TQP3M9008
High Linearity LNA Gain Block
Datasheet: Rev O 01-25-16
- 1 of 10 -
Disclaimer: Subject to change without notice
© 2016 TriQuint Semiconductor, Inc
www.triquint.com / www.qorvo.com
RFMD + TriQuint = Qorvo
Applications
Repeaters
Mobile Infrastructure
LTE / WCDMA / EDGE / CDMA
General Purpose Wireless
3-pin SOT-89 Package
Product Features
50 – 4000 MHz
20.6 dB Gain at 1.9 GHz
+36 dBm Output IP3
1.3 dB Noise Figure at 1.9 GHz
50 Ohm Cascadable Gain Block
Unconditionally stable
High input power capability
+5 V Single Supply, 85 mA Current
SOT-89 Package
Functional Block Diagram
Pin Configuration
Pin No.
Label
RF Input
GND
RF Output / VDD
GND
General Description
The TQP3M9008 is a cascadable, high linearity gain
block amplifier in a low-cost surface-mount package. At
1.9 GHz, the amplifier typically provides 20.6 dB gain,
+36 dBm OIP3, and 1.3 dB Noise Figure while only
drawing 85 mA current. The device is housed in a lead-
free/green/RoHS-compliant industry-standard SOT-89
package using a NiPdAu plating to eliminate the
possibility of tin whiskering.
The TQP3M9008 has the benefit of having high gain
across a broad range of frequencies while also providing
very low noise. This allows the device to be used in both
receiver and transmitter chains for high performance
systems. The amplifier is internally matched using a high
performance E-pHEMT process and only requires an
external RF choke and blocking/bypass capacitors for
operation from a single +5 V supply. The internal active
bias circuit also enables stable operation over bias and
temperature variations.
The TQP3M9008 covers the 0.05 – 4 GHz frequency band
and is targeted for wireless infrastructure or other
applications requiring high linearity and/or low noise
figure.
Ordering Information
Part No.
Description
TQP3M9008
High Linearity LNA Gain Block
TQP3M9008-PCB_IF
0.05 – 0.5 GHz Evaluation Board
TQP3M9008-PCB_RF
0.5 – 4.0 GHz Evaluation Board
Standard T/R size = 1000 pieces on a 7” reel
RF IN GND RF OUT / VDD
123
Backside Paddle - GND
TQP3M9008
High Linearity LNA Gain Block
Datasheet: Rev O 01-25-16
- 2 of 10 -
Disclaimer: Subject to change without notice
© 2016 TriQuint Semiconductor, Inc
www.triquint.com / www.qorvo.com
RFMD + TriQuint = Qorvo
Recommended Operating Conditions
Parameter
Min
Typ
Max
Units
Device Voltage (VDD)
+3.0
+5.0
+5.25
V
TCASE
−40
+105
°C
Tj for >106 hours MTTF
+190
°C
Electrical specifications are measured at specified test
conditions. Specifications are not guaranteed over all
recommended operating conditions.
Absolute Maximum Ratings
Parameter
Rating
Storage Temperature
−65 to 150 °C
RF Input Power, CW, 50Ω, T=25°C
+23 dBm
Device Voltage (VDD)
+7 V
Reverse Device Voltage
−0.3 V
Operation of this device outside the parameter ranges
given above may cause permanent damage.
