AP2141/ AP2151 0.5A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH Description Pin Assignments The AP2141 and AP2151 are integrated high-side power switches optimized for Universal Serial Bus (USB) and other hot-swap applications. This family of devices complies with USB 2.0 and is available with both polarities of Enable input. They offer current and thermal limiting and short circuit protection as well as controlled rise time and undervoltage lockout functionality. A 7ms deglitch capability on the open-drain Flag output prevents false over-current reporting and does not require any external components. (Top View) GND 1 8 NC IN 2 7 OUT IN 3 6 OUT EN 4 5 FLG SO-8 All devices are available in SO-8, MSOP-8EP, SOT25 and UDFN2018-6 packages. (Top View) Features Single USB Port Power Switches Over-Current and Thermal Protection 0.8A Accurate Current Limiting Reverse Current Blocking 95m On-Resistance Input Voltage Range: 2.7V to 5.5V 0.6ms Typical Rise Time Very Low Shutdown Current: 1A (Max) Fault Report (FLG) with Blanking Time (7ms Typ) ESD Protection: 4kV HBM, 400V MM Active High (AP2151) or Active Low (AP2141) Enable Ambient Temperature Range -40C to +85C SOT25, SO-8, MSOP-8EP (Exposed Pad), and U-DFN2018-6: Available in Green Molding Compound (No Br, Sb) Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. "Green" Device (Note 3) 15kV ESD Protection per IEC 61000-4-2 (With External Capacitance) UL Recognized, File Number E322375 IEC60950-1 CB Scheme Certified Applications Consumer Electronics - LCD TV & Monitor, Game Machines Communications - Set-Top Box, GPS, Smartphone Computing - Laptop, Desktop, Servers, Printers, Docking Station, HUB Notes: 1 8 NC IN 2 7 OUT IN 3 6 OUT EN 4 5 FLG GND MSOP-8EP (Top View) OUT 1 GND 2 FLG 3 5 IN 4 EN SOT25 (Top View) GND 1 6 OUT IN 2 5 OUT EN 3 4 FLG U-DFN2018-6 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated's definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. AP2141/ AP2151 Document number: DS31562 Rev. 10 - 2 1 of 18 www.diodes.com January 2017 (c) Diodes Incorporated AP2141/ AP2151 Typical Applications Circuit AP2151 Enable Active High IN Power Supply 2.7V to 5.5V 0.1F 0.1F 10F 10k Load OUT 120F FLG EN ON GND OFF Available Options Part Number Channel Enable Pin (EN) Current Limit (Typical) Recommended Maximum Continuous Load Current AP2141 AP2151 1 1 Active Low Active High 0.8A 0.8A 0.5A 0.5A Pin Descriptions Pin Number MSOP-8EP SOT25 Pin Name SO-8 GND IN 1 2, 3 1 2, 3 2 5 1 2 EN 4 4 4 3 FLG 5 5 3 4 OUT NC 6, 7 8 6, 7 8 1 -- 5, 6 -- Exposed Pad -- Exposed Pad -- Exposed Pad AP2141/ AP2151 Document number: DS31562 Rev. 10 - 2 Function U-DFN2018-6 Ground Voltage Input Pin (all IN pins must be tied together externally) Enable Input Active Low (AP2141) or Active High (AP2151) Over-Current and Over-Temperature Fault Report Open-Drain flag is active low when triggered Voltage Output Pin (all OUT pins must be tied together externally) No internal connection; recommend tie to OUT pins Exposed Pad It should be externally connected to GND plane and thermal mass for enhanced thermal impedance. It should not be used as electrical ground conduction path. 2 of 18 www.diodes.com January 2017 (c) Diodes Incorporated AP2141/ AP2151 Functional Block Diagram AP2141, AP2151 IN Current Sense OUT Current Limit FLG UVLO Driver EN Deglitch Thermal Sense GND Absolute Maximum Ratings (@TA = +25C, unless otherwise specified.) Symbol HBM MM ESD MM IEC System Level VIN Parameter Human Body Model ESD Protection Machine Model ESD Protection for SO-8, MSOP-8EP, SOT25 Packages Machine Model ESD Protection for U-DFN2018-6, SO-8 Packages Surges per EN61000-4-2. 1999 applied to output terminals of EVM (Note 5) Surges per EN61000-4-2. 