PRELIMINARY Am486 DX2 3.3-Volt Processor High-Performance, Clock-Doubled, 32-Bit Microprocessor Advanced Micro Devices DISTINCTIVE CHARACTERISTICS Operating voltage range 3.3 V 0.3 V Complete 32-Bit Architecture -- 66-MHz and 80-MHz operating frequencies -- Wide range of chipsets and support available through the AMD(R) FusionPCSM Program -- Address and data buses -- All registers -- 8-, 16-, and 32-bit data types High Integration On-Chip Multiprocessor Support -- 8-Kbyte code and data cache -- Floating-point unit -- Paged, virtual memory management -- Multiprocessor instructions -- Cache consistency protocols -- Support for second-level cache High-Performance Design Standard 168-pin PGA Package -- -- -- -- -- Environmental Protection Agency's "Energy Star" program compliant Frequent instructions execute in one clock 105.6-million bytes/second burst bus at 33 MHz 128-million bytes/second burst bus at 40 MHz Advanced submicron CMOS technology Dynamic bus sizing for 8-, 16-, and 32-bit buses -- Energy management capability provides an excellent base for energy-efficient design -- Works with a variety of energy-efficient, power-managed devices GENERAL DESCRIPTION The clock-doubled Am486DX2 processor is a high-performance 486 desktop solution that provides optimal price/performance for high-end 486 power-managed systems. The Am486DX2 CPU offers superior local bus graphics performance for Microsoft(R) Windows(R). 1x clock also reduces RF emission and simplifies clock generation. The input signal is doubled internally to achieve the maximum 2x operating frequency. The phases of the core clock are controlled by an internal Phase Lock Loop (PLL) circuit. The Am486DX2 processor operates with a 1x clock input. This 1x clock simplifies system design by reducing the clock frequency required by external devices. The This document contains information on a product under development at Advanced Micro Devices. The information is intended to help you evaluate this product. AMD reserves the right to change or discontinue work on this proposed product without notice. Publication# 19200 Rev: D Amendment/0 Issue Date: August 1995 PRELIMINARY AMD BLOCK DIAGRAM Am486 CPU Pipelined 32-Bit Microarchitecture Power Planes 64-Bit Interunit Transfer Bus 32-Bit Data Bus Core Clock 32 32-Bit Data Bus VOLDET VCC, VSS CLKMUL Clock Multiplier CLK 32 Linear Address Bus Barrel Shifter Base/ Index Bus 32 PCD, PWT Segmentation Unit Descriptor Registers Register File 32 Limit and Attribute PLA ALU Cache Unit 2 32 Paging Unit Translation Lookaside Buffer 20 Physical Address 8-Kbyte Cache 128 Micro-instruction Displacement Bus Prefetcher FloatingPoint Register File Central and Protection Test Unit Control ROM 32 32 Write Buffers 4 x 80 Data Bus Transceivers Bus Control Request Sequencer 32 Code Stream FloatingPoint Unit Bus Interface A31-A2, BE3-BE0 Address Drivers Instruction Decode 24 32-byte Code Queue 2 x 16 bytes Decoded Instruction Path Am486DX2 Microprocessor ADS, W/R, D/C, M/IO, PCD, PWT, RDY, LOCK, PLOCK, BOFF, A20M, BREQ, HOLD, HLDA, RESET, INTR, NMI, FERR, IGNNE, UP Burst Bus Control BRDY, BLAST Bus Size Control BS16, BS8 Cache Control KEN, FLUSH, AHOLD, EADS Parity Generation and Control PCHK, DP3-DP0 Boundary Scan Control TDI, TDO TMS, TCK 19200C-001 2 D31-D0 PRELIMINARY AMD ORDERING INFORMATION Standard Products AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is formed by a combination of the elements below. 80486DX2 A -80 N V 8 T CACHE TYPE T = Write-Through CACHE SIZE 8 = 8 Kbytes VOLTAGE V = 3.3-V Core, 5-V Tolerant I/O ICE MICROCODE N = No ICE Microcode SPEED OPTION -66 = 66 MHz -80 = 80 MHz DEVICE NUMBER/DESCRIPTION 80486DX2 Am486DX2 3.3-Volt High-Performance, Clock-Doubled, 32-bit Microprocessor PACKAGE TYPE A = 168-pin PGA (Pin Grid Array) Valid Combinations A 80486DX2 -66 -80 NV8T Valid Combinations Valid Combinations list configurations planned to be supported in volume for this device. Consult the local AMD sales office to confirm availability of specific valid combinations and to check on newly released combinations. Am486DX2 Microprocessor 3 PRELIMINARY AMD CONNECTION DIAGRAMS Am486DX2 CPU Pin Side View 168-Pin PGA (Pin Grid Array) Package 1 2 A27 A26 A28 A25 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 A23 VOLDET A14 VSS A12 VSS VSS VSS VSS VSS A10 VSS A6 A4 ADS VCC VCC A15 VCC VCC VCC VCC A11 A8 VCC A3 BLAST S S VSS A18 INC R R A31 VSS A17 A19 A21 A24 A22 A20 A16 A13 A9 A5 A7 A2 BREQ PLOCK PCHK Q Q D0 A29 A30 HLDA VCC VSS D2 D1 DP0 LOCK M/IO W/R VSS VCC D4 D/C VCC VSS VSS D6 D7 PWT P P N N M M VCC VSS L L VSS VCC D14 BE0 VCC VSS K K INC D5 D16 BE2 BE1 PCD VSS D3 DP2 BRDY VCC VSS VSS VCC D12 INC VCC VSS DP1 D8 D15 KEN RDY BE3 J J H H G G F F VSS VCC D10 HOLD VCC VSS E E D9 D13 D17 A20M D11 D18 CLK VCC VCC D19 D21 VSS VSS D20 D22 TCK D23 BS8 BOFF D D D27 D26 D28 D30 VSS DP3 INC UP D25 VCC D24 VSS INC NC FERR FLUSH RESET BS16 D31 VCC INC VCC INC CLKMUL TMS D29 VSS INC VSS INC C C NMI TDO EADS B B INC TDI IGNNE INTR AHOLD A A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Note: NC = No Connect. To guarantee functionality with future revisions, these pins must not be connected. INC = Internal No Connect. No special requirements. 