1. Product profile
1.1 General description
Low-power voltage regulator diodes in a small SOT23 (TO-236AB) Surface-Mounted
Device (SMD) plastic package.
The diodes are available in the normalized E24 1 % (BZX84-A), 2 % (BZX84-B) and
approximately 5 % (BZX84-C) tolerance range. The series includes 37 breakdown
voltages with nominal working voltages from 2.4 V to 75 V.
1.2 Features and benefits
1.3 Applications
General regulation functions
1.4 Quick reference data
[1] Pulse test: tp100 s; 0.02
[2] Device mounted on a FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
BZX84 series
Voltage regulator diodes
Rev. 5 — 18 September 2013 Product data sheet
SOT23
Total power dissipation: 250 mW Working voltage range:
nominal 2.4 V to 75 V (E24 range)
Three tolerance series: 1%, 2 % and
approximately 5%
Non-repetitive peak reverse power
dissipation: 40 W
AEC-Q101 qualified
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VFforward voltage IF=10mA [1] --0.9V
Ptot total power dissipation Tamb 25 °C [2] --250mW
BZX84_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 5 — 18 September 2013 2 of 16
NXP Semiconductors BZX84 series
Voltage regulator doides
2. Pinning information
3. Ordering information
[1] The series includes 37 breakdown voltages with nominal working voltages from 2.4 V to 75 V and 1 %,
2 % and 5 % tolerances.
4. Marking
Table 2. Pinning
Pin Symbol Description Simplified outline Graphic symbol
1 A anode
2 n.c. not connected
3 K cathode
12
3
aaa-006592
A
K
n.c.
Table 3. Ordering information
Type number Package
Name Description Version
BZX84 series[1] TO-236AB plastic surface-mounted package; 3 leads SOT23
Table 4. Marking codes
Type number Marking code[1] Type number Marking code[1]
BZX84-A2V4 *50 BZX84-A18 KF*
BZX84-A2V7 *51 BZX84-A20 *C2
BZX84-A3V0 *52 BZX84-A22 KG*
BZX84-A3V3 *53 BZX84-A24 KH*
BZX84-A3V6 *C1 BZX84-A27 *75
BZX84-A3V9 *55 BZX84-A30 KJ*
BZX84-A4V3 *56 BZX84-A33 KK*
BZX84-A4V7 *57 BZX84-A36 *C3
BZX84-A5V1 *58 BZX84-A39 *C4
BZX84-A5V6 *59 BZX84-A43 *C5
BZX84-A6V2 *60 BZX84-A51 *C6
BZX84-A6V8 *61 BZX84-A75 *86
BZX84-A7V5 *62 BZX84-B2V4 *Z0
BZX84-A8V2 *63 BZX84-B2V7 *Z1
BZX84-A9V1 *64 BZX84-B3V0 *S1
BZX84-A10 *65 BZX84-B3V3 *S2
BZX84-A11 *04 BZX84-B3V6 *S3
BZX84-A12 *67 BZX84-B3V9 *S4
BZX84-A13 *C0 BZX84-B4V3 *S7
BZX84-A15 *69 BZX84-B4V7 *S8
BZX84-A16 KE* BZX84-B5V1 *R1
BZX84_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 5 — 18 September 2013 3 of 16
NXP Semiconductors BZX84 series