1999 applied to output terminals of EVM (Note 5) Ratings 4 Units kV 400 V 300 V Air 15 kV Contact 8 kV 6.5 V Input Voltage VOUT Output Voltage VIN +0.3 V VEN , VFLG Enable Voltage 6.5 V Internal Limited A +150 C -65 to +150 C ILOAD TJ(MAX) TST Caution: Maximum Continuous Load Current Maximum Junction Temperature Storage Temperature Range (Note 4) Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time. Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling and transporting these devices. Notes: 4. UL Recognized Rating from -30C to +70C (Diodes qualified TST from -65C to +150C). 5. External capacitors need to be connected to the output, EVM board tested with capacitor 2.2F 50V 0805. This level is a pass test only and not a limit. Recommended Operating Conditions (@TA = +25C, unless otherwise specified.) Symbol Parameter VIN Input Voltage IOUT Output Current Min Max 2.7 5.5 Units V 0 500 mA TA Operating Ambient Temperature -40 +85 C VIL EN Input Logic Low Voltage 0 0.8 V VIH EN Input Logic High Voltage 2 VIN V AP2141/ AP2151 Document number: DS31562 Rev. 10 - 2 3 of 18 www.diodes.com January 2017 (c) Diodes Incorporated AP2141/ AP2151 Electrical Characteristics Symbol (@TA = +25C, VIN = 5.0V, unless otherwise specified.) Parameter Min Typ Max RLOAD = 1k 1.6 1.9 2.5 V ISHDN Input Shutdown Current Disabled, IOUT = 0 -- 0.5 1 A IQ Input Quiescent Current Enabled, IOUT = 0 -- 45 70 A ILEAK Input Leakage Current Disabled, OUT Grounded -- -- 1 A IREV Reverse Leakage Current Disabled, VIN = 0V, VOUT = 5V, IREV at VIN -- 1 -- A -- -- 95 90 115 110 VUVLO Input UVLO RDS(ON) Switch On-Resistance ISHORT Short-Circuit Current Limit Conditions SOT25, SO-8, MSOP-8EP U-DFN2018-6 VIN = 5V, IOUT = 0.5A TA = +25C -40C TA +85C -- -- 140 VIN = 3.3V, IOUT = 0.5A TA = +25C -- 120 140 -40C TA +85C Unit m -- -- 170 Enabled into Short Circuit, CL = 22F -- 0.6 -- A A ILIMIT Over-Load Current Limit VIN = 5V, VOUT = 4.8V, CL = 22F, -40C TA +85C 0.6 0.8 1.0 ITRIG Current Limiting Trigger Threshold Output Current Slew Rate (<100A/s), CL = 22F -- 1.0 -- A ISINK EN Input Leakage VEN = 5V -- -- 1 A tD(ON) Output Turn-On Delay Time CL = 1F, RLOAD = 10 -- 0.05 -- ms tR Output Turn-On Rise Time CL = 1F, RLOAD = 10 -- 0.6 1.5 ms CL = 1F, RLOAD = 10 -- 0.01 -- ms Output Turn-Off Fall Time CL = 1F, RLOAD = 10 -- 0.05 0.1 ms tD(OFF) Output Turn-Off Delay Time tF RFLG FLG Output FET On-Resistance IFLG =10mA -- 20 40 tBLANK FLG Blanking Time CIN = 10F, CL = 22F 4 7 15 ms TSHDN Thermal Shutdown Threshold Enabled, RLOAD = 1k -- +140 -- C THYS Thermal Shutdown Hysteresis -- +25 -- -- -- -- -- 110 60 157 70 -- -- -- -- JA Notes: Thermal Resistance Junction-toAmbient -- SO-8 (Note 6) MSOP-8EP (Note 7) SOT25 (Note 8) U-DFN2018-6 (Note 9) C o C/W o C/W o C/W o C/W 6. Test condition for SO-8: Device mounted on FR-4, 2oz copper, with minimum recommended pad layout. 7. Test condition for MSOP-8EP: Device mounted on 2 x 2 FR-4 substrate PC board, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground plane. 8. Test condition for SOT25: Device mounted on FR-4, 2oz copper, with minimum recommended pad layout. 9. Test condition for U-DFN2018-6: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad on top layer and 3 vias to bottom layer 1.0x1.4 ground plane. AP2141/ AP2151 Document number: DS31562 Rev. 10 - 2 4 of 18 www.diodes.com January 2017 (c) Diodes Incorporated AP2141/ AP2151 Typical Performance Characteristics VEN 50% VEN 50% tD(OFF) tR tD(ON) tD(OFF) tR tF 90% 50% 50% tD(ON) 90% VOUT tF 90% 90% VOUT 10% 10% 10% 10% Figure 1. Voltage Waveforms: AP2141 (Left), AP2151 (Right) All Enable Plots are for AP2151 Active High Turn-On Delay and Rise Time Turn-Off Delay and Fall Time VEN 5V/div VEN 5V/div VOUT 2V/div VOUT 2V/div CL = 1F TA = +25C RL = 10 CL = 1F TA = +25C RL = 10 500s/div 500s/div Turn-On Delay and Rise Time Turn-Off Delay and Fall Time VEN 5V/div VEN 5V/div VOUT 2V/div VOUT 2V/div CL = 1F TA = +25C RL = 10 500s/div AP2141/ AP2151 Document number: DS31562 Rev. 10 - 2 CL = 1F TA = +25C RL = 10 500s/div 5 of 18 www.diodes.com January 2017 (c) Diodes Incorporated AP2141/ AP2151 Typical Performance Characteristics (Cont.) Short Circuit Current, Device Enabled Into Short Inrush Current VEN 5V/div VEN 5V/div CL = 100F VIN = 5V TA = +25C RL = 10 IOUT 200mA/div VIN = 5V TA = +25C CL = 22F IOUT 200mA/div CL = 470F CL = 220F 500s/div 1ms/div 3 Load Connected to Enabled Device 2 Load Connected to Enabled Device VIN = 5V TA = +25C CL = 22F VFLAG 2V/div VIN = 5V TA = +25C CL = 22F VFLAG 2V/div IOUT 500mA/div IOUT 500mA/div 2ms/div 2ms/div Short Circuit with Blanking Time and Recovery VIN = 5V TA = +25C CL = 22F VOUT 5V/div VFLAG 5V/div Power On VFLAG 5V/div IOUT 200mA/div TA = +25C CL = 22F RL = 10 VEN 5V/div IOUT 1A/div VIN 5V/div 20ms/div AP2141/ AP2151 Document number: DS31562 Rev. 10 - 2 1ms/div 6 of 18 www.diodes.com January 2017 (c) Diodes Incorporated AP2141/ AP2151 Typical Performance Characteristics (Cont.) UVLO Increasing UVLO Decreasing TA = +25C CL = 22F RL = 10 VIN 2V/div TA = +25C CL = 22F RL = 10 VIN 2V/div IOUT 200mA/div 1ms/div 10ms/div Turn-On Time vs Input Voltage Turn-Off Time vs Input Voltage 800 31 700 31 600 Turn-Off Time (us) Turn-On Time (us) IOUT 200mA/div 500 400 300 CL = 1F RL = 10 TA = +25C 200 100 30 CL = 1F RL = 10 TA = +25C 30 29 29 28 28 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 1.5 6 2 2.5 3 25 500 24 400 23 Fall Time (us) Rise Time (us) 600 300 CL = 1F RL = 10 TA = +25C 100 4 4.5 5 5.5 6 Fall Time vs Input Voltage Rise Time vs Input Voltage 200 3.5 Input Voltage (V) Input Voltage (V) 22 21 CL = 1F RL = 10 TA = +25C 20 19 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 1.5 AP2141/ AP2151 Document number: DS31562 Rev. 10 - 2 2 2.5 3 3.5 4 4.5 5 5.5 6 Input Voltage (V) Input Voltage (V) 7 of 18 www.diodes.com January 2017 (c) Diodes Incorporated AP2141/ AP2151 Typical Performance Characteristics (Cont.) Supply Current, Output Disabled vs Ambient Temperature Supply Current, Output Enabled vs Ambient Temperature 1.60 Supply Current, Output Disabled (uA) Supply Current, Output Enabled (uA) 65 60 VIN = 5.0V 55 VIN = 5.5V 50 45 VIN = 2.7V 40 VIN = 3.3V 35 VIN = 5.5V 1.40 1.20 VIN = 5.0V 1.00 VIN = 3.3V 0.80 0.60 VIN = 2.7V 0.40 0.20 0.00 30 -60 -40 -20 0 20 40 60 80 -45 100 -25 -5 35 55 75 95 Short-Circuit Output Current vs Ambient Temperature Static Drain-Source On-State Resistance vs Ambient Temperature 710 Short-Circuit Output Current (mA) 200 190 Static Drain-Source On-State Resistance (m) 15 Ambient Temperature (C) Ambient Temperature (C) 180 VIN = 2.7V 170 VIN = 3.3V 160 150 140 130 120 110 VIN = 5.0V 100 VIN = 5.0V 700 VIN = 2.7V VIN = 3.3V 690 680 670 660 650 VIN = 5.5V 640 630 -60 -40 -20 0 20 40 60 80 100 -60 -40 -20 Ambient Temperature (C) 0 20 40 60 80 100 Ambient Temperature (C) Threshold Trip Current vs Input Voltage Undervoltage Lockout vs Ambient Temperature 1.15 2.05 Threshold Trip Current (A) Undervoltage Lockout (V) 2.04 2.03 UVLO Rising 2.02 2.01 2.00 1.99 UVLO Falling 1.98 1.97 1.14 1.13 1.12 TA = +25C CL = 22F 1.11 1.96 1.10 1.95 -60 -40 -20 0 20 40 60 80 100 AP2141/ AP2151 Document number: DS31562 Rev. 10 - 2 2.8 3.3 3.8 4.3 4.8 5.3 Input Voltage (V) Ambient Temperature (C) 8 of 18 www.diodes.com January 2017 (c) Diodes Incorporated AP2141/ AP2151 Typical Performance Characteristics (Cont.) Current Limit Response vs Peak Current 45 Current Limit Response (us) 40 35 30 CL = 22F VIN = 5V TA = +25C 25 20 15 10 5 0 2 3 4 5 6 7 8 9 10 Peak Current (A) AP2141/ AP2151 Document number: DS31562 Rev. 10 - 2 9 of 18 www.diodes.com January 2017 (c) Diodes Incorporated AP2141/ AP2151 Application Information Power Supply Considerations A 0.01F to 0.1F X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is recommended. Placing a high-value electrolytic capacitor on the input (10F minimum) and output pin(s) is recommended when the output load is heavy. This precaution reduces power-supply transients that may cause ringing on the input. Additionally, bypassing the output with a 0.01F to 0.1F ceramic capacitor improves the immunity of the device to short-circuit transients. Over-current and Short Circuit Protection An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting. Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before VIN has been applied. The AP2141/AP2151 senses the short circuit and immediately clamps output current to a certain safe level namely ISHORT. In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, higher current may flow for a very short period of time before the current limit function can react. After the current limit function has tripped (reached the over-current trip threshold), the device switches into current limiting mode and the current is clamped at I LIMIT. In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the current-limit threshold (ITRIG) is reached or until the thermal limit of the device is exceeded. The AP2141/AP2151 is capable of delivering current up to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current limiting mode and is set at ILIMIT. Note that when the output has been shorted to GND at extremely low temperature (< -30C), a minimum 120F electrolytic capacitor on the output pin is recommended. A correct capacitor type with capacitor voltage rating and temperature characteristics must be properly chosen so that capacitance value does not drop too low at the extremely low temperature operation. A recommended capacitor should have temperature characteristics of less than 10% variation of capacitance change when operated at extremely low temp. Our recommended aluminum electrolytic capacitor type is Panasonic FC series. FLG Response When an over-current or over-temperature shutdown condition is encountered, the FLG open-drain output goes active low after a nominal 7ms deglitch timeout. The FLG output remains low until both over-current and over-temperature conditions are removed. Connecting a heavy capacitive load to the output of the device can cause a momentary over-current condition, which does not trigger the FLG due to the 7ms deglitch timeout. The FLG will be triggered at above 500mA to indicate possible Over-Current condition. The AP2141/AP2151 is designed to eliminate false over-current reporting without the need of external components to remove unwanted pulses. Power Dissipation and Junction Temperature The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by: PD = RDS(ON) x I2 Finally, calculate the junction temperature: TJ = PD x RJA + TA Where: TA = Ambient temperature C RJA = Thermal resistance PD = Total power dissipation AP2141/ AP2151 Document number: DS31562 Rev. 10 - 2 10 of 18 www.diodes.com January 2017 (c) Diodes Incorporated AP2141/ AP2151 Application Information (Cont.) Thermal Protection Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The AP2141/AP2151 implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die temperature rises to approximately +140C due to excessive power dissipation in an over-current or short-circuit condition, the internal thermal sense circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing the device to cool down approximately +25C before the switch turns back on. The switch continues to cycle in this manner until the load fault or