4 Am486DX2 Microprocessor 16 17 19200C-002 PRELIMINARY AMD CONNECTION DIAGRAMS Am486DX2 CPU Top Side View 168-Pin PGA (Pin Grid Array) Package 17 16 15 14 13 12 ADS A4 A6 VSS A10 VSS 11 10 9 VSS VSS VSS 8 7 VSS A12 6 VSS 5 4 3 A14 VOLDET A23 2 1 A26 A27 S S INC BLAST A3 VCC A8 A11 VCC VCC VCC VCC A15 VCC A18 VSS VCC A25 A28 R R PCHK PLOCK BREQ A2 A7 A5 A9 A13 A16 A20 A22 A24 A21 A19 A17 VSS A31 Q Q VSS VCC HLDA A30 A29 D0 P P W/R M/IO LOCK DP0 D1 D2 VSS VCC D/C D4 VCC VSS N N M M VSS VCC VSS VCC PCD BE1 PWT D7 D6 VSS D14 VCC VSS D5 INC L L BE0 K K BE2 D16 J J VSS VCC BRDY DP2 D3 VSS VSS VCC INC D12 VCC VSS BE3 RDY KEN D15 D8 DP1 VCC HOLD D10 VCC VSS BS8 D17 D13 D9 H H G G F F VSS E E BOFF A20M D D BS16 RESET FLUSH FERR NC INC UP INC TMS CLKMUL INC VCC INC D30 D28 D26 D27 VCC D31 VCC D25 VSS VCC CLK D18 D11 VSS VSS D21 D19 C C EADS TDO NMI VCC B B AHOLD INTR IGNNE TDI INC INC VSS INC VSS D29 VSS D24 DP3 D23 TCK D22 D20 A A 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 Note: NC = No Connect. To guarantee functionality with future revisions, these pins must not be connected. INC = Internal No Connect. No special requirements. Am486DX2 Microprocessor 2 1 19200C-003 5 PRELIMINARY AMD PIN DESIGNATIONS (Functional Grouping) Address Data Control Pin Name Pin No. Pin Name Pin No. Pin Name A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 A21 A22 A23 A24 A25 A26 A27 A28 A29 A30 A31 Q-14 R-15 S-16 Q-12 S-15 Q-13 R-13 Q-11 S-13 R-12 S-7 Q-10 S-5 R-7 Q-9 Q-3 R-5 Q-4 Q-8 Q-5 Q-7 S-3 Q-6 R-2 S-2 S-1 R-1 P-2 P-3 Q-1 D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 D16 D17 D18 D19 D20 D21 D22 D23 D24 D25 D26 D27 D28 D29 D30 D31 P-1 N-2 N-1 H-2 M-3 J-2 L-2 L-3 F-2 D-1 E-3 C-1 G-3 D-2 K-3 F-3 J-3 D-3 C-2 B-1 A-1 B-2 A-2 A-4 A-6 B-6 C-7 C-6 C-8 A-8 C-9 B-8 A20M ADS AHOLD BE0 BE1 BE2 BE3 BLAST BOFF BRDY BREQ BS8 BS16 CLK CLKMUL D/C DP0 DP1 DP2 DP3 EADS FERR FLUSH HLDA HOLD IGNNE INTR KEN LOCK M/IO NMI PCD PCHK PWT PLOCK RDY RESET UP VOLDET W/R Test Pin No. D-15 S-17 A-17 K-15 J-16 J-15 F-17 R-16 D-17 H-15 Q-15 D-16 C-17 C-3 B-13 M-15 N-3 F-1 H-3 A-5 B-17 C-14 C-15 P-15 E-15 A-15 A-16 F-15 N-15 N-16 B-15 J-17 Q-17 L-15 Q-16 F-16 C-16 C-11 S-4 N-17 Vcc Vss Pin No. Pin Name Pin No. Pin No. Pin No. TCK TDI TDO TMS A-3 A-14 B-16 B-14 A-10 A-12 A-13 B-10 B-12 C-10 C-12 C-13 G-15 J-1 R-17 B-7 B-9 B-11 C-4 C-5 E-2 E-16 G-2 G-16 H-16 K-2 K-16 L-16 M-2 M-16 P-16 R-3 R-6 R-8 R-9 R-10 R-11 R-14 Notes: INC = Internal No Connect (A-10, A-12, A-13, B-10, B-12, C-10, C-12, G-15, J-1, R-17). NC = No Connect (C-13). VOLDET is connected internally to VSS. CLKMUL must be connected externally to VSS. 6 INC/NC Am486DX2 Microprocessor A-7 A-9 A-11 B-3 B-4 B-5 E-1 E-17 G-1 G-17 H-1 H-17 K-1 K-17 L-1 L-17 M-1 M-17 P-17 Q-2 R-4 S-6 S-8 S-9 S-10 S-11 S-12 S-14 PRELIMINARY AMD LOGIC SYMBOL D31-D0 32 DP3-DP0 4 CLKMUL 28 A31-A4 2 A3-A2 4 BE3-BE0 PCHK BRDY BLAST BS8 Bus Cycle Control BS16 ADS READY Am486 CPU PWT PCD M/IO D/C Bus Cycle Definition W/R LOCK PLOCK KEN FLUSH AHOLD EADS Interrupts Data Bus A20M Address Mask Clock Multiplier Address Bus VOLDET CLK Clock Data Parity Burst Control Page Cacheability Cache Control/ Invalidation INTR NMI RESET HOLD BOFF BREQ HLDA Bus Arbitration IGNNE FERR TCK Numeric Error Reporting Am486DX2 Microprocessor TDI TMS TDO 17852B-114 IEEE Test Access Port 7 PRELIMINARY AMD PIN DESCRIPTIONS The following paragraphs define the Am486DX2 CPU pins (signals). A31-A4/A3-A2 Address Lines (Inputs/Outputs)/(Outputs) A31-A2, together with the byte enables BE3-BE0, define the physical area of memory or input/output space accessed. Address lines A31-A4 are used to drive addresses into the microprocessor to perform cache line invalidations. Input signals must meet setup and hold times t22 and t23. A31-A2 are not driven during bus or address hold. A20M The Am486DX2 microprocessor provides four special bus cycles to indicate that certain instructions have been executed, or certain conditions have occurred internally. The special bus cycles (in Table 1) are defined when the bus cycle definition pins are in the following state: M/IO=0, D/C=0, and W/R=1. During these cycles, the address bus is driven Low while the data bus is undefined. The external hardware must acknowledge these special bus cycles by returning RDY and BRDY. ---------------------------------------------------------------------------------------------------------------------------- Table 1. Special Bus Cycle Encoding BE3 BE2 BE1 BE0 Special Bus Cycles Address Bit 20 Mask (Active Low; Input) 1 1 1 0 Shutdown When asserted, the Am486DX2 microprocessor masks physical address bit 20 (A20) before performing a lookup to the internal cache or driving a memory cycle on the bus. A20M emulates the address wraparound at 1 Mbyte, which occurs on the 8086. A20M is active Low and should be asserted only when the processor is in Real mode. This pin is asynchronous but should meet setup and hold times t20 and t21 for recognition in any specific clock. For proper operation, A20M should be sampled High at the falling edge of RESET. 1 1 0 1 Flush 1 0 1 1 Halt 0 1 1 1 Write Back ---------------------------------------------------------------------------------------------------------------------------- BS8/ BS16 Bus Size 8 (Active Low; Input)/ Bus Size 16 (Active Low; Input) ADS indicates that a valid bus cycle definition and address are available on the cycle definition lines and address bus. ADS is driven active in the same clock as the addresses are driven. ADS is active Low and is not driven during bus hold. These pins cause the Am486DX2 microprocessor to run multiple bus cycles to complete a request from devices that cannot provide or accept 32 bits of data in a single cycle. The bus sizing pins are sampled every clock. The state of these pins in the clock before RDY is used by the Am486DX2 microprocessor to determine the bus size. These signals are active Low and are provided with internal pull-up resistors. These inputs must satisfy setup and hold times t14 and t15 for proper operation. AHOLD BLAST ADS Address Status (Active Low; Output) Address Hold (Active High; Input) Burst Last (Active Low; Output) This