D3V3F4U10LP
Document number: DS38563 Rev. 1 - 2
1 of 5
www.diodes.com
March 2017
© Diodes Incorporated
D3V3F4U10LP
ADVANCED I NFORMATIO N
4 CHANNEL LOW CAPACITANCE TVS DIODE ARRAY
Product Summary
VBR (MIN)
IPP (MAX)
CT (TYP)
5.5V
5
0.5pF
Description
The D3V3F4U10LP is a high-performance device suitable for
protecting four high speed I/Os. These devices are assembled in U-
DFN2510-10 packages and have high ESD surge capability, low ESD
clamping voltage and Ultra-low capacitance.
Applications
Typically used at high-speed ports such as USB 3.0, USB 3.1, Serial
ATA, Display port.
Features
Clamping Voltage: 5V at 16A IEC6100-4-2
IEC61000-4-2 (ESD): Air — ±12kV, Contact — ±12kV
IEC61000-4-5 (Lightning): 5A (8/20µs)
4 Channels of ESD Protection
Ultra-Low Channel Input Capacitance of 0.5pF Typical
TLP Dynamic Resistance: 0.25Ω
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Mechanical Data
Case: U-DFN2510-10
Case Material: Molded Plastic, ―Green‖ Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: NiPdAu over Copper Leadframe (Lead Free Plating).
Solderable per MIL-STD-202, Method 208
Weight: 0.038 grams (Approximate)
U-DFN2510-10
Ordering Information (Note 4)
Product
Compliance
Marking
Reel Size (inches)
Tape Width (mm)
Quantity per Reel
D3V3F4U10LP-7
Standard
QD6
7
8
3,000/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green‖ products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
U-DFN2510-10
Date Code Key
Year
2015
2016
2017
2018
2019
2020
Code
C
D
E
F
G
H
Month
Jan
Feb
Mar
Apr
May
Jun
Jul
Aug
Sep
Oct
Nov
Dec
Code
1
2
3
4
5
6
7
8
9
O
N
D
Pin #
Description
1, 2, 4, 5
I/O
6, 7, 9, 10
No Connection
3, 8
Vss
Pin Description (Top View)
Device Schematic
QD6 = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: E = 2017)
M = Month (ex: 9 = September)
1 2 3 4 5
10 9 8 7 6
TF2 YM
QD6
e4
3,8
Pin1
Pin2
Pin4
Pin5
D3V3F4U10LP
Document number: DS38563 Rev. 1 - 2
2 of 5
www.diodes.com
March 2017
© Diodes Incorporated
D3V3F4U10LP
ADVANC ED I NFORMATIO N
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Unit
Condition
Peak Pulse Current, per IEC61000-4-5
IPP
5
A
I/O to VSS, 8/20µs
Peak Pulse Power, per IEC61000-4-5
PPP
30
W
I/O to VSS, 8/20µs
ESD Protection – Contact Discharge, per IEC61000-4-2
VESD_CONTACT
±12
kV
I/O to VSS
ESD Protection – Air Discharge, per IEC61000-4-2
VESD_AIR
±12
kV
I/O to VSS
Thermal Characteristics
Characteristic
Symbol
Value
Unit
Power Dissipation Typical (Note 5)
PD
350
mW
Thermal Resistance, Junction to Ambient Typical (Note 5)
RJA
360
°C/W
Operating and Storage Temperature Range
TJ,TSTG
-55 to +150
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
Reverse Working Voltage
VRWM
—
—
3.3
V
—
Reverse Current
IR
—
—
1.0
μA
VR = 3.3V, I/O to VSS
Reverse Breakdown Voltage
VBR
5.5
6.2
—
V
IR = 1mA, I/O to VSS
Forward Clamping Voltage
VF
-1.0
-0.85
—
V
IF = -15mA, I/O to VSS
Holding Reverse Voltage
VHOLD
—
1.3
—
V
I/O to VSS
Reverse Clamping Voltage (Note 6)
VC
—
3.5
—
V
IPP = 5A, I/O to VSS, 8/20µs
Clamping Voltage (Note 7)
VC
—
5
—
V
TLP, 16A, tP = 100ns, I/O to VSS
Clamping Voltage (Note 7)
VC
—
5
—
V
TLP, -16A, tP = 100ns, I/O to VSS
Dynamic Reverse Resistance
RDIF-R
—
0.25
—
Ω
TLP, 10A, tP = 100ns, I/O to VSS
Dynamic Forward Resistance
RDIF-F
—
0.2
—
Ω
TLP, 10A, tP = 100ns, VSS to I/O
Channel Input Capacitance
CI/O
—
0.5
55
—
pF
VI/O = 0V, VSS = 0V, f = 1MHz
Notes: 5. Device mounted on FR-4 PCB pad layout (2oz copper) as shown on Diodes Incorporated’s suggested pad layout, which can be found on our website at
http://www.diodes.com/package-outlines.html.
6. Clamping voltage value is based on an 8x20µs peak pulse current (IPP) waveform.
7. Clamping voltage value is based on a TLP model. TLP conditions: ZO=50Ω, tP = 100ns, tP = 1ns, averageing window; t1=70ns to t2=90ns.
D3V3F4U10LP
Document number: DS38563 Rev. 1 - 2
3 of 5
www.diodes.com
March 2017
© Diodes Incorporated
D3V3F4U10LP
ADVANC ED I NFORMATIO N
f=1MHz
Figure 3. Typical Junction Capacitance
Note 5
0
25
50
75
100
025 50 75 100 125 150 175 200
PEAK PULSE DERATING IN % OF
PEAK POWER OR CURRENT
TA, AMBIENT TEMPERATURE (°C)
Figure 1. Pulse Derating Curve
0.0
0.2
0.4
0.6
0.8
0.0 0.5 1.0 1.5 2.0 2.5 3.0
CI/O,INPUT CAPACITANCE (pF)
VI/O, INPUT VOLTAGE (V)
Figure 2. Input Capacitance vs. Input Voltage
I/O to VSS, f=1MHz
0
2
4
6
8
10
12
14
16
18
20
0 1 2 3 4 5 6 7 8 9 10
CURRENT FROM I/O TO VSS (A)
VOLTAGE FROM I/O TO VSS (V)
Figure 3. Current vs. Voltage
D3V3F4U10LP
Document number: DS38563 Rev. 1 - 2
4 of 5
www.diodes.com
March 2017
© Diodes Incorporated
D3V3F4U10LP
ADVANC ED I NFORMATIO N
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
U-DFN2510-10
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
U-DFN2510-10
U-DFN2510-10
Dim
Min
Max
Typ
A
0.545
0.605
0.575
A1
0.00
0.05
0.03
A3
-
-
0.13
b
0.15
0.25
0.20
b1
035
0.45
0.40
D
2.450
2.575
2.500
e
-
-
0.50
E
0.950
1.075
1.000
L
0.325
0.425
0.375
Z
-
-
0.150
All Dimensions in mm
Dimensions
Value
(in mm)
C
0.500
X
0.250
X1
0.450
X2
2.250
Y
0.625
Y1
0.575
Y2
0.700
Y3
1.400
Z
b1
R0.125
R0.075
D
E
eb
L
A
A1
A3
Seating Plane
X2
Y3
Y
X
Y2
Y1
X1
C
D3V3F4U10LP
Document number: DS38563 Rev. 1 - 2
5 of 5
www.diodes.com
March 2017
© Diodes Incorporated
D3V3F4U10LP
ADVANC ED I NFORMATIO N
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
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