a PRODUCT DESCRIPTION The AD8002 is a dual, low-power, high-speed amplifier designed to operate on 5 V supplies. The AD8002 features unique transimpedance linearization circuitry. This allows it to drive video loads with excellent differential gain and phase performance on only 50 mW of power per amplifier. The AD8002 is a current feedback amplifier and features gain flatness of 0.1 dB to 60 MHz while offering differential gain and phase error of 0.01% and 0.02. This makes the AD8002 ideal for professional video electronics such as cameras and video switchers. Additionally, the AD8002's low distortion and fast settling make it ideal for buffer high-speed A-to-D converters. The AD8002 offers low power of 5.5 mA/amplifier max (VS = 5 V) and can run on a single 12 V power supply, while capable of delivering over 70 mA of load current. It is offered in an 8-lead plastic DIP, SOIC, and SOIC package. These features make this amplifier ideal for portable and battery-powered applications where size and power are critical. OUT1 1 8 V+ -IN1 2 7 OUT2 +IN1 3 6 -IN2 V- 4 5 +IN2 AD8002 The outstanding bandwidth of 600 MHz along with 1200 V/s of slew rate make the AD8002 useful in many general purpose high speed applications where dual power supplies of up to 6 V and single supplies from 6 V to 12 V are needed. The AD8002 is available in the industrial temperature range of -40C to +85C. 1 SIDE 1 G = +2 RL = 100 VIN = 50mV SIDE 2 0 -1 -2 -3 0.1 0 SIDE 1 -4 -5 -0.1 SIDE 2 -0.2 -6 -0.3 -7 -0.4 -8 -0.5 1M NORMALIZED FREQUENCY RESPONSE - dB APPLICATIONS A-to-D Driver Video Line Driver Differential Line Driver Professional Cameras Video Switchers Special Effects RF Receivers FUNCTIONAL BLOCK DIAGRAM 8-Lead Plastic DIP, SOIC, and SOIC NORMALIZED FLATNESS - dB FEATURES Excellent Video Specifications (RL = 150 , G = +2) Gain Flatness 0.1 dB to 60 MHz 0.01% Differential Gain Error 0.02 Differential Phase Error Low Power 5.5 mA/Amp Max Power Supply Current (55 mW) High Speed and Fast Settling 600 MHz, -3 dB Bandwidth (G = +1) 500 MHz, -3 dB Bandwidth (G = +2) 1200 V/s Slew Rate 16 ns Settling Time to 0.1% Low Distortion -65 dBc THD, f C = 5 MHz 33 dBm Third Order Intercept, F1 = 10 MHz -66 dB SFDR, f = 5 MHz -60 dB Crosstalk, f = 5 MHz High Output Drive Over 70 mA Output Current Drives Up to Eight Back-Terminated 75 Loads (Four Loads/Side) While Maintaining Good Differential Gain/Phase Performance (0.01%/0.17) Available in 8-Lead Plastic DIP, SOIC and SOIC Packages Dual 600 MHz, 50 mW Current Feedback Amplifier AD8002 -9 1G 10M 100M FREQUENCY - Hz Figure 1. Frequency Response and Flatness, G = +2 SIDE 1 G = +2 1V STEP SIDE 2 200mV 5ns Figure 2. 1 V Step Response, G = +1 REV. D Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 World Wide Web Site: www.analog.com Fax: 781/326-8703 (c) Analog Devices, Inc., 2001 AD8002-SPECIFICATIONS (@ T = 25C, V = 5 V, R = 100 , R A S L 1 C = 75 , unless otherwise noted.) Model Conditions DYNAMIC PERFORMANCE -3 dB Small Signal Bandwidth, N Package R Package RM Package Min AD8002A Typ Max Unit G = +2, RF = 750 G = +1, RF = 1.21 k G = +2, RF = 681 G = +1, RF = 953 G = +2, RF = 681 G = +1, RF = 1 k 500 600 500 600 500 600 MHz MHz MHz MHz MHz MHz G = +2, R F = 750 G = +2, R F = 681 G = +2, R F = 681 G = +2, VO = 2 V Step G = -1, VO = 2 V Step G = +2, VO = 2 V Step G = +2, VO = 2 V Step, RF = 750 60 90 60 700 1200 16 2.4 MHz MHz MHz V/s V/s ns ns fC = 5 MHz, VO = 2 V p-p G = +2, RL = 100 f = 5 MHz, G = +2 f = 10 kHz, RC = 0 f = 10 kHz, +In -In NTSC, G = +2, R L = 150 NTSC, G = +2, R L = 150 f = 10 MHz f = 10 MHz f = 5 MHz -65 dBc -60 2.0 2.0 18 0.01 0.02 33 14 -66 dB nV/Hz pA/Hz pA/Hz % Degree dBm dBm dB Bandwidth for 0.1 dB Flatness N Package R Package RM Package Slew Rate Settling Time to 0.1% Rise and Fall Time NOISE/HARMONIC PERFORMANCE Total Harmonic Distortion Crosstalk, Output to Output Input Voltage Noise Input Current Noise Differential Gain Error