structure for Neutral White. 11 0.40 0.42 0.44 0.46 X-COORDINATE Figure 28. Color bin structure for Warm White. 0.46 0.42 0.32 0.38 0.42 0.44 0.48 0.50 Color Bin Limit Cool White Color Limits (Chromaticity Coordinates) Warm White Color Limits (Chromaticity Coordinates) Bin UM X Y 0.365 0.385 0.367 0.400 0.348 0.385 0.347 0.372 Bin MM X Y 0.471 0.451 0.460 0.430 0.473 0.432 0.486 0.455 Bin UN X Y 0.365 0.386 0.362 0.372 0.346 0.359 0.347 0.372 Bin M1 X Y 0.460 0.430 0.453 0.416 0.467 0.419 0.473 0.432 Bin U0 X Y 0.362 0.372 0.360 0.357 0.344 0.344 0.346 0.359 Bin M0 X Y 0.453 0.416 0.444 0.399 0.459 0.403 0.467 0.419 Bin UP X Y 0.360 0.357 0.357 0.342 0.343 0.311 0.344 0.344 Bin MA X Y 0.459 0.403 0.444 0.399 0.436 0.384 0.451 0.389 Bin VM X Y 0.329 0.357 0.329 0.369 0.348 0.385 0.347 0.372 Bin NM X Y 0.454 0.446 0.444 0.426 0.460 0.430 0.471 0.451 Bin VN X Y 0.329 0.345 0.329 0.357 0.347 0.372 0.346 0.359 Bin N1 X Y 0.444 0.426 0.438 0.412 0.453 0.416 0.460 0.430 Bin V0 X Y 0.329 0.331 0.329 0.345 0.346 0.359 0.344 0.344 Bin N0 X Y 0.438 0.412 0.429 0.394 0.444 0.399 0.453 0.416 Bin VP X Y 0.329 0.331 0.344 0.344 0.343 0.331 0.329 0.320 Bin NA X Y 0.444 0.399 0.429 0.394 0.422 0.379 0.436 0.384 Bin WM X Y 0.329 0.369 0.329 0.357 0.315 0.344 0.314 0.355 Bin PM X Y 0.438 0.440 0.430 0.421 0.444 0.426 0.454 0.446 Bin WN X Y 0.329 0.345 0.316 0.333 0.315 0.344 0.329 0.357 Bin P1 X Y 0.430 0.421 0.424 0.407 0.438 0.412 0.444 0.426 Bin W0 X Y 0.329 0.345 0.329 0.331 0.317 0.320 0.316 0.333 Bin P0 X Y 0.424 0.407 0.416 0.389 0.429 0.394 0.438 0.412 Bin WP X Y 0.329 0.331 0.329 0.320 0.318 0.310 0.317 0.320 Bin PA X Y 0.429 0.394 0.416 0.389 0.410 0.374 0.422 0.379 Bin WQ X Y 0.329 0.320 0.329 0.310 0.319 0.300 0.318 0.310 Bin QM X Y 0.421 0.433 0.414 0.414 0.430 0.421 0.438 0.440 Bin XM X Y 0.301 0.342 0.314 0.355 0.315 0.344 0.303 0.333 Bin Q1 X Y 0.414 0.414 0.409 0.400 0.424 0.407 0.430 0.421 Bin XN X Y 0.305 0.322 0.303 0.333 0.315 0.344 0.316 0.333 Bin Q0 X Y 0.409 0.400 0.402 0.382 0.416 0.389 0.424 0.407 Bin X0 X Y 0.308 0.311 0.305 0.322 0.316 0.333 0.317 0.320 Bin QA X Y 0.416 0.389 0.402 0.382 0.396 0.367 0.410 0.374 Bin XP X Y 0.308 0.311 0.317 0.320 0.319 0.300 0.311 0.293 Tolerance: 0.01 Bin Y0 X Y 0.308 0.311 0.283 0.284 0.274 0.301 0.303 0.333 Bin YA X Y 0.308 0.311 0.311 0.293 0.290 0.270 0.283 0.284 Tolerance: 0.01 12 Neutral White Color Limits (Chromaticity Coordinates) Bin RM X Y 0.421 0.433 0.414 0.414 0.397 0.406 0.402 0.423 Color Bin ID Min. Max. Red - 620.0 635.0 Bin R1 X Y 0.414 0.414 0.409 0.400 0.392 0.391 0.397 0.406 Red Orange - 610.0 620.0 Amber B 587.0 589.5 C 589.5 592.0 D 592.0 594.5 E 594.5 597.0 A 455.0 460.0 B 460.0 465.0 C 465.0 470.0 D 470.0 475.0 C 490.0 495.0 Bin R0 Dominant Wavelength (nm) at 350 mA X Y 0.392 0.391 0.387 0.374 0.402 0.382 0.409 0.400 X Y 0.387 0.374 0.383 0.360 0.396 0.367 0.402 0.382 Bin SM X Y 0.402 0.423 0.397 0.406 0.382 0.397 0.386 0.413 Bin S1 X Y 0.397 0.406 0.392 0.391 0.378 0.382 0.382 0.397 Bin S0 X Y 0.392 0.391 0.387 0.374 0.374 0.366 0.378 0.382 X Y 0.387 0.374 0.383 0.360 0.370 0.351 0.374 0.366 D 495.0 500.0 E 500.0 505.0 Bin TM X Y 0.386 0.413 0.382 0.397 0.365 0.386 0.367 0.400 F 505.0 510.0 Bin TN