AT25320B/AT25640B SPI Serial EEPROM 32 Kbits (4,096 x 8) and 64 Kbits (8,192 x 8) Features * * * * * * * * * * * * Serial Peripheral Interface (SPI) Compatible Supports SPI Modes 0 (0,0) and 3 (1,1): - Data sheet describes mode 0 operation Low-Voltage and Standard-Voltage Operation: - 1.8V (VCC = 1.8V to 5.5V) Industrial Temperature Range -40C to +85C 20 MHz Clock Rate (5V) 32-Byte Page Mode Block Write Protection: - Protect 1/4, 1/2 or entire array Write-Protect (WP) Pin and Write Disable Instructions for Both Hardware and Software Data Protection Self-Timed Write Cycle (5 ms Maximum) High Reliability: - Endurance: 1,000,000 write cycles - Data retention: 100 years Green (Pb/Halide-free/RoHS Compliant) Packaging Options Die Sales: Wafer Form and Bumped Wafers Packages * 8-Lead SOIC, 8-Lead TSSOP, 8-Pad UDFN, 8-Ball VFBGA and 8-Pad XDFN (c) 2018 Microchip Technology Inc. DS20005993A-page 1 AT25320B/AT25640B Table of Contents Features.......................................................................................................................... 1 Packages.........................................................................................................................1 1. Package Types (not to scale).................................................................................... 4 2. Pin Description.......................................................................................................... 5 2.1. 2.2. 2.3. 2.4. 2.5. 2.6. 2.7. 2.8. Chip Select (CS)...........................................................................................................................5 Serial Data Output (SO)............................................................................................................... 5 Write-Protect (WP)....................................................................................................................... 5 Ground (GND).............................................................................................................................. 6 Serial Data Input (SI)....................................................................................................................6 Serial Data Clock (SCK)...............................................................................................................6 Suspends Serial Input (HOLD).....................................................................................................6 Device Power Supply (VCC)......................................................................................................... 6 3. Description.................................................................................................................7 3.1. Block Diagram.............................................................................................................................. 7 4. Electrical Characteristics........................................................................................... 8 4.1. 4.2. 4.3. 4.4. 4.5. Absolute Maximum Ratings..........................................................................................................8 DC and AC Operating Range.......................................................................................................8 DC Characteristics....................................................................................................................... 8 AC Characteristics........................................................................................................................9 Electrical Specifications..............................................................................................................11 5. Serial Interface Description..................................................................................... 13 6. Functional Description............................................................................................. 14 7. Timing Diagrams......................................................................................................17 8. Packaging Information.............................................................................................20 8.1. Package Marking Information.....................................................................................................20 9. Revision History.......................................................................................................31 The Microchip Web Site................................................................................................ 32 Customer Change Notification Service..........................................................................32 Customer Support......................................................................................................... 32 Product Identification System........................................................................................ 33 Microchip Devices Code Protection Feature................................................................. 34 (c) 2018 Microchip Technology Inc. DS20005993A-page 2 AT25320B/AT25640B Legal Notice...................................................................................................................34 Trademarks................................................................................................................... 