Differential Phase Error Third Order Intercept 1 dB Gain Compression SFDR DC PERFORMANCE Input Offset Voltage 2.0 2.0 10 5.0 TMIN -TMAX Offset Drift -Input Bias Current TMIN -TMAX +Input Bias Current Open Loop Transresistance INPUT CHARACTERISTICS Input Resistance Input Capacitance Input Common-Mode Voltage Range Common-Mode Rejection Ratio Offset Voltage -Input Current +Input Current OUTPUT CHARACTERISTICS Output Voltage Swing Output Current2 Short Circuit Current2 POWER SUPPLY Operating Range Quiescent Current/Both Amplifiers Power Supply Rejection Ratio -Input Current +Input Current 3.0 TMIN -TMAX VO = 2.5 V TMIN -TMAX 250 175 +Input -Input +Input 6 9 25 35 6.0 10 900 10 50 1.5 3.2 VCM = 2.5 V VCM = 2.5 V, TMIN -TMAX VCM = 2.5 V, TMIN -TMAX 49 R L = 150 2.7 85 54 0.3 0.2 60 49 M pF V 1.0 0.9 10.0 75 56 0.5 0.1 dB A/V A/V V mA mA 3.1 70 110 3.0 TMIN -TMAX +VS = +4 V to +6 V, -VS = -5 V -VS = - 4 V to - 6 V, +VS = +5 V TMIN -TMAX TMIN -TMAX mV mV V/C A A A A k k 6.0 11.5 2.5 0.5 V mA dB dB A/V A/V NOTES 1 RC is recommended to reduce peaking and minimize input reflections at frequencies above 300 MHz. However, R C is not required. 2 Output current is limited by the maximum power dissipation in the package. See the power derating curves. Specifications subject to change without notice. -2- REV. D AD8002 ABSOLUTE MAXIMUM RATINGS 1 MAXIMUM POWER DISSIPATION Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13.2 V Internal Power Dissipation2 Plastic DIP Package (N) . . . . . . . . . . . . . . . . . . . . . . . 1.3 W Small Outline Package (R) . . . . . . . . . . . . . . . . . . . . . . 0.9 W SOIC Package (RM) . . . . . . . . . . . . . . . . . . . . . . . . . 0.6 W Input Voltage (Common Mode) . . . . . . . . . . . . . . . . . . . . VS Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . 1.2 V Output Short Circuit Duration . . . . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves Storage Temperature Range N, R, RM . . . . . -65C to +125C Operating Temperature Range (A Grade) . . . - 40C to +85C Lead Temperature Range (Soldering 10 sec) . . . . . . . . . 300C The maximum power that can be safely dissipated by the AD8002 is limited by the associated rise in junction temperature. The maximum safe junction temperature for plastic encapsulated devices is determined by the glass transition temperature of the plastic, approximately 150C. Exceeding this limit temporarily may cause a shift in parametric performance due to a change in the stresses exerted on the die by the package. Exceeding a junction temperature of 175C for an extended period can result in device failure. 2.0 8-LEAD PLASTIC-DIP PACKAGE MAXIMUM POWER DISSIPATION - W NOTES 1 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2 Specification is for device in free air: 8-Lead Plastic DIP Package: JA = 90C/W 8-Lead SOIC Package: JA = 155C/W 8-Lead SOIC Package: JA = 200C/W While the AD8002 is internally short circuit protected, this may not be sufficient to guarantee that the maximum junction temperature (150C) is not exceeded under all conditions. To ensure proper operation, it is necessary to observe the maximum power derating curves. 8-LEAD SOIC PACKAGE 1.5 TJ = 150C 1.0 0.5 8-LEAD SOIC PACKAGE 0 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 AMBIENT TEMPERATURE - C Figure 3. Plot of Maximum Power Dissipation vs. Temperature ORDERING GUIDE Model Temperature Range Package Description Package Option Brand Code AD8002AN AD8002AR AD8002AR-REEL AD8002AR-REEL7 AD8002ARM AD8002ARM-REEL AD8002ARM-REEL7 -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C 8-Lead PDIP 8-Lead SOIC 8-Lead SOIC 13" REEL 8-Lead SOIC 7" REEL 8-Lead SOIC 8-Lead SOIC 13" REEL 8-Lead SOIC 7" REEL N-8 SO-8 SO-8 SO-8 RM-8 RM-8 RM-8 Standard Standard Standard Standard HFA HFA HFA CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD8002 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. REV. D -3- WARNING! ESD SENSITIVE DEVICE AD8002-Typical Performance Characteristics 750 953 10F +5V 10F +5V 0.1F 0.1F 750 AD8002 AD8002 75 PULSE GENERATOR 50 TR/TF = 250ps 75 0.1F VIN PULSE GENERATOR 10F 50 TR/TF = 250ps -5V TPC 1. Test Circuit , Gain = +1 SIDE 1 0.1F VIN RL = 100 RL = 100 10F -5V TPC 4. Test Circuit, Gain = +2 SIDE 1 G = +1 100mV STEP G = +2 100mV STEP SIDE 2 SIDE 2 TPC 2. 