request allows another bus master access to the Am486DX2 microprocessor's address bus for a cache invalidation cycle. The Am486DX2 microprocessor stops driving its address bus in the clock following AHOLD going active. Only the address bus is floated during address hold; the remainder of the bus remains active. AHOLD is active High and is provided with a small internal pull-down resistor. For proper operation, AHOLD must meet setup and hold times t18 and t19. BLAST indicates that the next time BRDY is returned, the burst bus cycle is complete. BLAST is active for both burst and non-burst bus cycles. BLAST is active Low and is not driven during bus hold. BE3-BE0 Byte Enables (Active Low; Outputs) These pins indicate active bytes during read and write cycles. During the first cycle of a cache fill, the external system should assume that all byte enables are active. BE3 applies to D31-D24, BE2 applies to D23-D16, BE1 applies to D15-D8, and BE0 applies to D7-D0. BE3- BE0 are active Low and are not driven during bus hold. 8 BOFF Backoff (Active Low; Input) This input pin forces the Am486DX2 microprocessor to float its bus in the next clock. The microprocessor floats all pins normally floated during bus hold, but HLDA is not asserted in response to BOFF. BOFF has higher priority than RDY or BRDY; if both are returned in the same clock, BOFF takes effect. The microprocessor remains in bus hold until BOFF is negated. If a bus cycle is in progress when BOFF is asserted, the cycle is restarted. BOFF is active Low and must meet setup and hold times t18 and t19 for proper operation. Am486DX2 Microprocessor PRELIMINARY AMD The M/IO bus cycle definition pin distinguishes memory cycles (M) from input/output cycles (IO). BRDY Burst Ready Input (Active Low; Input) This input pin performs the same cycle during a burst cycle that RDY performs during a non-burst cycle. BRDY indicates that the external system has presented valid data in response to a read or that the external system has accepted data in response to write. BRDY is ignored when the bus is idle and at the end of the first clock in a bus cycle. BRDY is sampled in the second and subsequent clocks of a burst cycle. The data presented on the data bus is strobed into the microprocessor when BRDY is sampled active. If RDY is returned simultaneously with BRDY, BRDY is ignored and the burst cycle is prematurely aborted. BRDY is active Low and is provided with a small pull-up resistor. BRDY must satisfy the setup and hold times t16 and t17. The W/R bus definition pin distinguishes write cycles from read cycles. BREQ ---------------------------------------------------------------------------------------------------------------------------- Internal Cycle Pending (Active High; Output) DP3-DP0 BREQ indicates that the Am486DX2 microprocessor has internally generated a bus request. BREQ is generated whether or not the Am486DX2 microprocessor is driving the bus. BREQ is active High and is never floated, except for three-state test mode (see FLUSH). Data Parity (Active High; Inputs/Outputs) CLK Clock (Input) CLK is a 1x clock providing the fundamental timing for the bus interface unit and is multiplied in accordance with the CLKMUL pin to provide the internal frequency for the Am486DX2 microprocessor. All external timing parameters are specified with respect to the rising edge of CLK. ---------------------------------------------------------------------------------------------------------------------------- Table 2. Bus Cycle Definition M/IO D/C W/R Bus Cycle Initiated 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 Interrupt Acknowledge Halt/Special Cycle I/O Read I/O Write Code Read Reserved Memory Read Memory Write Data parity is generated on all write data cycles using the same timing as the data lines. Even parity information must be driven back into the microprocessor on the data parity pins with the same timing as read information. This process ensures that the correct parity check status is indicated. The signals read on these pins do not affect program execution. Input signals must meet setup and hold times t22 and t23. DP3-DP0 should be connected to VCC through a pull-up resistor in systems not using parity. DP3-DP0 are active High and are driven during the second and subsequent clocks of write cycles. EADS CLKMUL Valid External Address (Active Low; Input) Clock Multiplier (Input) This pin indicates a valid external address has been driven onto the Am486DX2 microprocessor address pins. This address is used to perform an internal cache invalidation cycle. EADS is active Low and is provided with an internal pull-up resistor. EADS must satisfy setup and hold times t12 and t13, for proper operation. This pin must be connected to VSS for proper operation. D31-D0 Data Lines (Inputs/Outputs) Lines D7-D0 define the least significant data byte and lines D31-D24 define the most significant byte. These signals must meet setup and hold times t22 and t23 for proper operation on reads. The pins are driven during the second and subsequent write cycle clocks. D/C, M/IO, W/R Data/Control, Memory/Input/Output, Write/Read (Active High/Active Low; Output) These are the primary bus definition signals. These signal are driven valid as the ADS signal is asserted. The bus definition signals are not driven during bus hold and follow the timing of the address bus (see Table 2). The D/C bus cycle definition pin distinguishes memory and I/O data cycles (D) from the control cycles (C): interrupt acknowledge, halt, and instruction fetching. FERR Floating-Point Error (Active Low; Output) Driven active when a floating-point error occurs. FERR is similar to the ERROR pin