34 Quality Management System Certified by DNV.............................................................35 Worldwide Sales and Service........................................................................................36 (c) 2018 Microchip Technology Inc. DS20005993A-page 3 AT25320B/AT25640B Package Types (not to scale) 1. Package Types (not to scale) 8-Lead SOIC/TSSOP (Top View) CS 1 8-Pad UDFN/XDFN (Top View) VCC 8 SO 2 7 HOLD WP 3 6 SCK GND 4 5 SI CS 1 8 VCC SO 2 7 HOLD WP 3 6 SCK GND 4 5 SI 8-Ball VFBGA (Top View) (c) 2018 Microchip Technology Inc. CS 1 8 VCC SO 2 7 HOLD WP 3 6 SCK GND 4 5 SI DS20005993A-page 4 AT25320B/AT25640B Pin Description 2. Pin Description The descriptions of the pins are listed in Table 2-1. Table 2-1.Pin Function Table Name 8-Lead SOIC 8-Lead TSSOP 8-Pad UDFN(1) 8-Pad XDFN 8-Ball VFBGA Function CS 1 1 1 1 1 Chip Select SO 2 2 2 2 2 Serial Data Output WP(2) 3 3 3 3 3 Write-Protect GND 4 4 4 4 4 Ground SI 5 5 5 5 5 Serial Data Input SCK 6 6 6 6 6 Serial Data Clock HOLD(2) 7 7 7 7 7 Suspends Serial Input VCC 8 8 8 8 8 Device Power Supply Note: 1. The exposed pad on this package can be connected to GND or left floating. 2. The Write-Protect (WP) and Hold (HOLD) pins should be driven high or low as appropriate. 2.1 Chip Select (CS) The AT25320B/AT25640B is selected when the CS pin is low. When the device is not selected, data will not be accepted via the SI pin, and the Serial Output (SO) pin will remain in a high-impedance state. To ensure robust operation, the Chip Select (CS) pin should follow VCC upon power-up. It is therefore recommended to connect CS to VCC using a pull-up resistor (less than or equal to 10 k). After power-up, a low level on CS is required prior to any sequence being initiated. 2.2 Serial Data Output (SO) The Serial Data Output (SO) pin is used to transfer data out of the AT25320B/AT25640B. During a read sequence, data is shifted out on this pin after the falling edge of the serial clock. 2.3 Write-Protect (WP) The Write-Protect (WP) pin will allow normal read/write operations when held high. When the WP pin is brought low and WPEN bit is set to a logic '1', all write operations to the STATUS register are inhibited. WP going low while CS is still low will interrupt a write operation to the STATUS register. If the internal write cycle has already been initiated, WP going low will have no effect on any write operation to the STATUS register. The WP pin function is blocked when the WPEN bit in the STATUS register is set to a logic '0'. This will allow the user to install the AT25320B/AT25640B in a system with the WP pin tied to ground and still be able to write to the STATUS register. All WP pin functions are enabled when the WPEN bit is set to a logic '1'. (c) 2018 Microchip Technology Inc. DS20005993A-page 5 AT25320B/AT25640B Pin Description 2.4 Ground (GND) The ground reference for the power supply. The Ground (GND) pin should be connected to the system ground. 2.5 Serial Data Input (SI) The Serial Data Input (SI) pin is used to transfer data into the device. It receives instructions, addresses and data. Data is latched on the rising edge of the serial clock. 2.6 Serial Data Clock (SCK) The Serial Data Clock (SCK) pin is used to synchronize the communication between a master and the AT25320B/AT25640B. Instructions, addresses or data present on the SI pin are latched on the rising edge of the clock input, while data on the SO pin is updated after the falling edge of the clock input. 2.7 Suspends Serial Input (HOLD) The HOLD pin is used in conjunction with the CS pin to pause the AT25320B/AT25640B. When the device is selected and a serial sequence is underway, HOLD can be used to pause the serial communication with the master device without resetting the serial sequence. To pause, the HOLD pin must be brought low while the SCK pin is low. To resume serial communication, the HOLD pin is brought high while the SCK pin is low (SCK may still toggle during HOLD). Inputs to the SI pin will be ignored while the SO pin is in the high-impedance state. 2.8 Device Power Supply (VCC) The Device Power Supply (VCC) pin is used to supply the source voltage to the device. Operations at invalid VCC voltages may produce spurious results and should not be attempted. (c) 2018 Microchip Technology Inc. DS20005993A-page 6 AT25320B/AT25640B Description 3. Description The AT25320B/AT25640B provides 32,768/65,536 bits of Serial Electrically Erasable Programmable Read-Only Memory (EEPROM) organized as 4,096/8,192 words of 8 bits each. The device is optimized for use in many industrial and commercial applications where low-power and low-voltage operation are essential. The AT25320B/AT25640B is enabled through the Chip Select (CS) pin and accessed via a 3-wire interface consisting of Serial Data Input (SI), Serial Data Output (SO) and Serial Clock (SCK). All programming cycles are completely self-timed, and no separate erase cycle is required before write. Block write protection is enabled by programming the STATUS register with one of four blocks of write protection. Separate Program Enable and Program Disable instructions are provided for additional data protection. Hardware data protection is provided via the WP pin to protect against inadvertent write attempts to the