100 mV Step Response, G = +1 SIDE 1 5ns 20mV 5ns 20mV TPC 5. 100 mV Step Response, G = +2 G = +1 1V STEP SIDE 1 G = +2 1V STEP SIDE 2 SIDE 2 200mV 5ns 20mV TPC 3. 1 V Step Response, G = +1 5ns TPC 6. 1 V Step Response, G = +2 -4- REV. D AD8002 -20 SIDE 2 -2 -3 0.1 SIDE 1 0 -0.1 -4 -5 75 50 -0.2 -1 50 SIDE 2 -6 -7 -0.3 RF 681 681 -0.4 -0.5 1M -8 -30 -40 -50 CROSSTALK - dB NORMALIZED FLATNESS - dB G = +2 RL = 100 VIN = 50mV 0 NORMALIZED FREQUENCY RESPONSE - dB 1 SIDE 1 OUTPUT SIDE 1 -60 OUTPUT SIDE 2 -70 -80 -90 -100 -110 -120 100k -9 1G 10M 100M FREQUENCY - Hz VIN = -4dBV RL = 100 VS = 5.0V G = +2 RF = 750 TPC 7. Frequency Response and Flatness, G = +2 1M 10M FREQUENCY - Hz 100M TPC 10. Crosstalk (Output-to-Output) vs. Frequency -50 G = +2 RL = 100 DISTORTION - dBc -60 G=+2 RF = 750 RC = 75 RL = 100 SIDE 1 -70 2ND HARMONIC -80 3RD HARMONIC SIDE 2 -90 -100 5ns -110 10k 100k 1M FREQUENCY - Hz 10M 100M NOTES: SIDE 1: VIN = 0V; 8mV/div RTO SIDE 2: 1V STEP RTO; 400mV/div TPC 8. Distortion vs. Frequency, G = +2, RL = 100 TPC 11. Pulse Crosstalk, Worst Case, 1 V Step -60 DIFF GAIN - % -80 2 BACK-TERMINATED LOADS (75) 0.01 0.00 -0.01 -0.02 2ND HARMONIC 3RD HARMONIC -100 -110 -120 10k 100k 1M FREQUENCY - Hz 10M 100M TPC 9. Distortion vs. Frequency, G = +2, RL = 1 k REV. D 1 BACK-TERMINATED LOAD (150) G = +2 RF = 750 NTSC -90 DIFF PHASE - Degrees DISTORTION - dBc -70 0.02 G = +2 RL = 1k VOUT = 2V p-p 2 BACK-TERMINATED LOADS (75) 0.08 0.06 1 BACK-TERMINATED LOAD (150) 0.04 0.02 0.00 1 2 3 4 5 6 IRE 7 8 9 10 11 TPC 12. Differential Gain and Differential Phase (per Amplifier) -5- 2 1 VIN = 50mV G = +1 RF = 953 RL = 100 SIDE 1 0 INPUT LEVEL - dBV GAIN - dB SIDE 2 -1 -2 75 -3 50 50 -4 6 -3 3 -6 0 -9 -3 -12 -6 -15 -9 -18 -21 953 -5 G = +2 RF = 681 VS = 5V RL = 100 -12 -15 -18 -24 -6 1M 10M 100M FREQUENCY - Hz -27 1M 1G TPC 13. Frequency Response, G = +1 9 RL = 100 G = +1 RF = 1.21k 6 G = +1 RL = 100 VOUT = 2V p-p INPUT/OUTPUT LEVEL - dBV -50 -21 500M 10M 100M FREQUENCY - Hz TPC 16. Large Signal Frequency Response, G = +2 -40 DISTORTION - dBc 0 OUTPUT LEVEL - dBV AD8002 -60 -70 2ND HARMONIC -80 3RD HARMONIC -90 3 0 -3 -6 75 50 -9 50 -12 -15 1.21k -18 -100 10k 100k 1M FREQUENCY - Hz 10M -27 1M 100M TPC 14. Distortion vs. Frequency, G = +1, RL = 100 45 G = +1 RL = 1k 40 VS = 5V RL = 100 35 -60 30 GAIN - dB DISTORTION - dBc 500M TPC 17. Large Signal Frequency Response, G = +1 -40 -50 10M 100M FREQUENCY - Hz -70 2ND HARMONIC 3RD HARMONIC -80 25 G = +100 RF = 1000 20 15 G = +10 RF = 499 10 -90 5 -100 -110 10k 0 100k 1M FREQUENCY - Hz 10M -5 1M 100M TPC 15. Distortion vs. Frequency, G = +1, RL = 1 k 10M 100M FREQUENCY - Hz 1G TPC 18. Frequency Response, G = +10, G = +100 -6- REV. D AD8002 OUTPUT G = +2 2V STEP RF = 750 RC = 75 RL = 100 G = +2 2V STEP RF = 750 RC = 75 ERROR, (0.05%/DIV) ERROR, (0.05%/DIV) OUTPUT INPUT INPUT 400mV 10ns 400mV TPC 19. Short-Term Settling Time TPC 22. Long-Term Settling Time 4 3.4 DEVICE #1 3.3 3 OUTPUT SWING - Volts 3.2 INPUT OFFSET VOLTAGE - mV RL = 150 VS = 5V 3.1 +VOUT |-VOUT| 3.0 2.9 RL = 50 2.8 VS = 5V 2.7 +VOUT 2.5 -55 -35 -15 5 1 DEVICE #2 0 DEVICE #3 -1 -2 |-VOUT| 2.6 2 25 45 65 85 105 -3 -55 125 -35 JUNCTION TEMPERATURE - C -15 5 25 45 65 85 105 125 JUNCTION TEMPERATURE - C TPC 20. Output Swing vs. Temperature TPC 23. Input Offset Voltage vs. Temperature 11.5 5 4 TOTAL SUPPLY CURRENT - mA INPUT BIAS CURRENT - A -IN 3 2 1 0 -1 +IN -2 -3 -55 -35 -15 5 25 45 65 85 105 10.5 VS = 5V 10.0 9.5 9.0 -55 125 -35 -15 5 25 45 65 85 105 125 JUNCTION TEMPERATURE - C JUNCTION TEMPERATURE - C TPC 21. Input