T4-LDS-0231-1, Rev. 1 (111902) ©2011 Microsemi Corporation Page 1 of 5
1N5415US thru 1N5420US
Availa ble on
commercial
versions
VOIDLESS-HERMETICALLY SE ALED SURFACE
MOUNT F AST RECOVE RY G LASS RE CTIFIERS
Qualified per MIL-PRF-19500/411
Qualified Levels:
JAN, JANTX, JANTXV
and JANS
DESCRIPTION
This “fast recovery” rectifier diode series is military qualified and is ideal for high-rel iabi lity appl icat ion s
where a failure cannot be tolerated. These industry-recognized 3.0 amp rated rectifiers for working peak
reverse voltages from 50 to 600 volts are hermetically sealed with voidless-glass construction using an
internal “Category 1” metallurgical bond. These devices are also available in axial-leaded packages for
thru-hole mounting. Microsemi also offers numerous other rectifier products to meet hig her and low er
current ratings with various recovery time speed requirements including fast and ultrafast device types in
both through-hole and surface mount packages.
“B” SQ-MELF
(D-5B) Package
Also available in:
“B” Package
(axial-leaded)
1N5415 – 1N5420
Important: For the latest information, visit our website http://www.microsemi.com.
FEATURES
• Surface mount equivalent of J ED EC registered 1N 5415 thru 1N5420 ser ies .
• Voidless hermetically sealed glass package.
• Quadruple-layer passivation.
• Internal “Category 1” metallurgical bonds.
• Working peak reverse voltage 50 to 600 volts.
• JAN, JANTX, JANTXV and JANS qualifications available per MIL-PRF-19500/411.
• RoHS compliant versions available (commercial grade only).
APPLICA TIONS / BENEFITS
• Fast recovery 3 amp 50 to 600 volt rectifiers.
• Military and other high-reliab ility applications.
• General rectifier applications including bridges, half-bridges, catch diodes, etc.
• High forwar d surge curr ent capability.
• Extr emely rob ust constr u cti on.
• Low thermal resistance.
• Controlled avalanche with peak reverse power capability.
• Inherently radiation hard as described in Microsemi “MicroNote 050”.
MAXIMUM RATINGS
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
1-800-446-1158
Tel: (978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
Parameters/Test Conditions
Symbol
Value
Unit
Junction and Storage Temperature
TJ and TSTG
-65 to +175
oC
Thermal Resi stan ce Jun cti on-to-End Cap
RӨJEC
6.5
oC/W
Forward Surge Current @ 8.3 ms half-sine
IFSM
80
A
Average Rectified Forward Current
(3)
@ TA = +55
o
C
@ TA = +100
o
C
IO
(1 , 2)
IO (2) 3
2 A
Working Peak Reverse Voltage 1N5415US
1N5416US
1N5417US
1N5418US
1N5419US
1N5420US
VRWM
50
100
200
400
500
600
V
Maximum Reverse Recovery Time (5) 1N5415US
1N5416US
1N5417US
1N5418US
1N5419US
1N5420US
trr
150
150
150
150
250
400
ns
Solder Temperature @ 10 s
TSP
260
oC
See notes on next page.
T4-LDS-0231-1, Rev. 1 (111902) ©2011 Microsemi Corporation Page 2 of 5
1N5415US thru 1N5420US
MAXIMUM RATINGS
Notes: 1. Derate linearly at 22 mA/oC f or 55 oC < TA < 100 oC.
2. Above TA = 100 oC, derate linearly at 26.7 mA/oC to zero at TA = 175 oC.
3. These ambient ratings are for PC boards where thermal resistance from mounting point to ambient is suffici entl y control l ed where TJ(max)
does not exceed 175 oC.
• CASE: Hermetically sealed voidless hard glass with tungst en sl ugs.
• TERMINALS: End caps are copper with tin/lead (Sn/Pb) finish. Note: Previous inventory had solid silver with tin/lead (Sn/Pb)
finish . RoHS compliant matte-tin is available for commercial grade only.
