W9812G2GH 1M X 4 BANKS X 32BITS SDRAM Table of Contents1. GENERAL DESCRIPTION ......................................................................................................... 3 2. FEATURES ................................................................................................................................. 3 3. AVAILABLE PART NUMBER...................................................................................................... 3 4. PIN CONFIGURATION ............................................................................................................... 4 5. PIN DESCRIPTION..................................................................................................................... 5 6. BLOCK DIAGRAM ...................................................................................................................... 6 7. FUNCTIONAL DESCRIPTION.................................................................................................... 7 8. 7.1 Power Up and Initialization ............................................................................................ 7 7.2 Programming Mode Register ......................................................................................... 7 7.3 Bank Activate Command................................................................................................ 7 7.4 Read and Write Access Modes...................................................................................... 7 7.5 Burst Read Command.................................................................................................... 8 7.6 Burst Write Command.................................................................................................... 8 7.7 Read Interrupted by a Read........................................................................................... 8 7.8 Read Interrupted by a Write ........................................................................................... 8 7.9 Write Interrupted by a Write ........................................................................................... 8 7.10 Write Interrupted by a Read ........................................................................................... 8 7.11 Burst Stop Command..................................................................................................... 9 7.12 Addressing Sequence of Sequential Mode.................................................................... 9 7.13 Addressing Sequence of Interleave Mode ..................................................................... 9 7.14 Auto-precharge Command........................................................................................... 10 7.15 Precharge Command ................................................................................................... 10 7.16 Self Refresh Command................................................................................................ 10 7.17 Power Down Mode....................................................................................................... 11 7.18 No Operation Command .............................................................................................. 11 7.19 Deselect Command...................................................................................................... 11 7.20 Clock Suspend Mode ................................................................................................... 11 OPERATION MODE ................................................................................................................. 12 8.1 9. Simplified Stated Diagram ........................................................................................... 13 ELECTRICAL CHARACTERISTICS......................................................................................... 14 9.1 Absolute Maximum Ratings ......................................................................................... 14 9.2 Recommended DC Operating Conditions.................................................................... 14 -1- Publication Release Date:May 19, 2008 Revision A09 W9812G2GH 10. 11. 12. 9.3 Capacitance ................................................................................................................. 15 9.4 DC Characteristics ....................................................................................................... 15 9.5 AC Characteristics and Operating Condition ............................................................... 16 TIMING WAVEFORMS ............................................................................................................. 19 10.1 Command Input Timing................................................................................................ 19 10.2 Read Timing................................................................................................................. 20 10.3 Control Timing of Input/Output Data ............................................................................ 21 10.4 Mode Register Set Cycle ............................................................................................. 22 OPERATING TIMING EXAMPLE ............................................................................................. 23 11.1 Interleaved Bank Read (Burst Length = 4, CAS Latency = 3) ..................................... 23 11.2 Interleaved Bank Read (Burst Length = 4, CAS Latency = 3, Auto-precharge) .......... 24 11.3 Interleaved Bank Read (Burst Length = 8, CAS Latency = 3) ..................................... 25 11.4 Interleaved Bank Read (Burst Length = 8, CAS Latency = 3, Auto-precharge) .......... 26 11.5 Interleaved Bank Write (Burst Length = 8)................................................................... 27 11.6 Interleaved Bank Write (Burst Length = 8, Auto-precharge)........................................ 28 11.7 Page Mode Read (Burst Length = 4, CAS Latency = 3).............................................. 29 11.8 Page Mode Read / Write (Burst Length = 8, CAS Latency = 3) .................................. 30 11.9 Auto-precharge Read (Burst Length = 4, CAS Latency = 3) ....................................... 31 11.10 Auto-precharge Write (Burst Length = 4)..................................................................... 32 11.11 Auto Refresh Cycle ...................................................................................................... 