Bias Current vs. Temperature REV. D 11.0 TPC 24. Total Supply Current vs. Temperature -7- AD8002 120 100 110 105 10 100 |SINK ISC| RESISTANCE - SOURCE ISC 95 90 85 1 RbT = 50 RF = 750 RC = 75 VS = 5.0V POWER = 0dBm (223.6mVrms) G = +2 RbT = 0 0.1 80 75 0.01 70 -55 -35 -15 5 25 45 65 85 105 125 10k 100k 1M 10M FREQUENCY - Hz JUNCTION TEMPERATURE - C 100M 1G TPC 28. Output Resistance vs. Frequency TPC 25. Short Circuit Current vs. Temperature 100 100 1 -3dB BANDWIDTH 0 SIDE 1 SIDE 2 INVERTING CURRENT VS = 5V 10 10 NONINVERTING CURRENT VS = 5V NOISE CURRENT - pA/ Hz NOISE VOLTAGE - nV/ Hz 0.2 -1 -2 0.1 SIDE 1 0.1dB FLATNESS 0 -3 -4 -0.1 -0.2 -0.3 VOLTAGE NOISE VS = 5V VS = 5V VIN = 50mV G = -1 RL = 100 RF = 549 -5 SIDE 2 -6 OUTPUT VOLTAGE - dB SHORT CIRCUIT CURRENT - mA 115 -7 -8 1 100k 1 100 10 1k FREQUENCY - Hz 10k 1M TPC 26. Noise vs. Frequency -9 1G 10M 100M FREQUENCY - Hz TPC 29. -3 dB Bandwidth vs. Frequency, G = -1 -48 -50.0 -52.5 -49 -PSRR -55.0 -50 -57.5 PSRR - dB CMRR - dB -CMRR -51 +CMRR -52 -53 2V SPAN -60.0 CURVES ARE FOR WORSTCASE CONDITION WHERE ONE SUPPLY IS VARIED WHILE THE OTHER IS HELD CONSTANT. -62.5 -65.0 -67.5 -54 -70.0 +PSRR -55 -56 -55 -72.5 -35 -15 5 25 45 65 85 JUNCTION TEMPERATURE - C 105 -75.0 -55 125 -35 -15 5 25 45 65 85 105 125 JUNCTION TEMPERATURE - C TPC 30. PSRR vs. Temperature TPC 27. CMRR vs. Temperature -8- REV. D AD8002 0 0 VIN -10 604 57.6 VIN = 200mV G = +2 -20 50 -30 154 154 -30 PSRR - dB CMRR - dB -20 -10 604 0.1F -5V -40 SIDE 2 VS = 5.0V RL = 100 VIN = 200mV 10M 100M FREQUENCY - Hz -80 -90 30k 100k 1G 1M 100M 10M FREQUENCY - Hz TPC 34. PSRR vs. Frequency TPC 31. CMRR vs. Frequency SIDE 1 +PSRR -70 -60 1M -50 -60 SIDE 1 -50 -PSRR -40 G = -1 RF = 576 RG = 576 RC = 50 SIDE 1 G = -2 2V STEP RF = 549 SIDE 2 SIDE 2 400mV 5ns 400mV TPC 32. 2 V Step Response, G = -1 5ns TPC 35. 2 V Step Response, G = -2 576 549 576 274 50 50 54.9 61.9 50 50 SIDE 1 SIDE 1 SIDE 2 SIDE 2 G = -1 100mV STEP RF = 549 G = -1 RF = 576 RG = 576 RC = 50 RL = 100 20mV 20mV 5ns TPC 36. 100 mV Step Response, G = -2 TPC 33. 100 mV Step Response, G = -1 REV. D 5ns -9- 500M AD8002 THEORY OF OPERATION Printed Circuit Board Layout Considerations A very simple analysis can put the operation of the AD8002, a current feedback amplifier, in familiar terms. Being a current feedback amplifier, the AD8002's open-loop behavior is expressed as transimpedance, VO/I-IN, or TZ. The open-loop transimpedance behaves just as the open-loop voltage gain of a voltage feedback amplifier, that is, it has a large dc value and decreases at roughly 6 dB/octave in frequency. As expected for a wideband amplifier, PC board parasitics can affect the overall closed-loop performance. Of concern are stray capacitances at the output and the inverting input nodes. If a ground plane is to be used on the same side of the board as the signal traces, a space (5 mm min) should be left around the signal lines to minimize coupling. Additionally, signal lines connecting the feedback and gain resistors should be short enough so that their associated inductance does not cause high frequency gain errors. Line lengths on the order of less than 5 mm are recommended. If long runs of coaxial cable are being driven, dispersion and loss must be considered. Since the RIN is proportional to 1/gm, the equivalent voltage gain is just TZ x gm, where the gm in question is the transconductance of the input stage. This results in a low open-loop input impedance at the inverting input, a now familiar result. Using this amplifier as a follower with gain, Figure 4, basic analysis yields the following result. Power Supply Bypassing Adequate power supply bypassing can be critical when optimizing the performance of a high-frequency circuit. Inductance in the power supply leads can form resonant circuits that produce peaking in the amplifier's response. In addition, if large current transients must be delivered to the load, bypass