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ESD8V0R1B...
Bi-directional Low Capacitance TVS Diode
• ESD / transient protection of high-speed
data lines in 3.3 / 5 / 12 V applications
according to:
IEC61000-4-2 (ESD): ±18 kV (air) ±15 kV (contact
)
IEC61000-4-4 (EFT): 40 A (5 / 50 ns)
• Extremely small form factor down to
0.62 x 0.32 x 0.31 mm³ (0201)
• Max. working voltage: −8 / +14 V
• Very low reverse current < 1 nA typ.
• Very low series inductance down to 0.2 nH typ.
• Low capacitance of 4 pF typ.
• Pb-free (RoHS compliant) package
• Qualified according AEC Q101
Applications
• USB 2.0, 10/100 Ethernet, Firewire, DVI
• Mobile communication
• Consumer products (STB, MP3, DVD, DSC...)
• LCD displays, camera
• Notebooks and destop computers, peripherals
ESD8V0R1B-02LS
ESD8V0R1B-02LRH
21
Type Package Configuration Marking
ESD8V0R1B-02LRH
ESD8V0R1B-02LS
TSLP-2-17
TSSLP-2-1
1 line, bi-directional
1 line, bi-directional
E
E
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ESD8V0R1B...
Maximum Ratings at T
A
= 25°C, unless otherwise specified
Parameter Symbol Value Unit
ESD discharge1)
air
contact
VESD
18
15
kV
Peak pulse current (t
p
= 8 / 20 µs)2) I
pp
1 A
Operating temperature range To
p
-55...150 °C
Storage temperature Tst
g
-65...150
Electrical Characteristics at T
A
= 25°C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
Characteristics
Reverse working voltage, from pin 2 to 1 VRWM -8 - 14 V
Breakdown voltage
I(BR) = 1 mA, from pin 2 to 1
I(BR) = 1 mA, from pin 1 to 2
V(BR)
14.5
8.5
17
11
20
14
Reverse current
VR = 3.3 V
IR- <1 50 nA
Clamping voltage
IPP = 1 A, tP = 8/20 µs, from pin 2 to 12)
IPP = 1 A, tP = 8/20 µs, from pin1 to 22)
VCL
-
-
23
17
28
22
V
Line capacitance
VR = 0 V, f = 1 MHz
CT- 4 7 pF
Series inductance
ESD8V0R1B-02LS
ESD8V0R1B-02LRH
LS
-
-
0.2
0.4
-
-
nH
1VESD according to IEC61000-4-2
2Ipp according to IEC61000-4-5
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ESD8V0R1B...
Power derating curve Ppk = ƒ (TA)
0 25 50 75 100 °C 150
TA
0
10
20
30
40
50
60
70
80
90
%
110
Ppk or Ipp
Non-repetitive peak pulse power
Ppk = ƒ (tp)
10 -8 10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 10 0
s
tp
0
10
1
10
2
10
3
10
W
Ppk
D= 0
D= .005
D= .01
D= .02
D= .05
D= .1
D= .2
D= .5
Reverse current IR = ƒ(VR)
TA = Parameter
0 2 4 6 8 10 V14
VR
-2
10
-1
10
0
10
1
10
nA
IR
TA = 25°C
TA = 85°C
Diode capacitance CT = ƒ (VR)
f = 1MHz
0 2 4 6 8 10 12 V15
VR
0
1
2
3
4
5
pF
7
CT
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ESD8V0R1B...
Application example ESD8V0R1B...
1 line, bi-directional
ESD
sensitive
device
I/O
2
1
Connector
Protected data line with signal levels
-8V up to +14V (bi-directional)
The protection diode should be placed
very close to the location where the ESD
or other transients can occur to keep
loops and inductances as small as
possible.
Pin 1 should be connected directly to a
ground plane on the board .
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ESD8V0R1B...
TSLP-2-17 (mm)
1
2
±0.05
0.6
1
2
±0.05
0.65
±0.035
0.25 1)
1±0.05
0.05 MAX.
+0.01
0.39-0.03
1) Dimension applies to plated terminal
Cathode
marking
1)
±0.035
0.5
Bottom viewTop view
Package Outline
Foot Print
Marking Layout (Example)
Standard Packing
Reel ø180 mm = 15.000 Pieces/Reel
Reel ø330 mm = 50.000 Pieces/Reel (optional)
For board assembly information please refer to Infineon website "Packages"
0.45
0.275
0.275
0.375
0.925
Copper Solder mask Stencil apertures
0.35
1
0.6
0.35
0.3
0.76
4
1.16
0.5
Cathode
marking
8
BAR90-02LRH
Type code
Cathode marking
Laser marking
2009-12-18
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ESD8V0R1B...
TSSLP-2-1 (mm)
2009-12-18
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ESD8V0R1B...
Edition 2009-11-16
Published by
Infineon Technologies AG
81726 Munich, Germany
2009 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee
of conditions or characteristics. With respect to any examples or hints given herein,
any typical values stated herein and/or any information regarding the application of
the device, Infineon Technologies hereby disclaims any and all warranties and
liabilities of any kind, including without limitation, warranties of non-infringement of
intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices,
please contact the nearest Infineon Technologies Office ( <www.infineon.com>).
Warnings
Due to technical requirements, components may contain dangerous substances.
For information on the types in question, please contact the nearest Infineon
Technologies Office.
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only with the express written approval of Infineon Technologies, if a failure of such
components can reasonably be expected to cause the failure of that life-support
device or system or to affect the safety or effectiveness of that device or system.
Life support devices or systems are intended to be implanted in the human body or
to support and/or maintain and sustain and/or protect human life. If they fail, it is
reasonable to assume that the health of the user or other persons may be
endangered.