on a 387 math coprocessor. FERR is included for compatibility with systems using DOS-type floating-point error reporting. FERR is active Low, and is not floated during bus hold, except during three-state test mode (see FLUSH). FLUSH Cache Flush (Active Low; Input) FLUSH forces the Am486DX2 microprocessor to flush its entire internal cache. FLUSH is active Low and need only be asserted for one clock. FLUSH is asynchronous but setup and hold times t20 and t21 must be met for Am486DX2 Microprocessor 9 PRELIMINARY AMD recognition in any specific clock. FLUSH being sampled Low in the clock before the falling edge of RESET causes the Am486DX2 microprocessor to enter the three-state test mode. HLDA Hold Acknowledge (Active High; Output) HLDA goes active in response to a hold request presented on the HOLD pin. HLDA indicates that the Am486DX2 microprocessor has given the bus to another local bus master. HLDA is driven active in the same clock that the Am486DX2 microprocessor floats its bus. HLDA is driven inactive when leaving bus hold. HLDA is active High and remains driven during bus hold. HLDA is never floated except during three-state test mode (see FLUSH). HOLD Bus Hold Request (Active High; Input) This input pin allows another bus master complete control of the Am486DX2 microprocessor bus. In response to HOLD going active, the Am486DX2 microprocessor floats most of its output and input/output pins. HLDA is asserted after completing the current bus cycle, burst cycle, or sequence of locked cycles. The Am486DX2 microprocessor remains in this state until HOLD is deasserted. HOLD is active High and is not provided with an internal pull-down resistor. HOLD must satisfy setup and hold times t18 and t19 for proper operation. IGNNE Ignore Numeric Error (Active Low; Input) When this pin is asserted, the Am486DX2 microprocessor will ignore a numeric error and continue executing non-control floating-point instructions. When IGNNE is deasserted, the Am486DX2 microprocessor will freeze on a non-control floating-point instruction if a previous floating-point instruction caused an error. IGNNE has no effect when the NE bit in Control Register 0 is set. IGNNE is active Low and is provided with a small internal pull-up resistor. IGNNE is asynchronous but must meet setup and hold times t20 and t21 to ensure recognition in any specific clock. INTR Maskable Interrupt (Active High; Input) INTR indicates an external interrupt has been generated. If the internal interrupt flag is set in EFLAGS, active interrupt processing is initiated. The Am486DX2 microprocessor generates two locked interrupt acknowledge bus cycles in response to the INTR pin going active. INTR must remain active until the interrupt acknowledges have been performed. This ensures that the interrupt is recognized. INTR is active High and is not provided with an internal pull-down resistor. INTR is asynchronous, but must meet setup and hold times t20 and t21 for recognition in any specific clock. 10 KEN Cache Enable (Active Low; Input) KEN is used to determine whether the current cycle is cacheable. When the Am486DX2 microprocessor generates a cacheable cycle and KEN is active, the cycle becomes a cache line fill cycle. Returning KEN active one clock before RDY during the last read in the cache line fill causes the line to be placed in the on-chip cache. KEN is active Low and is provided with a small internal pull-up resistor. KEN must satisfy setup and hold times t14 and t15 for proper operation. LOCK Bus Lock (Active Low; Output) LOCK indicates the current bus cycle is locked. The Am486DX2 microprocessor does not allow a bus hold when LOCK is asserted (but address holds are allowed). LOCK goes active in the first clock of the first locked bus cycle and goes inactive after the last clock of the last locked bus cycle. The last locked cycle ends when RDY is returned. LOCK is active Low and is not driven during bus hold. Locked read cycles are not transformed into cache fill cycles if KEN is active. NMI Non-Maskable Interrupt (Active High; Input) A high NMI signal indicates that external non-maskable interrupt occurred. NMI is rising edge sensitive, but must be held Low for at least four-CLK periods before the rising edge. NMI does not have an internal pull-down resistor. NMI is asynchronous, but must meet setup and hold times t20 and t21 for recognition in any specific clock. PCD/PWT Page Cache Disable/Page Write-Through (Active High; Outputs) The outputs reflect the state of the page attribute bits PWT and PCD in the page table or page directory entry. If paging is disabled or unpaged cycles occur, PWT and PCD reflect the state of the PWT and PCD bits in Control Register 3. PWT and PCD have the same timing as the cycle definition pins (M/IO, D/C, and W/R). PWT and PCD are active High and are not driven during bus hold. PCD is masked by the Cache Disable Bit (CD) in Control Register 0. PCHK Parity Status (Active Low; Output) For read operations, the parity status is driven on the PCHK pin one clock after RDY for data sampled at the end of the previous clock. A parity error is indicated by PCHK being Low. Parity status is only checked for enabled bytes as indicated by the byte enable and bus size signals. PCHK is valid only in the clock immediately after read data is returned to the microprocessor. At all other times, PCHK is inactive High. PCHK is never floated except during three-state test mode (see FLUSH). Am486DX2 Microprocessor PRELIMINARY AMD PLOCK TDI Pseudo-Lock (Active Low; Output) Test Data Input (Input) PLOCK indicates that the current bus transaction requires more than one bus cycle to complete. Examples of such operations are