X Y 0.382 0.397 0.378 0.382 0.362 0.372 0.365 0.386 G 510.0 515.0 H 515.0 520.0 Bin T0 X Y 0.378 0.382 0.374 0.366 0.360 0.357 0.362 0.372 A 515.0 520.0 B 520.0 525.0 Bin TP X Y 0.374 0.366 0.370 0.351 0.357 0.342 0.360 0.357 C 525.0 530.0 D 530.0 535.0 Bin RA Bin SA Tolerance: 0.01 Blue Cyan Green Tolerance: 1 nm Peak Wavelength (nm) at 350 mA Packaging Option [x6] Selection Option 0 Tube 1 Tape and Reel Color Bin ID Min. Max. Royal Blue C 440.0 445.0 D 445.0 450.0 E 450.0 455.0 F 455.0 460.0 Tolerance: 2 nm Example ASMT-AW00-NST00 ASMT-AW00-Nxxxx - Cool White, InGaN, Electrically isolated Heat Sink X3 = S - Minimum Flux Bin S X4 = T - Maximum Flux Bin T X5 = 0 - Full DIstribution X6 = 0 - Tube Option 13 Packing Tube - Option 0 0.4 0.1 7.3 0.1 8.4 0.1 3.4 0.1 5.0 0.1 17.2 0.1 mm 395 Figure 30. Package tube dimensions. 14 4.00 0.10 2.00 0.10 11.50 0.10 24.00 0.30 1.75 0.10 Tape and Reel - Option 1 A B O 1.50 +0.10 0.00 0.40 0.05 O 8.10 A +0.10 0.00 `BO' 14.30 0.10 R 0.30 Max (TYP.) `KO' 4.50 0.10 B 12.00 0.10 2.55 Section 'B-B' `AO' 8.10 0.10 Section 'A-A' Figure 31. Carrier tape dimensions. O 330.0 2.0 1.8 +0.2 0.0 24.0 +0.2 0.0 2.0 0.5 O 13.0 +0.5 -0.2 Detail - 1 See Detail - 1 Figure 32. Reel dimensions. 15 100 0.5 O 21.0 0.8 Handling Precaution The encapsulation material of the product is made of silicone for better reliability of the product. As silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. These might damage the product and cause premature failure. During assembly of handling, the unit should be held on the body only. Please refer to Avago Application Note AN 5288 for detail information. B. Control after opening the MBB - The humidity indicator card (HIC) shall be read immediately upon opening of MBB. - The LEDs must be kept at <30C/60%RH at all time and all high temperature related process including soldering, curing or rework need to be completed within 672 hours. C. Control for unfinished reel Moisture Sensitivity This product is qualified as Moisture Sensitive Level 2a per Jedec J-STD-020. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305 Handling of Moisture Sensitive Surface Mount Devices for details. A. Storage before use - Unopen moisture barrier bag (MBB) can be stored at <40C/90%RH for 12 months. If the actual shelf life has exceeded 12 months and the humidity indicator card (HIC) indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. - It is not recommended to open the MBB prior to assembly (e.g. for IQC). - For any unused LEDs, they need to be stored in sealed MBB with desiccant or desiccator at <5%RH. D. Control of assembled boards - If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB need to be stored in sealed MBB with desiccant or desiccator at <5%RH to ensure no LEDs have exceeded their floor life of 672 hours. E. Baking is required if: - HIC "10%" indicator is NOT Brown and "5%" indicator is Azure. - The LEDs are exposed to condition of >30C/60% RH at any time. - The LED floor life exceeded 672hrs. Recommended baking condition: 605C for 20hrs. DISCLAIMER: Avago's products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright (c) 2005-2012 Avago Technologies. All rights reserved. AV02-1640EN - September 28, 2012