capacitors (typically greater than 1 F) will be required to provide the best settling time and lowest distortion. A parallel combination of 4.7 F and 0.1 F is recommended. Some brands of electrolytic capacitors will require a small series damping resistor 4.7 for optimum results. TZ (S ) VO =Gx VIN TZ (S ) + G x RIN + R1 G = 1+ R1 RIN = 1 / g m 50 R2 R1 R2 DC Errors and Noise Recognizing that G x RIN << R1 for low gains, it can be seen to the first order that bandwidth for this amplifier is independent of gain (G). Considering that additional poles contribute excess phase at high frequencies, there is a minimum feedback resistance below which peaking or oscillation may result. This fact is used to determine the optimum feedback resistance, R F. In practice parasitic capacitance at the inverting input terminal will also add phase in the feedback loop, so picking an optimum value for R F can be difficult. There are three major noise and offset terms to consider in a current feedback amplifier. For offset errors, refer to the equation below. For noise error, the terms are root-sum-squared to give a net output error. In the circuit shown in Figure 5 they are input offset (VIO), which appears at the output multiplied by the noise gain of the circuit (1 + R F/R I), noninverting input current (IBN x RN), also multiplied by the noise gain, and the inverting input current, which, when divided between RF and RI and subsequently multiplied by the noise gain, always appears at the output as IBN x RF. The input voltage noise of the AD8002 is a low 2 nV/Hz. At low gains, though, the inverting input current noise times RF is the dominant noise source. Careful layout and device matching contribute to better offset and drift specifications for the AD8002 compared to many other current feedback amplifiers. The typical performance curves in conjunction with the equations below can be used to predict the performance of the AD8002 in any application. Achieving and maintaining gain flatness of better than 0.1 dB at frequencies above 10 MHz requires careful consideration of several issues. R R VOUT = VIO x 1 + F I BN x RN x 1 + F I BI x RF RI RI RIN VOUT VIN Figure 4. Choice of Feedback and Gain Resistors RF The fine scale gain flatness will, to some extent, vary with feedback resistance. It, therefore, is recommended that once optimum resistor values have been determined, 1% tolerance values should be used if it is desired to maintain flatness over a wide range of production lots. In addition, resistors of different construction have different associated parasitic capacitance and inductance. Surface mount resistors were used for the bulk of the characterization for this data sheet. It is not recommended that leaded components be used with the AD8002. RI RN IBI IBN VOUT Figure 5. Output Offset Voltage -10- REV. D AD8002 Driving Capacitive Loads -45 The AD8002 was designed primarily to drive nonreactive loads. If driving loads with a capacitive component is desired, best frequency response is obtained by the addition of a small series resistance as shown in Figure 6. THIRD ORDER IMD - dBc 909 RSERIES IN RL 500 G = +2 F1 = 10MHz F2 = 12MHz -50 CL -55 2F2 - F1 -60 2F1 - F2 -65 -70 -75 -80 -8 -7 Figure 6. Driving Capacitive Loads Figure 7 shows the optimum value for RSERIES versus capacitive load. It is worth noting that the frequency response of the circuit when driving large capacitive loads will be dominated by the passive roll-off of RSERIES and CL. 40 RSERIES - V 30 20 -6 -5 -4 -3 -2 -1 0 1 INPUT POWER - dBm 2 3 4 5 6 Figure 8. Third Order IMD; F1 = 10 MHz, F2 = 12 MHz Operation as a Video Line Driver The AD8002 has been designed to offer outstanding performance as a video line driver. The important specifications of differential gain (0.01%) and differential phase (0.02) meet the most exacting HDTV demands for driving one video load with each amplifier. The AD8002 also drives four back-terminated loads (two each), as shown in Figure 9, with equally impressive performance (0.01%, 0.07). Another important consideration is isolation between loads in a multiple load application. The AD8002 has more than 40 dB of isolation at 5 MHz when driving two 75 back-terminated loads. 