Voltage regulator doides
[1] * = placeholder for manufacturing site code
BZX84-B5V6 *R2 BZX84-C3V9 *B3
BZX84-B6V2 *R5 BZX84-C4V3 *B6
BZX84-B6V8 *R6 BZX84-C4V7 Z1*
BZX84-B7V5 *R8 BZX84-C5V1 Z2*
BZX84-B8V2 *R9 BZX84-C5V6 Z3*
BZX84-B9V1 *T1 BZX84-C6V2 Z4*
BZX84-B10 *66 BZX84-C6V8 Z5*
BZX84-B11 *Z6 BZX84-C7V5 Z6*
BZX84-B12 *Z7 BZX84-C8V2 Z7*
BZX84-B13 *Z8 BZX84-C9V1 Z8*
BZX84-B15 *Z9 BZX84-C10 Z9*
BZX84-B16 *70 BZX84-C11 Y1*
BZX84-B18 *71 BZX84-C12 Y2*
BZX84-B20 *72 BZX84-C13 Y3*
BZX84-B22 *73 BZX84-C15 Y4*
BZX84-B24 *74 BZX84-C16 Y5*
BZX84-B27 *Z5 BZX84-C18 Y6*
BZX84-B30 *Z4 BZX84-C20 Y7*
BZX84-B33 *Y1 BZX84-C22 Y8*
BZX84-B36 *Y2 BZX84-C24 Y9*
BZX84-B39 *S0 BZX84-C27 *T2
BZX84-B43 *S5 BZX84-C30 *T5
BZX84-B47 *S6 BZX84-C33 *T6
BZX84-B51 *S9 BZX84-C36 *T7
BZX84-B56 *R0 BZX84-C39 *T8
BZX84-B62 *R3 BZX84-C43 *B4
BZX84-B68 *R4 BZX84-C47 *B5
BZX84-B75 *R7 BZX84-C51 *B7
BZX84-C2V4 *T3 BZX84-C56 *B8
BZX84-C2V7 *T4 BZX84-C62 *B9
BZX84-C3V0 *T9 BZX84-C68 *B0
BZX84-C3V3 *B1 BZX84-C75 *A1
BZX84-C3V6 *B2 - -
Table 4. Marking codes …continued
Type number Marking code[1] Type number Marking code[1]
BZX84_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 5 — 18 September 2013 4 of 16
NXP Semiconductors BZX84 series
Voltage regulator doides
5. Limiting values
[1] tp=100s; square wave; Tj=25C before surge
[2] Device mounted on a FR4 PCB, single-sided copper, tin-plated and standard footprint.
6. Thermal characteristics
[1] Device mounted on a FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Soldering point of cathode tab.
7. Characteristics
[1] Pulse test: tp100 s; 0.02
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
IFforward current - 200 mA
PZSM non-repetitive peak
reverse power dissipation [1] -40W
Ptot total power dissipation Tamb 25 C[2] -250mW
Tamb ambient temperature - 150 C
Tstg storage temperature 55 +150 C
Tjjunction temperature 65 +150 C
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance from
junction to ambient in free air [1] - - 500 K/W
Rth(j-sp) thermal resistance from
junction to solder point [2] - - 330 K/W
Table 7. Ch aracteristics
Tj=25
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
VFforward voltage IF=10mA [1] --0.9V
BZX84_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 5 — 18 September 2013 5 of 16
NXP Semiconductors BZX84 series
Voltage regulator doides
Table 8. Characteristics per type; BZX84-A2V4 to BZX84-C24
Tj=25
C unless otherwise specified.