33 11.12 Self Refresh Cycle ....................................................................................................... 34 11.13 Burst Read and Single Write (Burst Length = 4, CAS Latency = 3) ............................ 35 11.14 Power Down Mode....................................................................................................... 36 11.15 Auto-precharge Timing (Read Cycle) .......................................................................... 37 11.16 Auto-precharge Timing (Write Cycle)........................................................................... 38 11.17 Timing Chart of Read to Write Cycle ........................................................................... 39 11.18 Timing Chart of Write to Read Cycle ........................................................................... 39 11.19 Timing Chart of Burst Stop Cycle (Burst Stop Command)........................................... 40 11.20 Timing Chart of Burst Stop Cycle (Precharge Command)........................................... 40 11.21 CKE/DQM Input Timing (Write Cycle).......................................................................... 41 11.22 CKE/DQM Input Timing (Read Cycle) ......................................................................... 42 PACKAGE SPECIFICATION .................................................................................................... 43 12.1 13. 86L TSOP (II)-400 mil .................................................................................................. 43 REVISION HISTORY ................................................................................................................ 44 -2- Publication Release Date:May 19, 2008 Revision A09 W9812G2GH 1. GENERAL DESCRIPTION W9812G2GH is a high-speed synchronous dynamic random access memory (SDRAM), organized as 1,048,576 words x 4 banks x 32 bits. Using pipelined architecture and 0.11 m process technology, W9812G2GH delivers a data bandwidth of up to 200M words per second (-5). For different application, W9812G2GH is sorted into the following speed grades: -5/-6/-6C/-6I and -75. The -5 is compliant to the 200MHz/CL3 specification. The -6/-6C/-6I is compliant to the 166MHz/CL3 specification. (The grade of and -6C/-6I is tIH=0.8nS and the -6I grade which is guaranteed to support -40C ~ 85C.). The -75 is compliant to the 133MHz/CL3 specification. Accesses to the SDRAM are burst oriented. Consecutive memory location in one page can be accessed at a burst length of 1, 2, 4, 8 or full page when a bank and row is selected by an ACTIVE command. Column addresses are automatically generated by the SDRAM internal counter in burst operation. Random column read is also possible by providing its address at each clock cycle. The multiple bank nature enables interleaving among internal banks to hide the precharging time. By having a programmable Mode Register, the system can change burst length, latency cycle, interleave or sequential burst to maximize its performance. W9812G2GH is ideal for main memory in high performance applications. 2. FEATURES * * * * * * * * * * * * 3.3V 0.3 V for -5/-6/-6I/-75 grade power supply 2.7V3.6V for -6C grade power supply 2.3V2.7V, @ tCK >10nS for -6C grade power supply Up to 200 MHz Clock Frequency 1,048,576 Words x 4 banks x 32 bits organization Self Refresh Mode CAS Latency: 2 and 3 Burst Length: 1, 2, 4, 8 and full page Burst Read, Single Writes Mode Byte Data Controlled by DQM0-3 Auto-precharge and Controlled Precharge 4K Refresh cycles/64 mS Interface: LVTTL Packaged in TSOP II 86-pin , using Lead free materials with RoHS compliant 3. AVAILABLE PART NUMBER PART NUMBER W9812G2GH-5 W9812G2GH-6 W9812G2GH-6C W9812G2GH-6I W9812G2GH-75 SPEED MAXIMUM SELF REFRESH CURRENT 200MHz/CL3 166MHz/CL3 166MHz/CL3 166MHz/CL3 133MHz/CL3 2mA 2mA 2mA 2mA 2mA -3- OPERATING TEMPERATURE 0C ~ 70C 0C ~ 70C 0C ~ 70C -40C ~ 85C 0C ~ 70C Publication Release Date:May 19, 2008 Revision A09 W9812G2GH 4. PIN CONFIGURATION VDD DQ0 VDDQ DQ1 DQ2 VSSQ DQ3 DQ4 VDDQ DQ5 DQ6 VSSQ DQ7 NC VDD DQM0 WE# CAS# RAS# CS# A11 BS0 BS1 A10 A0 A1 A2 DQM2 VDD NC DQ16 VSSQ DQ17 DQ18 VDDQ DQ19 DQ20 VSSQ DQ21 DQ22 VDDQ DQ23 VDD 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 -4- VSS DQ15 VSSQ DQ14 DQ13 VDDQ DQ12 DQ11 VSSQ DQ10 DQ9 VDDQ DQ8 NC VSS DQM1 NC NC CLK CKE A9 A8 A7 A6 A5 A4 A3 DQM3 VSS NC DQ31 VDDQ DQ30 DQ29 VSSQ DQ28 DQ27 VDDQ DQ26 DQ25 VSSQ DQ24 VSS Publication Release Date:May 19, 2008 Revision A09 W9812G2GH 5. PIN DESCRIPTION PIN NUMBER 25-27, 60-66, 24,21 PIN NAME A0-A11 FUNCTION DESCRIPTION Address Multiplexed pins for row and column address. Row address: A0-A11. Column address: A0-A7. A10 is sampled during a precharge command to determine if all banks are to be precharged or bank selected by BS0, BS1. Bank Select Select bank to activate during row address latch time, or bank to read/write during address latch time. 22,23 BS0, BS1 2,4,5,7,8,10,11,13,74, 76,77,79,80,82,83,85, 31,33,34,36,37,39,40, 42,45,47,48,50,51,53, 54,56 DQ0-DQ31 20 CS Chip Select 19 RAS Command input. When sampled at the rising edge of the Row Address clock, RAS , CAS and WE define the operation to be Strobe executed. 18 CAS Column Address Strobe Referred to RAS 17 WE Write Enable Referred to RAS 16,71,28,59 DQM0~3 Input/output mask The output buffer is placed at Hi-Z (with latency of 2) when DQM is sampled high in read cycle. In write cycle, sampling DQM high will block the write operation with zero latency. 68 CLK Clock Inputs System clock used to sample inputs on the rising edge of clock. 67 CKE Clock Enable CKE controls the clock activation and deactivation. When CKE is low, Power Down mode, Suspend mode, or Self Refresh mode is entered. 1,15,29,43 VDD Power (+3.3V) Power for input buffers and logic circuit inside DRAM. 44,58,72,86 VSS Ground Ground for input buffers and logic circuit inside DRAM. 3,9,35,41,49,55,75,81 VDDQ Power (+3.3V) Separated power from VDD, to improve DQ noise for I/O buffer immunity. 6,12,32,38,46,52,78, 84 VSSQ Ground for I/O Separated ground from VSS, to improve DQ noise buffer immunity. 