TQP3M9008 High Linearity LNA Gain Block RFMD + TriQuint = Qorvo Applications Repeaters Mobile Infrastructure LTE / WCDMA / EDGE / CDMA General Purpose Wireless 3-pin SOT-89 Package Product Features Functional Block Diagram 50 - 4000 MHz 20.6 dB Gain at 1.9 GHz +36 dBm Output IP3 1.3 dB Noise Figure at 1.9 GHz 50 Ohm Cascadable Gain Block Unconditionally stable High input power capability +5 V Single Supply, 85 mA Current SOT-89 Package Backside Paddle - GND General Description 2 GND 3 RF OUT / VDD Pin Configuration The TQP3M9008 is a cascadable, high linearity gain block amplifier in a low-cost surface-mount package. At 1.9 GHz, the amplifier typically provides 20.6 dB gain, +36 dBm OIP3, and 1.3 dB Noise Figure while only drawing 85 mA current. The device is housed in a leadfree/green/RoHS-compliant industry-standard SOT-89 package using a NiPdAu plating to eliminate the possibility of tin whiskering. The TQP3M9008 has the benefit of having high gain across a broad range of frequencies while also providing very low noise. This allows the device to be used in both receiver and transmitter chains for high performance systems. The amplifier is internally matched using a high performance E-pHEMT process and only requires an external RF choke and blocking/bypass capacitors for operation from a single +5 V supply. The internal active bias circuit also enables stable operation over bias and temperature variations. Pin No. Label 1 2 3 Backside Paddle RF Input GND RF Output / VDD GND Ordering Information Part No. The TQP3M9008 covers the 0.05 - 4 GHz frequency band and is targeted for wireless infrastructure or other applications requiring high linearity and/or low noise figure. Datasheet: Rev O 01-25-16 (c) 2016 TriQuint Semiconductor, Inc 1 RF IN Description TQP3M9008 High Linearity LNA Gain Block TQP3M9008-PCB_IF 0.05 - 0.5 GHz Evaluation Board TQP3M9008-PCB_RF 0.5 - 4.0 GHz Evaluation Board Standard T/R size = 1000 pieces on a 7" reel - 1 of 10 - Disclaimer: Subject to change without notice www.triquint.com / www.qorvo.com TQP3M9008 High Linearity LNA Gain Block RFMD + TriQuint = Qorvo Absolute Maximum Ratings Recommended Operating Conditions Parameter Parameter Min Typ Max Units Device Voltage (VDD) TCASE Tj for >106 hours MTTF +3.0 -40 +5.0 +5.25 +105 +190 Rating Storage Temperature RF Input Power, CW, 50, T=25C Device Voltage (VDD) Reverse Device Voltage -65 to 150 C +23 dBm +7 V -0.3 V Operation of this device outside the parameter ranges given above may cause permanent damage. V C C Electrical specifications are measured at specified test conditions. Specifications are not guaranteed over all recommended operating conditions. Electrical Specifications Test conditions unless otherwise noted: VDD = +5 V, Temp. = +25 C, 50 system Parameter Operational Frequency Range Test Frequency Gain Input Return Loss Output Return Loss Output P1dB Output IP3 Noise Figure Current, IDD Thermal Resistance, jc Datasheet: Rev O 01-25-16 (c) 2016 TriQuint Semiconductor, Inc Conditions Min Typ 50 19 Pout = +3 dBm/tone, f = 1 MHz Junction to case - 2 of 10 - +32.5 1900 20.6 16 17 +20 +36 1.3 85 Max Units 