BZX84-
xxx Sel Working
voltage
VZ(V)
Differential resistance
rdif ()Reverse
current
IR (A)
Temperature
coefficient
SZ(mV/K)
Diode
capacitance
Cd(pF)[1]
Non-repetitive
peak reverse
current
IZSM (A)[2]
IZ=5mA IZ=1mA IZ=5mA IZ=5mA
Min Max Typ Max Typ Max Max VR (V) Min Typ Max Max Max
2V4 A 2.37 2.43 275 600 70 100 50 1 3.5 1.6 0 450 6.0
B 2.35 2.45
C2.2 2.6
2V7 A 2.67 2.73 300 600 75 100 20 1 3.5 2.0 0 450 6.0
B 2.65 2.75
C2.5 2.9
3V0 A 2.97 3.03 325 600 80 95 10 1 3.5 2.1 0 450 6.0
B 2.94 3.06
C2.8 3.2
3V3 A 3.26 3.34 350 600 85 95 5 1 3.5 2.4 0 450 6.0
B 3.23 3.37
C3.1 3.5
3V6 A 3.56 3.64 375 600 85 90 5 1 3.5 2.4 0 450 6.0
B 3.53 3.67
C3.4 3.8
3V9 A 3.86 3.94 400 600 85 90 3 1 3.5 2.5 0 450 6.0
B 3.82 3.98
C3.7 4.1
4V3 A 4.25 4.35 410 600 80 90 3 1 3.5 2.5 0 450 6.0
B 4.21 4.39
C4.0 4.6
4V7 A 4.65 4.75 425 500 50 80 3 2 3.5 1.4 0.2 300 6.0
B 4.61 4.79
C4.4 5.0
5V1 A 5.04 5.16 400 480 40 60 2 2 2.7 0.8 1.2 300 6.0
B5.0 5.2
C4.8 5.4
5V6 A 5.54 5.66 80 400 15 40 1 2 2.0 1.2 2.5 300 6.0
B 5.49 5.71
C5.2 6.0
6V2 A 6.13 6.27 40 150 6 10 3 4 0.4 2.3 3.7 200 6.0
B 6.08 6.32
C5.8 6.6
6V8 A 6.73 6.87 30 80 6 15 2 4 1.2 3.0 4.5 200 6.0
B 6.66 6.94
C6.4 7.2
BZX84_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 5 — 18 September 2013 6 of 16
NXP Semiconductors BZX84 series
Voltage regulator doides
7V5 A 7.42 7.58 30 80 6 15 1 5 2.5 4.0 5.3 150 4.0
B 7.35 7.65
C7.0 7.9
8V2 A 8.11 8.29 40 80 6 15 0.7 5 3.2 4.6 6.2 150 4.0
B 8.04 8.36
C7.7 8.7
9V1 A 9 9.2 40 100 6 15 0.5 6 3.8 5.5 7.0 150 3.0
B 8.92 9.28
C8.5 9.6
10 A 9.9 10.1 50 150 8 20 0.2 7 4.5 6.4 8.0 90 3.0
B 9.8 10.2
C 9.4 10.6
11 A 10.8 11.11 50 150 10 20 0.1 8 5.4 7.4 9.0 85 2.5
B 10.8 11.2
C 10.4 11.6
12 A 11.88 12.12 50 150 10 25 0.1 8 6.0 8.4 10.0 85 2.5
B 11.8 12.2
C 11.4 12.7
13 A 12.87 13.13 50 170 10 30 0.1 8 7.0 9.4 11.0 80 2.5
B 12.7 13.3
C 12.4 14.1
15 A 14.85 15.15 50 200 10 30 0.05 10.5 9.2 11.4 13.0 75 2.0
B 14.7 15.3
C 13.8 15.6
16 A 15.84 16.16 50 200 10 40 0.05 11.2 10.4 12.4 14.0 75 1.5
B 15.7 16.3
C 15.3 17.1
18 A 17.82 18.18 50 225 10 45 0.05 12.6 12.4 14.4 16.0 70 1.5
B 17.6 18.4
C 16.8 19.1
20 A 19.8 20.2 60 225 15 55 0.05 14 14.4 16.4 18.0 60 1.5
B 19.6 20.4
C 18.8 21.2
22 A 21.78 22.22 60 250 20 55 0.05 15.4 16.4 18.4 20.0 60 1.25
B 21.6 22.4
C 20.8 23.3
Table 8. Characteristics per type; BZX84-A2V4 to BZX84-C24 …continue d
Tj=25
C unless otherwise specified.