14,30,57,69,70,73 NC No Connection No connection Data Input/ Output Multiplexed pins for data output and input. Disable or enable the command decoder. When command decoder is disabled, new command is ignored and previous operation continues. -5- Publication Release Date:May 19, 2008 Revision A09 W9812G2GH 6. BLOCK DIAGRAM CLK CLOCK BUFFER CKE CS CAS COMMAND CONTROL SIGNAL GENERATOR DECODER COLUMN DECODER A10 A0 ADDRESS BUFFER MODE REGISTER AND EMRS ROW DECODER WE COLUMN DECODER ROW DECODER RAS CELL ARRAY BANK #0 CELL ARRAY BANK #1 SENSE AMPLIFIER SENSE AMPLIFIER A9 A11 BS0 BS1 DMn DATA CONTROL CIRCUIT . COLUMN COUNTER DQ31 COLUMN DECODER ROW DECODER CELL ARRAY BANK #2 DQ0 DQMn COLUMN DECODER ROW DECODER REFRESH COUNTER DQ BUFFER SENSE AMPLIFIER CELL ARRAY BANK #3 SENSE AMPLIFIER NOTE: The cell array configuration is 4096 * 256 * 32 -6- Publication Release Date:May 19, 2008 Revision A09 W9812G2GH 7. FUNCTIONAL DESCRIPTION 7.1 Power Up and Initialization The default power up state of the mode register is unspecified. The following power up and initialization sequence need to be followed to guarantee the device being preconditioned to each user specific needs. During power up, all VDD and VDDQ pins must be ramp up simultaneously to the specified voltage when the input signals are held in the "NOP" state. The power up voltage must not exceed VDD +0.3V on any of the input pins or VDD supplies. After power up, an initial pause of 200 S is required followed by a precharge of all banks using the precharge command. To prevent data contention on the DQ bus during power up, it is required that the DQM and CKE pins be held high during the initial pause period. Once all banks have been precharged, the Mode Register Set Command must be issued to initialize the Mode Register. An additional eight Auto Refresh cycles (CBR) are also required before or after programming the Mode Register to ensure proper subsequent operation. 7.2 Programming Mode Register After initial power up, the Mode Register Set Command must be issued for proper device operation. All banks must be in a precharged state and CKE must be high at least one cycle before the Mode Register Set Command can be issued. The Mode Register Set Command is activated by the low signals of RAS , CAS , CS and WE at the positive edge of the clock. The address input data during this cycle defines the parameters to be set as shown in the Mode Register Operation table. A new command may be issued following the mode register set command once a delay equal to tRSC has elapsed. Please refer to the next page for Mode Register Set Cycle and Operation Table. 7.3 Bank Activate Command The Bank Activate command must be applied before any Read or Write operation can be executed. The operation is similar to RAS activate in EDO DRAM. The delay from when the Bank Activate command is applied to when the first read or write operation can begin must not be less than the RAS to CAS delay time (tRCD). Once a bank has been activated it must be precharged before another Bank Activate command can be issued to the same bank. The minimum time interval between successive Bank Activate commands to the same bank is determined by the RAS cycle time of the device (tRC). The minimum time interval between interleaved Bank Activate commands (Bank A to Bank B and vice versa) is the Bank to Bank delay time (tRRD). The maximum time that each bank can be held active is specified as tRAS (max). 7.4 Read and Write Access Modes After a bank has been activated, a read or write cycle can be followed. This is accomplished by setting RAS high and CAS low at the clock rising edge after minimum of tRCD delay. WE pin voltage level defines whether the access cycle is a read operation ( WE high), or a write operation ( WE low). The address inputs determine the starting column address. Reading or writing to a different row within an activated bank requires the bank be precharged and a new Bank Activate command be issued. When more than one bank is activated, interleaved bank Read or Write operations are possible. By using the programmed burst length and alternating the access and precharge operations between multiple banks, seamless data access operation among -7- Publication Release Date:May 19, 2008 Revision A09 W9812G2GH many different pages can be realized. Read or Write Commands can also be issued to the same bank or between active banks on every clock cycle. 7.5 Burst Read Command The Burst Read command is initiated by applying logic low level to CS and CAS while holding RAS and WE high at the rising edge of the clock. The address inputs determine the starting column address for the burst. The Mode Register sets type of burst (sequential or interleave) and the burst length (1, 2, 4, 8, full page) during the Mode Register Set Up cycle. Table 2 and 3 in the next page explain the address sequence of interleave mode and sequential mode. 7.6 Burst Write Command The Burst Write command is initiated by applying logic low level to CS , CAS and WE while holding RAS high at the rising edge of the clock. The address inputs determine the starting column address. Data for the first burst write cycle must be applied on the DQ pins on the same clock cycle that the Write Command is issued. The remaining data inputs must be supplied on each subsequent rising clock edge until the burst length is completed. Data supplied to the DQ pins after burst finishes will be ignored. 7.7 Read Interrupted by a Read A Burst Read may be interrupted by another Read Command. When the previous burst is interrupted, the remaining addresses are overridden by the new read address with the full burst length. The data from the first Read Command continues to appear on the outputs until the CAS Latency from the interrupting Read Command the is satisfied. 7.8 Read Interrupted by a Write To interrupt a burst read with a Write Command, DQM may be needed to place the DQs (output drivers) in a high impedance state to avoid data contention on the DQ bus. If a Read Command will issue data on the first and second clocks cycles of the write operation, DQM is needed to insure the DQs are tri-stated. After that point the Write Command will have control of the DQ bus and DQM masking is no longer needed. 7.9 Write Interrupted by a Write A burst write may be interrupted before completion of the burst by another Write Command. When the previous burst is interrupted, the remaining addresses are overridden by the new address and data will be written into the device until the programmed burst length is satisfied. 