OKI Semiconductor FEDR27T3202F-02-04
Issue Date: Jul. 9, 2004
MR27T3202F
2M–Word × 16–Bit or 4M–Word × 8–Bit P2ROM
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FEATURES
· 2,097,152-word × 16-bit / 4,194,304 - word × 8-bit electrically
switchable configuration
· 2.7 V to 3.6 V power supply
· Access time 90 ns MAX
· Operating current 20 mA MAX (5MHz)
· Standby current 10 µA MAX
· Input/Output TTL compatible
· Three-state output
PACKAGES
· MR27T3202F-xxxMA
44-pin plastic SOP (SOP44-P-600-1.27-K)
· MR27T3202F-xxxTP
44-pin plastic TSOP (TSOP II 44-P-400-0.80-K)
· MR27T3202F-xxxTN
48-pin plastic TSOP (TSOP I 48-P-1 220-0.50-1K)
P2ROM ADVANCED TECHNOLOGY
P2ROM stands for Production Programmed ROM. This
exclusive Oki technology utilizes factory test equipment for
programmi ng the customers code into the P2R OM prior to final
production testing. Advancements in this technology allows
production c osts to be e quivalent t o MASKROM a nd has many
advantages and added benefits over the other non-volatile
technologies, which include the following;
· Short lead time, since the P2ROM is programmed at the
final stage of the production process, a large P2ROM
inventory "bank system" of un-programmed packaged
products are maintained to provide an aggressive lead-time
and minimize liability as a custom product.
· No mask charge, since P2ROMs do not utilize a custom
mask for storing cu stomer code, no mask charges apply.
· No additional programming charge, unlike Flash and
OTP that require additional programming and handling
costs, the P2ROM already has the code loaded at the
factory with minimal effect on the production throughput.
The cost is included in the unit price.
· Custom Marking is available at no additional charge.
· Pin Compatible with Mask ROM and some FLASH
products.
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
A15
A14
A13
A12
A11
A10
A9
A8
A19
A20
NC
NC
NC
NC
NC
A18
A17
A7
A6
A5
A4
A3
A2
A1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48TSOP(Type-I)
PIN CONFIGURATION (TOP VIEW)
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
NC
A18
A17
A7
A6
A5
A4
A3
A2
A1
A0
CE#
VSS
OE#
D0
D8
D1
D9
D2
D10
D3
D11
A20
A19
A8
A9
A10
A11
A12
A13
A14
A15
A16
BYTE#
VSS
D15/A–1
D7
D14
D6
D13
D5
D12
D4
VCC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44SOP,
44TSOP(Type-II)
A16
BYTE#
VSS
D15/A–1
D7
D14
D6
D13
D5
D12
D4
VCC
D11
D3
D10
D2
D9
D1
D8
D0
OE#
VSS
CE#
A0
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BLOCK DIAGRAM
PIN DESCRIPTIONS
Pin name Functions
D15 / A–1 Data output / Address input
A0 to A20 Address inputs
D0 to D14 Data outputs
CE# Chip enable input
OE# Output enable input
BYTE# Word / Byte select input
VCC Power supply voltage
VSS Ground
NC No connect
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
A20
CE# BYTE# OE#
CE OE
× 8/× 16 Switch
D0 D2 D4 D6 D8 D10 D12 D14
D1 D3 D5 D7 D9 D11 D13 D15
Memory Cell Matrix
2M × 16-Bit or 4M × 8-Bit
Multiplexer
Output Buffer
Row Decoder
Column Decoder
Address Buffer
In 8-bit output mode, these pins
are placed in a high-Z state and
pin D15 functions as the A-1
address pin.