4000 MHz MHz dB dB dB dBm dBm dB mA C/W 22 100 38.7 Disclaimer: Subject to change without notice www.triquint.com / www.qorvo.com TQP3M9008 High Linearity LNA Gain Block RFMD + TriQuint = Qorvo S-Parameters Test Conditions: VDD = +5 V, IDD = 85 mA, Temp. = +25 C, 50 system, calibrated to device leads Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S22 (dB) S22 (ang) 50 -12.5 -170.0 23.6 172.9 -26.7 0.6 -9.8 177.2 100 -11.9 -175.1 23.5 167.7 -26.7 200 -11.4 178.0 23.1 159.5 -26.6 -1.9 -9.9 171.9 -5.5 -10.0 162.2 400 -11.4 167.0 22.7 144.1 600 -11.6 154.1 22.3 129.4 -26.7 -12.9 -10.5 145.5 -26.7 -19.6 -10.7 129.3 800 -11.8 147.2 22.0 114.6 -26.7 -26.1 -11.3 111.8 1000 -12.3 139.1 1200 -12.7 132.1 21.7 99.5 -26.8 -33.4 -12.4 94.3 21.4 85.6 -26.9 -39.9 -13.1 77.8 1400 -13.3 1600 -13.6 126.3 21.0 71.0 -27.1 -47.7 -14.3 58.7 116.9 20.8 56.2 -27.4 -56.5 -15.4 36.8 1800 -13.9 110.2 20.5 41.8 -27.6 -63.3 -16.3 15.3 2000 -14.3 103.5 20.3 27.9 -28.1 -71.6 -17.5 -11.2 2200 -15.1 94.6 19.9 13.8 -28.5 -80.2 -18.0 -39.1 2400 -15.8 85.2 19.7 -1.1 -28.7 -88.9 -17.4 -65.9 2600 -16.8 72.7 19.5 -16.0 -29.4 -96.8 -16.6 -94.2 2800 -18.0 55.2 19.2 -31.3 -29.9 -105.7 -14.9 -115.0 3000 -19.8 25.5 19.0 -46.9 -30.6 -117.1 -14.1 -131.7 3200 -19.9 -16.8 18.6 -63.5 -31.0 -128.0 -13.1 -148.3 3400 -17.8 -59.0 18.3 -80.5 -31.8 -139.4 -12.4 -160.2 3600 -14.3 -90.8 17.7 -98.5 -32.8 -154.4 -11.9 -173.9 3800 -11.3 -114.3 17.0 -117.1 -34.0 -168.1 -11.2 174.5 4000 -8.7 -132.7 16.1 -135.8 -34.8 173.1 -10.7 167.6 Datasheet: Rev O 01-25-16 (c) 2016 TriQuint Semiconductor, Inc - 3 of 10 - S12 (ang) Disclaimer: Subject to change without notice www.triquint.com / www.qorvo.com TQP3M9008 High Linearity LNA Gain Block RFMD + TriQuint = Qorvo TQP3M9008-PCB_IF / RF Evaluation Board J3 J4 J3 VDD R1 0 J4 GND R1 C3 L1 C3 Q1 C1 L1 C2 J1 C1 C2 1 Q1 RF Input J2 3 RF Output 2, Backside Paddle Notes: 1. See Evaluation Board PCB section for material and stack-up. 2. Components shown on the silkscreen but not on the schematic are not used. 3. R1 (0 jumper) may be replaced with copper trace in the target application layout. 4. The recommended component values are dependent upon the frequency of operation. 5. All components are of 0603 size unless stated on the schematic. Bill of Material - TQP3M9008-PCB_IF / RF Reference Designation Q1 C1, C2 C3 L1 D1 R1 TQP3M9008-PCB_IF 50 - 500 MHz TQP3M9008-PCB_RF 500 - 4000 MHz TQP3M9008 1000 pF 0.01 uF 330 nH TQP3M9008 100 pF 0.01 uF 68 nH Do Not Place 0 Performance can be optimized at frequency of interest by using recommended component values shown in the table below. Reference Designation C1, C2 L1 Datasheet: Rev O 01-25-16 (c) 2016 TriQuint Semiconductor, Inc 500 100 pF 82 nH Frequency (MHz) 2000 2500 3500 22 pF 22 nH 22 pF 15 nH - 4 of 10 - 22 pF 18 nH Disclaimer: Subject to change without notice www.triquint.com / www.qorvo.com TQP3M9008 High Linearity LNA Gain Block RFMD + TriQuint = Qorvo Typical Performance - TQP3M9008-PCB_RF Test conditions unless otherwise noted: VDD=+5 V, IDD=85 mA, Temp=+25 C, 50 system Parameter Units Typical Value Frequency Gain Input Return Loss Output Return Loss