7.10 Write Interrupted by a Read A Read Command will interrupt a burst write operation on the same clock cycle that the Read Command is activated. The DQs must be in the high impedance state at least one cycle before the new read data appears on the outputs to avoid data contention. When the Read Command is activated, any residual data from the burst write cycle will be ignored. -8- Publication Release Date:May 19, 2008 Revision A09 W9812G2GH 7.11 Burst Stop Command A Burst Stop Command may be used to terminate the existing burst operation but leave the bank open for future Read or Write Commands to the same page of the active bank, if the burst length is full page. Use of the Burst Stop Command during other burst length operations is illegal. The Burst Stop Command is defined by having RAS and CAS high with CS and WE low at the rising edge of the clock. The data DQs go to a high impedance state after a delay which is equal to the CAS Latency in a burst read cycle interrupted by Burst Stop. If a Burst Stop Command is issued during a full page burst write operation, then any residual data from the burst write cycle will be ignored. 7.12 Addressing Sequence of Sequential Mode A column access is performed by increasing the address from the column address which is input to the device. The disturb address is varied by the Burst Length as shown in Table 2. Table 2 Address Sequence of Sequential Mode DATA ACCESS ADDRESS BURST LENGTH Data 0 n BL = 2 (disturb address is A0) Data 1 n+1 No address carry from A0 to A1 Data 2 n+2 BL = 4 (disturb addresses are A0 and A1) Data 3 n+3 No address carry from A1 to A2 Data 4 n+4 Data 5 n+5 BL = 8 (disturb addresses are A0, A1 and A2) Data 6 n+6 No address carry from A2 to A3 Data 7 n+7 7.13 Addressing Sequence of Interleave Mode A column access is started in the input column address and is performed by inverting the address bit in the sequence shown in Table 3. Table 3 Address Sequence of Interleave Mode DATA ACCESS ADDRESS Data 0 A8 A7 A6 A5 A4 A3 A2 A1 A0 Data 1 A8 A7 A6 A5 A4 A3 A2 A1 A0 Data 2 A8 A7 A6 A5 A4 A3 A2 A1 A0 Data 3 A8 A7 A6 A5 A4 A3 A2 A1 A0 Data 4 A8 A7 A6 A5 A4 A3 A2 A1 A0 Data 5 A8 A7 A6 A5 A4 A3 A2 A1 A0 Data 6 A8 A7 A6 A5 A4 A3 A2 A1 A0 Data 7 A8 A7 A6 A5 A4 A3 A2 A1 A0 -9- BURST LENGTH BL = 2 BL = 4 BL = 8 Publication Release Date:May 19, 2008 Revision A09 W9812G2GH 7.14 Auto-precharge Command If A10 is set to high when the Read or Write Command is issued, then the Auto-precharge function is entered. During Auto-precharge, a Read Command will execute as normal with the exception that the active bank will begin to precharge automatically before all burst read cycles have been completed. Regardless of burst length, it will begin a certain number of clocks prior to the end of the scheduled burst cycle. The number of clocks is determined by CAS Latency. A Read or Write Command with Auto-precharge can not be interrupted before the entire burst operation is completed. Therefore, use of a Read, Write or Precharge Command is prohibited during a read or write cycle with Auto-precharge. Once the precharge operation has started, the bank cannot be reactivated until the Precharge time (tRP) has been satisfied. Issue of Auto-precharge command is illegal if the burst is set to full page length. If A10 is high when a Write Command is issued, the Write with Auto-precharge function is initiated. The SDRAM automatically enters the precharge operation two clocks delay from the last burst write cycle. This delay is referred to as Write tWR. The bank undergoing Auto-precharge can not be reactivated until tWR and tRP are satisfied. This is referred to as tDAL, Data-in to Active delay (tDAL = tWR + tRP). When using the Auto-precharge Command, the interval between the Bank Activate Command and the beginning of the internal precharge operation must satisfy tRAS (min). 7.15 Precharge Command The Precharge Command is used to precharge or close a bank that has been activated. The Precharge Command is entered when CS , RAS and WE are low and CAS is high at the rising edge of the clock. The Precharge Command can be used to precharge each bank separately or all banks simultaneously. Three address bits, A10, BS0 and BS1 are used to define which bank(s) is to be precharged when the command is issued. After the Precharge Command is issued, the precharged bank must be reactivated before a new read or write access can be executed. The delay between the Precharge Command and the Activate Command must be greater than or equal to the Precharge time (tRP). 7.16 Self Refresh Command The Self Refresh Command is defined by having CS , RAS , CAS and CKE held low with WE high at the rising edge of the clock. All banks must be idle prior to issuing the Self Refresh Command. Once the command is registered, CKE must be held low to keep the device in Self Refresh mode. When the SDRAM has entered Self Refresh mode all of the external control signals, except CKE, are disabled. The clock is internally disabled during Self Refresh Operation to save power. The device will exit Self Refresh operation after CKE is returned high. A minimum delay time is required when the device exits Self Refresh Operation and before the next command can be issued. This delay is equal to the tAC cycle time plus the Self Refresh exit time. If, during normal operation, AUTO REFRESH cycles are issued in bursts (as opposed to being evenly distributed), a burst of 4,096 AUTO REFRESH cycles should be completed just prior to entering and just after exiting the self refresh mode. The period between the Auto Refresh command and the next command is specified by tRC. - 10 - Publication Release Date:May 19, 2008 Revision A09 W9812G2GH 7.17 Power Down Mode The Power Down mode is initiated by holding CKE low. All of the receiver circuits except CKE are gated off to reduce the power. The Power Down mode does not perform any refresh operations, therefore the device can not remain in Power Down mode longer than the Refresh period (tREF) of the device. The Power Down mode is exited by bringing CKE high. When CKE goes high, a No Operation Command is required on the next rising clock edge, depending on tCK. The input buffers need to be enabled with CKE held high for a period equal to tCKS (min) + tCK (min). 7.18 No Operation Command The No Operation Command should be used in cases when the SDRAM is in a idle or a wait state to prevent the SDRAM from registering any unwanted commands between operations. A No Operation Command is registered when CS is low with RAS , CAS , and WE held high at the rising edge of the clock. A No Operation Command will not terminate a previous operation that is still executing, such as a burst read or write cycle. 