ESD8V0R1B... Bi-directional Low Capacitance TVS Diode * ESD / transient protection of high-speed data lines in 3.3 / 5 / 12 V applications according to: IEC61000-4-2 (ESD): 18 kV (air) 15 kV (contact) IEC61000-4-4 (EFT): 40 A (5 / 50 ns) * Extremely small form factor down to 0.62 x 0.32 x 0.31 mm (0201) * Max. working voltage: -8 / +14 V * Very low reverse current < 1 nA typ. * Very low series inductance down to 0.2 nH typ. * Low capacitance of 4 pF typ. * Pb-free (RoHS compliant) package * Qualified according AEC Q101 Applications * USB 2.0, 10/100 Ethernet, Firewire, DVI * Mobile communication * Consumer products (STB, MP3, DVD, DSC...) * LCD displays, camera * Notebooks and destop computers, peripherals ESD8V0R1B-02LS ESD8V0R1B-02LRH 1 2 Type ESD8V0R1B-02LRH ESD8V0R1B-02LS Package TSLP-2-17 TSSLP-2-1 Configuration 1 line, bi-directional 1 line, bi-directional 1 Marking E E 2009-12-18 ESD8V0R1B... Maximum Ratings at TA = 25C, unless otherwise specified Parameter Symbol ESD discharge1) VESD Value Unit kV air 18 contact 15 Peak pulse current (tp = 8 / 20 s)2) I pp 1 A Operating temperature range T op -55...150 C Storage temperature T stg -65...150 Electrical Characteristics at TA = 25C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. -8 - 14 I(BR) = 1 mA, from pin 2 to 1 14.5 17 20 I(BR) = 1 mA, from pin 1 to 2 8.5 11 14 - <1 50 Characteristics Reverse working voltage, from pin 2 to 1 VRWM Breakdown voltage V(BR) Reverse current IR V nA VR = 3.3 V Clamping voltage V VCL IPP = 1 A, tP = 8/20 s, from pin 2 to 1 2) - 23 28 IPP = 1 A, tP = 8/20 s, from pin1 to 2 2) - 17 22 - 4 7 Line capacitance CT pF VR = 0 V, f = 1 MHz Series inductance LS nH ESD8V0R1B-02LS - 0.2 - ESD8V0R1B-02LRH - 0.4 - 1V ESD according to IEC61000-4-2 2I pp according to IEC61000-4-5 2 2009-12-18 ESD8V0R1B... Power derating curve Ppk = (TA) Non-repetitive peak pulse power Ppk = (tp) 10 3 110 % W P pk or I pp P pk 90 D= 0 D= .005 D= .01 D= .02 D= .05 D= .1 D= .2 D= .5 10 2 10 1 80 70 60 50 40 30 20 10 10 0 -8 -7 -6 -5 -4 -3 -2 10 10 10 10 10 10 10 s 10 0 0 0 25 50 75 100 C tp 150 TA Reverse current IR = (VR) Diode capacitance CT = (VR) f = 1MHz TA = Parameter 10 1 7 pF nA TA = 85C 5 IR CT 10 0 4 TA = 25C 3 10 -1 2 1 10 -2 0 2 4 6 8 10 V 0 0 14 VR 2 4 6 8 10 12 V 15 VR 3 2009-12-18 ESD8V0R1B... Connector Application example ESD8V0R1B... 1 line, bi-directional Protected data line with signal levels -8V up to +14V (bi-directional) I/O ESD sensitive device 2 1 The protection diode should be placed very close to the location where the ESD or other transients can occur to keep loops and inductances as small as possible. Pin 1 should be connected directly to a ground plane on the board . 4 2009-12-18 TSLP-2-17 (mm) ESD8V0R1B... Package Outline Top view Bottom view 0.39 +0.01 -0.03 0.6 0.05 0.05 MAX. 1 1 0.25 0.035 1) 2 10.05 0.65 0.05 2 0.5 0.035 1) Cathode marking 1) Dimension applies to plated terminal Foot Print 0.45 Copper Solder mask 0.375 0.35 0.275 1 0.925 0.3 0.35 0.6 0.275 For board assembly information please refer to Infineon website "Packages" Stencil apertures Marking Layout (Example) BAR90-02LRH Type code Cathode marking Laser marking Standard Packing Reel o180 mm = 15.000 Pieces/Reel Reel o330 mm = 50.000 Pieces/Reel (optional) 0.5 Cathode marking 8 1.16 4 0.76 5 2009-12-18 TSSLP-2-1 (mm) 6 ESD8V0R1B... 2009-12-18 ESD8V0R1B... Edition 2009-11-16 Published by Infineon Technologies AG 81726 Munich, Germany 2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office ( <www.infineon.com>). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 7 2009-12-18