Electrical Specifications
Test conditions unless otherwise noted: VDD = +5 V, Temp. = +25 °C, 50 Ω system
Parameter
Conditions
Min
Typ
Max
Units
Operational Frequency Range
50
4000
MHz
Test Frequency
1900
MHz
Gain
19
20.6
22
dB
Input Return Loss
16
dB
Output Return Loss
17
dB
Output P1dB
+20
dBm
Output IP3
Pout = +3 dBm/tone, ∆f = 1 MHz
+32.5
+36
dBm
Noise Figure
1.3
dB
Current, IDD
85
100
mA
Thermal Resistance, θjc
Junction to case
38.7
°C/W
TQP3M9008
High Linearity LNA Gain Block
Datasheet: Rev O 01-25-16
- 3 of 10 -
Disclaimer: Subject to change without notice
© 2016 TriQuint Semiconductor, Inc
www.triquint.com / www.qorvo.com
RFMD + TriQuint = Qorvo
S-Parameters
Test Conditions: VDD = +5 V, IDD = 85 mA, Temp. = +25 °C, 50 Ω system, calibrated to device leads
Freq (MHz)
S11 (dB)
S11 (ang)
S21 (dB)
S21 (ang)
S12 (dB)
S12 (ang)
S22 (dB)
S22 (ang)
50
-12.5
-170.0
23.6
172.9
-26.7
0.6
-9.8
177.2
100
-11.9
-175.1
23.5
167.7
-26.7
-1.9
-9.9
171.9
200
-11.4
178.0
23.1
159.5
-26.6
-5.5
-10.0
162.2
400
-11.4
167.0
22.7
144.1
-26.7
-12.9
-10.5
145.5
600
-11.6
154.1
22.3
129.4
-26.7
-19.6
-10.7
129.3
800
-11.8
147.2
22.0
114.6
-26.7
-26.1
-11.3
111.8
1000
-12.3
139.1
21.7
99.5
-26.8
-33.4
-12.4
94.3
1200
-12.7
132.1
21.4
85.6
-26.9
-39.9
-13.1
77.8
1400
-13.3
126.3
21.0
71.0
-27.1
-47.7
-14.3
58.7
1600
-13.6
116.9
20.8
56.2
-27.4
-56.5
-15.4
36.8
1800
-13.9
110.2
20.5
41.8
-27.6
-63.3
-16.3
15.3
2000
-14.3
103.5
20.3
27.9
-28.1
-71.6
-17.5
-11.2
2200
-15.1
94.6
19.9
13.8
-28.5
-80.2
-18.0
-39.1
2400
-15.8
85.2
19.7
-1.1
-28.7
-88.9
-17.4
-65.9
2600
-16.8
72.7
19.5
-16.0
-29.4
-96.8
-16.6
-94.2
2800
-18.0
55.2
19.2
-31.3
-29.9
-105.7
-14.9
-115.0
3000
-19.8
25.5
19.0
-46.9
-30.6
-117.1
-14.1
-131.7
3200
-19.9
-16.8
18.6
-63.5
-31.0
-128.0
-13.1
-148.3
3400
-17.8
-59.0
18.3
-80.5
-31.8
-139.4
-12.4
-160.2
3600
-14.3
-90.8
17.7
-98.5
-32.8
-154.4
-11.9
-173.9
3800
-11.3
-114.3
17.0
-117.1
-34.0
-168.1
-11.2
174.5
4000
-8.7
-132.7
16.1
-135.8
-34.8
173.1
-10.7
167.6
TQP3M9008
High Linearity LNA Gain Block
Datasheet: Rev O 01-25-16
- 4 of 10 -
Disclaimer: Subject to change without notice
© 2016 TriQuint Semiconductor, Inc
www.triquint.com / www.qorvo.com
RFMD + TriQuint = Qorvo
TQP3M9008-PCB_IF / RF Evaluation Board
Notes:
1. See Evaluation Board PCB section for material and stack-up.
2. Components shown on the silkscreen but not on the schematic are not used.
3. R1 (0 Ω jumper) may be replaced with copper trace in the target application layout.
4. The recommended component values are dependent upon the frequency of operation.
5. All components are of 0603 size unless stated on the schematic.
Bill of Material − TQP3M9008-PCB_IF / RF
Reference Designation
TQP3M9008-PCB_IF
TQP3M9008-PCB_RF
50 - 500 MHz
500 - 4000 MHz
Q1
TQP3M9008
TQP3M9008
C1, C2
1000 pF
100 pF
C3
0.01 uF
0.01 uF
L1
330 nH
68 nH
D1
Do Not Place
R1
0 Ω
Performance can be optimized at frequency of interest by using recommended component values shown in the table below.