STATUS register. The HOLD pin may be used to suspend any serial communication without resetting the serial sequence. Block Diagram Memory System Control Module CS High-Voltage Generation Circuit Power-on Reset Generator VCC Pause Operation Control HOLD Register Bank: STATUS Register SO EEPROM Array 1 page WP Column Decoder Data Register Row Decoder 3.1 Address Register and Counter SCK Data Output Buffer GND (c) 2018 Microchip Technology Inc. Write Protection Control SI DS20005993A-page 7 AT25320B/AT25640B Electrical Characteristics 4. Electrical Characteristics 4.1 Absolute Maximum Ratings Operating temperature -55C to +125C Storage temperature -65C to +150C Voltage on any pin with respect to ground -1.0V to +7.0V VCC 6.25V DC output current 5.0 mA ESD protection 2 kV Note: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification are not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 4.2 DC and AC Operating Range Table 4-1.DC and AC Operating Range AT25320B/AT25640B 4.3 Operating Temperature (Case) Industrial Temperature Range -40C to +85C VCC Power Supply Low Voltage Grade 1.8V to 5.5V DC Characteristics Table 4-2.DC Characteristics (1) Parameter Symbol Minimum Typical Maximum Units Conditions Supply Voltage VCC1 1.8 -- 5.5 V Supply Voltage VCC2 2.5 -- 5.5 V Supply Voltage VCC3 4.5 -- 5.5 V Supply Current ICC1 -- 7.5 10.0 mA VCC = 5.0V at 20 MHz, SO = Open, Read Supply Current ICC2 -- 4.0 10.0 mA VCC = 5.0V at 20 MHz, SO = Open, Read, Write Supply Current ICC3 -- 4.0 6.0 mA VCC = 5.0V at 5 MHz, SO = Open, Read, Write Standby Current ISB1 -- <0.1 6.0(2) A VCC = 1.8V, CS = VCC (c) 2018 Microchip Technology Inc. DS20005993A-page 8 AT25320B/AT25640B Electrical Characteristics Parameter Symbol Minimum Typical Maximum Units Conditions Standby Current ISB2 -- 0.3 7.0(2) A VCC = 2.5V, CS = VCC Standby Current ISB3 -- 2.0 10.0(2) A VCC = 5.0V, CS = VCC Input Leakage IIL -3.0 -- 3.0 A VIN = 0V to VCC Output Leakage IOL -3.0 -- 3.0 A VIN = 0V to VCC, TAC = 0C to +70C Input Low-Voltage VIL(3) -0.6 -- VCC x 0.3 V Input High-Voltage VIH(3) VCC x 0.7 -- VCC + 0.5 V Output Low-Voltage VOL1 -- -- 0.4 V 3.6V VCC 5.5V IOL = 3.0 mA Output High-Voltage VOH1 VCC - 0.8 -- -- V 3.6V VCC 5.5V IOH = -1.6 mA Output Low-Voltage VOL2 -- -- 0.2 V 1.8V VCC 3.6V IOL = 0.15 mA Output High-Voltage VOH2 VCC - 0.2 -- -- V 1.8V VCC 3.6V IOH = -100 A Note: 1. Applicable over recommended operating range from: TA = -40C to +85C, VCC = 1.8V to 5.5V (unless otherwise noted). 2. Worst case measured at 85C. 3. VIL min and VIH max are reference only and are not tested. 4.4 AC Characteristics Table 4-3.AC Characteristics(1) Parameter SCK Clock Frequency Input Rise Time Input Fall Time (c) 2018 Microchip Technology Inc. Symbol fSCK tRI tFI Minimum Maximum Units Conditions 0 20 MHz VCC = 4.5V to 5.5V 0 10 MHz VCC = 2.5V to 5.5V 0 5 MHz VCC = 1.8V to 5.5V -- 2 s VCC = 4.5V to 5.5V -- 2 s VCC = 2.5V to 5.5V -- 2 s VCC = 1.8V to 5.5V -- 2 s VCC = 4.5V to 5.5V -- 2 s VCC = 2.5V to 5.5V DS20005993A-page 9 AT25320B/AT25640B Electrical Characteristics Parameter SCK High Time SCK Low Time CS High Time CS Setup Time CS Hold Time Data In Setup Time Data In Hold Time HOLD Setup Time HOLD Hold Time Output Valid Output Hold Time (c) 2018 Microchip Technology Inc. Symbol tWH tWL tCS tCSS tCSH tSU tH tHD tCD tV tHO Minimum Maximum Units Conditions -- 2 s VCC = 1.8V to 5.5V 20 -- ns VCC = 4.5V to 5.5V 40 -- ns VCC = 2.5V to 5.5V 80 -- ns VCC = 1.8V to 5.5V 20 -- ns VCC = 4.5V to 5.5V 40 -- ns VCC = 2.5V to 5.5V 80 -- ns VCC = 1.8V to 5.5V 25 -- ns VCC = 4.5V to 5.5V 50 -- ns VCC = 2.5V to 5.5V 100 -- ns VCC = 1.8V to 5.5V 25 -- ns VCC = 4.5V to 5.5V 50 -- ns VCC = 2.5V to 5.5V 100 -- ns VCC = 1.8V to 5.5V 25 -- ns VCC = 4.5V to 5.5V 50 -- ns VCC = 2.5V to 5.5V 100 -- ns VCC = 1.8V to 5.5V 5 -- ns VCC = 4.5V to 5.5V 10 -- ns VCC = 2.5V to 5.5V 20 -- ns VCC = 1.8V to 5.5V 5 -- ns VCC = 4.5V to 5.5V 10 -- ns VCC = 2.5V to 5.5V 20 -- ns VCC = 1.8V to 5.5V 5 -- ns VCC = 4.5V to 5.5V 10 -- ns VCC = 2.5V to 5.5V 20 -- ns VCC = 1.8V to 5.5V 5 -- ns VCC = 4.5V to 5.5V 10 -- ns VCC = 2.5V to 5.5V 20 -- ns VCC = 1.8V to 5.5V 0 20 ns VCC = 4.5V to 5.5V 0 40 ns VCC = 2.5V to 5.5V 0 80 ns VCC = 1.8V to 5.5V 0 -- ns VCC = 4.5V to 5.5V DS20005993A-page 10 AT25320B/AT25640B Electrical Characteristics Parameter HOLD to Output Low Z HOLD to Output High Z Output Disable Time Write Cycle Time Symbol tLZ tHZ tDIS tWC Minimum Maximum Units Conditions 0 -- ns VCC = 2.5V to 5.5V 0 -- ns VCC = 1.8V to 5.5V 0 25 ns VCC = 4.5V to 5.5V 0 50 ns VCC = 2.5V to 5.5V 0 100 ns VCC = 1.8V to 5.5V -- 40 ns VCC = 4.5V to 5.5V -- 80 ns VCC = 2.5V to 5.5V -- 200 ns VCC = 1.8V to 5.5V -- 40 ns VCC = 4.5V to 5.5V -- 80 ns VCC = 2.5V to 5.5V -- 200 ns VCC = 1.8V to 5.5V -- 5 ms VCC = 4.5V to 5.5V -- 5 ms VCC = 2.5V to 5.5V -- 5 ms VCC = 1.8V to 5.5V Note: 1. Applicable over recommended operating range from TA = -40C to +85C, VCC = As Specified, CL = 1 TTL Gate and 30 pF (unless otherwise noted). 