Product Number: 214-44-308-01-670800 Description: DIP Socket Surface Mount Stub Tail Closed Frame Surface Mount Accepts .015-.025" Leads Plating Code: 44 Shell Plating: 200 " Tin (matte finish) over 100 " Nickel Inner Contact Plating: 100 " Tin (matte finish) over 50 " Nickel Packaging: Packaged in Tubes # Of Pins A B C Qty. per Tube Mill-Max Part Number 8 0.4 0.3 0.4 50 214-44-308-01-670800 RoHS Compliant CONTACT: Contact Used: #30, Standard 4 Finger Contact Current Rating = 3 Amps BERYLLIUM COPPER ALLOY 172 (UNS C17200) per ASTM B 194 Properties of BERYLLIUM COPPER: Chemical composition: Cu 98.1%, Be 1.9% Temper as stamped: TD01 Properties after heat treatment (TH01): Hardness: 36-43 Rockwell C Mechanical Life: 100 Cycles Min. Density: .298 lbs/in3 Electrical Conductivity: 22% IACS* Resistance: 10 miliohms Max Operating Temperature: -55C/+125C Melting point: 980C/865C (liquidus/solidus) Stress Relaxation: 96% of stress remains after 1,000 hours @ 100 C ; 70% of stress remains after 1,000 hours @ 200 C *International Annealed Copper Standard, i.e. as a % of pure copper. Since BeCu loses its spring properties over time at high temperatures; it is rated for continuous use up to 150C. For applications up to 300C, Mill-Max offers many contacts in Beryllium Nickel. Contact Tech Support for more info. LOOSE PIN: Pin Used: 1434 (Brass Alloy) Mill-Max Mfg. Corp. Datasheet -- Last Modified 12/31/2009 Page 1 of 2 BRASS ALLOY (UNS C36000) per ASTM B 16 Properties of BRASS ALLOY: Chemical composition: Cu 61.5%, Zn 35.4%, Pb 3.1% Hardness as machined: 80-90 Rockwell B Density: .307 lbs/in3 Electrical conductivity: 26% IACS* Melting point: 900C/885C (liquidus/solidus) (3 to 4% lead is used to permit "free machining" and is permitted by EC Directive 2002/95Annex 6; so all pin materials are RoHS compliant) *International Annealed Copper Standard, i.e. as a % of pure copper. INSULATOR INFORMATION: NYLON 46 (Stanyl TE250F6 {30% glass} or TE250F9 {45% glass}, black) High Temperature Properties of NYLON 46: Brand: Stanyl Grade: TE250-F6 or F9 Material Heat Deflection Temp. (per ASTM D 648): 554F (290C) @ 264 psi Note: Materials above 446F (230C) are considered suitable for "eutectic" reflow soldering, above 500F (260C) for "lead-free" reflow soldering. Mill-Max Mfg. Corp. Datasheet -- Last Modified 12/31/2009 Page 2 of 2