Output P1dB OIP3 Noise figure 500 22.8 10 9.5 +20.9 +37.5 1.1 900 22.3 12 12 +19.7 +37.6 1.1 1900 20.6 16 17 +19.9 +36 1.3 2700 19.0 18 13 +19.4 +35.3 1.6 3500 17.6 10 12.4 +19.7 +34.7 2 4000 16.0 7.3 14 +18.5 +33.7 2.5 MHz dB dB dB dBm dBm dB Notes: 1. OIP3 measured with two tones at an output power of +3 dBm / tone separated by 1 MHz. 2. Noise figure values in the table above includes board losses. Approx. =0.1dB at 2 GHz. Performance Plots - TQP3M9008-PCB_RF Test conditions unless otherwise noted: VDD = +5 V, IDD = 85 mA, Temp. = +25 C, 50 system 0 -40C -20C +25C +85C +85 C +25 C -40 C -20C -10 18 -15 16 -20 1000 1500 2000 2500 3000 3500 4000 -20 500 1000 1500 2500 3000 3500 OIP3 vs. Pout/tone over Temp Noise Figure vs. Frequency over Temp 4 OIP3 (dBm) 2 1 0 2500 3000 Frequency (MHz) Datasheet: Rev O 01-25-16 (c) 2016 TriQuint Semiconductor, Inc 3500 4000 3500 4000 1 MHz tone spacing, 3 dBm/tone +25 C +85 C -40 C +25 C +85 C -40 C 40 35 35 30 25 2000 2000 2500 3000 Frequency (MHz) OIP3 vs. Frequency over Temp 30 1500 1500 45 40 +85 C +25 C -40 C 1000 1000 F=1900 MHz, 1 MHz tone spacing 45 500 500 4000 Frequency (MHz) Frequency (MHz) 3 2000 OIP3 (dBm) 500 -10 -15 -25 14 -40 C -20 C +25 C +85C -5 S22 (dB) 20 0 -5 S11 (dB) Gain (dB) 22 NF (dB) S22 vs. Frequency over Temp S11 vs. Frequency over Temp Gain vs. Frequency over Temp 24 25 0 3 6 Pout/tone (dBm) - 5 of 10 - 9 12 500 1000 1500 2000 2500 3000 Frequency (MHz) 3500 4000 Disclaimer: Subject to change without notice www.triquint.com / www.qorvo.com TQP3M9008 High Linearity LNA Gain Block RFMD + TriQuint = Qorvo Performance Plots - TQP3M9008-PCB_RF Test conditions unless otherwise noted: VDD = +5 V, IDD = 85 mA, Temp. = +25 C, 50 system P1dB vs. Frequency over Temp OIP2 vs. Frequency 55 22 Compression Curve 32 Pout = 3 dBm / tone, 1 MHz spacing, +5V, +25C TQP3M9008_PCB-RF Freq.=500 MHz 50 28 Temp.=+25C 18 -40 C +25 C +85 C 16 45 Pout (dBm) OIP2 (dBm) P1dB (dBm) 20 40 1500 2000 2500 3000 3500 4000 0 500 1000 1500 OIP3 vs. Vdd 45 2000 2500 3000 3500 12 4000 -10 -6 -4 P1dB vs. Vdd 30 -2 0 2 4 6 8 10 12 14 Pin (dBm) Noise Figure vs. Vdd 3.0 Pout/tone = 3dBm Tone spacing = 1MHz 2.5 25 35 1900 MHz 900 MHz 2.0 NF (dB) 1900MHz 900MHz P1dB (dBm) OIP3 (dBm) -8 Frequency (MHz) Frequency (MHz) 40 P10dB 16 30 1000 20 P1dB 35 14 500 24 20 1900MHz 900MHz 1.5 1.0 30 15 25 10 0.5 3 4 5 6 7 0.0 3 4 5 Vdd (Volts) 6 3 4 5 6 7 Vdd (Volts) Idd vs. Temperature Idd vs Vdd 90 CW Signal 90 85 85 Idd (mA) Idd (mA) 7 Vdd (Volts) 80 75 80 75 70 70 65 3 4 5 6 7 Vdd (Volts) Datasheet: Rev O 01-25-16 (c) 2016 TriQuint Semiconductor, Inc -40 -15 10 35 60 85 Temperature (C) - 6 of 10 - Disclaimer: Subject to change without notice www.triquint.com / www.qorvo.com TQP3M9008 High Linearity LNA Gain Block RFMD + TriQuint = Qorvo Typical Performance - TQP3M9008-PCB_IF Test conditions unless otherwise noted: VDD = +5 V, IDD = 85 mA, Temp. = +25 C, 50 system Parameter Units Typical Value Frequency Gain Input Return Loss Output Return Loss Output P1dB OIP3 Noise figure 70 23.2 10 9 +19.8 +37 1.2 100 23.2 11 9 +20.2 +37 1.1 200 22.9 11 10 +19.9 +37 0.8 500 22.3 11 10 +19.9 +37 1.1 MHz dB dB dB dBm dBm dB Notes: 1. OIP3 measured with two tones at an output power of +3 dBm / tone separated by 1 MHz. 2. Noise figure values in the table above includes board losses. Approx. =0.1dB at 2 GHz. Performance Plots - TQP3M9008-PCB_IF Test conditions unless otherwise noted: VDD =+5 V, IDD =85 mA, Temp= +25 C, 50 system. 