• MARKING: Cathode band only.
• POLARITY: Cathode indicated by band.
• TAPE & REEL option: Standard per EIA-481-B. Contact factory for quantities.
• WEIGHT: 539 milligrams.
• See Package Dimensions and recommended Pad Layout on last page.
JAN 1N5415 US (e3)
Reliability Level
JAN = JAN Level
JANTX = JANTX Level
JANTXV = JANTXV Level
JANS = JANS Level
Blank = commercial
JEDEC type number
See Electrical Characteristics
table
RoHS Compli ance
e3 = RoHS compliant (available
on commercial grade only)
Blank = non-RoHS compliant
MELF Package
SYMBOLS & DEFINITIONS
Symbol
Definition
VBR
Minimum Breakdown Voltage: The minimum voltage the device will exhibit at a specified current.
VRWM
Working Peak Reverse Voltage: The maximum peak voltage that can be applied over the operating temperature range
excluding all transient voltages (ref JESD282-B).
IO
Average Rectified Output Current: The Output Current averaged over a full cycle with a 50 Hz or 60 Hz sine-wave
input and a 180 degree conduction angle.
VF
Maximum Forward Voltage: The maximum forward voltage the device will exhibit at a specified current.
IR
Maximum Reverse Current: The maximum reverse (leakage) current that will flow at the specified voltage and
temperature.
trr
Reverse Recovery Time: The time interval between the instant the current passes through zero when changing from
the forward direction to the reverse direction and a specified decay point after a peak reverse current occurs.
T4-LDS-0231-1, Rev. 1 (111902) ©2011 Microsemi Corporation Page 3 of 5
1N5415US thru 1N5420US
TYPE
MINIMUM
BREAKDOWN
VOLTAGE
VBR @ 50
µ
A
Volts
FORWARD
VOLTAGE
VF @ 9 A
MAXIMUM
REVERSE
CURRENT
IR @ VRWM
CAPACITANCE
C
VR @ 4 V
pF
MIN.
Volts
MAX.
Volts
25 oC
µA
100 oC
µA
1N5415US
1N5416US
1N5417US
1N5418US
1N5419US
1N5420US
55
110
220
440
550
660
0.6
0.6
0.6
0.6
0.6
0.6
1.5
1.5
1.5
1.5
1.5
1.5
1.0
1.0
1.0
1.0
1.0
1.0
20
20
20
20
20
20
550
430
250
165
140
120
NOTE 1: IF = 0.5 A, IRM = 1 A, IR(REC) = 0.250 A.
T4-LDS-0231-1, Rev. 1 (111902) ©2011 Microsemi Corporation Page 4 of 5
1N5415US thru 1N5420US
% PIV Heating Time (sec)
FIGURE 1 FIGURE 2
Typical Reverse Current vs. PIV Maximum Thermal Impedance
VF – Voltage (V)
FIGURE 3
Typical Forward Current vs. Forward Voltage
I
F
– Current (µA)
Z
ӨJX
(oC/Watt)
I
F
– Current (A)
T4-LDS-0231-1, Rev. 1 (111902) ©2011 Microsemi Corporation Page 5 of 5
1N5415US thru 1N5420US
NOTES:
1. Dimensions are in inches.
2. Millimeter equivalents are given for general information only.
3. Dimensions are pre-solder dip.
4. Minimum clearance of glass body to mounting surface on all orientations.
5. In accordance with ASME Y14.5M, diameters are equivalent to Φx symbology.
6. This package outline has also previously been identified as “D-5B”.
INCH MILLIMETERS
MIN
MAX
MIN
MAX
BL 0.200 0.225 5.08 5.72
BD 0.137 0.148 3.48 3.76
ECT 0.019 0.028 0.48 0.71
S 0.003 --- 0.08 ---
INCH
MILLIMETERS
A
0.288
7.32
B
0.070
1.78
C
0.155
3.94
Note: If mounting requires adhesive
separate from the solder, an additional
0.080 inch diameter contact may be
placed in the center between the pads
as an optional spot for cement.