750 75 75 CABLE 750 VOUT #1 10 +VS 75 4.7F + 0 0 0.1F 5 10 15 20 25 CL - pF 75 1/2 AD8002 Figure 7. Recommended RSERIES vs. Capacitive Load 75 CABLE VOUT #2 75 0.1F Communications Distortion is a key specification in communications applications. Intermodulation distortion (IMD) is a measure of the ability of an amplifier to pass complex signals without the generation of spurious harmonics. The third order products are usually the most problematic since several of them fall near the fundamentals and do not lend themselves to filtering. Theory predicts that the third order harmonic distortion components increase in power at three times the rate of the fundamental tones. The specification of third order intercept as the virtual point where fundamental and harmonic power are equal is one standard measure of distortion performance. Op amps used in closed-loop applications do not always obey this simple theory. At a gain of two, the AD8002 has performance summarized in Figure 8. Here the worst third order products are plotted versus. input power. The third order intercept of the AD8002 is 33 dBm at 10 MHz. REV. D -11- 75 CABLE 4.7F VIN 75 -VS 1/2 AD8002 75 75 CABLE VOUT #3 75 750 750 75 75 CABLE VOUT #4 75 Figure 9. Video Line Driver AD8002 Driving A-to-D Converters The AD8002 is well suited for driving high-speed analog-todigital converters such as the AD9058. The AD9058 is a dual 8-bit 50 MSPS ADC. In Figure 10, the AD8002 is shown driving the inputs of the AD9058 which are configured for 0 V to 2 V ranges. Bipolar input signals are buffered, amplified (-2x), and offset (by 1.0 V) into the proper input range of the ADC. Using the AD9058's internal 2 V reference connected to both ADCs as shown in Figure 10 reduces the number of external components required to create a complete data acquisition system. The 20 resistors in series with ADC inputs are used to help the AD8002s drive the 10 pF ADC input capacitance. The AD8002 adds only 100 mW to the power consumption, while not limiting the performance of the circuit. 10 ENCODE A 8 549 38 ANALOG IN A 0.5V 274 1.1k 50 1/2 AD8002 20 1k 74ACT04 ENCODE 6 10pF 50 36 ENCODE B -VREF A +VS -VREF B 5, 9, 22, 24, 37, 41 +5V 0.1F RZ1 AIN A D0A (LSB) 18 17 AD707 0.1F 20k 20k 0.1F 3 43 14 +VREF A 13 11 RZ2 AD9058 (J-LEAD) D0B (LSB) 274 28 29 20 40 74ACT 273 30 1/2 50 AD8002 31 AIN B 32 33 1 D7B (MSB) -VS RZ1, RZ2 = 2,000 SIP (8-PKG) 35 7, 20, 26, 39 0.1F 4,19, 21 8 34 COMP 0.1F 8 12 +VREF B 1.1k ANALOG IN B 0.5V 15 +VINT D7A (MSB) 549 74ACT 273 16 2 -2V -5V CLOCK 1N4001 25, 27, 42 Figure 10. AD8002 Driving a Dual A-to-D Converter -12- REV. D AD8002 Single-Ended-to-Differential Driver Using an AD8002 The two halves of an AD8002 can be configured to create a single-ended-to-differential high-speed driver with a -3 dB bandwidth in excess of 200 MHz, as shown in Figure 11. Although the individual op amps are each current feedback, the overall architecture yields a circuit with attributes normally associated with voltage feedback amplifiers, while offering the speed advantages inherent in current feedback amplifiers. In addition, the gain of the circuit can be changed by varying a single resistor, RF, which is often not possible in a dual op amp differential driver. RF 511 OP AMP #1 1/2 AD8002 50 OUTPUT #1 RA 511 RB 511 Reactive elements can be used in the feedback network. This is in contrast to current feedback amplifiers that restrict the use of reactive elements in the feedback. The circuit described requires about 0.9 pF of capacitance in shunt across RF in order to optimize peaking and realize a -3 dB bandwidth of more than 200 MHz. 50 1/2 