0 0 -40 C -20 C +25 C +85 C S11 (dB) -5 21 -40C -20C +25C +85C 19 -10 -20 -20 15 0 100 200 300 400 500 0 100 Frequency (MHz) 200 300 Frequency (MHz) 400 0 500 100 300 400 500 OIP3 vs. Frequency over Temp 1 MHz tone spacing, 3 dBm/tone 45 3 -40 C +25 C +85 C 40 OIP3 (dBm) +85 C +25 C -40 C 2 200 Frequency (MHz) Noise Figure vs. Frequency over Temp 4 NF (dB) -10 -15 -15 17 -20 C -40 C +25 C +85C -5 S22 (dB) 23 Gain (dB) S22 vs. Frequency over Temp S11 vs. Frequency over Temp Gain vs. Frequency over Temp 25 1 35 30 25 0 0 100 200 300 400 0 500 100 200 300 400 500 Frequency (MHz) Frequency (MHz) P1dB vs. Frequency over Temp 22 Compression Curve 32 TQP3M9008_PCB-IF Freq.=500 MHz 28 Temp.=+25C Pout (dBm) P1dB (dBm) 20 18 -40 C +25 C +85 C 16 24 20 P10dB P1dB 16 14 0 100 200 300 400 500 12 Datasheet: Rev O 01-25-16 (c) 2016 TriQuint Semiconductor, Inc -10 -8 -6 -4 -2 0 2 4 6 8 10 12 14 Pin (dBm) Frequency (MHz) - 7 of 10 - Disclaimer: Subject to change without notice www.triquint.com / www.qorvo.com TQP3M9008 High Linearity LNA Gain Block RFMD + TriQuint = Qorvo Pin Configuration and Description Backside Paddle - GND 1 2 RF IN GND 3 RF OUT / VDD Pin No. Label Description 1 RF IN 2, Backside Paddle GND RF input; matched to 50 ohms. External DC Block is required. RF/DC ground. Use recommended via pattern to minimize inductance and 3 RF OUT / VDD thermal resistance. See PCB Mounting Pattern for suggested footprint. RF output, matched to 50 ohms. External DC Block and bias voltage required. Evaluation Board PCB Qorvo PCB 1075825 Material and Stack-up 1 oz. Cu top layer Nelco N-4000-13 1 oz. Cu inner layer 0.062" 0.006" Finished Board Thickness Core 1 oz. Cu inner layer Nelco N-4000-13 1 oz. Cu bottom layer 50 ohm line dimensions: width = .028", spacing = .028" Datasheet: Rev O 01-25-16 (c) 2016 TriQuint Semiconductor, Inc - 8 of 10 - Disclaimer: Subject to change without notice www.triquint.com / www.qorvo.com TQP3M9008 High Linearity LNA Gain Block RFMD + TriQuint = Qorvo Package Marking and Dimensions Package Marking Product Identifier: 3M9008 Assembly Code: YXXX 3M9008 YXXX Notes: 1. All dimensions are in millimeters. Angles are in degrees. 2. Dimension and tolerance formats conform to ASME Y14.4M-1994. 3. The terminal #1 identifier and terminal numbering conform to JESD 95-1 SPP-012. 4. Contact plating: NiPdAu PCB Mounting Pattern 3.86 [0.152] 29X 3 1.26 [0.050] 0.63 [0.025] 0.76 [0.030] 4.50 [0.177] O.254 (.010) PLATED THRU VIA HOLES PACKAGE OUTLINE 2X 1.27 [0.050] 2X 0.58 [0.023] 2.65 [0.104] 2X 0.86 [0.034] 0.64 [0.025] 0.86 [0.034] 3.86 [0.152] NOTES: 1. All dimensions are in millimeters[inches]. Angles are in degrees. 2. Use 1 oz. copper minimum for top and bottom layer metal. 