Reference
Designation
Frequency (MHz)
500
2000
2500
3500
C1, C2
100 pF
22 pF
22 pF
22 pF
L1
82 nH
22 nH
18 nH
15 nH
Q1
C2
L1
J3
J4
C1
R1
C3
Q1 J2
RF
Output
J4 GND
J3 VDD
1
2, Backside Paddle
3
J1
RF
Input
L1
R1
0
C2C1
C3
TQP3M9008
High Linearity LNA Gain Block
Datasheet: Rev O 01-25-16
- 5 of 10 -
Disclaimer: Subject to change without notice
© 2016 TriQuint Semiconductor, Inc
www.triquint.com / www.qorvo.com
RFMD + TriQuint = Qorvo
Typical Performance − TQP3M9008-PCB_RF
Test conditions unless otherwise noted: VDD=+5 V, IDD=85 mA, Temp=+25 °C, 50 Ω system
Parameter
Typical Value
Units
Frequency
500
900
1900
2700
3500
4000
MHz
Gain
22.8
22.3
20.6
19.0
17.6
16.0
dB
Input Return Loss
10
12
16
18
10
7.3
dB
Output Return Loss
9.5
12
17
13
12.4
14
dB
Output P1dB
+20.9
+19.7
+19.9
+19.4
+19.7
+18.5
dBm
OIP3
+37.5
+37.6
+36
+35.3
+34.7
+33.7
dBm
Noise figure
1.1
1.1
1.3
1.6
2
2.5
dB
Notes:
1. OIP3 measured with two tones at an output power of +3 dBm / tone separated by 1 MHz.
2. Noise figure values in the table above includes board losses. Approx. =0.1dB at 2 GHz.
Performance Plots − TQP3M9008-PCB_RF
Test conditions unless otherwise noted: VDD = +5 V, IDD = 85 mA, Temp. = +25 °C, 50 Ω system
14
16
18
20
22
24
500 1000 1500 2000 2500 3000 3500 4000
Gain (dB)
Frequency (MHz)
Gain vs. Frequency over Temp
-40°C
-20°C
+25°C
+85⁰C
-25
-20
-15
-10
-5
0
500 1000 1500 2000 2500 3000 3500 4000
S11 (dB)
Frequency (MHz)
S11 vs. Frequency over Temp
+85 C
+25 C
-40 C
-20⁰C
-20
-15
-10
-5
0
500 1000 1500 2000 2500 3000 3500 4000
S22 (dB)
Frequency (MHz)
S22 vs. Frequency over Temp
-40 C
-20 C
+25 C
+85⁰C
0
1
2
3
4
500 1000 1500 2000 2500 3000 3500 4000
NF (dB)
Frequency (MHz)
Noise Figure vs. Frequency over Temp
+85 C
+25 C
-40 C
25
30
35
40
45
0 3 6 9 12
OIP3 (dBm)
Pout/tone (dBm)
OIP3 vs. Pout/tone over Temp
F=1900 MHz, 1 MHz tone spacing
+25 C
+85 C
-40 C
25
30
35
40
45
500 1000 1500 2000 2500 3000 3500 4000
OIP3 (dBm)
Frequency (MHz)
OIP3 vs. Frequency over Temp
1 MHz tone spacing, 3 dBm/tone
+25 C
+85 C
-40 C
TQP3M9008
High Linearity LNA Gain Block
Datasheet: Rev O 01-25-16
- 6 of 10 -
Disclaimer: Subject to change without notice
© 2016 TriQuint Semiconductor, Inc
www.triquint.com / www.qorvo.com
RFMD + TriQuint = Qorvo
Performance Plots − TQP3M9008-PCB_RF
Test conditions unless otherwise noted: VDD = +5 V, IDD = 85 mA, Temp. = +25 °C, 50 Ω system
14
16
18
20
22
500 1000 1500 2000 2500 3000 3500 4000
P1dB (dBm)
Frequency (MHz)
P1dB vs. Frequency over Temp
-40 C
+25 C
+85 C
30
35
40
45
50
55
0500 1000 1500 2000 2500 3000 3500 4000
OIP2 (dBm)
Frequency (MHz)
OIP2 vs. Frequency
Pout = 3 dBm / tone, 1 MHz spacing, +5V, +25C
12
16
20
24
28
32
-10 -8 -6 -4 -2 0 2 4 6 8 10 12 14
Pout (dBm)
Pin (dBm)
Compression Curve
Temp.=+25°C
P1dB
P10dB
TQP3M9008_PCB-RF
Freq.=500 MHz
25
30
35
40
45
34567
OIP3 (dBm)
Vdd (Volts)
OIP3 vs. Vdd
1900MHz
900MHz
Pout/tone = 3dBm
Tone spacing = 1MHz
10
15
20
25
30
34567
P1dB (dBm)
Vdd (Volts)
P1dB vs. Vdd
1900 MHz
900 MHz
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3 4 5 6 7
NF (dB)
Vdd (Volts)
Noise Figure vs. Vdd
1900MHz
900MHz
65
70
75
80
85
90
3 4 5 6 7
Idd (mA)
Vdd (Volts)
Idd vs Vdd
70
75
80
85
90
-40 -15 10 35 60 85
Idd (mA)
Temperature (°C)
Idd vs. Temperature
CW Signal
TQP3M9008
High Linearity LNA Gain Block
Datasheet: Rev O 01-25-16
- 7 of 10 -
Disclaimer: Subject to change without notice
© 2016 TriQuint Semiconductor, Inc
www.triquint.com / www.qorvo.com
RFMD + TriQuint = Qorvo
Performance Plots − TQP3M9008-PCB_IF
Test conditions unless otherwise noted: VDD =+5 V, IDD =85 mA, Temp= +25 °C, 50 Ω system.