7.19 Deselect Command The Deselect Command performs the same function as a No Operation Command. Deselect Command occurs when CS is brought high, the RAS , CAS , and WE signals become don't cares. 7.20 Clock Suspend Mode During normal access mode, CKE must be held high enabling the clock. When CKE is registered low while at least one of the banks is active, Clock Suspend Mode is entered. The Clock Suspend mode deactivates the internal clock and suspends any clocked operation that was currently being executed. There is a one clock delay between the registration of CKE low and the time at which the SDRAM operation suspends. While in Clock Suspend mode, the SDRAM ignores any new commands that are issued. The Clock Suspend mode is exited by bringing CKE high. There is a one clock cycle delay from when CKE returns high to when Clock Suspend mode is exited. - 11 - Publication Release Date:May 19, 2008 Revision A09 W9812G2GH 8. OPERATION MODE Fully synchronous operations are performed to latch the commands at the positive edges of CLK. Table 1 shows the truth table for the operation commands. Table 1 Truth Table (Note (1), (2)) COMMAND Bank Active DEVICE STATE CKEn-1 CKEn Idle H x DQM BS0, 1 A10 A0-A9 A11 CS x v v v L RAS L CAS H WE H Bank Precharge Any H x x v L x L L H L Precharge All Any H x x x H x L L H L Active (3) H x x v L v L H L L Active (3) H x x v H v L H L L Read Active (3) H x x v L v L H L H Read with Auto-precharge Active (3) H x x v H v L H L H H x x v v v L L L L H x x x x x L H H H Write Write with Auto-precharge Mode Register Set Idle No - Operation Any Burst Stop Active (4) H x x x x x L H H L Device Deselect Any H x x x x x H x x x Auto - Refresh Idle H H x x x x L L L H Self - Refresh Entry Idle H L x x x x L L L H x Self Refresh Exit Clock suspend Mode Entry Power Down Mode Entry Clock Suspend Mode Exit idle L H x x x x H x x (S.R.) L H x x x x L H H x Active H L x x x x x x x x Idle H L x x x x H x x x H L x x x x L H H x Active L H x x x x x x x x Active (5) Any Power Down Mode Exit L H x x x x H x x x (power down) L H x x x x L H H x Data write/Output Enable Active H x L x x x x x x x Data Write/Output Disable Active H x H x x x x x x x Notes: (1) v = valid x = Don't care L = Low Level H = High Level (2) CKEn signal is input level when commands are provided. CKEn-1 signal is the input level one clock cycle before the command is issued. (3) These are state of bank designated by BS0, BS1 signals. (4) Device state is full page burst operation. (5) Power Down Mode can not be entered in the burst cycle. When this command asserts in the burst cycle, device state is clock suspend mode. - 12 - Publication Release Date:May 19, 2008 Revision A09 W9812G2GH 8.1 Simplified Stated Diagram Self Refresh LF SE Mode Register Set MRS it ex LF E S REF IDLE CBR Refresh CK E CK E ACT Power Down CKE Writ ew Aut o pr ith ech arg e BS T W READ Precharge PRE ) tion ina term ge har rec E(p CKE PR WRITEA POWER ON Read Write PR E( p rec har ge term inat ion ) CKE d WRITEA SUSPEND Read WRITE CKE ea R CKE T BS WRITE SUSPEND ith dw Rea arge ch p re Write Active Power Down CKE o Aut rit e ROW ACTIVE CKE CKE READA CKE CKE READ SUSPEND READA SUSPEND Precharge Automatic sequence Manual input MRS = Mode Register Set REF = Refresh ACT = Active PRE = Precharge WRITEA = Write with Auto-precharge READA = Read with Auto-precharge - 13 - Publication Release Date:May 19, 2008 Revision A09 W9812G2GH 9. ELECTRICAL CHARACTERISTICS 9.1 Absolute Maximum Ratings PARAMETER SYMBOL RATING UNIT NOTES Input, Column Output Voltage VIN, VOUT -0.3~VDD+ 0.3V V 1 Power Supply Voltage VDD, VDDQ -0.3~4.6V V 1 Operating Temperature(-5/-6/-6C/-75) TOPR 0 ~ 70 C 1 Operating Temperature (-6I) TOPR -40 ~ 85 C 1 Storage Temperature TSTG -55 ~ 150 C 1 TSOLDER 260 C 1 PD 1 W 1 IOUT 50 mA 1 Soldering Temperature (10s) Power Dissipation Short Circuit Output Current Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the device. 9.2 Recommended DC Operating Conditions (TA = 0 to 70C for -5/-6/-6C/-75, TA = -40 to 85C for -6I) PARAMETER SYM. MIN. TYP. MAX. UNIT VDD 3.0 3.3 3.6 V VDDQ 3.0 - 3.6 V VDD 2.7 3.3 3.6 V VDDQ 2.7 - 3.6 V VDD 2.3 2.5 2.7 V VDDQ 2.3 - 2.7 V VIH VIL 2 -0.3 - VDD +0.3 +0.8 V V 1 2 VIH 0.8* VDDQ - VDD +0.3 V 1 VIL -0.3 - 0.2* VDDQ V 2 Output logic high voltage VOH 2.4 - - V IOH= -2mA Output logic low voltage Output logic high voltage VOL - - 0.4 V IOL= 2mA VOH 2 - - V IOH= -2mA VOL - - 0.4 V IOL= 2mA Input leakage current II(L) -5 - 5 A 3 Output leakage current Io(L) -5 - 5 A 4 Power Supply Voltage (-5/-6/-75) Power Supply Voltage (for I/O Buffer) (-5/-6/-75) Power Supply Voltage (-6C) Power Supply Voltage (for I/O Buffer) ( -6C) Power Supply Voltage (-6C @ tCK>10nS) Power Supply Voltage (for I/O Buffer) (-6C @ tCK>10nS) Input High Voltage Input Low Voltage Input High Voltage (-6C @ VDD=2.3V~2.7V) Input Low Voltage (-6C @ VDD=2.3V~2.7V) (-6C @ VDDQ=2.3V~2.7V) Output logic low voltage (-6C @ VDDQ=2.3V~2.7V) - 14 - NOTES Publication Release Date:May 19, 2008 Revision A09 W9812G2GH Note: 1. VIH (max.) = VDD/VDDQ+1.2V for pulse width < 5 nS. 2. VIL (min.) = VSS/VSSQ-1.2V for pulse width < 5 nS. 3. Any input 0V<VIN<VDDQ. Input leakage currents include Hi-Z output leakage for all bi-directional buffers with Tri-State outputs. 4. Output disabled, 0V VOUT VDDQ 9.3 Capacitance (VDD =3.3V0.3V for -5/-6/-6I/-75, VDD=2.7V-3.6V for -6C, TA = 25 C, f = 1 MHz) PARAMETER SYM. Input Capacitance (A0 to A10, BS0, BS1, CS , RAS , CAS , WE , DQM, CKE) Input Capacitance (CLK) MAX. UNIT CI 3.8 pf CCLK 3.5 pf 6.5 pf CIO Input/Output capacitance (DQ0-DQ31) MIN. 4 Note: These parameters are periodically sampled and not 100% tested. 9.4 DC Characteristics (VDD = 3.3V0.3V for -5/-6/-75, VDD=2.7V-3.6V for -6C, on TA = 0~70C, VDD = 3.3V0.3V for -6I on TA = -40~85C) -5 MAX. -6/-6C/-6I -75 IDD1 150 130 110 3 IDD2 55 45 35 3 IDD2P 2 2 2 3 IDD2S 15 15 15 IDD2PS 2 2 2 CKE = VIH IDD3 75 70 65 CKE = VIL (Power Down mode) IDD3P 15 15 15 IDD4 220 200 180 3, 4 IDD5 250 230 210 3 IDD6 2 2 2 PARAMETER Operating Current tCK = min., tRC = min. Active precharge command cycling without burst operation Standby Current SYM. UNIT NOTES 1 Bank Operation tCK = min., CS = VIH VIH/L = VIH (min.)