BZX84-
xxx Sel Working
voltage
VZ(V)
Differential resistance
rdif ()Reverse
current
IR (A)
Temperature
coefficient
SZ(mV/K)
Diode
capacitance
Cd(pF)[1]
Non-repetitive
peak reverse
current
IZSM (A)[2]
IZ=5mA IZ=1mA IZ=5mA IZ=5mA
Min Max Typ Max Typ Max Max VR (V) Min Typ Max Max Max
BZX84_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 5 — 18 September 2013 7 of 16
NXP Semiconductors BZX84 series
Voltage regulator doides
[1] f = 1 MHz; VR=0V
[2] tp= 100 s; square wave; Tj=25C before surge
24 A 23.76 24.24 60 250 25 70 0.05 16.8 18.4 20.4 22.0 55 1.25
B 23.5 24.5
C 22.8 25.6
Table 8. Characteristics per type; BZX84-A2V4 to BZX84-C24 …continue d
Tj=25
C unless otherwise specified.
BZX84-
xxx Sel Working
voltage
VZ(V)
Differential resistance
rdif ()Reverse
current
IR (A)
Temperature
coefficient
SZ(mV/K)
Diode
capacitance
Cd(pF)[1]
Non-repetitive
peak reverse
current
IZSM (A)[2]
IZ=5mA IZ=1mA IZ=5mA IZ=5mA
Min Max Typ Max Typ Max Max VR (V) Min Typ Max Max Max
Table 9. Characteristics per type; BZX84-A27 to BZX84-C75
Tj=25
C unless otherwise specified.
BZX84-
xxx Sel Working
voltage
VZ(V)
Differential resistance
rdif ()Reverse
current
IR (A)
Temperature
coefficient
SZ(mV/K)
Diode
capacitance
Cd(pF)[1]
Non-repetitive
peak reverse
current
IZSM (A)[2]
IZ=2mA IZ=0.5mA IZ=2mA IZ=2mA
Min Max Typ Max Typ Max Max VR (V) Min Typ Max Max Max
27 A 26.73 27.27 65 300 25 80 0.05 18.9 21.4 23.4 25.3 50 1.0
B 26.5 27.5
C 25.1 28.9
30 A 29.7 30.30 70 300 30 80 0.05 21 24.4 26.6 29.4 50 1.0
B 29.4 30.6
C 28.0 32.0
33 A 32.67 33.33 75 325 35 80 0.05 23.1 27.4 29.7 33.4 45 0.9
B 32.3 33.7
C 31.0 35.0
36 A 35.64 36.36 80 350 35 90 0.05 25.2 30.4 33.0 37.4 45 0.8
B 35.3 36.7
C 34.0 38.0
39 A 38.61 39.39 80 350 40 130 0.05 27.3 33.4 36.4 41.2 45 0.7
B 38.2 39.8
C 37.0 41.0
43 A 42.57 43.43 85 375 45 150 0.05 30.1 37.6 41.2 46.6 40 0.6
B 42.1 43.9
C 40.0 46.0
47 B 46.1 47.9 85 375 50 170 0.05 32.9 42.0 46.1 51.8 40 0.5
C 44.0 50.0
51 A 50.49 51.51 90 400 60 180 0.05 35.7 46.6 51.0 57.2 40 0.4
B 50.0 52.0
C 48.0 54.0
BZX84_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 5 — 18 September 2013 8 of 16
NXP Semiconductors BZX84 series
Voltage regulator doides
[1] f = 1 MHz; VR=0V
[2] tp= 100 s; square wave; Tj=25C before surge
56 B 54.9 57.1 100 425 70 200 0.05 39.2 52.2 57.0 63.8 40 0.3
C 52.0 60.0
62 B 60.8 63.2 120 450 80 215 0.05 43.4 58.8 64.4 71.6 35 0.3
C 58.0 66.0
68 B 66.6 69.4 150 475 90 240 0.05 47.6 65.6 71.7 79.8 35 0.25
C 64.0 72.0
75 A 74.25 75.75 170 500 95 255 0.05 52.5 73.4 80.2 88.6 35 0.20
B 73.5 76.5
C 70.0 79.0
Table 9. Characteristics per type; BZX84-A27 to BZX84-C75 …continued
Tj=25
C unless otherwise specified.
