Walsin Technology Corporation
Page 1 of 7 WA04X_1% Version 6 Mar.-2007
WA04X
±1%, Convex Type
General purpose chip resistors array
Size 0402x4
Customer :
Approval No :
Issue Date :
Customer Approval :
Walsin Technology Corporation
Page 2 of 7 WA04X_1% Version 6 Mar.-2007
FEATURE
1. Small size and light weight
2. Reduced size of final equipment
3. Lower surface mounted assembly costs
4. Higher component and equipment reliability
5. Lead (Pb) free product is available
APPLICATION
• Consumer electrical equipment, PDA, Digital Camcoder, …
• EDP, Computer application
• Mobile phone, Telecom
DESCRIPTION
The resistors array is constructed in a high grade ceramic body (aluminum oxide). Internal metal electrodes are
added at each end and connected by a resistive paste that is applied to the top surface of the substrate. The
composition of the paste is adjusted to give the approximate resistance required and the value is trimmed to
within tolerance by laser cutting of this resistive layer.
The resistive layer is covered with a protective coat. Finally, the two external end terminations are added. For
ease of soldering the outer layer of these end terminations is a Lead-tin or Tin (Lead free) solder alloy.
Fig 1. Consctruction of a Chip-R array WA04X
Walsin Technology Corporation
Page 3 of 7 WA04X_1% Version 6 Mar.-2007
QUICK REFERENCE DATA
Item General Specification
Series No. WA04X(Convex)
Size 0402x4 (1005x4)
Resistance Tolerance ±1%
Resistance Range 10Ω ~ 1MΩ
TCR (ppm/°C)
10Ω≤R<1MΩ
R<10Ω, R>1MΩ
≤ ± 300
-
Max. dissipation at
Tamb=70°C 1/16 W
Max. Operation
Voltage (DC or RMS) 25V
Max. overload voltage 50V
Climatic category 55/155/56
Note :
1. This is the maximum voltage that may be continuously supplied to the resistor element, see “IEC publication
60115-8”
2. Max. Operation Voltage : So called RCWV (Rated Continuous Working Voltage) is determined by
ValueResistancePower RatedRCWV ×= or Max. RCWV listed above, whichever is lower.
DIMENSIONS
WA04X
L 2.00 ± 0.10
W 1.00 ± 0.10
T 0.45 ± 0.10
P 0.50 ± 0.05
A 0.40 ± 0.10
B 0.20 ± 0.10
C 0.30 ± 0.05
G 0.25 ± 0.10
CONSTRUCTION
R1=R2=R3=R4
Walsin Technology Corporation
Page 4 of 7 WA04X_1% Version 6 Mar.-2007
MARKING
E24 series resistance : 3-digits marking
Each resistor is marked with a three digits code on the protective coating to designate the nominal resistance
value.
For values up to 910Ω the R is used as a decimal point. For values of 1KΩ or greater the first 3 digits
apply to the resistance value and fourth indicate the number of zeros to follow.
Example
RESISTANCE 10Ω 12Ω 100Ω 6800Ω 47000Ω
3-digits marking 100 12R 101 682 473
E96 series resistance : No marking
FUNCTIONAL DESCRIPTION
Product characterization
Standard values of nominal resistance are taken from the E24+E96 series for resistors with a tolerance of
±1%, The values of the E24/E96 series are in accordance with “IEC publication 60063”
Derating
The power that the resistor can dissipate depends on the operating temperature; see Fig.2
Fig 2. Maximum dissipation in percentage of rated power
As a function of the ambient temperature
Walsin Technology Corporation
Page 5 of 7 WA04X_1% Version 6 Mar.-2007
CATALOGUE NUMBERS
The resistors have a catalogue number starting with .
WA04 X 472_ J T _
Size code
WA04 : 0402 per
element
Type code
X : x4, convex
Resistance code
E24 : 2 significant digits followed
by no. of zeros and a blank
10Ω =100_
220Ω =221_
Jumper =000_
(“_” means a blank)
E96 : 3 significant digits followed
by no. of zeros
102Ω =1020
37.4KΩ =3742
Tolerance
J : ±5%
F : ±1%
Packaging code
T : 7” Reel taping
B : Bulk
Termination code
_ = SnPb base (“_”
means a blank)
L = Sn base (lead
free)
1. Reeled tape packaging : 8mm width paper taping 10,000pcs per reel.
MOUNTING
Due to their rectangular shapes and small tolerances, Surface Mountable Resistors are suitable for handling by
automatic placement systems.
Chip placement can be on ceramic substrates and printed-circuit boards (PCBs).
Electrical connection to the circuit is by individual soldering condition.
The end terminations guarantee a reliable contact.
SOLDERING CONDITION
The robust construction of chip resistors
allows them to be completely immersed in
a solder bath of 260°C for one minute.