/VIL (max.) CKE = VIH Bank: Inactive State CKE = VIL (Power Down mode) Standby Current CLK = VIL, CS = VIH VIH/L=VIH (min.)/VIL (max.) CKE = VIH Bank: Inactive State CKE = VIL (Power Down mode) No Operating Current tCK = min., CS = VIH (min.) Bank: Active State (4 Banks) Burst Operating Current (tCK = min.) Read/Write command cycling Auto Refresh Current (tCK = min.) Auto refresh command cycling Self Refresh Current Self refresh mode (CKE = 0.2V) - 15 - mA Publication Release Date:May 19, 2008 Revision A09 W9812G2GH 9.5 AC Characteristics and Operating Condition (VDD = 3.3V 0.3V, TA = 0 to 70C for -5/-6/-75, VDD=2.7V-3.6V for -6C, TA = 0 to 70C, VDD = 3.3V 0.3V, TA = -40 to 85C for -6I) (Notes: 5, 6, 7, 8, 9, 10) PARAMETER Ref/Active to Ref/Active Command Period Active to precharge Command Period Active to Read/Write Command Delay Time Read/Write(a) to Read/Write(b) Command Period Precharge to Active Command Period Active(a) to Active(b) Command Period Write Recovery Time CL* = 2 CL* = 3 CL* = 2 CL* = 3 CL* = 3 (VDD=2.3V~2.7V) CLK High Level width CLK Low Level width Access Time CL* = 2 from CLK CL* = 3 Output Data Hold Time Output Data CL* = 2 High Impedance CL* = 3 Time Output Data Low Impedance Time Power Down Mode Entry Time Transition Time of CLK (Rise and Fall) Data-in Set-up Time Data-in Hold Time Data-in Hold Time (VDD=2.3V~2.7V) Address Set-up Time Address Hold Time Address Hold Time (VDD=2.3V~2.7V) CKE Set-up Time CKE Hold Time CKE Hold Time (VDD=2.3V~2.7V) Command Set-up Time Command Hold Time Command Hold Time (VDD=2.3V~2.7V) Refresh Time Mode register Set Cycle Time Exit self refresh to ACTIVE command CLK Cycle Time SYM. MIN. tRC 55 tRAS 40 tRCD 15 -5 -6 MAX. MIN. MAX. 60 100000 42 -6C/-6I MIN. MAX. 60 100000 18 42 -75 MIN. MAX. 65 100000 18 45 1 1 1 1 tRP 15 18 18 20 tRRD 10 12 12 15 2 2 -- 2 2 2 2 2 tCK tCH tCL 10 5 1000 1000 10 6 1000 1000 10 6 1000 1000 -- -- -- -- 10 1000 2 2 6 4.5 tAC tOH 3 tHZ tLZ tSB tT tDS tDH tAS tAH tCKS tCKH tCMS tCMH tREF tRSC tXSR 2 2 0 0 2 2 6 5 3 nS tCK 1000 1000 -- -- 2.5 2.5 6 5 3 8 8 6 5.4 9 6 6 6 4.5 5 5 5.4 0 0 6 1 0 0 6 1 0 0 1.5 1.0 -1.5 1.0 -1.5 1.0 -1.5 1.0 1.5 0.8 1.0 1.5 0.8 1.0 1.5 0.8 1.0 1.5 0.8 1.5 1.0 -1.5 1.0 -1.5 1.0 -1.5 1.0 -- -- 1.0 -- 64 64 12 72 64 12 72 9 3 6 5 1 nS tCK 10 7.5 1.5 1.0 -1.5 1.0 -1.5 1.0 -1.5 1.0 10 70 100000 20 tCCD tWR UNITNOTES 9 7.5 1 nS 8 8 8 8 8 8 8 8 64 15 75 7 mS nS nS *CL = CAS Latency - 16 - Publication Release Date:May 19, 2008 Revision A09 W9812G2GH Notes: 1. Operation exceeds "Absolute Maximum Ratings" may cause permanent damage to the devices. 2. All voltages are referenced to VSS 2.7V~3.6V power supply for -6C speed grades. 2.3V~2.7V, @ tCK >10nS power supply for -6C speed grades. 3. These parameters depend on the cycle rate and listed values are measured at a cycle rate with the minimum values of tCK and tRC. 4. These parameters depend on the output loading conditions. Specified values are obtained with output open. 5. Power up sequence is further described in the "Functional Description" section. 6. AC Testing Conditions PARAMETER CONDITIONS Output Reference Level 1.4V Output Reference Level (-6C, VDD/VDDQ=2.3V~2.7V) 1.2V Output Load See diagram below Transition Time (tT: tr/tf) of Input Signal 1/1 nS Input Reference Level 1.4V Input Reference Level (-6C, VDD/VDDQ=2.3V~2.7V) 1.2V (-6C, VDD/VDDQ=2.3V2.7V) 1.2V 1.4V 50 ohms output 50 ohms Z = 50 ohms output Z = 50 ohms 30pF 30pF AC TEST LOAD (1) AC TEST LOAD (2) - 17 - Publication Release Date:May 19, 2008 Revision A09 W9812G2GH 7. tHZ defines the time at which the outputs achieve the open circuit condition and is not referenced to output level. 8. Assumed input rise and fall time (tT) = 1nS. If tr & tf is longer than 1nS, transient time compensation should be considered, i.e., [(tr + tf)/2-1]nS should be added to the parameter (The tT maximum can't be more than 10nS for low frequency application.) 9. If clock rising time (tT) is longer than 1nS, (tT/2-0.5)nS should be added to the parameter. - 18 - Publication Release Date:May 19, 2008 Revision A09 W9812G2GH 10. TIMING WAVEFORMS 10.1 Command Input Timing tCL tCK CLK tCH VIH VIL tCMS tCMH tCMS tCMH tCMS tCMH tCMS tCMH tAS tAH tT tCMH tT tCMS CS RAS CAS WE A0-A11 BS0, 1 tCKS tCKH tCKS tCKH tCKS tCKH CKE - 19 - Publication Release Date:May 19, 2008 Revision A09 W9812G2GH 10.2 Read Timing Read CAS Latency CLK CS RAS CAS WE A0-A11 BS0, 1 tAC tAC tLZ tHZ tOH tOH Valid Data-Out Valid Data-Out DQ Read Command Burst Length - 20 - Publication Release Date:May 19, 2008 Revision A09 W9812G2GH 10.3 Control Timing of Input/Output Data Control Timing of Input Data (Word Mask) CLK tCMS tCMH tCMH tCMS DQM tDS tDH tDS Valid Data-in DQ0 -31 tDH tDS Valid Data-in tDH tDS Valid Data-in tDH Valid Data-in (Clock Mask) CLK tCKH tCKS tCKH tDH tDS tDH tCKS CKE tDS DQ0 -31 Valid Data-in tDS Valid Data-in tDH tDS Valid Data-in tDH Valid Data-in Control Timing of Output Data (Output Enable) CLK tCMS tCMH tCMH tCMS DQM tAC tOH tOH tHZ tAC tOH Valid Data-Out DQ0 -31 Valid Data-Out tLZ tAC tOH tAC Valid Data-Out OPEN (Clock Mask) CLK tCKH tCKS tCKH tCKS CKE tAC tOH DQ0 -31 tAC tAC tOH tOH Valid Data-Out Valid Data-Out - 21 - tOH tAC Valid Data-Out Publication Release Date:May 19, 2008 Revision A09 W9812G2GH 10.4 Mode Register Set Cycle tRSC CLK tCMS tCMH tCMS tCMH CS RAS tCMS tCMH tCMS tCMH CAS WE tAS A0-A11 BS0,1 tAH Register set data A0 A1 Burst Length A2 A3 Addressing Mode A4 A5 CAS Latency A2 0 0 0 0 1 1 1 1 A6 A0 A7 "0" A8 "0" A10 "0" A11 A0 "0" BS0 "0" BS1 "0" A0 A3 A0 0 A0 1 (Test Mode) Reserved WriteA0 Mode A9 A0 A0 Reserved A0 A1 A0 A0 A0 0 0 A0 0 1 A0 1 0 A0 1 1 A0 0 0 A0 0 1 A0 1 0 A0 1 1 A6 0 0 0 0 1 A5 A0 A4 A0 0 0 A0 0 1 A0 1 0 A0 1 1 A0 0 0 A0 A9 A0 0 A0 1 - 22 - next command BurstA0 Length Sequential A0 Interleave A0 1 A0 1 A0 A0 2 2 A0 4 A0 4 A0 8 A0 8 A0 Reserved A0 Reserved FullA0 Page A0 Mode Addressing Sequential A0 Interleave A0 CAS Latency A0 Reserved A0 Reserved A0 2 A0 3 Reserved Single Write Mode Burst read and A0 Burst write Burst read and A0 single write Publication Release Date:May 19, 2008 Revision A09 W9812G2GH 11. OPERATING TIMING EXAMPLE 11.1 Interleaved Bank Read (Burst Length = 4, CAS Latency = 3) 1 0 2 3 4 6 5 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 CLK CS tRC tRC tRC tRC RAS tRAS tRP tRAS tRAS tRP tRP tRAS CAS WE BS0 BS1 tRCD A10 RAa A0-A9, A11 RAa tRCD tRCD RBb CBx RBb CAw