input power is removed. The FLG open-drain output is asserted when an over-temperature shutdown or over-current occurs with 7ms deglitch. Under-Voltage Lockout (UVLO) Undervoltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 1.9V, even if the switch is enabled. Whenever the input voltage falls below approximately 1.9V, the power switch is quickly turned off. This facilitates the design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed. Host/Self-Powered HUBs Hosts and self-powered hubs (SPH) have a local power supply that powers the embedded functions and the downstream ports (see Figure 2). This power supply must provide from 5.25V to 4.75V to the board side of the downstream connection under both full-load and no-load conditions. Hosts and SPHs are required to have current-limit protection and must report over-current conditions to the USB controller. Typical SPHs are desktop PCs, monitors, printers, and stand-alone hubs. Figure 2. Typical One-Port USB Host / Self-Powered Hub Generic Hot-Plug Applications In many applications it may be necessary to remove modules or PC boards while the main unit is still operating. These are considered hot-plug applications. Such implementations require the control of current surges seen by the main power supply and the card being inserted. The most effective way to control these surges is to limit and slowly ramp the current and voltage being applied to the card, similar to the way in which a power supply normally turns on. Due to the controlled rise and fall times of the AP2141/AP2151, these devices can be used to provide a softer start-up to devices being hot-plugged into a powered system. The UVLO feature of the AP2141/AP2151 also ensures that the switch is off after the card has been removed, and that the switch is off during the next insertion. By placing the AP2141/AP2151 between the VCC input and the rest of the circuitry, the input power reaches these devices first after insertion. The typical rise time of the switch is approximately 1ms, providing a slow voltage ramp at the output of the device. This implementation controls system surge current and provides a hot-plugging mechanism for any device. Dual-Purpose Port Applications AP2141/AP2151 is not recommended for use in dual-purpose port applications in which a single port is used for data communication between the host and peripheral devices while simultaneously maintaining a charge to the battery of the peripheral device. An example of such a nonrecommended application is a shared HDMI/MHL (Mobile High-definition Link) port that allows streaming video between an HDTV or set-top box and a smartphone or tablet while maintaining a charge to the smartphone or tablet battery. If a voltage is maintained across the output of the AP2141/AP2151 when the output is disabled and the VIN of the device is subsequently ramped up, an overstress condition to the AP2141/AP2151 may result. AP2141/ AP2151 Document number: DS31562 Rev. 10 - 2 11 of 18 www.diodes.com January 2017 (c) Diodes Incorporated AP2141/ AP2151 Ordering Information Note: Part Number Package Code Packaging (Note 10) AP21X1WG-7 AP21X1SG-13 AP21X1MPG-13 AP21X1FMG-7 W S MP FM SOT25 SO-8 MSOP-8EP U-DFN2018-6 Quantity 7" / 13" Tape and Reel Part Number Suffix 3,000/Tape & Reel 2,500/Tape & Reel 2,500/Tape & Reel 3,000/Tape & Reel -7 -13 -13 -7 10. For packaging details, go to our website at http://www.diodes.com/products/packages.html. Marking Information (1) SO-8 (Top View) 8 7 6 5 Logo Part Number 4 : Active Low 5 : Active High YY WW X X 2 1 (2) 1 : 1 Channel G : Green YY : Year : 08, 09,10~ WW : Week : 01~52; 52 represents 52 and 53 week X : Internal Code AP21X X 3 4 MSOP-8EP ( Top View ) 8 7 Logo AP21X X 1 Document number: DS31562 Rev. 10 - 2 5 YWXE Part Number 4 : Active Low 5 : Active High AP2141/ AP2151 6 2 3 A~Z : Green MSOP-8EP Y : Year : 0~9 W : Week : A~Z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week 1 : 1 Channel 4 12 of 18 www.diodes.com January 2017 (c) Diodes Incorporated AP2141/ AP2151 Marking Information (Cont.) (3) SOT25 ( Top View ) 4 7 5 XX : Identification code Y : Year 0~9 W : Week : A~Z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week X : A~Z : Green XX Y W X 1 (4) 2 3 Device Package Type Identification Code AP2141W AP2151W SOT25 SOT25 HR HS U-DFN2018-6 (Top View) XX YWX AP2141/ AP2151 Document number: DS31562 Rev. 10 - 2 XX : Identification Code Y : Year : 0~9 W : Week : A~Z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week X : A~Z : Green Device Package Type Identification Code AP2141FM AP2151FM U-DFN2018-6 U-DFN2018-6 HR HS 13 of 18 www.diodes.com January 2017 (c) Diodes Incorporated AP2141/ AP2151 Package Outline Dimensions Please see http://www.diodes.com/package-outlines.html for the latest version. (1) SO-8 E 1 b E1 h ) ides 7 A R 1 0. c 4 3 A1 e Q 45 All s 9 ( E0 SO-8 Dim Min Max Typ A 1.40 1.50 1.45 A1 0.10 0.20 0.15 b 0.30 0.50 0.40 c 0.15 0.25 0.20 D 4.85 4.95 4.90 E 5.90 6.10 6.00 E1 3.80 3.90 3.85 E0 3.85 3.95 3.90 e --1.27 h -0.35 L 0.62 0.82 0.72 Q 0.60 0.70 0.65 All Dimensions in mm Gauge Plane Seating Plane L D (2) MSOP-8EP D 4X 10 0.25 D1 x E E2 Gauge Plane Seating Plane a y 1 4X 10 8Xb e Detail C E3 A1 A3 L c A2 A D E1 See Detail C AP2141/ AP2151 Document number: DS31562 Rev. 10 - 2 14 of 18 www.diodes.com MSOP-8EP Dim Min Max Typ A 1.10 A1 0.05 0.15 0.10 A2 0.75 0.95 0.86 A3 0.29 0.49 0.39 b 0.22 0.38 0.30 c 0.08 0.23 0.15 D 2.90 3.10 3.00 D1 1.60 2.00 1.80 E 4.70 5.10 4.90 E1 2.90 3.10 3.00 E2 1.30 1.70 1.50 E3 2.85 3.05 2.95 e 0.65 L 0.40 0.80 0.60 a 0 8 4 x 0.750 y 0.750 All Dimensions in mm January 2017 (c) Diodes Incorporated AP2141/ AP2151 Package Outline Dimensions (Cont.) Please see http://www.diodes.com/package-outlines.html for the latest version. (3) SOT25 A SOT25 Dim Min Max Typ A 0.35 0.50 0.38 B 1.50 1.70 1.60 C 2.70 3.00 2.80 D 0.95 H 2.90 3.10 3.00 J 0.013 0.10 0.05 K 1.00 1.30 1.10 L 0.35 0.55 0.40 M 0.10 0.20 0.15 N 0.70 0.80 0.75 0 8 All Dimensions in mm B C H K J (4) M N L D U-DFN2018-6 A3 A SEATING PLANE U-DFN2018-6 Dim Min Max Typ A 0.545 0.605 0.575 A1 0 0.05 0.02 A3 0.13 b 0.15 0.25 0.20 D 1.750 1.875 1.80 D2 1.30 1.50 1.40 e 0.50 E 1.95 2.075 2.00 E2 0.90 1.10 1.00 L 0.20 0.30 0.25 z 0.30 All Dimensions in mm A1 Pin#1 ID D D2 L E2 E z e AP2141/ AP2151 Document number: DS31562 Rev. 10 - 2 b 15 of 18 www.diodes.com January 2017 (c) Diodes Incorporated AP2141/ AP2151 Suggested Pad Layout Please see http://www.diodes.com/package-outlines.html for the latest version. (1) SO-8 X1 Dimensions Value (in mm) C 1.27 X 0.802 X1 4.612 Y 1.505 Y1 6.50 Y1 Y C (2) X MSOP-8EP C X Dimensions G C G X X1 Y Y1 Y2 Y Y2 Y1 X1 (3) Value (in mm) 0.650 0.450 0.450 2.000 1.350 1.700 5.300 SOT25 C2 Z C2 Dimensions Z G X Y C1 C2 C1 G Y Value 3.20 1.60 0.55 0.80 2.40 0.95 X AP2141/ AP2151 Document number: DS31562 Rev. 10 - 2 16 of 18 www.diodes.com January 2017 (c) Diodes Incorporated AP2141/ AP2151 Suggested Pad Layout (Cont.) Please see http://www.diodes.com/package-outlines.html for the latest version. (4) U-DFN2018-6 X C Dimensions Y C G X X1 Y Y1 Y1 Value (in mm) 0.50 0.20 0.25 1.60 0.35 1.20 G X1 AP2141/ AP2151 Document number: DS31562 Rev. 10 - 2 17 of 18 www.diodes.com January 2017 (c) Diodes Incorporated AP2141/ AP2151 IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright (c) 2017, Diodes Incorporated www.diodes.com AP2141/ AP2151 Document number: DS31562 Rev. 10 - 2 18 of 18 www.diodes.com January 2017 (c) Diodes Incorporated