BZX84-
xxx Sel Working
voltage
VZ(V)
Differential resistance
rdif ()Reverse
current
IR (A)
Temperature
coefficient
SZ(mV/K)
Diode
capacitance
Cd(pF)[1]
Non-repetitive
peak reverse
current
IZSM (A)[2]
IZ=2mA IZ=0.5mA IZ=2mA IZ=2mA
Min Max Typ Max Typ Max Max VR (V) Min Typ Max Max Max
BZX84_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 5 — 18 September 2013 9 of 16
NXP Semiconductors BZX84 series
Voltage regulator doides
(1) Tj=25C (before surge)
(2) Tj= 150 C (before surge) Tj=25C
Fig 1. Non-repetitive peak reverse power dissipation
as a function of pulse duration; maximum
values
Fig 2. Forward current as a function of forward
voltage; typical values
BZX84-A/B/C2V4 to BZX84-A/B/C4V3
Tj=25C to 150 CBZX84-A/B/C4V7 to BZX84-A/B/C12
Tj=25C to 150 C
Fig 3. Temperature coefficient as a function of
working current; typica l values Fig 4. Temperature coefficient as a function of
working current; typical va lues
mbg801
10
3
1t
p
(ms)
P
ZSM
(W)
10
10
2
10
1
10
1
(1)
(2)
VF (V)
0.6 10.8
mbg781
100
200
300
IF
(mA)
0
060
0
2
3
1
mbg783
20 40 IZ (mA)
SZ
(mV/K) 4V3
3V9
3V6
3V0
2V4
2V7
3V3
02016
10
0
5
5
mbg782
4812 IZ (mA)
SZ
(mV/K)
4V7
12
11
10
9V1
8V2
7V5
6V8 6V2
5V6
5V1
BZX84_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 5 — 18 September 2013 10 of 16
NXP Semiconductors BZX84 series
Voltage regulator doides
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualifica tion for discrete semiconductors, and is
suitable for use in automotive applications.
BZX84-A/B/C2V4 to BZX84-A/B/C6V8
Tamb =25CBZX84-A/B/C7V5 to BZX84-A/B/C24
Tamb =25C
Fig 5. Reverse current as a function of reverse
voltage; typical values Fig 6. Reverse current as a function of reverse
voltage; typical values
BZX84-A/B/C27 to BZX84-A/B/C75
Tamb =25C
Fig 7. Reverse current as a function of reverse voltage; typical values
aaa-006665
10-1
10-2
10-3
10-4
10-5
10-6
10-7
10-8
IR
(A)
10-9
VR (V)
08624
2V4
2V7
3V0
3V3
3V6 3V9 4V3 4V7 5V1
5V6 6V2 6V8
aaa-006666
IR
(A)
10-5
10-7
10-6
10-2
10-3
10-4
10-1
10-8
VR (V)
02515 20510
7V5
8V2
9V1
10
11
12
13
15
16
18
20
22
24
aaa-006667
10-1
10-2
10-3
10-4
10-5
10-6
10-7
10-8
IR
(A)
10-9
VR (V)
20 806040
27
30
33
36
39
43
47
51
56
62
68
75
BZX84_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 5 — 18 September 2013 11 of 16
NXP Semiconductors BZX84 series
Voltage regulator doides
9. Package outline
10. Packing information
[1] For further information and the availability of packing methods, see Section 14.
[2] The series includes 37 breakdown voltages with nominal working voltages from 2.4 V to 75 V and 1 %,
2 % and 5 % tolerances.