Therefore, it is possible to mount Surface
Mount Resistors on one side of a PCB
and other discrete components on the
reverse (mixed PCBs).
Surface Mount Resistors are tested for
solderability at 235°C during 2 seconds.
The test condition for no leaching is 260°C
for 60 seconds. Typical examples of
soldering processes that provide reliable
joints without any damage are given in Fig
3.
Fig 3. Infrared soldering p ro file for Chip Resistors array
Walsin Technology Corporation
Page 6 of 7 WA04X_1% Version 6 Mar.-2007
TEST AND REQUIREMENTS(JIS C 5201-1 : 1998)
Essentially all tests are carried out according to the schedule of IEC publication 60115-8, category LCT/UCT/56
(rated temperature range : Lower Category Temperature, Upper Category Temperature; damp heat, long term,
56 days). The testing also meets the requirements specified by EIA, EIAJ and JIS.
The tests are carried out in accordance with IEC pub1ication 68, "Recommended basic climatic and mechanical
robustness testing procedure for electronic components" and under standard atmospheric conditions according
to IEC 60068-1, subclause 5.3. Unless otherwise specified, the following value supplied :
Temperature: 15°C to 35°C, Relative humidity: 45% to 75%, Air pressure: 86kPa to 106 kPa (860 mbar to 1060
mbar). All soldering tests are performed with midly activated flux.
REQUIREMENT
TEST PROCEDURE Resistor Jumper
DC resistance
Clause 4.5
DC resistance values measured at the test voltages specified below :
<10Ω@0.1V,<100Ω@0.3V,<1KΩ@1.0V,<10KΩ@3V, <100KΩ@10V,
<1MΩ@25V, <10MΩ@30V
Within the specified
tolerance
< 50mΩ
Temperature Coefficient of
Resistance (T.C.R)
Clause 4.8
Natural resistance change per change in degree centigrade.
()
6
121
12 10×
−
−
ttR RR (ppm/°C) t1 : 20°C+5°C-1°C
R1 : Resistance at reference temperature
R2 : Resistance at test temperature
Refer to
“QUICK REFERENCE DATA”
N/a
Short time overload
(S.T.O.L)
Clause 4.13
Permanent resistance change after a 5second application of a
voltage 2.5 times RCWV or the maximum overload voltage specified
in the above list, whichever is less.
∆R/R max. ±(2%+0.10Ω)
< 50mΩ
Resistance to Soldering
Heat (R.S.H) Clause 4.18
Un-mounted chips completely immersed for 10±1second in a solder
bath at 270℃±5ºC
ΔR/R max. ±(1%+0.05Ω)
no visible damage
< 50mΩ
Solderability
Clause4.17
Un-mounted chips completely immersed for 2±0.5second in a solder
bath at 235℃±5℃
good tinning (>95% covered)
no visible damage
Leaching Test
Clause 4.18
Un-mounted chips completely immersed for 60±1second in a solder
bath at 260℃±5℃
Ditto
Temperature cycling
Clause 4.19
30 minutes at -55°C±3°C, 2~3 minutes at 20°C+5°C-1°C, 30 minutes
at +155°C±3°C, 2~3 minutes at 20°C+5°C-1°C, total 5 continuous
cycles
ΔR/R max. ±(1%+0.05Ω)
no visible damage
< 50mΩ
Load life (endurance)
Clause 4.25
70±2ºC, 1000 hours, loaded with RCWV or Vmax,1.5 hours on and
0.5 hours off
ΔR/R max.±(3%+0.10Ω)
For 10Ω≤R<1MΩ ;
ΔR/R max.±(5%+0.10Ω)
For R<10Ω, R≥1MΩ
< 50mΩ
Load life in Humidity
Clause 4.24
1000 hours, at rated continuous working voltage in humidity chamber
controller at 40°C±2°C and 90~95% relative humidity, 1.5hours on
and 0.5 hours off
ΔR/R max.±(3%+0.10Ω)
For 10Ω≤R<1MΩ ;
ΔR/R max.±(5%+0.10Ω)
For R<10Ω, R≥1MΩ
< 50mΩ
Adhesion
Clause 4.32
Pressurizing force: 5N, Test time: 10±1sec. No remarkable damage or removal of
the terminations.
Walsin Technology Corporation
Page 7 of 7 WA04X_1% Version 6 Mar.-2007
PACKAGING
Paper Tape specifications (unit :mm)
Series No. A B W F E
WA04X 2.20±0.20 1.20±0.20 8.00±0.30 3.50±0.20 1.75±0.10
Series No. P1 P0 ΦD T
WA04X 2.00±0.05 4.00±0.10 1.0
0.0
50.1 +
−
Φ Max. 0.6
Reel dimensions
Symbol A B C D
(unit : mm) Φ178.0±2.0 Φ60.0±1.0 13.0±0.2 9.0±0.5