floating-point long reads and writes (64 bits), segment table descriptor reads (64 bits), and cache line fills (128 bits). The Am486DX2 microprocessor drives PLOCK active until the addresses for the last bus cycle of the transaction have been driven, regardless of whether RDY or BRDY has been returned. Normally, PLOCK and BLAST are inverse of each other. However, during the first bus cycle of a 64-bit floatingpoint write, both PLOCK and BLAST will be asserted. PLOCK is a function of the BS8, BS16, and KEN inputs. PLOCK should be sampled only if the clock RDY is returned. PLOCK is active Low and is not driven during bus hold. TDI is the serial input used to shift JTAG instructions and data into the component. TDI is sampled on the rising edge of TCK, during the SHIFT-IR and the SHIFT-DR TAP controller states. During all other tap controller states, TDI is a "don't care." TDO Test Data Output (Output) TDO is the serial output used to shift JTAG instructions and data out of the component. TDO is driven on the falling edge of TCK during the SHIFT-IR and SHIFT-DR TAP controller states. At all other times, TDO is driven to the high impedance state. TMS Test Mode Select (Input) RESET Reset (Active High; Input) This pin forces the Am486DX2 microprocessor to begin execution at a known state. The microprocessor cannot begin execution of instructions until at least 1 ms after VCC and CLK have reached proper DC and AC specifications. The RESET pin should remain active during this time to ensure proper microprocessor operation. RESET is active High. RESET is asynchronous but must meet setup and hold times t20 and t21 for recognition in any specific clock. RDY Non-Burst Ready (Active Low; Input) This input pin indicates that the current bus cycle is complete. RDY indicates that the external system has presented valid data on the data pins in response to a read, or that the external system has accepted data from the Am486DX2 microprocessor in response to a write. RDY is ignored when the bus is idle and at the end of the bus cycle's first clock. RDY is active during address hold. Data can be returned to the processor while AHOLD is active. RDY is active Low and is not provided with an internal pull-up resistor. RDY must satisfy setup and hold times t16 and t17 for proper chip operation. TMS is decoded by the JTAG TAP (Test Access Port) to select the operation of the test logic. TMS is sampled on the rising edge of TCK. To guarantee deterministic behavior of the TAP controller, TMS is provided with an internal pull-up resistor. UP Upgrade Present (Active Low; Input) The Upgrade Present pin forces the Am486DX2 CPU to three-state all its outputs and enter the power-down mode. When the Upgrade Present pin is sampled asserted by the CPU in the clock before the falling edge of RESET, the power-down mode is enabled. UP has no effect on the power-down status expect during this edge. The CPU is also forced to three-state all of its outputs immediately in response to this signal. The UP signal must remain asserted in order to keep the pins three-state. UP is active Low and is provided with an internal pull-up resistor. VOLDET Voltage Detect (Output) The voltage detect signal allows external system logic to distinguish between a 5-V Am486 processor and the 3.3-V Am486DX2 processor. The signal is active Low for a 3.3-V Am486DX2 processor. TCK Test Clock (Input) Test Clock is an input to the Am486DX2 CPU and provides the clocking function required by the JTAG boundary scan feature. TCK is used to clock state information and data into and out of the component. State select information and data are clocked into the component on the rising edge of TCK on TMS and TDI, respectively. Data is clocked out of the component on the falling edge of TCK on TDO. Am486DX2 Microprocessor 11 PRELIMINARY AMD Table 3. Output Pins Table 5. Input/Output Pins Name Active Level Floated At Name Active Level Floated At BREQ HLDA BE3-BE0 PCD/PWT W/R, D/C, M/IO LOCK PLOCK ADS BLAST PCHK A3-A2 FERR VOLDET High High Low High High Low Low Low Low Low High Low - Three-State Test Mode Three-State Test Mode Bus Hold Bus Hold Bus Hold Bus Hold Bus Hold Bus Hold Bus Hold Three-State Test Mode Bus, Address Hold Three-State Test Mode - D31--D0 DP3-DP0 A31-A4 High High High Bus Hold Bus Hold Bus, Address Hold Table 6. Test Pins Name Input or Output Sampled/Driven On TCK TDI TDO TMS Input Input Output Input N/A Rising Edge of TCK Falling Edge of TCK Rising Edge of TCK Table 4. Input Pins 12 Name Active Level Synchronous/ Asynchronous CLK RESET HOLD AHOLD EADS BOFF FLUSH A20M BS16, BS8 KEN RDY BRDY INTR NMI UP IGNNE CLKMUL - High High High Low Low Low Low Low Low Low Low High High Low Low - - Asynchronous Synchronous Synchronous Synchronous Synchronous Asynchronous Asynchronous Synchronous Synchronous Synchronous Synchronous Asynchronous Asynchronous Asynchronous Asynchronous - Am486DX2 Microprocessor PRELIMINARY AMD CPU IDENTIFICATION CODES The DX register always contains a component identification at the conclusion of RESET. The upper byte of DX (DH) will contain 04 and the lower byte of DX (DL) will contain a CPU type/stepping identifier. Table 7. CPU ID Component ID (DH) Component ID (DL) 04 32 Memory is organized into one or more variable length segments, each up to 4 Gbytes (232 bytes) in size. A segment can have attributes associated with it. These attributes include its location, size, type (i.e., stack, code, or data), and protection characteristics. Each task on an Am486DX2 microprocessor can have a maximum of 16,381 segments, each up to 4 Gbytes in size. Thus, each task has a maximum of 64 Tbytes (terabytes) of virtual memory. The segmentation unit