tRCD RAc RBd RAc CAy RAe RBd CBz RAe DQM CKE DQ aw0 tRRD Bank #0 Active Bank #1 tAC tAC tAC aw1 aw2 aw3 bx0 Precharge Active bx2 bx3 Active cy1 cy2 cy3 tRRD Precharge Read Precharge Read tAC cy0 tRRD tRRD Read bx1 Active Active Read Bank #2 Idle Bank #3 - 23 - Publication Release Date:May 19, 2008 Revision A09 W9812G2GH 11.2 Interleaved Bank Read (Burst Length = 4, CAS Latency = 3, Auto-precharge) 0 1 2 3 4 6 5 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 CLK CS tRC tRC tRC tRC RAS tRAS tRP tRAS tRAS tRP tRP tRAS CAS WE BS0 BS1 tRCD tRCD tRCD A10 RAa RBb A0-A9, A11 RAa CAw RBb tRCD CBx RAe RBd RAc CAy RAc CBz RBd RAe DQM CKE tAC DQ tRRD Active Bank #0 Bank #1 Bank #2 aw1 aw2 aw3 bx0 Active AP* Active bx1 bx2 bx3 tAC cy0 cy1 tRRD tRRD Read tAC tAC aw0 cy3 dz0 tRRD Read AP* Read cy2 AP* Active Active Read Idle Bank #3 * AP is the internal precharge start timing - 24 - Publication Release Date:May 19, 2008 Revision A09 W9812G2GH 11.3 Interleaved Bank Read (Burst Length = 8, CAS Latency = 3) 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 CLK CS tRC tRC tRC RAS tRAS tRP tRAS tRP tRAS tRP CAS WE BS0 BS1 tRCD A10 RAa A0-A9, A11 RAa tRCD tRCD RAc RBb CAx RBb CBy RAc CAz DQM CKE tAC DQ tAC ax0 ax1 tRRD Bank #0 Active Bank #2 ax3 ax4 ax5 ax6 by0 by1 by4 by5 by6 by7 CZ0 tRRD Read Precharge Bank #1 ax2 tAC Precharge Active Read Active Read Precharge Idle Bank #3 - 25 - Publication Release Date:May 19, 2008 Revision A09 W9812G2GH 11.4 Interleaved Bank Read (Burst Length = 8, CAS Latency = 3, Auto-precharge) 0 1 2 3 4 6 5 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 CLK tRC CS RAS tRAS tRAS tRP tRAS tRP CAS WE BS0 BS1 tRCD A10 A0-A9, A11 RBb RAa RAa tRCD tRCD CAx RAc RBb RAc CBy CAz DQM CKE tCAC tCAC DQ ax0 ax1 ax2 tRRD Bank #0 Active Bank #2 Bank #3 Idle ax4 ax5 ax6 ax7 by0 by1 by4 by5 by6 CZ0 tRRD AP* Read Active Bank #1 ax3 tCAC Active Read Read AP* * AP is the internal precharge start timing - 26 - Publication Release Date:May 19, 2008 Revision A09 W9812G2GH 11.5 Interleaved Bank Write (Burst Length = 8) 1 0 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 CLK CS tRC RAS tRAS tRAS tRP tRP tRAS CAS tRCD tRCD tRCD WE BS0 BS1 A10 RAa A0-A9, A11 RAa RBb CAx RAc RBb CBy RAc CAz DQM CKE DQ ax0 ax1 ax4 ax5 ax6 ax7 by0 by1 tRRD Bank #0 Active Bank #2 Bank #3 by3 by4 by5 by6 by7 CZ0 CZ1 CZ2 tRRD Precharge Write Active Bank #1 by2 Write Active Write Precharge Idle - 27 - Publication Release Date:May 19, 2008 Revision A09 W9812G2GH 11.6 Interleaved Bank Write (Burst Length = 8, Auto-precharge) 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 CLK CS tRC RAS tRP tRAS tRAS CAS WE BS0 BS1 tRCD tRCD A10 RAa A0-A9 A11 RAa tRCD RBb CAx RAb CBy RBb CAz RAc DQM CKE DQ ax0 ax1 ax4 ax5 ax6 ax7 by0 by1 tRRD Bank #0 Active Bank #2 Bank #3 Idle by3 by4 by5 by6 by7 CZ0 CZ1 CZ2 tRRD AP* Write Active Bank #1 by2 Write Active Write AP* * AP is the internal precharge start timing - 28 - Publication Release Date:May 19, 2008 Revision A09 W9812G2GH 11.7 Page Mode Read (Burst Length = 4, CAS Latency = 3) 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 CLK tCCD tCCD tCCD CS tRAS tRP tRAS tRP RAS CAS WE BS0 BS1 tRCD A10 RAa A0-A9, A11 RAa tRCD RBb RBb CAI CBx CAy CAm CBz DQM CKE tAC DQ tAC tAC a0 a1 a2 a3 bx0 bx1 Ay0 tAC Ay1 Ay2 tAC am0 am1 am2 bz0 bz1 bz2 bz3 tRRD Bank #0 Active Bank #2 Bank #3 Read Active Bank #1 Read Read Read Precharge Read AP* Idle * AP is the internal precharge start timing - 29 - Publication Release Date:May 19, 2008 Revision A09 W9812G2GH 11.8 Page Mode Read / Write (Burst Length = 8, CAS Latency = 3) 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 CLK CS tRAS tRP RAS CAS WE BS0 BS1 tRCD A10 RAa A0-A9, A11 RAa CAx CAy DQM CKE tAC DQ tWR ax0 Q Q Bank #0 Active ax1 ax3 ax2 Q Q ax5 ax4 Q Q Read ay1 ay0 D D Write ay2 D ay4 ay3 D D Precharge Bank #1 Bank #2 Bank #3 Idle - 30 - Publication Release Date:May 19, 2008 Revision A09 W9812G2GH 11.9 Auto-precharge Read (Burst Length = 4, CAS Latency = 3) CLK 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 CS tRC tRC RAS tRAS tRP tRAS tRP CAS WE BS0 BS1 tRCD A10 RAa A0-A9, A11 RAa tRCD RAb CAw RAb CAx DQM CKE tAC DQ Bank #0 tAC aw0 Active Read aw1 AP* aw2 bx0 aw3 Active Read bx1 bx2 bx3 AP* Bank #1 Bank #2 Bank #3 Idle * AP is the internal precharge start timing - 31 - Publication Release Date:May 19, 2008 Revision A09 W9812G2GH 11.10 Auto-precharge Write (Burst Length = 4) CLK 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 CS tRC tRC RAS tRAS tRP tRAS tRP CAS WE BS0 BS1 tRCD tRCD A10 RAa A0-A9, A11 RAa RAc RAb CAw RAb CAx RAc DQM CKE DQ Bank #0 aw0 Active Write aw1 aw2 bx0 aw3 AP* Active Write bx1 bx2 bx3 AP* Active Bank #1 Bank #2 Bank #3 Idle * AP is the internal precharge start timing - 32 - Publication Release Date:May 19, 2008 Revision A09 W9812G2GH 11.11 Auto Refresh Cycle 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 CLK tRP tRC tRC CS RAS CAS WE BS0,1 A10 A0-A9, A11 DQM CKE DQ All Banks Prechage Auto Refresh Auto Refresh (Arbitrary Cycle) - 33 - Publication Release Date:May 19, 2008 Revision A09 W9812G2GH 11.12 Self Refresh Cycle (CLK = 100 MHz) 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 CLK CS tRP RAS CAS WE BS0,1 A10 A0-A9, A11 DQM tCKS tCKS tSB CKE tCKS DQ tXSR Self Refresh Cycle All Banks Precharge Self Refresh Entry No Operation / Command Inhibit Self Refresh Exit - 34 - Arbitrary Cycle Publication Release Date:May 19, 2008 Revision A09 W9812G2GH 11.13 Burst Read and Single Write (Burst Length = 4, CAS Latency = 3) 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 CLK CS RAS CAS tRCD WE BS0 BS1 A10 RBa A0-A9, A11 RBa CBv CBw CBx CBy CBz DQM CKE tAC tAC DQ av0 Q Bank #0 Active Bank #1 Bank #2 Bank #3 av1 Q av2 av3 aw0 ax0 ay0 az0 az1 az2 az3 Q Q D D D Q Q Q Q Read Single Write Read Idle - 35 - Publication Release Date:May 19, 2008 Revision A09 W9812G2GH 11.14 Power Down Mode 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 CLK CS RAS CAS WE BS A10 RAa A0-A9 A11 RAa RAa CAa RAa CAx DQM tSB tSB CKE tCKS tCKS DQ ax0 Active tCKS tCKS ax1 ax2 NOP Read ax3 Precharge NOP Active Precharge Standby Power Down mode Active Standby Power Down mode Note: The PowerDown Mode is entered by asserting CKE "low". All Input/Output buffers (except CKE buffers) are turned off in the Power Down mode. When CKE goes high, command input must be No operation at next CLK rising edge. Violating refresh requirements