A–1
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FUNCTION TABLE
Mode CE# OE# BYTE# VCC D0 to D7 D8 to D14 D15/A–1
Read (16-Bit) L L H DOUT
Read (8-Bit) L L L DOUT Hi–Z L/H
H
Output disable L H L
Hi–Z
H
Standby H L
3.0 V
Hi–Z
: Don’t Care (H or L)
ABSOLUTE MAXIMUM RATINGS
Parameter Symbol Condition Value Unit
Operating temperature under bias Ta 0 to 70 °C
Storage temperature Tstg –55 to 125 °C
Input voltage VI –0.5 to VCC+0.5 V
Output voltage VO –0.5 to VCC+0.5 V
Power supply voltage VCC relative to VSS –0.5 to 5 V
Power dissipation per package PD Ta = 25°C 1.0 W
Output short circuit current IOS 10 mA
RECOMMENDED OPERATING CONDITI ON S
(Ta = 0 to 70°C)
Parameter Symbol Condition Min. Typ. Max. Unit
VCC power supply voltage VCC 2.7 3.6 V
Input “H” level VIH 2.2 VCC+0.5 V
Input “L” level VIL VCC = 2.7 to 3.6 V –0.5∗∗ 0.6 V
Voltage is relative to VSS.
: Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns.
∗∗ : -1.5V(Min.) when pulse width of undershoot is less than 10ns.
PIN CAPACITANCE
(VCC = 3.0 V, Ta = 25°C, f = 1 MHz)
Parameter Symbol Condition Min. Typ. Max. Unit
Input CIN18
BYTE# CIN2 VI = 0 V — — 120
Output COUT V
O = 0 V 10 pF
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ELECTRICAL CHARACTERISTICS
DC Characteristics
(VCC = 2.7 V to 3.6 V, Ta = 0 to 70°C)
Parameter Symbol Condition Min. Typ. Max. Unit
Input leakage current ILI V
I = 0 to VCC10 µA
Output leakage current ILO V
O = 0 to VCC10 µA
ICCSC CE# = VCC10 µA VCC power supply current
(Standby) ICCST CE# = VIH1 mΑ
VCC power supply current
(Read) ICCA CE# = VIL, OE# = VIH
f=5MHz — — 20 mA
Input “H” level VIH — 2.2 VCC+0.5 V
Input “L” level VIL–0.5∗∗ 0.6 V
Output “H” level VOH I
OH = –1 mA 2.4 V
Output “L” level VOL I
OL = 2 mA 0.4 V
Voltage is relative to VSS.
: Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns.
∗∗ : -1.5V(Min.) when pulse width of undershoot is less than 10ns.
AC Characteristics
(VCC = 2.7 V to 3.6 V, Ta = 0 to 70°C)
Parameter Symbol Condition Min. Max. Unit
Address cycle time tC 90 ns
Address access time tACC CE# = OE# = VIL 90 ns
CE# access time tCE OE# = VIL 90 ns
OE# access time tOE CE# = VIL 30 ns
tCHZ OE# = VIL 0 30 ns
Output disable time tOHZ CE# = VIL 0 25 ns
Output hold time tOH CE# = OE# = VIL 0 ns
Measurement conditions
Input signal level --------------------------------------0 V / 3 V
Input timing reference level-------------------------1/2 Vcc
Output load ---------------------------------------------50 pF
Output timing reference level ----------------------1/2 Vcc
Output load
Output
50 pF
(Including scope and jig)
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TIMING CHART (READ CYCLE)
8-Bit Read Mode (BYTE# = VIL)
A-1 to A20
CE#
OE#
D0 to D7
tC
tCE
tOE
tOH
tCHZ
tOHZ
Valid Data
Hi-Z Hi-Z
tOH
Valid Data
tACC
tC
tACC
16-Bit Read Mode (BYTE# = VIH)
A0 to A20
CE#
OE#
D0 to D15
tC
tCE
tOE
tOH
tCHZ
tOHZ
Valid Data
Hi-Z Hi-Z
tOH
Valid Data
tACC
tC
tACC
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PACKAGE DIMENSIONS
SOP44-P-600-1.27-K
Mirror finish
Package material Epox y resin
Lead frame materi al 42 alloy
Pin treatment Solder plating (m)
Package weight (g) 2.10 TYP.