Fig 8. Package outline SOT23 (TO-236AB)
04-11-04Dimensions in mm
0.45
0.15
1.9
1.1
0.9
3.0
2.8
2.5
2.1 1.4
1.2
0.48
0.38 0.15
0.09
12
3
Table 10. Packing methods
The indicated -xxx are the last thre e digits of the 12NC ordering code.[1]
Type number Package Description Packing quan tity
3000 10000
BZX84 series[2] SOT23
(TO-236AB) 4 mm pitc h, 8 mm t ape and reel -215 -235
BZX84_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 5 — 18 September 2013 12 of 16
NXP Semiconductors BZX84 series
Voltage regulator doides
11. Soldering
Fig 9. Reflow soldering footprint SOT23 (TO-236AB)
Fig 10. Wave soldering footprint SOT23 (TO-236AB)
solder lands
solder resist
occupied area
solder paste
sot023_fr
0.5
(3×)
0.6
(3×)
0.6
(3×)
0.7
(3×)
3
1
3.3
2.9
1.7
1.9
2
Dimensions in mm
solder lands
solder resist
occupied area
preferred transport direction during soldering
sot023_fw
2.8
4.5
1.4
4.6
1.4
(2×)
1.2
(2×)
2.2
2.6
Dimensions in mm
BZX84_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 5 — 18 September 2013 13 of 16
NXP Semiconductors BZX84 series
Voltage regulator doides
12. Revision history
Table 11. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BZX84_SER v.5 20130918 Product data sheet - BZX84_SER v.4
Modifications: Section 2 “Pinning informa tion: graphic symbol corrected
BZX84_SER v.4 20130322 Product data sheet - BZX84_SERIES v.3
BZX84_SERIES v.3 20030410 Product data sheet - BZX84 v.2
BZX84 v.2 19990518 Product specification - BZX84 v.1
BZX84 v.1 19960426 Product specification - -
BZX84_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 5 — 18 September 2013 14 of 16
NXP Semiconductors BZX84 series
Voltage regulator doides
13. Legal information
13.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall pre vail.
Product specificatio n — The information and data provided in a Product
data sheet shall define the specification of the product as agr eed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to off er functions and qualities beyond those described in the
Product data sheet.
13.3 Disclaimers
Limited warr a nty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Se miconductors takes no
responsibility for the content in this document if provided by an inf ormation
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental ,
punitive, special or consequ ential damages (including - wit hout limitatio n - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconduct ors’ aggregate and cumulat ive liability toward s
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
to the publication hereof .
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless ot herwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors pro duct can reasonably be expected
to result in perso nal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconducto rs products in such equipment or
applications an d ther efo re su ch inclusi on a nd/or use is at the cu stome r's own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty tha t such application s will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and ope ration of their application s
and products using NXP Semiconductors product s, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suit able and fit for the custome r’s applications and
products planned, as well as fo r the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associa ted with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessa ry
testing for th e customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by cu stomer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanent ly and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individua l agreement. In case an individual
agreement is concluded only the ter ms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.
Product [short] dat a sheet Production This document contains the product specification.
BZX84_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 5 — 18 September 2013 15 of 16
NXP Semiconductors BZX84 series
Voltage regulator doides
No offer to sell or license — Nothing in this document may be interpret ed or
construed as an of fer to sell product s that is op en for accept ance or the grant ,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
13.4 Trademarks
Notice: All referenced b rands, produc t names, service names and trademarks
are the property of their respect i ve ow ners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors BZX84 series
Voltage regulator doides
© NXP B.V. 2013. All rights reserved.
For more information, please visit: http://www.nxp.co m
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 18 September 2013
Document identifier: BZX84_SER
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
15. Contents
1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
6 Thermal characteristics . . . . . . . . . . . . . . . . . . 4
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4
8 Test information. . . . . . . . . . . . . . . . . . . . . . . . 10
8.1 Quality information . . . . . . . . . . . . . . . . . . . . . 10
9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11
10 Packing information . . . . . . . . . . . . . . . . . . . . 11
11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 13
13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 14
13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14
13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 14
13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15
14 Contact information. . . . . . . . . . . . . . . . . . . . . 15
15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16