1453-2GT/TR1(R) - EVERLIGHT ELECTRONICS

1

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LAMP

1453-2GT/TR1(R)

Features

•Long life feature.

•Low power consumption.

•High emitting efficiency.

•Most radial lead plastic LED lamp acail able packed in ape and reel.

•Reel package simplifies handling and teat.

•Pb free

•The product itself will remain within RoHS compliant version

Description

•The 1453 lamps are made with GaP diodes which emit Green

•Automatically insert able with radial lead insertion equipment.

Applications

•Audio equipment

•Monitor

•Sign board

•Computer peripheral

•Air condition

•Home appliance

•Satellite receiver

•Burglar alarm

Ver.:2 Release Date:04/11/2017 狀態:Approved(正式發行)

DATASHEET

LAMP

1453-2GT/TR1(R)

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•Stop light

Device Selection Guide

PART NO.

Chip Materials

Emitted Color

Resin Color

1453-2GT

GaP

Green

Green Trans

Absolute Maximum Ratings (Ta=25℃)

Parameter

Symbol

Rating

Unit

Continuous Forward Current

IF

30

mA

Peak Forward Current (Duty 1/10 @ 1KHZ)

IFP

60

mA

Reverse Voltage

VR

5

V

Power Dissipation

Pd

60

mW

Operating Temperature

Topr

-40 ~ +85

℃

Storage Temperature

Tstg

-40 ~ +100

℃

Soldering Temperature

Tsol

260 ℃ for 5 sec.

Electro-Optical Characteristics (Ta=25℃)

Parameter

Symbol

Min.

Typ.

Max.

Unit

Conditio

n

Luminous Intensity

Iv

6.7

12.5

-----

mcd

IF=10mA

Viewing Angle

2θ1/2

-----

80

-----

deg

IF=20mA

Peak Wavelength

λp

-----

634

-----

nm

IF=20mA

Dominant Wavelength

λd

-----

624

-----

nm

IF=20mA

Spectrum Radiation Bandwidth

Δλ

-----

20

-----

nm

IF=20mA

Forward Voltage

VF

1.7

2.0

2.4

V

IF=20mA

Reverse Current

IR

-----

10

μA

VR=5V

Note:

*Measurement Uncertainty of Forward Voltage: ±0.1V

Ver.:2 Release Date:04/11/2017 狀態:Approved(正式發行)

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LAMP

1453-2GT/TR1(R)

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*Measurement Uncertainty of Luminous Intensity: ±10%

*Measurement Uncertainty of Dominant Wavelength ±1.0nm

Typical Electro-Optical Characteristics Curves

Relative Intensity vs. Wavelength (Ta=25℃)

Directivity (Ta=25℃)

Relative Intensity (a.u.)

Radiation Angle

Wavelength (nm)

Relative Intensity (a.u.)

Forward Current vs. Forward Voltage (Ta=25℃)

Relative Intensity vs. Forward Current (Ta=25℃)

Forward Current (mA)

Relative Intensity(a.u.)

0 5 10 15 20 25 30

0.0

0.5

1.0

1.5

Relative Intensity(a.u.)

Forward Current(mA)

Forward Voltage (V)

Forward Current (mA)

Relative Intensity vs. Ambient Temp.

Forward Current vs. Ambient Temp.

Relative Intensity(a.u.)

25 30 35 40 45 50 55 60 65 70

0.0

0.5

1.0

1.5

2.0

Forward Current (mA)

Ver.:2 Release Date:04/11/2017 狀態:Approved(正式發行)

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LAMP

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Ambient Temperature Ta(℃)

Package Dimension

Notes:

1. All dimensions are in millimeters, tolerance is ±0.25mm except being specified

2. Lead spacing is measured where the lead emerge from the package

3. Protruded resin under flange is 1.5 mm(0.059”) Max LED.

Ver.:2 Release Date:04/11/2017 狀態:Approved(正式發行)

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LAMP

1453-2GT/TR1(R)

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4. The single LED picture which is after taping.

Carrier Tape Dimensions:

Notes:

1.All dimensions are in millimeters, tolerance is ±0.25mm except being specified

2.Lead spacing is measured where the lead emerge from the package

Taping Sizes

Note: Tolerances unless mentioned ±0.1mm. Unit = mm

Symbol Items

Symbol

Specifications

Avg.

Tolerance

mm

Inch

(mm)

Tape Feed Hole Diameter

D

4.0

0.157

±0.2

Component Lead Pitch

F

2.54

0.100

+0.8/-0.2

Front-to-Read Deflection

△H

0°

0

±5°

Feed Hole to Button of Component

H1

18.50

0.728

±1.0

Feed Hole to Overall Component Height

H2

24.50

0.965

±1.0

Lead Length after Component Removal

L

11.00

0.433

MAX

Feed Hole Pitch

P

12.70

0.500

±0.3

Lead Location

P1

5.08

0.200

±0.7

Center of Component Location

P2

6.35

0.250

±1.2

Overall Taped Package Thickness

T

1.42

0.056

MAX

Feed Hole Location

W0

9.00

0.354

±0.5

Adhesive Tape Width

W1

13.00

0.512

±0.5

Adhesive Tape Position

W2

2.00

0.079

MAX

Tape Width

W3

18.00

0.709

±0.75

Ver.:2 Release Date:04/11/2017 狀態:Approved(正式發行)