AD8002 RF R x 1 + A RG RB The resulting architecture offers several advantages. First, the gain can be changed by changing a single resistor. Changing either RF or RG will change the gain as in an inverting op amp circuit. For most types of differential circuits, more than one resistor must be changed to change gain and still maintain good CMR. RA 511 RB 511 G = OUTPUT #2 OP AMP #2 Figure 11. Differential Line Driver The peaking exhibited by the circuit is very sensitive to the value of this capacitor. Parasitics in the board layout on the order of tenths of picofarads will influence the frequency response and the value required for the feedback capacitor, so a good layout is essential. The current feedback nature of the op amps, in addition to enabling the wide bandwidth, provides an output drive of more than 3 V p-p into a 20 load for each output at 20 MHz. On the other hand, the voltage feedback nature provides symmetrical high impedance inputs and allows the use of reactive components in the feedback network. The circuit consists of the two op amps, each configured as a unity gain follower by the 511 RA feedback resistors between each op amp's output and inverting input. The output of each op amp has a 511 RB resistor to the inverting input of the other op amp. Thus, each output drives the other op amp through a unity gain inverter configuration. By connecting the two amplifiers as cross-coupled inverters, their outputs are freed to be equal and opposite, assuring zero-output common-mode voltage. The shunt capacitor type selection is also critical. A good microwave type chip capacitor with high Q was found to yield best performance. The part selected for this circuit was a muRata Erie part number MA280R9B. The distortion was measured at 20 MHz with a 3 V p-p input and a 100 load on each output. For Output #1 the distortion is -37 dBc and -41 dBc for the second and third harmonics respectively. For Output #2 the second harmonic is -35 dBc and the third harmonic is -43 dBc. With this circuit configuration, the common-mode signal of the outputs is reduced. If one output moves slightly higher, the negative input to the other op amp drives its output to go slightly lower and thus preserves the symmetry of the complementary outputs, which reduces the common-mode signal. The commonmode output signal was measured to be -50 dB at 1 MHz. Looking at this configuration overall, there are two high impedance inputs (the + inputs of each op amp), two low impedance outputs, and high open-loop gain. If we consider the two noninverting inputs and just the output of Op Amp #2, the structure looks like a voltage feedback op amp having two symmetrical, high-impedance inputs, and one output. The +input to Op Amp #2 is the noninverting input (it has the same polarity as Output #2) and the +input to Amplifier #1 is the inverting input (opposite polarity of Output #2). 6 CC = 0.9pF 4 2 0 OUTPUT - dB VIN The differential gain of this circuit is: The RF /RG term is the gain of the overall op amp configuration and is the same as for an inverting op amp except for the polarity. If Output #1 is used as the output reference, the gain is positive. The 1 + RA/RB term is the noise gain of each individual op amp in its noninverting configuration. CC 0.5-1.5pF RG 511 With a feedback resistor RF, an input resistor RG, and grounding of the +input of Op Amp #2, a feedback amplifier is formed. This configuration is just like a voltage feedback amplifier in an inverting configuration if only Output #2 is considered. The addition of Output #1 makes the amplifier differential output. -2 -4 -6 OUT+ -8 -10 OUT- -12 -14 1M 10M 100M FREQUENCY - Hz 1G Figure 12. Differential Driver Frequency Response REV. D -13- AD8002 RF Layout Considerations The specified high-speed performance of the AD8002 requires careful attention to board layout and component selection. Proper RF design techniques and low parasitic