provides four levels of protection for isolating and protecting applications and the operating system from each other. The hardware enforced protection allows high integrity system designs. Table 8. JTAG ID Code Version Code Part Number Code Manufacturer Identity 00h 0432 01 ARCHITECTURAL OVERVIEW The Am486DX2 processor is a 32-bit architecture with on-chip memory management and cache memory units. It is a fully compatible member of the Am486 microprocessor family. On-chip cache memory allows frequently used data and code to be stored on-chip, thereby reducing accesses to the external bus. RISC design techniques are used to reduce instruction cycle times. A burst bus feature enables fast cache fills. The Am486 CPU Memory Management Unit (MMU) consists of a segmentation unit and a paging unit. Segmentation allows management of the logical address space by providing easy data and code relocatibility and efficient sharing of global resources. The paging mechanism operates beneath segmentation and is transparent to the segmentation process. Paging is optional and can be disabled by system software. Each segment can be divided into one or more 4-Kbyte segments. To implement a virtual memory system, the Am486DX2 microprocessor supports full restartability for all page and segment faults. The Am486DX2 microprocessor has three modes of operation: Real Address mode (Real mode), Virtual Address mode (Protected mode), and within Protected mode, tasks may be performed in Virtual 8086 mode. In Real mode, the Am486DX2 microprocessor operates as a very fast 8086. Real mode is required primarily to set up the processor for Protected mode operation. Protected mode provides access to the sophisticated memory management paging and privilege capabilities of the processor. Within Protected mode, software can perform a task switch to enter into tasks designated as Virtual 8086 mode tasks. Each Virtual 8086 task behaves with 8086 semantics, allowing 8086 software (an application program or an entire operating system) to execute. The on-chip cache is 8 Kbytes. It is four-way set associative and follows a write-through policy. The on-chip cache includes features that provide flexibility in external memory system design. Individual pages can be designated as cacheable or non-cacheable by software or hardware. The cache can also be enabled and disabled by software or hardware. Finally, the Am486DX2 microprocessor has features that facilitate high-performance hardware designs. The 2x clock multiplier improves execution performance without increasing the board design complexity. This 2x clock multiplier enhances all operations operating out of the cache and/or not blocked by external bus assesses. The burst bus feature enables fast cache fills. Am486DX2 Microprocessor 13 AMD PRELIMINARY ELECTRICAL DATA The following sections describe recommended electrical connections for the Am486DX2 microprocessor and its electrical specifications. Power and Grounding Power Connections The Am486DX2 microprocessor is implemented in advanced submicron CMOS-process technology and has modest power requirements. However, its high clock frequency output buffers can cause power surges as multiple output buffers drive new signal levels simultaneously. For clean, on-chip power distribution at high frequency, 23 VCC and 28 VSS pins feed the Am486DX2 microprocessor. Power and ground connections must be made to all external VCC and GND pins of the Am486DX2 microprocessor. On the circuit board, all VCC pins must be connected on a VCC plane. All VSS pins must likewise be connected on a GND plane. Power Decoupling Recommendations Liberal decoupling capacitance should be placed near the Am486DX2 CPU. The Am486DX2 microprocessor, driving its 32-bit parallel address and data buses at high frequencies, can cause transient power surges, particularly when driving large capacitive loads. 14 Low inductance capacitors and interconnects are recommended for best high-frequency electrical performance. Inductance can be reduced by shortening circuit board traces between the Am486DX2 microprocessor, and using decoupling capacitors as much as possible. Capacitors specifically for PGA packages are also commercially available. System Clock Recommendations The CLK input to the Am486DX2 processor should not be driven until VCC has reached its normal operating level (3.3 V). Once VCC has reached its normal operating level, the Am486DX2 CPU can handle the clock frequency for which it is specified and the oscillator/clock driver should have locked onto its desired frequency. Other Connection Recommendations NC pins should always remain unconnected. For reliable operation, always connect unused inputs to an appropriate signal level. Active Low inputs should be connected to VCC through a pull-up resistor. Pull-ups in the range of 20 K are recommended. Active High inputs should be connected to GND. Any pin designated as INC is electrically isolated and has no special requirements. Am486DX2 Microprocessor PRELIMINARY AMD ABSOLUTE MAXIMUM RATINGS OPERATING RANGES Case Temperature under Bias ...........-65C to +110C Storage Temperature...........................-65C to +150C Voltage on any pin with respect to ground.............. -0.5 V to VCC +2.6 V Supply voltage with respect to VSS ................................... -0.5 V to +4.6 V Commercial (C) Devices TCASE ....................................................... 0C to +85C VCC .......................................................... 