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LAMP

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Moisture Resistant Packing Materials

Label Explanation

CPN: Customer's Production Number

P/N : Production Number

QTY: Packing Quantity

CAT: Ranks

HUE: Dominant Wavelength

REF: Reference

LOT No: Lot Number

Packing Specification

■Tape ■ Inner Carton ■ Outside Carton

■ Packing Quantity

1. 2000 PCS/1 Inner Carton

2. 10 Inner Cartons/1 Outside Carton

Ver.:2 Release Date:04/11/2017 狀態:Approved(正式發行)

DATASHEET

LAMP

1453-2GT/TR1(R)

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Prehead

laminar wave

Fluxing

Notes

1. Lead Forming

 During lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy bulb.

 Lead forming should be done before soldering.

 Avoid stressing the LED package during leads forming. The stress to the base may damage the LED’s characteristics or it

may break the LEDs.

 Cut the LED lead frames at room temperature. Cutting the lead frames at high temperatures may cause failure of the LEDs.

 When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead position of the LED. If the LEDs

are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the LEDs.

2. Storage

 The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from Everlight and the storage life limits

are 3 months. If the LEDs are stored for 3 months or more, they can be stored for a year in a sealed container with a

nitrogen atmosphere and moisture absorbent material.

 Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where condensation can

occur.

3. Soldering

 Careful attention should be paid during soldering. When soldering, leave more then 3mm from solder joint to epoxy bulb,

and soldering beyond the base of the tie bar is recommended.

 Recommended soldering conditions:

Hand Soldering

DIP Soldering

Temp. at tip of iron

300℃ Max. (30W Max.)

Preheat temp.

100℃ Max. (60 sec Max.)

Soldering time

3 sec Max.

Bath temp. & time

260 Max., 5 sec Max

Distance

3mm Min.(From solder

joint to epoxy bulb)

Distance

3mm Min. (From solder

joint to epoxy bulb)

 Recommended soldering profile

 Avoiding applying any stress to the lead frame while the LEDs are at high temperature particularly when soldering.

 Dip and hand soldering should not be done more than one time

Ver.:2 Release Date:04/11/2017 狀態:Approved(正式發行)

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LAMP

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 After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration until the LEDs return to

room temperature.

 A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.

 Although the recommended soldering conditions are specified in the above table, dip or hand soldering at the lowest

possible temperature is desirable for the LEDs.

 Wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder

wave.

4. Cleaning

 When necessary, cleaning should occur only with isopropyl alcohol at room temperature for a duration of no more than

one minute. Dry at room temperature before use.

 Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs

depends on factors such as ultrasonic power and the assembled condition. Ultrasonic cleaning shall be pre-qualified to

ensure this will not cause damage to the LED

5. Heat Management

 Heat management of LEDs must be taken into consideration during the design stage of LED application. The current

should be de-rated appropriately by referring to the de-rating curve found in each product specification.

 The temperature surrounding the LED in the application should be controlled. Please refer to the data sheet de-rating

curve.

6. ESD (Electrostatic Discharge)

 The products are sensitive to static electricity or surge voltage. ESD can damage a die and its reliability.

When handling the products, the following measures against electrostatic discharge are strongly

recommended:

Eliminating the charge

Grounded wrist strap, ESD footwear, clothes, and floors

Grounded workstation equipment and tools

ESD table/shelf mat made of conductive materials

 Proper grounding is required for all devices, equipment, and machinery used in product assembly.

Surge protection should be considered when designing of commercial products.

 If tools or equipment contain insulating materials such as glass or plastic,

the following measures against electrostatic discharge are strongly recommended:

Dissipating static charge with conductive materials

Preventing charge generation with moisture

Neutralizing the charge with ionizers

7. Directions for use

 The LEDs should be operated with forward bias. The driving circuit must be designed so that the LEDs are not subjected

to forward or reverse voltage while it is off. If reverse voltage is continuously applied to the LEDs, it may cause migration

resulting in LED damage.

DISCLAIMER

1. EVERLIGHT reserves the right(s) on the adjustment of product material mix for the specification.

2. The product meets EVERLIGHT published specification for a period of twelve (12) months from date of

Ver.:2 Release Date:04/11/2017 狀態:Approved(正式發行)

DATASHEET

LAMP

1453-2GT/TR1(R)

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shipment.

3. The graphs shown in this datasheet are representing typical data only and do not show guaranteed values.

4. When using this product, please observe the absolute maximum ratings and the instructions for using outlined

in these specification sheets. EVERLIGHT assumes no responsibility for any damage resulting from the use of

the product which does not comply with the absolute maximum ratings and the instructions included in these

specification sheets.

5. These specification sheets include materials protected under copyright of EVERLIGHT. Reproduction in any

form is prohibited without obtaining EVERLIGHT’s prior consent.

6. This product is not intended to be used for military, aircraft, automotive, medical, life sustaining or life saving

applications or any other application which can result in human injury or death. Please contact authorized

Everlight sales agent for special application request.

Ver.:2 Release Date:04/11/2017 狀態:Approved(正式發行)