4.5 Electrical Specifications 4.5.1 Power-Up Requirements and Reset Behavior During a power-up sequence, the VCC supplied to the AT25320B/AT25640B should monotonically rise from GND to the minimum VCC level as specified in Table 4-1 with a slew rate no faster than 0.1 V/s. 4.5.1.1 Device Reset To prevent inadvertent write operations or any other spurious events from occurring during a power-up sequence, the AT25320B/AT25640B includes a Power-on Reset (POR) circuit. Upon power-up, the device will not respond to any instructions until the VCC level crosses the internal voltage threshold (VPOR) that brings the device out of Reset and into Standby mode. The system designer must ensure the instructions are not sent to the device until the VCC supply has reached a stable value greater than or equal to the minimum VCC level. Additionally, once the VCC is greater than or equal to the minimum VCC level, the bus master must wait at least tPUP before sending the first instruction to the device. See Table 4-4 for the values associated with these power-up parameters. (c) 2018 Microchip Technology Inc. DS20005993A-page 11 AT25320B/AT25640B Electrical Characteristics Table 4-4. Power-Up Conditions(1) Symbol Parameter Min. Max. Units tPUP Time required after VCC is stable before the device can accept instructions. 100 -- s VPOR Power-on Reset Threshold Voltage. -- 1.5 V tPOFF Minimum time at VCC = 0V between power cycles. 500 -- ms Note: 1. These parameters are characterized but they are not 100% tested in production. If an event occurs in the system where the VCC level supplied to the AT25320B/AT25640B drops below the maximum VPOR level specified, it is recommended that a full power cycle sequence be performed by first driving the VCC pin to GND in less than 1 ms, waiting at least the minimum tPOFF time and then performing a new power-up sequence in compliance with the requirements defined in this section. 4.5.2 Pin Capacitance Table 4-5.Pin Capacitance(1,2) Symbol COUT CIN Test Conditions Max. Units Conditions Output Capacitance (SO) 8 pF VOUT = 0V Input Capacitance (CS, SCK, SI, WP, HOLD) 6 pF VIN = 0V Note: 1. This parameter is characterized and is not 100% tested. 2. Applicable over recommended operating range from: TA = 25C, fSCK = 1.0 MHz, VCC = 5.0V (unless otherwise noted). 4.5.3 EEPROM Cell Performance Characteristics Table 4-6.EEPROM Cell Performance Characteristics Operation Test Condition Write Endurance(1) TA = 25C,VCC= 3.3V, Page Mode Data Retention(1) TA = 55C Min. Max. Units 1,000,000 -- Write Cycles 100 -- Years Note: 1. Performance is determined through characterization and the qualification process. (c) 2018 Microchip Technology Inc. DS20005993A-page 12 AT25320B/AT25640B Serial Interface Description 5. Serial Interface Description Master: The device that generates the serial clock. Slave: Because the Serial Clock (SCK) pin is always an input, the AT25320B/AT25640B always operates as a slave. Transmitter/ receiver: The AT25320B/AT25640B has separate pins designated for data transmission (SO) and reception (SI). MSb: The Most Significant bit (MSb) is the first bit transmitted and received. Serial Opcode: After the device is selected with CS going low, the first byte will be received. This byte contains the opcode that defines the operations to be performed. Invalid Opcode: If an invalid opcode is received, no data will be shifted into the AT25320B/AT25640B, and the Serial Output (SO) pin will remain in a highimpedance state until the falling edge of CS is detected again. This will reinitialize the serial communication. Figure 5-1.SPI Serial Interface Master: Microcontroller Data Out (MOSI) Data In (MISO) Serial Clock (SPI CK) SS0 SS1 SS2 SS3 Slave: AT25320B/ AT25640B SI SO SCK CS SI SO SCK CS SI SO SCK CS SI SO SCK CS (c) 2018 Microchip Technology Inc. DS20005993A-page 13 AT25320B/AT25640B Functional Description 6. Functional Description The AT25320B/AT25640B is designed to interface directly with the synchronous Serial Peripheral Interface (SPI) of the 6805 and 68HC11 series of microcontrollers. The AT25320B/AT25640B utilizes an 8-bit instruction register. The list of instructions and their operation codes are contained in Table 6-1. All instructions, addresses and data are transferred with the MSb first and start with a high-to-low CS transition. Table 6-1.Instruction Set Instruction Name Instruction Format Operation WREN 0000 X110 Set Write Enable Latch WRDI 0000 X100 Reset Write Enable Latch RDSR 0000 X101 Read STATUS Register WRSR 0000 X001 Write STATUS Register READ 0000 X011 Read Data from Memory Array WRITE 0000 X010 Write Data to Memory Array Write Enable (WREN): The device will power-up in the Write Disable state when VCC is applied. All programming instructions must therefore be preceded by a Write Enable instruction. Write Disable (WRDI): To protect the device against inadvertent writes, the Write Disable instruction disables all programming modes. The WRDI instruction is independent of the status of the WP pin. Read STATUS Register (RDSR): The Read STATUS Register instruction provides access to the STATUS register. The Ready/Busy and Write Enable status of the device can be determined by the RDSR instruction. Similarly, the Block Write Protection bits indicate the extent of protection employed. These bits are set by using the WRSR instruction. Table 6-2.STATUS Register Format Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 WPEN X X X BP1 BP0 WEN RDY Table 6-3.Read STATUS Register Bit Definition Bit Definition Bit 0 (RDY) Bit 0 = 0 (RDY) indicates the device is READY. Bit 0 = 1 indicates the write cycle is in progress. Bit 1 (WEN) Bit 1= 0 indicates the device is not write enabled. Bit 1 = 1 indicates the device is write enabled. Bit 2 (BP0) See Table 6-4. Bit 3 (BP1) See Table 6-4. (c) 2018 Microchip Technology Inc. DS20005993A-page 14 AT25320B/AT25640B Functional Description Bit Definition Bits 4 - 6 are zeros when device is not in an internal write cycle. Bit 7 (WPEN) See Table 6-5. Bits 0 - 7 are ones during an internal write cycle. Write STATUS Register (WRSR): The WRSR instruction allows the user to select one of four levels of protection. The AT25320B/AT25640B is divided into four array segments. One-quarter, one-half or all of the memory segments can be protected. Any of the data within any selected segment will therefore be read-only. The Block Write Protection levels and corresponding STATUS register control bits are shown in Table 6-4. The three bits BP0, BP1 and WPEN are nonvolatile cells that have the same properties and functions as the regular memory cells (e.g., WREN, tWC, RDSR). Table 6-4.Block Write-Protect Bits Level STATUS Register Bits Array Addresses Protected BP1 BP0 AT25320B AT25640B 0 0 0 None None 1(1/4) 0 1 0C00-0FFF 1800-1FFF 2(1/2) 1 0 0800-0FFF 1000-1FFF 3(All) 1 1 0000-0FFF 0000-1FFF The WRSR instruction also allows the user to enable or disable the Write-Protect (WP) pin through the use of the Write-Protect Enable (WPEN) bit. Hardware Write Protection is enabled when the WP pin is low and the WPEN bit is set to a logic '1'. Hardware Write Protection is disabled when either the WP pin is high or the WPEN bit is set to a logic '0'. When the device is Hardware Write-Protected, writes to the STATUS register, including the Block Protect bits and the WPEN bit, and the block-protected sections in the memory array are disabled. Writes are only allowed to sections of the memory that are not blockprotected. Note: When the WPEN bit is Hardware Write-Protected, it cannot be set back to a logic '0' as long as the WP pin is held low. Table 6-5.WPEN Operation WPEN WP WEN Protected Blocks Unprotected Blocks STATUS Register 0 x 0 Protected Protected Protected 0 x 1 Protected Writeable Writeable 1 Low 0 Protected Protected Protected 1 Low 1 Protected Writeable Protected x High 0 Protected Protected Protected x High 1 Protected Writeable Writeable (c) 2018 Microchip Technology Inc. DS20005993A-page 15 AT25320B/AT25640B Functional Description Read Sequence (READ): Reading the AT25320B/AT25640B via the Serial Output (SO) pin requires the following sequence. After the CS line is pulled low to select a device, the READ instruction is transmitted via the SI line followed by the byte address to be read (A15 - A0, see Table 6-6). Upon completion, any data on the SI line will be ignored. The data (D7 - D0) at the specified address is then shifted out onto the SO line. If only one byte is to be read, the CS line should be driven high after the data comes out. The read sequence can be continued since the byte address is automatically incremented and data will continue to be shifted out. When the highest address is reached, the address counter will roll over to the lowest address allowing the entire memory to be read in one continuous read cycle. Write Sequence (WRITE): In order to program the AT25320B/AT25640B, two separate instructions must be executed. First, the device must be write enabled via the WREN instruction. Then a WRITE instruction may be executed. Also, the address of the memory location(s) to be programmed must be outside the protected address field location selected by the Block Write Protection level. During an internal write cycle, all instructions will be ignored except the RDSR instruction. A WRITE instruction requires the following sequence. After the CS line is pulled low to select the device, the WRITE instruction is transmitted via the SI line followed by the byte address (A15 - A0) and the data (D7 - D0) to be programmed (see Table 6-6). Programming will start after the CS pin is brought high. The low-to-high transition of the CS pin must occur during the SCK low-time immediately after clocking in the D0 (LSb) data bit. The Ready/Busy status of the device can be determined by initiating a Read STATUS Register (RDSR) instruction. If Bit 0 = 1, the write cycle is still in progress. If Bit 0 = 0, the write cycle has ended. Only the RDSR instruction is enabled during the write programming cycle. The AT25320B/AT25640B is capable of a 32-byte page write operation. After each byte of data is received, the five low-order address bits are internally incremented by one; the high-order bits of the address will remain constant. If more than 32 bytes of data are transmitted, the address counter will rollover and the previously written data will be overwritten. The AT25320B/AT25640B is automatically returned to the write disable state at the completion of a write cycle. Note: If the device is not write enabled, the device will ignore the WRITE instruction and will return to the Standby state, when CS is brought high. A new CS falling edge is required to reinitiate the serial communication. Table 6-6.Address Key Address AT25320B AT25640B AN A11-A0 A12-A0 Don't Care Bits A15-A12 A15-A13 (c) 2018 Microchip Technology Inc. DS20005993A-page 16 AT25320B/AT25640B Timing Diagrams 7. Timing Diagrams Figure 7-1.Synchronous Data Timing (for Mode 