3.3 V 0.3 V Operating Ranges define those limits between which the functionality of the device is guaranteed. Stresses above those listed under Absolute Maximum Ratings may cause permanent device failure. Functionality at or above these limits is not implied. Exposure to Absolute Maximum Ratings for extended periods may affect device reliability. ---------------------------------------------------------------------------------------------------------------------------- DC CHARACTERISTICS over COMMERCIAL operating ranges Functional Operating Range: VCC = 3.3 V 0.3 V. TCASE =0C to +85C. Preliminary Symbol Parameter Description Notes Min Max Unit VIL Input Low Voltage -0.3 +0.8 V VIH Input High Voltage 2.0 VCC+2.4 V VOL Output Low Voltage IOL =(Note 1) 0.45 V VOH Output High Voltage IOH =(Note 2) ICC Power Supply Current (Note 3) 66 MHz (Note 3) 80 MHz 660 800 mA ILI Input Leakage Current (Note 4) (Note 8) 15 50 A A IIH Input Leakage Current (Note 5) 200 A IIL Input Leakage Current (Note 6) -400 A ILO Output Leakage Current (Note 9) (Note 10) 15 50 A A CIN Input Capacitance FC =1 MHz (Note 7) 10 pF CO I/O or Output Capacitance FC =1 MHz (Note 7) 14 pF CLK Capacitance FC =1 MHz (Note 7) 12 pF CCLK 2.4 V Notes: 1. This parameter is measured at: Address, Data, BE3-BE0 4.0 mA Definition, Control 5.0 mA 2. This parameter is measured at: Address, Data, BE3-BE0 -1.0 mA Definition, Control -0.9 mA 3. Typical supply current: 530 mA @ 66 MHz and 640 mA @ 80 MHz. 4. This parameter is for inputs without pull-ups or pull-downs and 0 VIN VCC. 5. This parameter is for inputs with pull-downs and VIH =2.4 V. 6. This parameter is for inputs with pull-ups and VIL =0.45 V. 7. Not 100% tested. 8. This parameter is for inputs without pull-ups or pull-downs and VCC VIN 5 V. 9. This parameter is for three-state outputs where VEXT is driven on the three-state output and 0 VEXT VCC. 10. This parameter is for three-state outputs where VEXT is driven on the three-state output and VCC VEXT 5 V. Am486DX2 Microprocessor 15 AMD PRELIMINARY SWITCHING CHARACTERISTICS The switching characteristics consist of output delays, input setup requirements, and input hold requirements. All switching characteristics are relative to the rising edge of the CLK signal. Switching characteristics measurement is defined by Figures 2-9. Inputs must be driven to the voltage levels indicated by Figure 2 when switching characteristics are measured. 16 Am486DX2 microprocessor delays are specified with minimum and maximum limits. The minimum Am486DX2 processor delay times are hold times provided to external circuitry. Am486DX2 CPU input setup and hold times are specified as minimums, defining the smallest acceptable sampling windows. Within the sampling windows, a synchronous input signal must be stable for correct Am486DX2 microprocessor operation. Am486DX2 Microprocessor PRELIMINARY AMD SWITCHING CHARACTERISTICS over COMMERCIAL operating ranges Switching Characteristics at 66 MHz; TCASE =0C to +85C; CL =50 pF unless otherwise specified. Preliminary Symbol Parameter Description Notes Figure Operating Frequency 2 Min Max Unit 8 33 MHz 30 125 ns 0.1% t1 CLK Period t1a CLK Period Stability Adjacent Clocks t2 CLK High Time @ 2.0 V 2 11 ns t3 CLK Low Time @ 0.8 V 2 11 ns t4 CLK Fall Time 2 3 ns t5 CLK Rise Time 2 3 ns t6 A31-A2, PWT, PCD, M/IO, BE3-BE0, D/C, W/R, ADS, LOCK, FERR, BREQ, HLDA Valid Delay 7 14 ns t7 A31-A2, PWT, PCD, M/IO, BE3-BE0, D/C, W/R, ADS, LOCK, FERR, BREQ, HLDA Float Delay 20 ns t8 PCHK Valid Delay 6 3 14 ns t8a BLAST, PLOCK Valid Delay 7 3 14 ns t9 BLAST, PLOCK Float Delay 20 ns t10 D31-D0, DP3-DP0 Write Data Valid Delay 14 ns t11 D31-D0, DP3-DP0 Write Data Float Delay 20 ns t12 EADS Setup Time 4 5 ns t13 EADS Hold Time 4 3 ns t14 KEN, BS16, BS8 Setup Time 4 5 ns t15 KEN, BS16, BS8 Hold Time 4 3 ns t16 RDY, BRDY Setup Time 5 5 ns t17 RDY, BRDY Hold Time 5 3 ns t18 HOLD, AHOLD Setup Time 4 6 ns t18a BOFF Setup Time 4 7 ns t19 HOLD, AHOLD, BOFF Hold Time 4 3 ns t20 RESET, FLUSH, A20M, NMI, INTR, IGNNE Setup Time 3, 4 5 ns t21 RESET, FLUSH, A20M, NMI, INTR, IGNNE Hold Time 3, 4 3 ns t22 D31-D0, DP3-DP0, A31-A4 Read Setup Time 4, 5 5 ns t23 D31-D0, DP3-DP0, A31-A4 Read Hold Time 4, 5 3 ns (Note 1) (Note 1) 8 8 7 (Note 1) 3 3 8 Note: 1. Not 100% tested. Guaranteed by design characterization. Am486DX2 Microprocessor 17 PRELIMINARY AMD SWITCHING CHARACTERISTICS over COMMERCIAL operating ranges Switching Characteristics at 80 MHz; TCASE =0C to +85C; CL =50 pF unless otherwise specified. Preliminary Symbol Parameter Description Notes Figure Operating Frequency 2 Max Unit 8 40 MHz 25 125 ns 0.1% t1 CLK Period t1a CLK Period Stability Adjacent Clocks t2 CLK High Time @ 2.0 V 2 9 ns t3 CLK Low Time @ 0.8 V 2 9 ns t4 CLK Fall Time 2 3 ns t5 CLK Rise Time 2 3 ns t6 A31-A2, PWT, PCD, M/IO, BE3-BE0, D/C, W/R, ADS, LOCK, FERR, BREQ, HLDA Valid Delay 7 3 14 ns t7 A31-A2, PWT, PCD, M/IO, BE3-BE0, D/C, W/R, ADS, LOCK, FERR, BREQ, HLDA Float Delay 8 3 18 ns t8 PCHK Valid Delay 6 3 16 ns t8a BLAST, PLOCK Valid Delay 7 3 18 ns t9 BLAST, PLOCK Float Delay 8 3 16 ns t10 D31-D0, DP3-DP0 Write Data Valid Delay 7 3 14 ns t11 D31-D0, DP3-DP0 Write Data Float Delay 8 3 18 ns t12 EADS Setup Time 4 5 ns t13 EADS Hold Time 4 3 ns t14 KEN, BS16, BS8 Setup Time 4 5 ns t15 KEN, BS16, BS8 Hold Time 4 3 ns t16 RDY, BRDY Setup Time 5 5 ns t17 RDY, BRDY Hold Time 5 3 ns t18 HOLD, AHOLD Setup Time 4 6 ns t18a BOFF Setup Time 4 8 ns t19 HOLD, AHOLD, BOFF Hold Time 4 3 ns t20 RESET, FLUSH, A20M, NMI, INTR, IGNNE Setup Time 3, 4 5 ns t21 RESET, FLUSH, A20M, NMI, INTR, IGNNE Hold Time 3, 4 3 ns t22 D31-D0, DP3-DP0, A31-A4 Read Setup Time 4, 5 5 ns t23 D31-D0, DP3-DP0, A31-A4 Read Hold Time 4, 5 3 ns (Note 1) (Note 1) (Note 1) Note: 1. Not 100% tested. Guaranteed by design characterization. 