Typical Performance − TQP3M9008-PCB_IF
Test conditions unless otherwise noted: VDD = +5 V, IDD = 85 mA, Temp. = +25 °C, 50 Ω system
Parameter
Typical Value
Units
Frequency
70
100
200
500
MHz
Gain
23.2
23.2
22.9
22.3
dB
Input Return Loss
10
11
11
11
dB
Output Return Loss
9
9
10
10
dB
Output P1dB
+19.8
+20.2
+19.9
+19.9
dBm
OIP3
+37
+37
+37
+37
dBm
Noise figure
1.2
1.1
0.8
1.1
dB
Notes:
1. OIP3 measured with two tones at an output power of +3 dBm / tone separated by 1 MHz.
2. Noise figure values in the table above includes board losses. Approx. =0.1dB at 2 GHz.
15
17
19
21
23
25
0100 200 300 400 500
Gain (dB)
Frequency (MHz)
Gain vs. Frequency over Temp
-40°C
-20°C
+25°C
+85⁰C
-20
-15
-10
-5
0
0100 200 300 400 500
S11 (dB)
Frequency (MHz)
S11 vs. Frequency over Temp
-40 ⁰C
-20 C
+25 C
+85 C
-20
-15
-10
-5
0
0100 200 300 400 500
S22 (dB)
Frequency (MHz)
S22 vs. Frequency over Temp
-20 C
-40 C
+25 C
+85⁰C
0
1
2
3
4
0100 200 300 400 500
NF (dB)
Frequency (MHz)
Noise Figure vs. Frequency over Temp
+85 C
+25 C
-40 C
25
30
35
40
45
0100 200 300 400 500
OIP3 (dBm)
Frequency (MHz)
OIP3 vs. Frequency over Temp
1 MHz tone spacing, 3 dBm/tone
-40 C
+25 C
+85 C
14
16
18
20
22
0100 200 300 400 500
P1dB (dBm)
Frequency (MHz)
P1dB vs. Frequency over Temp
-40 C
+25 C
+85 C
12
16
20
24
28
32
-10 -8 -6 -4 -2 0 2 4 6 8 10 12 14
Pout (dBm)
Pin (dBm)
Compression Curve
TQP3M9008_PCB-IF
Freq.=500 MHz
Temp.=+25°C
P1dB
P10dB
TQP3M9008
High Linearity LNA Gain Block
Datasheet: Rev O 01-25-16
- 8 of 10 -
Disclaimer: Subject to change without notice
© 2016 TriQuint Semiconductor, Inc
www.triquint.com / www.qorvo.com
RFMD + TriQuint = Qorvo
Pin Configuration and Description
Pin No.
Label
Description
1
RF IN
RF input; matched to 50 ohms. External DC Block is required.
2, Backside Paddle
GND
RF/DC ground. Use recommended via pattern to minimize inductance and
thermal resistance. See PCB Mounting Pattern for suggested footprint.
3
RF OUT / VDD
RF output, matched to 50 ohms. External DC Block and bias voltage required.