during power-down may result in a loss of data. - 36 - Publication Release Date:May 19, 2008 Revision A09 W9812G2GH 11.15 Auto-precharge Timing (Read Cycle) 0 1 Read AP 2 3 4 5 6 7 8 9 10 11 (1) CAS Latency=2 ( a ) burst length = 1 Command Act tRP Q0 DQ ( b ) burst length = 2 Command Read AP Q0 DQ Act tRP Q1 ( c ) burst length = 4 Command Read AP Act tRP DQ Q0 Q1 Q2 Q3 ( d ) burst length = 8 Command Read AP Q0 DQ Q1 Q2 Q3 Q4 Q5 Q6 Act tRP Q7 (2) CAS Latency=3 ( a ) burst length = 1 Command Read AP Act tRP Q0 DQ ( b ) burst length = 2 Command Read AP Q0 DQ ( c ) burst length = 4 Command Act tRP Read Q1 AP Act tRP Q0 DQ ( d ) burst length = 8 Command Q1 Q2 Q3 Read AP Q0 DQ Q1 Q2 Q3 Q4 Q5 Act tRP Q6 Q7 Note: Read AP Act represents the Read with Auto precharge command. represents the start of internal precharging. represents the Bank Activate command. When the Auto precharge command is asserted, the period from Bank Activate command to the start of internal precgarging must be at least tRAS (min). - 37 - Publication Release Date:May 19, 2008 Revision A09 W9812G2GH 11.16 Auto-precharge Timing (Write Cycle) 0 1 2 3 4 5 6 7 8 9 10 11 12 CLK (1) CAS Latency = 2 (a) burst length = 1 Command Write AP tWR DQ Act tRP D0 (b) burst length = 2 Command Write AP Act tWR DQ D0 tRP D1 (c) burst length = 4 Command AP Write DQ D0 D1 D2 Act tRP tWR D3 (d) burst length = 8 Command Write AP tWR DQ D0 D1 D2 D3 D4 D5 D6 Act tRP D7 (2) CAS Latency = 3 (a) burst length = 1 Command Write AP Act tWR DQ (b) burst length = 2 Command tRP D0 Write AP Act tWR DQ D0 tRP D1 (c) burst length = 4 Command Write AP Act tWR DQ D0 D1 D2 tRP D3 (d) burst length = 8 Command Write AP tWR DQ D0 D1 D2 D3 D4 D5 D6 Act tRP D7 Note ) Write represents the Write with Auto precharge command. AP represents the start of internal precharing. Act represents the Bank Active command. When the /auto precharge command is asserted,the period from Bank Activate command to the start of intermal precgarging must be at least tRAS (min). - 38 - Publication Release Date:May 19, 2008 Revision A09 W9812G2GH 11.17 Timing Chart of Read to Write Cycle In the case of Burst Length = 4 (1) CAS Latency=2 0 1 2 3 4 5 D1 D2 D3 D0 D1 D2 D1 D2 D3 D1 D2 6 7 8 9 10 11 9 10 11 Read Write ( a ) Command DQM D0 DQ Read ( b ) Command Write DQM DQ D3 (2) CAS Latency=3 Read Write ( a ) Command DQM D0 DQ Read ( b ) Command Write DQM D0 DQ D3 Note: The Output data must be masked by DQM to avoid I/O conflict 11.18 Timing Chart of Write to Read Cycle In the case of Burst Length=4 0 1 2 3 4 5 6 7 8 Q0 Q1 Q2 Q3 Q0 Q1 Q2 Q3 Q0 Q1 Q2 Q3 Q0 Q1 Q2 (1) CAS Latency=2 ( a ) Command Write Read DQM DQ ( b ) Command D0 Read Write DQM DQ (2) CAS Latency=3 ( a ) Command D0 D1 Write Read DQM DQ ( b ) Command D0 Write Read DQM DQ D0 D1 - 39 - Q3 Publication Release Date:May 19, 2008 Revision A09 W9812G2GH 11.19 Timing Chart of Burst Stop Cycle (Burst Stop Command) 0 1 2 3 4 5 6 7 8 9 10 11 (1) Read cycle ( a ) CAS latency =2 Command Read BST Q0 DQ Q1 Q2 Q4 Q3 ( b )CAS latency = 3 Command Read BST Q0 DQ Q1 Q2 Q3 Q4 (2) Write cycle Command DQ Write Q0 BST Q1 Q2 Note: Q3 BST Q4 represents the Burst stop command 11.20 Timing Chart of Burst Stop Cycle (Precharge Command) 0 1 2 3 4 Q1 Q2 Q0 Q1 5 6 7 8 9 10 11 (1) Read cycle (a) CAS latency =2 Command Read PRCG DQ (b) CAS latency =3 Command Q0 Read Q3 Q4 PRCG DQ Q2 Q3 Q4 (2) Write cycle (a) CAS latency =2 Command PRCG Write tWR DQM DQ (b) CAS latency =3 Command Q0 Q1 Q2 Q3 Q4 PRCG Write tWR DQM DQ Q0 Q1 Q2 Q3 Q4 - 40 - Publication Release Date:May 19, 2008 Revision A09 W9812G2GH 11.21 CKE/DQM Input Timing (Write Cycle) CLK cycle No. 1 2 3 D1 D2 D3 4 5 6 7 External CLK Internal CKE DQM DQ D5 DQM MASK D6 CKE MASK (1) CLK cycle No. 1 2 3 D1 D2 D3 4 5 6 7 External CLK Internal CKE DQM DQ D5 DQM MASK D6 CKE MASK (2) CLK cycle No. 1 2 3 D1 D2 D3 4 5 6 7 External CLK Internal CKE DQM DQ D4 D5 D6 CKE MASK (3) - 41 - Publication Release Date:May 19, 2008 Revision A09 W9812G2GH 11.22 CKE/DQM Input Timing (Read Cycle) CLK cycle No. 1 2 3 4 Q1 Q2 Q3 Q4 6 5 7 External CLK Internal CKE DQM DQ Q6 Open Open (1) CLK cycle No. 1 2 3 Q1 Q2 Q3 4 5 6 7 External CLK Internal CKE DQM DQ Q4 Q6 Open (2) CLK cycle No. 1 2 Q1 Q2 3 4 5 6 7 Q4 Q5 Q6 External CLK Internal CKE DQM DQ Q3 (3) - 42 - Publication Release Date:May 19, 2008 Revision A09 W9812G2GH 12. PACKAGE SPECIFICATION 12.1 86L TSOP (II)-400 mil 86 44 HE E 1 43 e b C D q A2 ZD A1 Y A L L1 SEATING PLANE Controlling Dimension: Millimeters DIMENSION (MM) SYM. MIN. NOM. A A1 A2 b 0.05 DIMENSION (INCH) MAX. MIN. 1.20 0.15 0.002 0.27 0.21 0.007 0.005 1.00 NOM. MAX. 0.047 0.006 0.039 c 0.17 0.12 D 22.12 22.22 22.62 0.871 0.875 0.905 E 10.06 10.16 10.26 0.396 0.400 0.404 HE 11.56 11.76 11.96 0.455 0.463 0.471 e L L1 0.50 0.40 0.50 0.008 0.020 0.60 0.016 0.80 0.020 0.024 0.032 0.004 0.10 Y ZD 0.011 0.024 0.61 - 43 - Publication Release Date:May 19, 2008 Revision A09 W9812G2GH 13. REVISION HISTORY VERSION DATE PAGE A01 Mar. 24, 2006 All Create new document A02 Sep. 08, 2006 10 Exit Auto Refresh to next command is specified by tRC A03 Sep. 27, 2006 18 Modify Characteristics Notes 8 and add Notes 9 (tT) A04 Oct. 03, 2006 16 Add tXSR timing specification A05 Nov. 10, 2006 A06 Jun. 06, 2007 A07 Aug. 13, 2007 A08 Feb. 14, 2008 A09 May 19, 2008 DESCRIPTION 3,14,15,16,17 Add -6C grade 3,14,15,16 Add -6I grade Revise transient time tT AC test condition and calculate formula for compensation consideration in 16 Notes 6, 8 of AC Characteristics and Operating Condition Add -6F grade and remove AC Testing Conditions 3,14,15,16,17 table in Notes 6 3,14,15,16 Add -5 grade and remove -6F grade Change power supply voltage -6C grade from 3,14,15,16,17 3.0V~3.6V to 2.7V~3.6V Important Notice Winbond products are not designed, intended, authorized or warranted for use as components in systems or equipment intended for surgical implantation, atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for other applications intended to support or sustain life. Further more, Winbond products are not intended for applications wherein failure of Winbond products could result or lead to a situation wherein personal injury, death or severe property or environmental damage could occur. Winbond customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Winbond for any damages resulting from such improper use or sales. - 44 - Publication Release Date:May 19, 2008 Revision A09