0) tCS VIH CS VIL tCSS tCSH VIH tWH SCK tWL VIL tSU tH VIH SI Valid In VIL tV VOH SO High Z tHO tDIS High Z VOL Figure 7-2.WREN Timing CS SCK SI SO WREN Opcode High Z Figure 7-3.WRDI Timing CS SCK SI SO (c) 2018 Microchip Technology Inc. WRDI Opcode High Z DS20005993A-page 17 AT25320B/AT25640B Timing Diagrams Figure 7-4.RDSR Timing CS 0 SCK 1 SI 2 3 4 5 6 7 8 9 10 11 12 13 14 15 2 1 0 Instruction Data Out High-Impedance SO 7 6 5 4 3 MSB Figure 7-5.WRSR Timing CS SCK tWC(1) 0 1 2 3 4 5 6 7 8 9 10 11 Instruction 13 14 15 Data In SI 7 6 5 4 3 2 1 0 High-Impedance SO Note: 12 This instruction initiates a self-timed internal write cycle (tWC) on the rising edge of CS after a valid sequence. Figure 7-6.Read Timing CS 0 1 2 3 4 5 6 7 8 9 10 11 20 21 22 23 24 25 26 27 28 29 30 31 SCK Byte Address SI SO Instruction High-Impedance 15 14 13 ... 3 2 1 0 Data Out 7 6 5 4 3 2 1 0 MSB (c) 2018 Microchip Technology Inc. DS20005993A-page 18 AT25320B/AT25640B Timing Diagrams Figure 7-7.Write Timing CS tWC(1) 0 1 2 3 4 5 6 7 8 9 10 11 20 21 22 23 24 25 26 27 28 29 30 31 SCK Instruction Byte Address 15 14 13 ... SI SO 3 2 Data In 1 0 7 6 5 4 3 2 1 0 High-Impedance Note: This instruction initiates a self-timed internal write cycle (tWC) on the rising edge of CS after a valid sequence. Figure 7-8.HOLD Timing CS tCD tCD SCK tHD tHD HOLD tHZ SO tLZ (c) 2018 Microchip Technology Inc. DS20005993A-page 19 AT25320B/AT25640B Packaging Information 8. Packaging Information 8.1 Package Marking Information AT25320B and AT25640B: Package Marking Information 8-lead TSSOP 8-lead SOIC 8-pad XDFN 1.8 x 2.2 mm Body ATMLHYWW ###% CO YYWWNNN ATHYWW ###%CO YYWWNNN 8-pad UDFN 8-ball VFBGA 2.0 x 3.0 mm Body 2.35 x 3.73 mm Body ### H% NNN Note 1: ### NNN ###U WWNNN designates pin 1 Note 2: Package drawings are not to scale Catalog Number Truncation AT25320B Truncation Code ###: 5BB AT25640B Truncation Code ###: 5CB Date Codes YY = Year 16: 2016 17: 2017 18: 2018 19: 2019 Voltages 20: 2020 21: 2021 22: 2022 23: 2023 Y = Year 6: 2016 7: 2017 8: 2018 9: 2019 0: 2020 1: 2021 2: 2022 3: 2023 WW = Work Week of Assembly 02: Week 2 04: Week 4 ... 52: Week 52 Country of Origin Device Grade CO = Country of Origin H or U: Industrial Grade % = Minimum Voltage L: 1.8V min Atmel Truncation AT: Atmel ATM: Atmel ATML: Atmel Lot Number or Trace Code NNN = Alphanumeric Trace Code (2 Characters for Small Packages) (c) 2018 Microchip Technology Inc. DS20005993A-page 20 AT25320B/AT25640B Packaging Information 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2X 0.10 C A-B D A D NOTE 5 N E 2 E1 2 E1 E NOTE 1 2 1 e B NOTE 5 NX b 0.25 C A-B D TOP VIEW 0.10 C C A A2 SEATING PLANE 8X A1 SIDE VIEW 0.10 C h R0.13 h R0.13 H SEE VIEW C VIEW A-A 0.23 L (L1) VIEW C Microchip Technology Drawing No. C04-057-SN Rev D Sheet 1 of 2 (c) 2017 Microchip Technology Inc. (c) 2018 Microchip Technology Inc. DS20005993A-page 21 AT25320B/AT25640B Packaging Information 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units Dimension Limits Number of Pins N e Pitch Overall Height A Molded Package Thickness A2 Standoff A1 Overall Width E Molded Package Width E1 Overall Length D Chamfer (Optional) h Foot Length L L1 Footprint Foot Angle c Lead Thickness b Lead Width Mold Draft Angle Top Mold Draft Angle Bottom MIN 1.25 0.10 0.25 0.40 0 0.17 0.31 5 5 MILLIMETERS NOM 8 1.27 BSC 6.00 BSC 3.90 BSC 4.90 BSC 1.04 REF - MAX 1.75 0.25 0.50 1.27 8 0.25 0.51 15 15 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Significant Characteristic 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm per side. 4. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. 5. Datums A & B to be determined at Datum H. Microchip Technology Drawing No. C04-057-SN Rev D Sheet 2 of 2 (c) 2017 Microchip Technology Inc. (c) 2018 Microchip Technology Inc. DS20005993A-page 22 AT25320B/AT25640B Packaging Information 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging SILK SCREEN C Y1 X1 E RECOMMENDED LAND PATTERN Units Dimension Limits E Contact Pitch Contact Pad Spacing C Contact Pad Width (X8) X1 Contact Pad Length (X8) Y1 MIN MILLIMETERS NOM 1.27 BSC 5.40 MAX 0.60 1.55 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-2057-SN Rev B (c) 2017 Microchip Technology Inc. (c) 2018 Microchip Technology Inc. DS20005993A-page 23 M AT25320B/AT25640B Packaging Diagrams and Parameters Packaging Information 8-Lead Plastic Thin Shrink Small Outline (ST) - 4.4 mm Body [TSSOP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D N E E1 NOTE 1 1 2 b e c A A2 A1 L L1 Units Dimension Limits Number of Pins MILLIMETERS MIN N NOM MAX 8 Pitch e Overall Height A - 0.65 BSC - Molded Package Thickness A2 0.80 1.00 1.05 Standoff A1 0.05 - 0.15 1.20 Overall Width E Molded Package Width E1 4.30 6.40 BSC 4.40 Molded Package Length D 2.90 3.00 3.10 Foot Length L 0.45 0.60 0.75 Footprint L1 4.50 1.00 REF Foot Angle 0 - 8 Lead Thickness c 0.09 - 0.20 Lead Width b 0.19 - 0.30 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. 3. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-086B (c) 2007 Microchip Technology Inc. (c) 2018 Microchip Technology Inc. DS00049AR-page 117 DS20005993A-page 24 M Note: AT25320B/AT25640B Packaging Diagrams and Parameters Packaging Information For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS00049BC-page 96 (c) 2018 Microchip Technology Inc. 2009 Microchip Technology Inc. DS20005993A-page 25 AT25320B/AT25640B Packaging Information 8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN] Atmel Legacy YNZ Package Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A B N (DATUM A) E (DATUM B) NOTE 1 2X 0.10 C 1 2 2X 0.10 C TOP VIEW A1 0.10 C C SEATING PLANE A 8X (A3) SIDE VIEW 0.10 0.08 C C A B D2 e 2 1 2 0.10 E2 C A B K N L 8X b e 0.10 0.05 C A B C BOTTOM VIEW Microchip Technology Drawing C04-21355-Q4B Rev A Sheet 1 of 2 (c) 2017 Microchip Technology Inc. (c) 2018 Microchip Technology Inc. DS20005993A-page 26 AT25320B/AT25640B Packaging Information 8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN] Atmel Legacy YNZ Package Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Notes: Units Dimension Limits Number of Terminals N e Pitch A Overall Height Standoff A1 Terminal Thickness A3 Overall Length D Exposed Pad Length D2 Overall Width E Exposed Pad Width E2 b Terminal Width Terminal Length L Terminal-to-Exposed-Pad K MIN 0.50 0.00 1.40 1.20 0.18 0.35 0.20 MILLIMETERS NOM 8 0.50 BSC 0.55 0.02 0.152 REF 2.00 BSC 1.50 3.00 BSC 1.30 0.25 0.40 - MAX 0.60 0.05 1.60 1.40 0.30 0.45 - 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated 3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-21355-Q4B Rev A Sheet 2 of 2 (c) 2017 Microchip Technology Inc. (c) 2018 Microchip Technology Inc. DS20005993A-page 27 AT25320B/AT25640B Packaging Information 8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN] Atmel Legacy YNZ Package Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging X2 EV G2 8 OV C Y2 G1 Y1 1 2 SILK SCREEN X1 E RECOMMENDED LAND PATTERN Units Dimension Limits E Contact Pitch Optional Center Pad Width X2 Optional Center Pad Length Y2 Contact Pad Spacing C Contact Pad Width (X8) X1 Contact Pad Length (X8) Y1 Contact Pad to Center Pad (X8) G1 Contact Pad to Contact Pad (X6) G2 Thermal Via Diameter V Thermal Via Pitch EV MIN MILLIMETERS NOM 0.50 BSC MAX 1.60 1.40 2.90 0.30 0.85 0.20 0.33 0.30 1.00 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. 2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process Microchip Technology Drawing C04-21355-Q4B Rev A (c) 2017 Microchip Technology Inc. (c) 2018 Microchip Technology Inc. DS20005993A-page 28 AT25320B/AT25640B Packaging Information f d A1 BALL PAD CORNER D 0.10 A (4X) 0.10 C 0.08 C d C A1 BALL PAD CORNER 2 1 Ob j j E n 0.15 m C A B n 0.08 m C A B e C D (e1) B A1 d A2 (d1) A TOP VIEW BOTTOM VIEW SIDE VIEW 8 SOLDER BALLS COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL Notes: 1. This drawing is for general 2. Dimension 'b' is measured at the maximum solder ball diameter. 3. Solder ball composition shall be 95.5Sn-4.0Ag-.5Cu. A A1 A2 b D E e e1 d d1 MIN 0.81 0.15 0.40 0.25 MAX NOM 0.91 0.20 0.45 0.30 2.35 BSC 3.73 BSC 0.75 BSC 0.74 REF 0.75 BSC 0.80 REF NOTE 1.00 0.25 0.50 0.35 6/11/13 TITLE 8U2-1, 8-ball, 2.35 x 3.73 mm Body, 0.75 mm pitch, Very Thin, Fine-Pitch Ball Grid Array Package (VFBGA) GPC DRAWING NO. GWW 8U2-1 REV. G Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging. (c) 2018 Microchip Technology Inc. DS20005993A-page 29 AT25320B/AT25640B Packaging Information D 7 8 6 5 E PIN #1 ID 2 1 3 4 A1 Top View A Side View e1 b L COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX A - - 0.40 A1 0.00 - 0.05 D 1.70 1.80 1.90 E 2.10 2.20 2.30 b 0.15 0.20 0.25 0.10 PIN #1 ID 0.15 b e End View e 0.40 TYP e1 1.20 REF L 0.26 0.30 NOTE 0.35 9/10/2012 TITLE GPC DRAWING NO. REV. 8ME1, 8-pad (1.80mm x 2.20mm body) Extra Thin DFN (XDFN) DTP 8ME1 B Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging. (c) 2018 Microchip Technology Inc. DS20005993A-page 30 AT25320B/AT25640B Revision History 9. Revision History Atmel Document 8535 Revision A (April 2008) Initial document release. Atmel Document 8535 Revision B (July 2008) Modified `Endurance' parameter on page 6. Atmel Document 8535 Revision C (May 2009) Added Part Marking information; changed to Preliminary status. Atmel Document 8535 Revision D (August 2009) Changed Catalog Numbering. Added new Part Marking Information. Atmel Document 8535 Revision E (April 2010) Updated Ordering Code Detail, Ordering Information, template. Atmel Document 8535 Revision F (June 2010) Updated 8A2 and 8S1 package drawings. Remove Preliminary. Atmel Document 8535 Revision G (November 2012) Updated part markings to single page part marking. Updated package drawings. Replaced 8A2 package with 8X package. Update template and Atmel logos. Atmel Document 8535 Revision H (January 2015) Added the UDFN Expanded Quantity Option. Updated the 8X, 8MA2, and 8ME1 package outline drawings and the ordering information. Revision A (June 2018) Updated to the Microchip template. Microchip DS20005993A replaces Atmel document 8535. Updated Part Marking Information. Added ESD rating. Removed lead finish designation. Added POR recommendations section. Updated trace code format in package markings. Updated section content throughout for clarification. Updated the SOIC, TSSOP, and UDFN package drawings to the Microchip equivalents. (c) 2018 Microchip Technology Inc. DS20005993A-page 31 AT25320B/AT25640B The Microchip Web Site Microchip provides online support via our web site at http://www.microchip.com/. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: * * * Product Support - Data sheets and errata, application notes and sample programs, design resources, user's guides and hardware support documents, latest software releases and archived software General Technical Support - Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing Business of Microchip - Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives Customer Change Notification Service Microchip's customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at http://www.microchip.com/. Under "Support", click on "Customer Change Notification" and follow the registration instructions. Customer Support Users of Microchip products can receive assistance through several channels: * * * * Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or Field Application Engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://www.microchip.com/support (c) 2018 Microchip Technology Inc. DS20005993A-page 32 AT25320B/AT25640B Product Identification System To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. Examples: Device Package Package Drawing Code Package Option Shipping Carrier Option Device Grade AT25320B-SSHL-B SOIC SN SS Bulk (Tubes) AT25320B-SSHL-T SOIC SN SS Tape and Reel Industrial Temperature (-40C to 85C) AT25640B-SSHL-T SOIC SN SS Tape and Reel AT25320B-XHL-B TSSOP ST X Bulk (Tubes) AT25640B-XHL-T TSSOP ST X Tape and Reel AT25320B-MAHL-E UDFN Q4B MA Tape and Reel AT25640B-MAHL-T UDFN Q4B MA Tape and Reel AT25640B-MAHL-E UDFN Q4B MA Tape and Reel VFBGA 8U2-1 C Tape and Reel XDFN 8ME1 ME Tape and Reel AT25640B-CUL-T AT25320B-MEHL-T (c) 2018 Microchip Technology Inc. DS20005993A-page 33 AT25320B/AT25640B Microchip Devices Code Protection Feature Note the following details of the code protection feature on Microchip devices: * * * * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Legal Notice Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, KeeLoq logo, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, CryptoAuthentication, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, Mindi, MiWi, (c) 2018 Microchip Technology Inc. DS20005993A-page 34 AT25320B/AT25640B motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. (c) 2018, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-5224-3161-9 Quality Management System Certified by DNV ISO/TS 16949 Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California (R) (R) and India. The Company's quality system processes and procedures are for its PIC MCUs and dsPIC (R) DSCs, KEELOQ code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. (c) 2018 Microchip Technology Inc. DS20005993A-page 35 Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Austin, TX Tel: 512-257-3370 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Novi, MI Tel: 248-848-4000 Houston, TX Tel: 281-894-5983 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Tel: 317-536-2380 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Tel: 951-273-7800 Raleigh, NC Tel: 919-844-7510 New York, NY Tel: 631-435-6000 San Jose, CA Tel: 408-735-9110 Tel: 408-436-4270 Canada - Toronto Tel: 905-695-1980 Fax: 905-695-2078 Australia - Sydney Tel: 61-2-9868-6733 China - Beijing Tel: 86-10-8569-7000 China - Chengdu Tel: 86-28-8665-5511 China - Chongqing Tel: 86-23-8980-9588 China - Dongguan Tel: 86-769-8702-9880 China - Guangzhou Tel: 86-20-8755-8029 China - Hangzhou Tel: 86-571-8792-8115 China - Hong Kong SAR Tel: 852-2943-5100 China - Nanjing Tel: 86-25-8473-2460 China - Qingdao Tel: 86-532-8502-7355 China - Shanghai Tel: 86-21-3326-8000 China - Shenyang Tel: 86-24-2334-2829 China - Shenzhen Tel: 86-755-8864-2200 China - Suzhou Tel: 86-186-6233-1526 China - Wuhan Tel: 86-27-5980-5300 China - Xian Tel: 86-29-8833-7252 China - Xiamen Tel: 86-592-2388138 China - Zhuhai Tel: 86-756-3210040 India - Bangalore Tel: 91-80-3090-4444 India - New Delhi Tel: 91-11-4160-8631 India - Pune Tel: 91-20-4121-0141 Japan - Osaka Tel: 81-6-6152-7160 Japan - Tokyo Tel: 81-3-6880- 3770 Korea - Daegu Tel: 82-53-744-4301 Korea - Seoul Tel: 82-2-554-7200 Malaysia - Kuala Lumpur Tel: 60-3-7651-7906 Malaysia - Penang Tel: 60-4-227-8870 Philippines - Manila Tel: 63-2-634-9065 Singapore Tel: 65-6334-8870 Taiwan - Hsin Chu Tel: 886-3-577-8366 Taiwan - Kaohsiung Tel: 886-7-213-7830 Taiwan - Taipei Tel: 886-2-2508-8600 Thailand - Bangkok Tel: 66-2-694-1351 Vietnam - Ho Chi Minh Tel: 84-28-5448-2100 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 Finland - Espoo Tel: 358-9-4520-820 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Garching Tel: 49-8931-9700 Germany - Haan Tel: 49-2129-3766400 Germany - Heilbronn Tel: 49-7131-67-3636 Germany - Karlsruhe Tel: 49-721-625370 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Germany - Rosenheim Tel: 49-8031-354-560 Israel - Ra'anana Tel: 972-9-744-7705 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Italy - Padova Tel: 39-049-7625286 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Norway - Trondheim Tel: 47-7289-7561 Poland - Warsaw Tel: 48-22-3325737 Romania - Bucharest Tel: 40-21-407-87-50 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Sweden - Gothenberg Tel: 46-31-704-60-40 Sweden - Stockholm Tel: 46-8-5090-4654 UK - Wokingham Tel: 44-118-921-5800 Fax: 44-118-921-5820 (c) 2018 Microchip Technology Inc. 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