component selection are mandatory. +VS RG IN RBT OUT RT RS The PCB should have a ground plane covering all unused portions of the component side of the board to provide a low impedance ground path. The ground plane should be removed from the area near the input pins to reduce stray capacitance. -VS Inverting Configuration Chip capacitors should be used for supply bypassing (see Figure 13). One end should be connected to the ground plane and the other within 1/8 in. of each power pin. An additional large tantalum electrolytic capacitor (4.7 F-10 F) should be connected in parallel, but not necessarily so close, to supply current for fast, large-signal changes at the output. +VS C1 0.1F C3 10F C2 0.1F C4 10F -VS The feedback resistor should be located close to the inverting input pin in order to keep the stray capacitance at this node to a minimum. Capacitance variations of less than 1 pF at the inverting input will significantly affect high-speed performance. Supply Bypassing RF Stripline design techniques should be used for long signal traces (greater than about 1 in.). These should be designed with a characteristic impedance of 50 or 75 and be properly terminated at each end. +VS RG RBT OUT *RC IN RT -VS *SEE TABLE I Noninverting Configuration Figure 13. Inverting and Noninverting Configurations Table I. Recommended Component Values AD8002AN (DIP) Gain AD8002AR (SOIC) Gain Component -10 -2 -1 +1 +2 +10 +100 -10 -2 -1 +1 +2 +10 +100 RF () RG () RBT (Nominal) () RC ()* RS () RT (Nominal) () Small Signal BW (MHz) 0.1 dB Flatness (MHz) 499 49.9 49.9 549 274 49.9 576 576 49.9 1210 - 49.9 75 750 750 49.9 75 499 54.9 49.9 0 1000 10 49.9 0 499 49.9 49.9 499 249 49.9 549 549 49.9 953 - 49.9 75 681 681 49.9 75 499 54.9 49.9 0 1000 10 49.9 0 49.9 - 270 45 49.9 61.9 380 80 49.9 54.9 410 130 49.9 600 35 49.9 500 60 49.9 170 24 49.9 17 3 49.9 - 250 50 49.9 61.9 410 100 49.9 54.9 410 100 49.9 600 35 49.9 500 90 49.9 170 24 49.9 17 3 AD8002ARM (SOIC) Gain Component -10 -2 -1 +1 +2 +10 +100 RF () RG () RBT (Nominal) () RC ()* RS () RT (Nominal) () Small Signal BW (MHz) 0.1 dB Flatness (MHz) 499 49.9 49.9 499 249 49.9 590 590 49.9 1000 - 49.9 75 681 681 49.9 75 499 54.9 49.9 0 1000 10 49.9 0 49.9 - 270 60 49.9 61.9 400 100 49.9 49.9 410 100 49.9 600 35 49.9 450 70 49.9 170 35 49.9 19 3 *RC is recommended to reduce peaking, and minimizes input reflections at frequencies above 300 MHz. However, R C is not required. -14- REV. D AD8002 Figure 14. Board Layout (Silkscreen) REV. D -15- AD8002 Figure 15. Board Layout (Component Layer) -16- REV. D AD8002 Figure 16. Board Layout (Solder Side) (Looking through the Board) REV. D -17- AD8002 OUTLINE DIMENSIONS Dimensions shown in inches and (mm). 8-Lead Plastic DIP (N-8) 0.430 (10.92) 0.348 (8.84) 8 5 1 PIN 1 0.280 (7.11) 0.240 (6.10) 4 0.325 (8.25) 0.300 (7.62) 0.100 (2.54) BSC 0.060 (1.52) 0.015 (0.38) 0.210 (5.33) MAX 0.195 (4.95) 0.115 (2.93) 0.130 (3.30) MIN 0.160 (4.06) 0.115 (2.93) 0.015 (0.381) 0.008 (0.204) 0.022 (0.558) 0.070 (1.77) SEATING 0.014 (0.356) 0.045 (1.15) PLANE 8-Lead SOIC (SO-8) 0.1968 (5.00) 0.1890 (4.80) 8 5 1 4 0.1574 (4.00) 0.1497 (3.80) 0.2440 (6.20) 0.2284 (5.80) PIN 1 0.0196 (0.50) 45 0.0099 (0.25) 0.0500 (1.27) BSC 0.0688 (1.75) 0.0532 (1.35) 0.0098 (0.25) 0.0040 (0.10) 8 0.0500 (1.27) 0.0098 (0.25) 0 0.0160 (0.41) 0.0075 (0.19) 0.0192 (0.49) 0.0138 (0.35) SEATING PLANE 8-Lead SOIC (RM-8) 0.122 (3.10) 0.114 (2.90) 8 5 0.199 (5.05) 0.187 (4.75) 0.122 (3.10) 0.114 (2.90) 1 4 PIN 1 0.0256 (0.65) BSC 0.120 (3.05) 0.112 (2.84) 0.006 (0.15) 0.002 (0.05) 0.018 (0.46) SEATING 0.008 (0.20) PLANE 0.120 (3.05) 0.112 (2.84) 0.043 (1.09) 0.037 (0.94) 0.011 (0.28) 0.003 (0.08) -18- 33 27 0.028 (0.71) 0.016 (0.41) REV. D Revision History- AD8002 Location Page Data Sheet changed from REV. C to REV. D. MAX RATINGS changed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 REV. D -19- -20- PRINTED IN U.S.A. C01044b-0-4/01(D)