Evaluation Board PCB
Qorvo PCB 1075825 Material and Stack-up
50 ohm line dimensions: width = .028”, spacing = .028”
RF IN GND RF OUT / VDD
123
Backside Paddle - GND
1 oz. Cu bottom layer
Nelco N-4000-13
Core
Nelco N-4000-13 1 oz. Cu top layer
1 oz. Cu inner layer
1 oz. Cu inner layer
0.062" ± 0.006"
Finished Board
Thickness
TQP3M9008
High Linearity LNA Gain Block
Datasheet: Rev O 01-25-16
- 9 of 10 -
Disclaimer: Subject to change without notice
© 2016 TriQuint Semiconductor, Inc
www.triquint.com / www.qorvo.com
RFMD + TriQuint = Qorvo
Package Marking and Dimensions
Notes:
1. All dimensions are in millimeters. Angles are in degrees.
2. Dimension and tolerance formats conform to ASME Y14.4M-1994.
3. The terminal #1 identifier and terminal numbering conform to JESD 95-1 SPP-012.
4. Contact plating: NiPdAu
PCB Mounting Pattern
3M9008
YXXX
Package Marking
Product Identifier: 3M9008
Assembly Code: YXXX
3.86 [0.152]
0.64 [0.025] 2X 0.86 [0.034]
0.76 [0.030]
0.63 [0.025]
Ø.254 (.010) PLATED THRU VIA HOLES
1.26 [0.050]
2X 1.27 [0.050]
0.86 [0.034]
2X 0.58 [0.023]
4.50 [0.177]
2.65 [0.104]
PACKAGE OUTLINE
3.86 [0.152]
29X 3
NOTES:
1. All dimensions are in millimeters[inches]. Angles are in degrees.
2. Use 1 oz. copper minimum for top and bottom layer metal.
3. Vias are required under the backside paddle of this device for proper RF/DC grounding and thermal dissipation. We
recommend a 0.35mm (#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of 0.25mm (0.10”).
4. Ensure good package backside paddle solder attach for reliable operation and best electrical performance.
5. Place mounting screws near the part to fasten a back side heat sink.
6. Do not apply solder mask to the back side of the PC board in the heat sink contact region.
7. Ensure that the backside via region makes good physical contact with the heat sink.
TQP3M9008
High Linearity LNA Gain Block
Datasheet: Rev O 01-25-16
- 10 of 10 -
Disclaimer: Subject to change without notice
© 2016 TriQuint Semiconductor, Inc
www.triquint.com / www.qorvo.com
RFMD + TriQuint = Qorvo
Product Compliance Information
ESD Sensitivity Ratings
Caution! ESD-Sensitive Device
ESD Rating: Class 1A
Value:  250 V to < 500 V
Test: Human Body Model (HBM)
Standard: ESDA/JEDEC Standard JS-001-2012
ESD Rating: Class C3
Value: ≥ 1000 V
Test: Charged Device Model (CDM)
Standard: JEDEC Standard JESD22-C101F
Solderability
Compatible with both lead-free (260 °C maximum reflow
temperature) and tin/lead (245 °C maximum reflow
temperature) soldering processes.
Contact plating: NiPdAu
RoHs Compliance
This part is compliant with EU 2002/95/EC RoHS
directive (Restrictions on the Use of Certain Hazardous
Substances in Electrical and Electronic Equipment).
This product also has the following attributes:
Lead Free
Halogen Free (Chlorine, Bromine)
Antimony Free
TBBP-A (C15H12Br402) Free
PFOS Free
SVHC Free
MSL Rating
MSL Rating: Level 3
Test: 260 °C convection reflow
Standard: JEDEC Standard IPC/JEDEC J-STD-020
Contact Information
For the latest specifications, additional product information, worldwide sales and distribution locations:
Web: www.triquint.com Tel: 877-800-8584
Email: customer.support@qorvo.com
For information about the merger of RFMD and TriQuint as Qorvo:
Web: www.qorvo.com
For technical questions and application information:
Email: sjcapplications.engineering@qorvo.com
Important Notice
The information contained herein is believed to be reliable. TriQuint makes no warranties regarding the information
contained herein. TriQuint assumes no responsibility or liability whatsoever for any of the information contained herein.
TriQuint assumes no responsibility or liability whatsoever for the use of the information contained herein. The information
contained herein is provided "AS IS, WHERE IS" and with all faults, and the entire risk associated with such information
is entirely with the user. All information contained herein is subject to change without notice. Customers should obtain
and verify the latest relevant information before placing orders for TriQuint products. The information contained herein
or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other
intellectual property rights, whether with regard to such information itself or anything described by such information.
TriQuint products are not warranted or authorized for use as critical components in medical, life-saving, or life-sustaining
applications, or other applications where a failure would reasonably be expected to cause severe personal injury or
death.