18 Min Am486DX2 Microprocessor PRELIMINARY AMD Am486DX2 CPU AC Characteristics for Boundary Scan Test Signals at 25 MHz VCC = 3.3 V 0.3 V; TCASE =0C to +85C; CL = 50 pF. All inputs and outputs are TTL Level. Symbol Parameter Min Max Unit 25 MHz Figure Notes t24 TCK Frequency t25 TCK Period 40 ns Note 2 t26 TCK High Time 10 ns at 2.0 V t27 TCK Low Time 10 ns at 0.8 V t28 TCK Rise Time 4 ns Note 1 t29 TCK Fall Time 4 ns Note 1 t30 TDI, TMS Setup Time 8 ns 9 Note 3 t31 TDI, TMS Hold Time 7 ns 9 Note 3 t32 TDO Valid Delay 3 25 ns 9 Note 3 t33 TDO Float Delay 36 ns 9 Note 3 t34 All Outputs (Non-Test) Valid Delay 25 ns 9 Note 3 t35 All Outputs (Non-Test) Float Delay 36 ns 9 Note 3 t36 All Inputs (Non-Test) Setup Time 8 ns 9 Note 3 t37 All Inputs (Non-Test) Hold Time 7 ns 9 Note 3 3 1x Clock Notes: 1. Rise/Fall times are measured between 0.8 V and 2.0 V. Rise/Fall times can be relaxed by 1 ns per 10-ns increase in TCK period. 2. TCK period > CLK period. 3. Parameter measured from TCK. Am486DX2 Microprocessor 19 PRELIMINARY AMD WAVEFORM INPUTS OUTPUTS Must be Steady Will be Steady May Change from H to L Will be Changing from H to L May Change from L to H Will be Changing from L to H Don't Care, Any Change Permitted Changing, State Unknown Does Not Apply Center Line is HighImpedance "Off" State Figure 1. Change State Diagram t2 2.0 V 1.5 V t3 0.8 V t5 t4 t1 17852B-095 Figure 2. CLK Waveforms 20 Am486DX2 Microprocessor PRELIMINARY RESET AMD Initialization Sequence Tx Tx Tx Tx CLK t20 RESET t21 Figure 3. Reset Setup and Hold Timing Tx Tx Tx Tx CLK t12 t13 t14 t15 t18 t19 t20 t21 t22 t23 EADS BS8, BS16, KEN BOFF, AHOLD, HOLD RESET, FLUSH, A20M, IGNNE, INTR, NMI A31-A4 (Read) 17852A-099 Figure 3. Input Setup and Hold Timing Am486DX2 Microprocessor 21 PRELIMINARY AMD T2 Tx Tx Tx CLK t16 t17 RDY, BRDY D31-D0 DP3-DP0 (Read) 1.5 V t22 t23 1.5 V 17852A-100 Figure 4. RDY and BRDY Input Setup and Hold Timing T2 Tx Tx Tx CLK BRDY, RDY D31-D0 DP3-DP0 (Read) Valid t8 Min Max PCHK Valid 17852A-101 Figure 5. PCHK Valid Delay Timing Tx Tx Tx Tx CLK A31-A2, PWT, PCD, BE3-BE0, M/IO, D/C, W/R, ADS, LOCK, FERR, BREQ, HLDA t6 Min t10 D31-D0, DP3-DP0, (Write) Valid n +1 Min Valid n t8a BLAST, PLOCK Max Valid n Max Valid n +1 Min Valid n Max Valid n +1 17852A-102 Figure 6. Output Valid Delay Timing 22 Am486DX2 Microprocessor PRELIMINARY Tx Tx AMD Tx Tx CLK Min t7 t6 A31-A2, PWT, PCD, BE3-BE0, M/IO, D/C, W/R, ADS, LOCK, FERR, BREQ, HLDA Valid Min t10 D31-D0, DP3-DP0 (Write) Valid Min t8a BLAST, PLOCK t11 t9 Valid 17852A-103 Figure 7. Maximum Float Delay Timing t25 TCK t30 t31 TDI, TMS t33 t32 TDO Output Signals t35 t34 t36 t37 Input Signals 17852B-104 Figure 8. Test Signal Timing Diagram Am486DX2 Microprocessor 23 PRELIMINARY AMD Package Thermal Specifications where: The Am486DX2 microprocessor is specified for operation when TCASE (the case temperature) is within the range of 0C to +85C. TCASE can be measured in any environment to determine whether the Am486DX2 microprocessor is within specified operating range. The case temperature should be measured at the center of the top surface opposite the pins. TJ, TA, TCASE= Junction, Ambient, and Case Temperature. The ambient temperature (TA) is guaranteed as long as TCASE is not violated. The ambient temperature can be calculated from JC and JA and from the following equations: TJ = TCASE + P * JC TA = TJ - P * JA TCASE = TA + P * [JA - JC] JC, JA = Junction-to-Case and Junction-to-Ambient Thermal Resistance, respectively. P = Maximum Power Consumption The values for JA and JC are given in Table 9 for the 1.75 sq. in., 168-pin, ceramic PGA. Table 10 shows the TA allowable (without exceeding TCASE) at various airflows and operating frequencies (Clock). Note that TA is greatly improved by attaching fins or a heat sink to the package. Heat sink dimensions are shown in Figure 10. P (the maximum power consumption) is calculated by using the maximum ICC as tabulated in the DC Characteristics. ---------------------------------------------------------------------------------------------------------------------------- Table 9. Thermal Resistance (C/W) JC and JA for the 66-MHz and 80-MHz Am486DX2 CPU JA vs. Airflow-ft/min. (m/sec) JC 0 (0) 200 (1.01) 400 (2.03) 600 (3.04) 800 (4.06) 1000 (5.07) No Heat Sink 1.5 16.5 14.0 12.0 10.5 9.5 9.0 Heat Sink* 2.0 12.0 7.0 5.0 4.0 3.5 3.25 Heat Sink* and fan 2.0 5.0 4.6 4.2 3.8 3.5 3.25 *0.350 high unidirectional heat sink (Al alloy 6063-T5, 40 mil fin width, 155 mil center-to-center fin spacing). 0.115 0.290 0.040 0.060 0.350 0.100 1.53 17852B-113 Figure 10. Heat Sink Dimensions Table 10. Maximum TA at Various Airflows in C Airflow-ft/min. (m/sec) TA without Heat Sink* TA with Heat Sink TA with Heat Sink and fan 24 Clock 0 (0) 200 (1.01) 400 (2.03) 600 (3.04) 800 (4.06) 1000 (5.07) 66 MHz 49.4 55.3 60.1 63.6 66.0 67.2 66 MHz 61.2 73.1 77.9 80.3 81.4 82.0 80 MHz 56.2 70.6 76.4 79.2 80.7 81.4 66 MHz 77.9 78.8 79.8 80.7 81.4 82.0 80 MHz 76.4 77.5 78.7 79.8 80.7 81.4 Am486DX2 Microprocessor PRELIMINARY AMD PHYSICAL DIMENSIONS For reference only. All dimensions are measured in inches. BSC is an ANSI standard for Basic Space Centering. CGM 168 Index Corner 1.735 1.765 1.595 1.605 Base Plane Seating Plane 0.017 0.020 1.595 1.605 1.735 1.765 0.090 0.110 0.105 0.125 Bottom View (Pins Facing Up) 0.025 0.045 0.140 0.180 0.110 0.140 Side View 16734C 5/11/93 MH AMD, Am386, and Am486 are registered trademarks of Advanced Micro Devices, Inc. FusionPC is a service mark of Advanced Micro Devices, Inc. Microsoft and Windows are registered trademarks of Microsoft Corp. Product names used in this publication are for identification purposes only and may be trademarks of their respective companies. Am486DX2 Microprocessor 25