3. Vias are required under the backside paddle of this device for proper RF/DC grounding and thermal dissipation. We recommend a 0.35mm (#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of 0.25mm (0.10"). 4. Ensure good package backside paddle solder attach for reliable operation and best electrical performance. 5. Place mounting screws near the part to fasten a back side heat sink. 6. Do not apply solder mask to the back side of the PC board in the heat sink contact region. 7. Ensure that the backside via region makes good physical contact with the heat sink. Datasheet: Rev O 01-25-16 (c) 2016 TriQuint Semiconductor, Inc - 9 of 10 - Disclaimer: Subject to change without notice www.triquint.com / www.qorvo.com TQP3M9008 High Linearity LNA Gain Block RFMD + TriQuint = Qorvo Product Compliance Information ESD Sensitivity Ratings Solderability Compatible with both lead-free (260 C maximum reflow temperature) and tin/lead (245 C maximum reflow temperature) soldering processes. Caution! ESD-Sensitive Device Contact plating: NiPdAu ESD Rating: Value: Test: Standard: Class 1A 250 V to < 500 V Human Body Model (HBM) ESDA/JEDEC Standard JS-001-2012 ESD Rating: Value: Test: Standard: Class C3 1000 V Charged Device Model (CDM) JEDEC Standard JESD22-C101F RoHs Compliance This part is compliant with EU 2002/95/EC RoHS directive (Restrictions on the Use of Certain Hazardous Substances in Electrical and Electronic Equipment). This product also has the following attributes: Lead Free Halogen Free (Chlorine, Bromine) Antimony Free TBBP-A (C15H12Br402) Free PFOS Free SVHC Free MSL Rating MSL Rating: Level 3 Test: 260 C convection reflow Standard: JEDEC Standard IPC/JEDEC J-STD-020 Contact Information For the latest specifications, additional product information, worldwide sales and distribution locations: Web: www.triquint.com Email: customer.support@qorvo.com Tel: 877-800-8584 For information about the merger of RFMD and TriQuint as Qorvo: Web: www.qorvo.com For technical questions and application information: Email: sjcapplications.engineering@qorvo.com Important Notice The information contained herein is believed to be reliable. TriQuint makes no warranties regarding the information contained herein. TriQuint assumes no responsibility or liability whatsoever for any of the information contained herein. TriQuint assumes no responsibility or liability whatsoever for the use of the information contained herein. The information contained herein is provided "AS IS, WHERE IS" and with all faults, and the entire risk associated with such information is entirely with the user. All information contained herein is subject to change without notice. Customers should obtain and verify the latest relevant information before placing orders for TriQuint products. The information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by such information. TriQuint products are not warranted or authorized for use as critical components in medical, life-saving, or life-sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death. Datasheet: Rev O 01-25-16 (c) 2016 TriQuint Semiconductor, Inc - 10 of 10 - Disclaimer: Subject to change without notice www.triquint.com / www.qorvo.com