5
Rev. No./Last Revised 4/Dec. 5, 1996
Notes for Mounting the Surface Mount Type Packag e
The surface mount type packages are very susceptible to heat in reflow mounting and humidity
absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product
name, package name, pin number, package code and desired mounting conditions (reflow method,
temperature and times).
(Unit: mm)
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TSOP(2)44-P-400-0.80-K
Mirror finish
Package material Epox y resin
Lead frame materi al 42 alloy
Pin treatment Solder plating (m)
Package weight (g) 0.54 TYP.
5
Rev. No./Last Revised 3/Dec. 10, 1996
Notes for Mounting the Surface Mount Type Packag e
The surface mount type packages are very susceptible to heat in reflow mounting and humidity
absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product
name, package name, pin number, package code and desired mounting conditions (reflow method,
temperature and times).
(Unit: mm)
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TSOP(1)48-P-1220-0.50-1K
Mirror finish
Package material Epoxy resin
Lead frame material 42 alloy
Pin treatment Solder plating (5µm)
Package weight (g) 0.55 TYP.
5
Rev. No./Last Revised 1/Dec. 2, 1999
Notes for Mounting the Surface Mount Type Packag e
The surface mount type packages are very susceptible to heat in reflow mounting and humidity
absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product
name, package name, pin number, package code and desired mounting conditions (reflow method,
temperature and times).
(Unit: mm)
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REVISION HISTORY
Page
Document
No. Date Previous
Edition Current
Edition
Description
FEDR27T3202F- 02-01 Oct., 2000 Final edition 1
Changed tC, tACC, tCE to 90ns
Added ICCA2 at tC = 200ns
Change the symbol, ICCA to ICCA1
Changed ICCA1 to 30mA
Changed tOE to 30ns
Changed ICCSC to 10uA
Changed IOH, the condition of VOH, to
–1 mA
5 4
Changed IOL, the conditio n of VOL, to
2 mA
FEDR27T3202F-02-02 Mar., 2002
1-4, 7 1-3 Changed the form
1 1 Change 48TSOP(1) package code to –1K
FEDR27T3202F- 02-03 Jun. 4, 2003 1, 4 1, 4 Unify ICCA condition into f=5MHz
FEDR27T3202F-02-04 Jul. 9, 2004 3 3 Add PD condition and IOS = 10mA
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NOTICE
1. The information contained herein can change without notice owing to product and/or technical improvements.
Before using the product, please make sure that the information being referred to is up-to-date.
2. The outline of action and examples for application circuits described herein have been chosen as an
explanation f or the standard acti on and performa nce of the product. When planning to use t he product, please
ensure that the external conditions are reflected in the actual circuit, assembly, and program designs.
3. When designing your product, please use our product below the specified maximum ratings and within the
specified operating ranges in cluding, but no t limited to, operating voltage, power dissipation, and operating
temperature.
4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation
resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or
unusual physi cal or electrical stress including, but not limited to, expos ure to parameters beyond t he specified
maximum ratings or operation outside the specified operating range.
5. Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is
granted by us i n connection with the use o f the product and/or the inf ormation and drawing s contained herein.
No responsibility is assumed by us for any infringement of a third party’s right which may result from the use
thereof.
6. The products listed in this document are intended for use in general electronics equipment for commercial
applications (e.g., office automation, communication equipment, measurement equipment, consumer
electronics, etc.). These products are not, unless specifically authorized by Oki, authorized for use in any
system or application that requires special or enhanced quality and reliability characteristics nor in any
system or application where the failure of such system or application may result in the loss or damage of
property, or death or injury to hu mans.
Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aeros pace
equipment, nuclear power control, medical equipment, and life-supp ort systems.
7. Certain products in this document may need government approval before they can be exported to particular
countries. The purchaser assumes the responsibility of determining the legality of export of these products
and will take appropriate and necessary steps at their own expense for these.
8. No part of the contents contained herein may be reprinted or reproduced without our prior permission.
Copyright 2 00 4 Oki El ect ri c Ind ustry Co ., Ltd.